CN108198780A - Electronic products manufacturing is equipped - Google Patents
Electronic products manufacturing is equipped Download PDFInfo
- Publication number
- CN108198780A CN108198780A CN201711365632.8A CN201711365632A CN108198780A CN 108198780 A CN108198780 A CN 108198780A CN 201711365632 A CN201711365632 A CN 201711365632A CN 108198780 A CN108198780 A CN 108198780A
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- Prior art keywords
- penetrator ram
- piston
- penetrator
- ejection
- ram
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention belongs to electronic product production technical fields, and in particular to a kind of Electronic products manufacturing equipment；Including rack and the supporting table for being used to support wafer, further include penetrating mechanism, hydraulic cylinder, hydraulic piston and the push-and-pull portion for hydraulic piston to be made to be moved back and forth in hydraulic cylinder, hydraulic cylinder and be connected in rack；Supporting table is equipped with several ejection holes；Penetrating mechanism includes at least two ejection units, and ejection unit includes penetrator ram, push-and-pull piston, piston rod and piston cylinder；The cross-sectional area of each penetrator ram is different, the penetrator ram of small cross sectional is slidably connected in the penetrator ram of comparatively large cross-sectional area, the penetrator ram of comparatively large cross-sectional area can drive the penetrator ram of small cross sectional together through ejection hole, and all penetrator rams flush for ejecting the end of chip.This programme can be directed to various sizes of chip using various sizes of penetrator ram, avoid manually replacing penetrator ram process, improve production efficiency when chip is ejected.
Description
Technical field
The invention belongs to electronic product production technical fields, and in particular to a kind of Electronic products manufacturing equipment.
Background technology
Electronic product is the electronic product that confession under directions everyday consumer life uses.Chip, also known as microcircuit, microchip, collection
Into circuit, refer to include the silicon chip of integrated circuit, volume very little is most important part in electronic product, carry operation and
The function of storage.Several rings such as the complete procedure of chip manufacturing includes chip design, wafer fabrication, encapsulation makes, cost is tested
Section；It is wafer that it, which makes raw material,.Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle
Shape, therefore referred to as wafer；Various circuit component structures can be manufactured on silicon, and become the IC for having specific electrical functionality
Product；And the chip of different dimensions can be processed on wafer, so as to adapt to needed for production.
The front process of chip package generally includes wafer grinding (Back Grinding), wafer cutting (Wafer
Saw), die bonding (Die Attach) and lead welding (Wire Bond).The purpose wherein cut is will by cutter
Full wafer wafer cuts into chip independent one by one, facilitates subsequent bonding process.Penetrator ram is used after the completion of cutting from chip
Lower section jacks up chip, chip is then picked up above chip with suction nozzle again, so as to carry out subsequent bonding process.
Manufacturer is frequently necessary to produce the chip of different dimensions at present, however is jacking up chip with penetrator ram at present
When, it often will appear following defect：1st, when the chip of large-size is jacked up with the penetrator ram of reduced size, due to
The region of chip local pressure concentrates on the position contacted with penetrator ram, leads to chip unbalance stress, and chip is inherently very thin,
Therefore the problems such as easily causing chip rupture；2nd, when the chip of reduced size is jacked up with the penetrator ram of large-size, hold
Easily because of the chip beside the oversized and related jack-up of penetrator ram, cause accurately draw the chip on target location；And
In order to avoid the appearance of the problem, some factories using artificial penetrator ram of replacing to adapt to the size of chip, it is but this
Way is excessively troublesome, reduces production efficiency.
Invention content
The purpose of the present invention is to provide a kind of Electronic products manufacturing equipments, when chip is ejected, can be directed to difference
The chip of size uses various sizes of penetrator ram, avoids manually replacing penetrator ram process, improves production efficiency.
To achieve the above object, the present invention provides following technical solution：Electronic products manufacturing is equipped, and including rack and is used for
The supporting table of wafer is supported, further includes penetrating mechanism, hydraulic cylinder, hydraulic piston and for making hydraulic piston reciprocal in hydraulic cylinder
Mobile push-and-pull portion, hydraulic cylinder are connected in rack；Supporting table is equipped with several ejection holes；Penetrating mechanism is pushed away including at least two
Unit is pushed up, ejection unit includes penetrator ram, push-and-pull piston, piston rod and piston cylinder；Piston rod one end is connect with penetrator ram, piston
The bar other end is connect with push-and-pull piston；Push-and-pull piston is slidably connected in piston cylinder, and is pushed and pulled and connected between piston and piston cylinder
There is return unit；Piston cylinder is connected with hydraulic cylinder, and piston cylinder is equipped with solenoid valve；The cross-sectional area of each penetrator ram is different, compared with
The penetrator ram of small cross-sectional area is slidably connected in the penetrator ram of comparatively large cross-sectional area, and the penetrator ram of comparatively large cross-sectional area can drive
The penetrator ram of small cross sectional is together through ejection hole, and all penetrator rams flush for ejecting the end of chip.
The advantageous effect of above-mentioned technical proposal is：
1st, by setting at least two penetrator rams, and the cross-sectional area of each penetrator ram is different, in this way, in ejection chip
When, larger or smaller penetrator ram can be selected according to different scale chips, effectively reduce chip size and penetrator ram it
Between difference, avoid the situation that chip is too small, penetrator ram is excessive or chip is excessive, penetrator ram is too small；Chip is reduced to eject
Local pressure degree of irregularity in the process, so as to reduce the possibility for a problem that chip ruptures；And can effectively it prevent
Chip beside the oversized and related jack-up of thrust mandril helps to improve the standard for the chip that penetrator ram is drawn on target location
True property.
2nd, piston and piston rod realization are pushed and pulled in piston cylinder by the way that each penetrator ram is allowed to correspond to a piston cylinder, and is passed through
When interior oiling, penetrator ram moves up；And piston cylinder all connects, while electromagnetism is set on piston cylinder again with hydraulic cylinder
Valve；The process for replacing penetrator ram is dexterously changed into the process which piston cylinder is selected to be connected with hydraulic cylinder, i.e. operator
Member when penetrator ram select, it is only necessary to the keying of corresponding selection solenoid valve, avoid it is of the prior art manually more
Penetrator ram process is changed, helps to improve production efficiency.
3rd, by the way that the penetrator ram of small cross sectional is allowed to be slidably connected in the penetrator ram of comparatively large cross-sectional area, not only ensure
The normal ejection of smaller penetrator ram, and the volume of equipment can be effectively reduced, improve the measure of precision of equipment.
4th, by the way that the penetrator ram of comparatively large cross-sectional area is allowed to drive the penetrator ram of small cross sectional together through ejection hole, and
The end that all penetrator rams are used to eject chip flushes, and can allow when the penetrator ram of comparatively large cross-sectional area ejects chip,
The penetrator ram of small cross sectional is driven to eject together, so as to increase the contact area between chip and the end of penetrator ram, into
One step reduces local pressure degree of irregularity of the chip in ejection process, a problem that chip is effectively prevent to rupture,
Reduce product fraction defective.
Preferred embodiment one as the preferred embodiment of basic scheme, ejects the keying being hinged in hole for sealing ejection hole
Door, open and close door includes at least two fan paging doors, and often fans between paging door and supporting table and be respectively connected with compression spring.
In this way during cutting, open and close door will eject hole sealing, and ejection hole is avoided to influence the straight cuts of cutter
Path；And finished in cutting, when ejecting chip, open and close door can normally open ejection hole again, facilitate ejection chip.Meanwhile
When penetrator ram pushes up the paging door of open and close door upwards, paging door can also loosen chip in advance so that chip and surrounding
Chip be detached from, facilitate the further ejection of subsequent penetrator ram, ejection effect is more preferable.
The preferred embodiment of preferred embodiment two, preferably one, open and close door include the eight equal-sized paging doors of fan.This
The open and close door of kind structure is more preferable to the sealing effect for ejecting hole, and is more convenient during penetrator ram opening open and close door.
Preferred embodiment three, as the preferred embodiment of basic scheme, penetrator ram includes ejection end and the use for ejecting chip
In the support end being connect with piston rod；Penetrating mechanism include cross-sectional area become larger successively the first penetrator ram, the second penetrator ram and
Third penetrator ram；The support end of first penetrator ram is supported on the support end of the second penetrator ram, the support end branch of the second penetrator ram
Support is on the support end of third penetrator ram.In this way, when the second penetrator ram moves up, the first penetrator ram can also follow to
Upper movement；Similarly, when third penetrator ram moves up, the first penetrator ram and the second penetrator ram can be also followed to moving up
It is dynamic；It is simple in structure.
The preferred embodiment of preferred embodiment four, preferably three is fixedly connected with the second retainer ring in third penetrator ram,
Second penetrator ram is slidably connected in the second retainer ring；The first retainer ring, the first penetrator ram are fixedly connected in second penetrator ram
It is slidably connected in the first retainer ring.In this way, when the first penetrator ram moves up, the second penetrator ram and third penetrator ram
It will not move up；And when the second penetrator ram moves up, third penetrator ram will not move up；And penetrator ram is solid
Sliding process is stablized under the action of determining ring.
Preferred embodiment five, preferably two or preferred embodiment four preferred embodiment, supporting table is equipped with for solid
Determine the groove of wafer.Simple structure can fix the position of wafer, facilitate and carry out wafer cutting and ejection chip.
Description of the drawings
Fig. 1 is the structure diagram that Electronic products manufacturing of the present invention equips embodiment；
Fig. 2 is the vertical view of supporting table in Fig. 1；
Fig. 3 is the structure diagram of ejection unit in Fig. 1.
Specific embodiment
Below by the further details of explanation of specific embodiment：
Reference numeral in Figure of description includes：Rack 1, cutter 10, supporting table 2, groove 20, iron ring placing groove
21st, iron ring 210, ejection hole 22, open and close door 23, paging door 230, hydraulic cylinder 3, hydraulic piston 30, cylinder 31, the first penetrator ram 4,
First retainer ring 40, the second penetrator ram 5, the second retainer ring 50, third penetrator ram 6, push-and-pull piston 7, piston rod 70, piston cylinder
71st, solenoid valve 710, wafer 8, penetrating mechanism 9.
Embodiment is substantially as shown in Figure 1：
Electronic products manufacturing is equipped, including rack 1, supporting table 2, penetrating mechanism 9, hydraulic cylinder 3 and push-and-pull portion.
The top of rack 1 telescopically connects the cutter 10 for cutting crystal wafer 8.
Supporting table 2 is used to support wafer 8, as shown in Fig. 2, the shape of supporting table 2 is cube, and in supporting table 2
Centre opens up a circular groove 20, and the internal diameter of groove 20 is consistent with the outer diameter of wafer 8, so as to fulfill fixed after wafer 8 is put into
The effect of wafer 8.The circumferential direction of groove 20 can also open up an iron ring placing groove 21, and the depth of iron ring placing groove 21 is than groove 20
Depth as shallow, in this way after wafer 8 to groove 20 is put into a, moreover it is possible to iron ring 210 is placed in iron ring placing groove 21, so as to wafer
8 circumferential work is further fixed, facilitates subsequent cutting and ejection chip process.It opens the lower section of 2 respective slot 20 of supporting table
Equipped with several ejection holes 22, and several ejection holes 22 are neatly arranged according to ranks.It is hinged with to seal ejection in ejection hole 22
The open and close door 23 in hole 22, open and close door 23 include at least two fan paging doors 230, and the present embodiment is eight fans, and often fans paging door 230
Compression spring is respectively connected between bottom and supporting table 2.In this way during cutting, open and close door 23 is sealed hole 22 is ejected, and is avoided
Ejecting hole 22 influences the rectilinear cutting paths of cutter 10, and is finished in cutting, and when ejecting chip, open and close door 23 can be opened
Hole 22 is ejected, facilitates ejection chip.Meanwhile when penetrator ram pushes up the paging door 230 of open and close door 23 upwards, paging door 230
Chip can also be loosened in advance so that chip and the chip of surrounding are detached from, and facilitate the further ejection of subsequent penetrator ram, are pushed up
It is more preferable to go out effect.
Hydraulic cylinder 3 is slidably connected in rack 1, and hydraulic piston 30, the top of hydraulic piston 30 are slidably connected in hydraulic cylinder 3
Portion is full of hydraulic oil, and the bottom of hydraulic piston 30 is connected with push-and-pull portion, and the push-and-pull portion of the present embodiment is cylinder 31, for making hydraulic pressure
Piston 30 moves back and forth up and down in hydraulic cylinder 3.
As shown in figure 3, penetrating mechanism 9 include at least two ejection units, ejection unit include penetrator ram, push-and-pull piston 7,
Piston rod 70 and piston cylinder 71；Penetrator ram includes ejection end (upper end) for ejecting chip and for connecting with piston rod 70
Support end (lower end).The upper end of piston rod 70 and the support end of penetrator ram connect, and lower end and the push-and-pull piston 7 of piston rod 70 connect
It connects；Push-and-pull piston 7 is slidably connected in piston cylinder 71, and is pushed and pulled and be connected with compression spring between piston 7 and piston cylinder 71, is pushed away for allowing
Piston 7 is drawn to reset；The bottom of piston cylinder 71 is connected with hydraulic cylinder 3, and piston cylinder 71 is equipped with solenoid valve 710, for controlling liquid
Whether hydraulic oil is flowed into piston cylinder 71 in cylinder pressure 3.
For convenience of description, the present embodiment ejection unit is three, i.e. penetrating mechanism 9 includes three penetrator rams：First ejection
Bar 4, the second penetrator ram 5 and third penetrator ram 6；And the cross-sectional area of first penetrator ram 4, the second penetrator ram 5 and third penetrator ram 6
Become larger successively；The support end of first penetrator ram 4 is supported on the support end of the second penetrator ram 5, the support end branch of the second penetrator ram 5
Support is on the support end of third penetrator ram 6；Meanwhile the ejection end of first penetrator ram 4, the second penetrator ram 5 and third penetrator ram 6 is neat
Flat, concrete structure can be designed as, and open up a circular cavity at the ejection end of the second penetrator ram 5 and third penetrator ram 6, so
The ejection end of the second penetrator ram 5 is allowed to be located in the ejection end of third penetrator ram 6 afterwards, the ejection end of the first penetrator ram 4 is located at second
In the ejection end of penetrator ram 5, and the ejection end Seal Design of the first penetrator ram 4.The welding one second in third penetrator ram 6 simultaneously
Retainer ring 50, the outer wall of the second penetrator ram 5 are slidably connected in the second retainer ring 50；Welding one has first in second penetrator ram 5
Retainer ring 40, the outer wall of the first penetrator ram 4 are slidably connected in the first retainer ring 40.Such knock-pin structure design, can be with
Realize when the penetrator ram upward sliding of small cross sectional, the penetrator ram of comparatively large cross-sectional area is motionless so that only compared with
The penetrator ram of small cross-sectional area extends upward through ejection hole 22；And when the penetrator ram upward sliding of comparatively large cross-sectional area, it can band
The penetrator ram of dynamic small cross sectional upward sliding together so that the penetrator ram of comparatively large cross-sectional area and pushing away for small cross sectional
Mandril extends upward through ejection hole 22 together.
After having cut wafer 8, according to the penetrator ram of the size selection corresponding size of chip, and corresponding solenoid valve is opened
710；Then start cylinder 31 so that 30 upward hydraulic oil of hydraulic piston, hydraulic oil enter in piston cylinder 71 and squeezes upwards
Pressure push-and-pull piston 7, push-and-pull piston 7 so that corresponding penetrator ram is upward, into ejection hole 22, and open corresponding open and close door 23,
So as to eject chip upwards.After the chip for removing ejection, then make 30 slide downward of hydraulic piston, hydraulic oil is fallen after rise from piston cylinder 71
To hydraulic cylinder 3；Push-and-pull piston 7 resetted downwards under the action of compression spring, piston rod 70 also moves down, penetrator ram also and then to
Lower movement and leave ejection hole 22；Paging door 230 in open and close door 23 resets under compression spring effect and re-closes ejection hole 22,
Simultaneously close off corresponding solenoid valve 710.
It, can be by sliding hydraulic cylinder 3 so as to mobile when needing to eject next ejection 22 corresponding chip of hole
Penetrator ram ejects the lower section in hole 22 to next, and continues to repeat above-mentioned action.But in view of wafer 8 is divided after practical cutting
The small chip neatly arranged by ranks into several, therefore, in order to further improve production efficiency, pushing away in the present embodiment
Top mechanism 9 also has several, and the arrangement mode procession of corresponding chip is neatly arranged, and the piston of each penetrating mechanism 9
Cylinder 71 is connected with hydraulic cylinder 3, in this way, just only needing to start a cylinder 31 when chip is ejected, you can will be on wafer 8
Chip all eject, largely improve production efficiency.
Above-described is only the embodiment of the present invention, and the common sense such as well known concrete structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these should also be considered as protection scope of the present invention, these all do not interfere with what the present invention was implemented
Effect and practical applicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (6)
1. Electronic products manufacturing is equipped, including rack and the supporting table for being used to support wafer, it is characterised in that：Further include ejection machine
Structure, hydraulic cylinder, hydraulic piston and the push-and-pull portion for hydraulic piston to be made to be moved back and forth in hydraulic cylinder, the hydraulic cylinder are connected to
In rack；The supporting table is equipped with several ejection holes；The penetrating mechanism includes at least two ejection units, the ejection list
Member includes penetrator ram, push-and-pull piston, piston rod and piston cylinder；Described piston rod one end is connect with penetrator ram, the piston rod other end
It is connect with push-and-pull piston；The push-and-pull piston is slidably connected in piston cylinder, and push and pull and be connected between piston and piston cylinder again
Position part；The piston cylinder is connected with the hydraulic cylinder, and piston cylinder is equipped with solenoid valve；The cross-sectional area of each penetrator ram is not
Together, the penetrator ram of small cross sectional is slidably connected in the penetrator ram of comparatively large cross-sectional area, the penetrator ram of comparatively large cross-sectional area
The penetrator ram of small cross sectional can be driven together through the ejection hole, and all penetrator rams are neat for ejecting the end of chip
It is flat.
2. Electronic products manufacturing equipment according to claim 1, it is characterised in that：It is hinged in the ejection hole for close
The open and close door in the ejection hole is sealed, the open and close door includes at least two fan paging doors, and often fans between paging door and supporting table
It is connected with compression spring.
3. Electronic products manufacturing equipment according to claim 2, it is characterised in that：The open and close door includes eight fan size phases
Deng the paging door.
4. Electronic products manufacturing equipment according to claim 1, it is characterised in that：The penetrator ram includes ejecting core
The ejection end of piece and the support end for being connect with the piston rod；The penetrating mechanism includes that cross-sectional area becomes larger successively
One penetrator ram, the second penetrator ram and third penetrator ram；The support end of first penetrator ram is supported on second penetrator ram
On support end, the support end of second penetrator ram is supported on the support end of the third penetrator ram.
5. Electronic products manufacturing equipment according to claim 4, it is characterised in that：It is fixedly connected in the third penetrator ram
There is the second retainer ring, second penetrator ram is slidably connected in the second retainer ring；It is fixedly connected in second penetrator ram
First retainer ring, first penetrator ram are slidably connected in the first retainer ring.
6. the Electronic products manufacturing equipment according to claim 3 or 5, it is characterised in that：The supporting table is equipped with and is used for
The groove of fixed wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365632.8A CN108198780B (en) | 2017-12-18 | 2017-12-18 | Electronic product manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365632.8A CN108198780B (en) | 2017-12-18 | 2017-12-18 | Electronic product manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108198780A true CN108198780A (en) | 2018-06-22 |
| CN108198780B CN108198780B (en) | 2020-05-19 |
Family
ID=62574383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711365632.8A Active CN108198780B (en) | 2017-12-18 | 2017-12-18 | Electronic product manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108198780B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| CN101510764A (en) * | 2008-02-15 | 2009-08-19 | 精工电子有限公司 | Method of fabricating piezoelectric vibrating piece, apparatus having the same, wafer and jig for wafer |
| CN101901742A (en) * | 2009-04-02 | 2010-12-01 | 先进自动器材有限公司 | Device for thin die detachment and pick-up |
| CN204792868U (en) * | 2015-05-29 | 2015-11-18 | 中建材浚鑫科技股份有限公司 | Silicon chip top flat mechanism |
| JP2016131230A (en) * | 2015-01-15 | 2016-07-21 | パイオニア株式会社 | Push-up apparatus and push-up method |
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
-
2017
- 2017-12-18 CN CN201711365632.8A patent/CN108198780B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| CN101510764A (en) * | 2008-02-15 | 2009-08-19 | 精工电子有限公司 | Method of fabricating piezoelectric vibrating piece, apparatus having the same, wafer and jig for wafer |
| CN101901742A (en) * | 2009-04-02 | 2010-12-01 | 先进自动器材有限公司 | Device for thin die detachment and pick-up |
| JP2016131230A (en) * | 2015-01-15 | 2016-07-21 | パイオニア株式会社 | Push-up apparatus and push-up method |
| CN204792868U (en) * | 2015-05-29 | 2015-11-18 | 中建材浚鑫科技股份有限公司 | Silicon chip top flat mechanism |
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108198780B (en) | 2020-05-19 |
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