CN108198768A - Process for manufacturing electronic product - Google Patents
Process for manufacturing electronic product Download PDFInfo
- Publication number
- CN108198768A CN108198768A CN201711365633.2A CN201711365633A CN108198768A CN 108198768 A CN108198768 A CN 108198768A CN 201711365633 A CN201711365633 A CN 201711365633A CN 108198768 A CN108198768 A CN 108198768A
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- China
- Prior art keywords
- penetrator ram
- chip
- piston
- penetrator
- ejection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
The invention belongs to electronic product production technical fields, and in particular to a kind of process for manufacturing electronic product ejects chip using ejector；Eject step includes：A, solenoid valve is opened：The penetrator ram of corresponding size is selected according to chip size, opens the corresponding solenoid valve of corresponding penetrator ram；B, start push-and-pull portion：Cause the push-and-pull piston in the hydraulic oil extrusion piston cylinder in hydraulic cylinder, penetrator ram enters ejection hole ejection chip；C, absorption chip：The chip of ejection is removed with vacuum cups；D, it resets：By the hydraulic oil rework solution cylinder pressure in push-and-pull portion piston cylinder, penetrator ram resets, and closes solenoid valve.This programme can be directed to various sizes of chip using various sizes of penetrator ram, avoid manually replacing penetrator ram process, improve production efficiency when chip is ejected.
Description
Technical field
The invention belongs to electronic product production technical fields, and in particular to a kind of process for manufacturing electronic product.
Background technology
Electronic product is the electronic product that confession under directions everyday consumer life uses.Chip, also known as microcircuit, microchip, collection
Into circuit, refer to include the silicon chip of integrated circuit, volume very little is most important part in electronic product, carry operation and
The function of storage.Several rings such as the complete procedure of chip manufacturing includes chip design, wafer fabrication, encapsulation makes, cost is tested
Section；It is wafer that it, which makes raw material,.Wafer refers to the silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle
Shape, therefore referred to as wafer；Various circuit component structures can be manufactured on silicon, and become the IC for having specific electrical functionality
Product；And the chip of different dimensions can be processed on wafer, so as to adapt to needed for production.
The front process of chip package generally includes wafer grinding (Back Grinding), wafer cutting (Wafer
Saw), die bonding (Die Attach) and lead welding (Wire Bond).The purpose wherein cut is will by cutter
Full wafer wafer cuts into chip independent one by one, facilitates subsequent bonding process.Penetrator ram is used after the completion of cutting from chip
Lower section jacks up chip, chip is then picked up above chip with suction nozzle again, so as to carry out subsequent bonding process.
Manufacturer is frequently necessary to produce the chip of different dimensions at present, however is jacking up chip with penetrator ram at present
When, it often will appear following defect：1st, when the chip of large-size is jacked up with the penetrator ram of reduced size, due to
The region of chip local pressure concentrates on the position contacted with penetrator ram, leads to chip unbalance stress, and chip is inherently very thin,
Therefore the problems such as easily causing chip rupture；2nd, when the chip of reduced size is jacked up with the penetrator ram of large-size, hold
Easily because of the chip beside the oversized and related jack-up of penetrator ram, cause accurately draw the chip on target location；And
In order to avoid the appearance of the problem, some factories using artificial penetrator ram of replacing to adapt to the size of chip, it is but this
Way is excessively troublesome, reduces production efficiency.
Invention content
The purpose of the present invention is to provide a kind of process for manufacturing electronic product, when chip is ejected, can be directed to difference
The chip of size uses various sizes of penetrator ram, avoids manually replacing penetrator ram process, improves production efficiency.
To achieve the above object, the present invention provides following technical solution：Process for manufacturing electronic product is ejected using ejector
Chip, ejector include rack, supporting table, penetrating mechanism, hydraulic cylinder, hydraulic piston and for making hydraulic piston in hydraulic cylinder
The push-and-pull portion of reciprocating movement, hydraulic cylinder are connected in rack；Supporting table is equipped with several ejection holes；Penetrating mechanism includes at least two
A ejection unit, ejection unit include penetrator ram, push-and-pull piston, piston rod and piston cylinder；Piston rod one end is connect with penetrator ram,
The piston rod other end is connect with push-and-pull piston；Push-and-pull piston is slidably connected in piston cylinder, and is pushed and pulled between piston and piston cylinder
It is connected with return unit；Piston cylinder is connected with hydraulic cylinder, and piston cylinder is equipped with solenoid valve；The cross-sectional area of each penetrator ram is not
Together, the penetrator ram of small cross sectional is slidably connected in the penetrator ram of comparatively large cross-sectional area, the penetrator ram of comparatively large cross-sectional area
The penetrator ram of small cross sectional can be driven together through ejection hole, and all penetrator rams flush for ejecting the end of chip；
Eject step includes：
A, solenoid valve is opened：The penetrator ram of corresponding size is selected according to chip size, opens the corresponding electricity of corresponding penetrator ram
Magnet valve；
B, start push-and-pull portion：So that the push-and-pull piston in hydraulic oil extrusion piston cylinder in hydraulic cylinder, penetrator ram is to enterprising
Enter to eject hole and eject chip, hydraulic oil squeeze pressure is 6~15MPa；
C, absorption chip：The chip of ejection is removed with vacuum cups, the suction pressure of vacuum cups is 0.5~2KPa；
D, it resets：By the hydraulic oil rework solution cylinder pressure in push-and-pull portion piston cylinder, penetrator ram resets, and closes electromagnetism
Valve.
The advantageous effect of above-mentioned technical proposal is：
1st, by selecting larger or smaller penetrator ram according to different scale chips, can effectively reduce chip size and
Difference between penetrator ram avoids the situation that chip is too small, penetrator ram is excessive or chip is excessive, penetrator ram is too small；Reduce core
Local pressure degree of irregularity of the piece in ejection process, so as to reduce the possibility for a problem that chip ruptures；And
The chip beside the oversized and related jack-up of penetrator ram is can effectively prevent, penetrator ram is helped to improve and draws on target location
The accuracy of chip.
The 2nd, the process for replacing penetrator ram is dexterously changed into the process which piston cylinder is selected to be connected with hydraulic cylinder, i.e.,
Operating personnel are when penetrator ram is selected, it is only necessary to which the keying of corresponding selection solenoid valve avoids of the prior art
It is artificial to replace penetrator ram process, help to improve production efficiency.
3rd, by the way that the penetrator ram of comparatively large cross-sectional area is allowed to drive the penetrator ram of small cross sectional together through ejection hole, and
The end that all penetrator rams are used to eject chip flushes, and can allow when the penetrator ram of comparatively large cross-sectional area ejects chip,
The penetrator ram of small cross sectional is driven to eject together, so as to increase the contact area between chip and the end of penetrator ram, into
One step reduces local pressure degree of irregularity of the chip in ejection process, a problem that chip is effectively prevent to rupture,
Reduce product fraction defective.
Preferred embodiment one as the preferred embodiment of basic scheme, ejects the keying being hinged in hole for sealing ejection hole
Door, open and close door includes at least two fan paging doors, and often fans between paging door and supporting table and be respectively connected with compression spring.
In this way during cutting, open and close door will eject hole sealing, and ejection hole is avoided to influence the straight cuts of cutter
Path；And finished in cutting, when ejecting chip, open and close door can normally open ejection hole again, facilitate ejection chip.Meanwhile
When penetrator ram pushes up the paging door of open and close door upwards, paging door can also loosen chip in advance so that chip and surrounding
Chip be detached from, facilitate the further ejection of subsequent penetrator ram, ejection effect is more preferable.
The preferred embodiment of preferred embodiment two, preferably one, open and close door include the eight equal-sized paging doors of fan.This
The open and close door of kind structure is more preferable to the sealing effect for ejecting hole, and is more convenient during penetrator ram opening open and close door.
Preferred embodiment three, as the preferred embodiment of basic scheme, penetrator ram includes ejection end and the use for ejecting chip
In the support end being connect with piston rod；Penetrating mechanism include cross-sectional area become larger successively the first penetrator ram, the second penetrator ram and
Third penetrator ram；The support end of first penetrator ram is supported on the support end of the second penetrator ram, the support end branch of the second penetrator ram
Support is on the support end of third penetrator ram.In this way, when the second penetrator ram moves up, the first penetrator ram can also follow to
Upper movement；Similarly, when third penetrator ram moves up, the first penetrator ram and the second penetrator ram can be also followed to moving up
It is dynamic；It is simple in structure.
The preferred embodiment of preferred embodiment four, preferably three is fixedly connected with the second retainer ring in third penetrator ram,
Second penetrator ram is slidably connected in the second retainer ring；The first retainer ring, the first penetrator ram are fixedly connected in second penetrator ram
It is slidably connected in the first retainer ring.In this way, when the first penetrator ram moves up, the second penetrator ram and third penetrator ram
It will not move up；And when the second penetrator ram moves up, third penetrator ram will not move up；And penetrator ram is solid
Sliding process is stablized under the action of determining ring.
Preferred embodiment five, preferably two or preferred embodiment four preferred embodiment, supporting table is equipped with for solid
Determine the groove of wafer.Simple structure can fix the position of wafer, facilitate and carry out wafer cutting and ejection chip.
Description of the drawings
Fig. 1 is the structure diagram of ejector in process for manufacturing electronic product embodiment of the present invention；
Fig. 2 is the vertical view of supporting table in Fig. 1；
Fig. 3 is the structure diagram of ejection unit in Fig. 1.
Specific embodiment
Below by the further details of explanation of specific embodiment：
Reference numeral in Figure of description includes：Rack 1, cutter 10, supporting table 2, groove 20, iron ring placing groove
21st, iron ring 210, ejection hole 22, open and close door 23, paging door 230, hydraulic cylinder 3, hydraulic piston 30, cylinder 31, the first penetrator ram 4,
First retainer ring 40, the second penetrator ram 5, the second retainer ring 50, third penetrator ram 6, push-and-pull piston 7, piston rod 70, piston cylinder
71st, solenoid valve 710, wafer 8, penetrating mechanism 9.
Embodiment 1
Substantially as shown in Figure 1：
Process for manufacturing electronic product ejects chip using ejector, and ejector includes rack 1, supporting table 2, ejection
Mechanism 9, hydraulic cylinder 3 and push-and-pull portion.
The top of rack 1 telescopically connects the cutter 10 for cutting crystal wafer 8.
Supporting table 2 is used to support wafer 8, as shown in Fig. 2, the shape of supporting table 2 is cube, and in supporting table 2
Centre opens up a circular groove 20, and the internal diameter of groove 20 is consistent with the outer diameter of wafer 8, so as to fulfill fixed after wafer 8 is put into
The effect of wafer 8.The circumferential direction of groove 20 can also open up an iron ring placing groove 21, and the depth of iron ring placing groove 21 is than groove 20
Depth as shallow, in this way after wafer 8 to groove 20 is put into a, moreover it is possible to iron ring 210 is placed in iron ring placing groove 21, so as to wafer
8 circumferential work is further fixed, facilitates subsequent cutting and ejection chip process.It opens the lower section of 2 respective slot 20 of supporting table
Equipped with several ejection holes 22, and several ejection holes 22 are neatly arranged according to ranks.It is hinged with to seal ejection in ejection hole 22
The open and close door 23 in hole 22, open and close door 23 include at least two fan paging doors 230, and the present embodiment is eight fans, and often fans paging door 230
Compression spring is respectively connected between bottom and supporting table 2.In this way during cutting, open and close door 23 is sealed hole 22 is ejected, and is avoided
Ejecting hole 22 influences the rectilinear cutting paths of cutter 10, and is finished in cutting, and when ejecting chip, open and close door 23 can be opened
Hole 22 is ejected, facilitates ejection chip.Meanwhile when penetrator ram pushes up the paging door 230 of open and close door 23 upwards, paging door 230
Chip can also be loosened in advance so that chip and the chip of surrounding are detached from, and facilitate the further ejection of subsequent penetrator ram, are pushed up
It is more preferable to go out effect.
Hydraulic cylinder 3 is slidably connected in rack 1, and hydraulic piston 30, the top of hydraulic piston 30 are slidably connected in hydraulic cylinder 3
Portion is full of hydraulic oil, and the bottom of hydraulic piston 30 is connected with push-and-pull portion, and the push-and-pull portion of the present embodiment is cylinder 31, for making hydraulic pressure
Piston 30 moves back and forth up and down in hydraulic cylinder 3.
As shown in figure 3, penetrating mechanism 9 include at least two ejection units, ejection unit include penetrator ram, push-and-pull piston 7,
Piston rod 70 and piston cylinder 71；Penetrator ram includes ejection end (upper end) for ejecting chip and for connecting with piston rod 70
Support end (lower end).The upper end of piston rod 70 and the support end of penetrator ram connect, and lower end and the push-and-pull piston 7 of piston rod 70 connect
It connects；Push-and-pull piston 7 is slidably connected in piston cylinder 71, and is pushed and pulled and be connected with compression spring between piston 7 and piston cylinder 71, is pushed away for allowing
Piston 7 is drawn to reset；The bottom of piston cylinder 71 is connected with hydraulic cylinder 3, and piston cylinder 71 is equipped with solenoid valve 710, for controlling liquid
Whether hydraulic oil is flowed into piston cylinder 71 in cylinder pressure 3.
For convenience of description, the present embodiment ejection unit is three, i.e. penetrating mechanism 9 includes three penetrator rams：First ejection
Bar 4, the second penetrator ram 5 and third penetrator ram 6；And the cross-sectional area of first penetrator ram 4, the second penetrator ram 5 and third penetrator ram 6
Become larger successively；The support end of first penetrator ram 4 is supported on the support end of the second penetrator ram 5, the support end branch of the second penetrator ram 5
Support is on the support end of third penetrator ram 6；Meanwhile the ejection end of first penetrator ram 4, the second penetrator ram 5 and third penetrator ram 6 is neat
Flat, concrete structure can be designed as, and open up a circular cavity at the ejection end of the second penetrator ram 5 and third penetrator ram 6, so
The ejection end of the second penetrator ram 5 is allowed to be located in the ejection end of third penetrator ram 6 afterwards, the ejection end of the first penetrator ram 4 is located at second
In the ejection end of penetrator ram 5, and the ejection end Seal Design of the first penetrator ram 4.The welding one second in third penetrator ram 6 simultaneously
Retainer ring 50, the outer wall of the second penetrator ram 5 are slidably connected in the second retainer ring 50；Welding one has first in second penetrator ram 5
Retainer ring 40, the outer wall of the first penetrator ram 4 are slidably connected in the first retainer ring 40.Such knock-pin structure design, can be with
Realize when the penetrator ram upward sliding of small cross sectional, the penetrator ram of comparatively large cross-sectional area is motionless so that only compared with
The penetrator ram of small cross-sectional area extends upward through ejection hole 22；And when the penetrator ram upward sliding of comparatively large cross-sectional area, it can band
The penetrator ram of dynamic small cross sectional upward sliding together so that the penetrator ram of comparatively large cross-sectional area and pushing away for small cross sectional
Mandril extends upward through ejection hole 22 together.
After having cut wafer 8, chip ejection is carried out, eject step includes：
A, solenoid valve 710 is opened：The penetrator ram of corresponding size is selected according to chip size, it is corresponding to open corresponding penetrator ram
Solenoid valve 710；
B, start cylinder 31：Cause 30 upward hydraulic oil of hydraulic piston, hydraulic oil enters in piston cylinder 71 and upward
Push-and-pull piston 7 is squeezed, push-and-pull piston 7 so that corresponding penetrator ram is upward, into ejection hole 22, and opens corresponding open and close door
23, so as to eject chip upwards, hydraulic oil squeeze pressure is 6MPa；
C, absorption chip：The chip of ejection is removed with vacuum cups, the suction pressure of vacuum cups is 0.5KPa；
D, it resets：Make 30 slide downward of hydraulic piston, hydraulic oil is fallen after rise from piston cylinder 71 to hydraulic cylinder 3；Push and pull piston 7
It is resetted downwards under the action of compression spring, piston rod 70 also moves down, and penetrator ram also and then moves down and leaves ejection hole 22；
Paging door 230 in open and close door 23 resets under compression spring effect and re-closes ejection hole 22, simultaneously closes off corresponding solenoid valve
710。
It, can be by sliding hydraulic cylinder 3 so as to mobile when needing to eject next ejection 22 corresponding chip of hole
Penetrator ram ejects the lower section in hole 22 to next, and continues to repeat above-mentioned action.But in view of wafer 8 is divided after practical cutting
The small chip neatly arranged by ranks into several, therefore, in order to further improve production efficiency, pushing away in the present embodiment
Top mechanism 9 also has several, and the arrangement mode procession of corresponding chip is neatly arranged, and the piston of each penetrating mechanism 9
Cylinder 71 is connected with hydraulic cylinder 3, in this way, just only needing to start a cylinder 31 when chip is ejected, you can will be on wafer 8
Chip all eject, largely improve production efficiency.
Embodiment 2
The present embodiment and embodiment 1 difference lies in：Hydraulic oil squeeze pressure is 15MPa in step B；Vacuum in step C
The suction pressure of suction nozzle is 2KPa.
Above-described is only the embodiment of the present invention, and the common sense such as well known concrete structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these should also be considered as protection scope of the present invention, these all do not interfere with what the present invention was implemented
Effect and practical applicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific embodiment can be used for explaining the content of claim.
Claims (6)
1. process for manufacturing electronic product ejects chip using ejector, which is characterized in that the ejector includes rack, support
Platform, penetrating mechanism, hydraulic cylinder, hydraulic piston and the push-and-pull portion for hydraulic piston to be made to be moved back and forth in hydraulic cylinder, the liquid
Cylinder pressure is connected in rack；The supporting table is equipped with several ejection holes；The penetrating mechanism includes at least two ejection units,
The ejection unit includes penetrator ram, push-and-pull piston, piston rod and piston cylinder；Described piston rod one end is connect with penetrator ram, living
The stopper rod other end is connect with push-and-pull piston；The push-and-pull piston is slidably connected in piston cylinder, and push and pull piston and piston cylinder it
Between be connected with return unit；The piston cylinder is connected with the hydraulic cylinder, and piston cylinder is equipped with solenoid valve；The horizontal stroke of each penetrator ram
Sectional area is different, and the penetrator ram of small cross sectional is slidably connected in the penetrator ram of comparatively large cross-sectional area, comparatively large cross-sectional area
Penetrator ram can drive the penetrator ram of small cross sectional together through the ejection hole, and all penetrator rams are for ejecting chip
End flush；Eject step includes：
A, solenoid valve is opened：The penetrator ram of corresponding size is selected according to chip size, and opens the corresponding electromagnetism of corresponding penetrator ram
Valve；
B, start push-and-pull portion：Cause the push-and-pull piston in the hydraulic oil extrusion piston cylinder in hydraulic cylinder, penetrator ram is upwardly into top
Portal and eject chip, the hydraulic oil squeeze pressure is 6~15MPa；
C, absorption chip：The chip of ejection is removed with vacuum cups, the suction pressure of the vacuum cups is 0.5~2KPa；
D, it resets：By the hydraulic oil rework solution cylinder pressure in push-and-pull portion piston cylinder, penetrator ram resets, and closes solenoid valve.
2. process for manufacturing electronic product according to claim 1, it is characterised in that：It is hinged in the ejection hole for close
The open and close door in the ejection hole is sealed, the open and close door includes at least two fan paging doors, and often fans between paging door and supporting table
It is connected with compression spring.
3. process for manufacturing electronic product according to claim 2, it is characterised in that：The open and close door includes eight fan size phases
Deng the paging door.
4. process for manufacturing electronic product according to claim 1, it is characterised in that：The penetrator ram includes ejecting core
The ejection end of piece and the support end for being connect with the piston rod；The penetrating mechanism includes that cross-sectional area becomes larger successively
One penetrator ram, the second penetrator ram and third penetrator ram；The support end of first penetrator ram is supported on second penetrator ram
On support end, the support end of second penetrator ram is supported on the support end of the third penetrator ram.
5. process for manufacturing electronic product according to claim 4, it is characterised in that：It is fixedly connected in the third penetrator ram
There is the second retainer ring, second penetrator ram is slidably connected in the second retainer ring；It is fixedly connected in second penetrator ram
First retainer ring, first penetrator ram are slidably connected in the first retainer ring.
6. the process for manufacturing electronic product according to claim 3 or 5, it is characterised in that：The supporting table is equipped with and is used for
The groove of fixed wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365633.2A CN108198768B (en) | 2017-12-18 | 2017-12-18 | Manufacturing process of electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711365633.2A CN108198768B (en) | 2017-12-18 | 2017-12-18 | Manufacturing process of electronic product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108198768A true CN108198768A (en) | 2018-06-22 |
| CN108198768B CN108198768B (en) | 2020-05-19 |
Family
ID=62574414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711365633.2A Active CN108198768B (en) | 2017-12-18 | 2017-12-18 | Manufacturing process of electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108198768B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113580557A (en) * | 2021-07-28 | 2021-11-02 | 沛顿科技（深圳）有限公司 | 3D printing method for replacing NCF in TSV process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| JP2010165835A (en) * | 2009-01-15 | 2010-07-29 | Tdk Corp | Pickup method and pickup device for electronic component |
| CN205984931U (en) * | 2016-08-18 | 2017-02-22 | 徐州同鑫光电科技股份有限公司 | Positioner suitable for different dimensions wafers |
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
-
2017
- 2017-12-18 CN CN201711365633.2A patent/CN108198768B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6386815B1 (en) * | 1999-01-20 | 2002-05-14 | Nec Corporation | Pick-up apparatus for semiconductor chips |
| JP2010165835A (en) * | 2009-01-15 | 2010-07-29 | Tdk Corp | Pickup method and pickup device for electronic component |
| CN205984931U (en) * | 2016-08-18 | 2017-02-22 | 徐州同鑫光电科技股份有限公司 | Positioner suitable for different dimensions wafers |
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113580557A (en) * | 2021-07-28 | 2021-11-02 | 沛顿科技（深圳）有限公司 | 3D printing method for replacing NCF in TSV process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108198768B (en) | 2020-05-19 |
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