CN108198772A - Bearing assembly and cutting equipment, the cutting method of flexible media - Google Patents
Bearing assembly and cutting equipment, the cutting method of flexible media Download PDFInfo
- Publication number
- CN108198772A CN108198772A CN201711465231.XA CN201711465231A CN108198772A CN 108198772 A CN108198772 A CN 108198772A CN 201711465231 A CN201711465231 A CN 201711465231A CN 108198772 A CN108198772 A CN 108198772A
- Authority
- CN
- China
- Prior art keywords
- groove body
- flexible media
- bearing assembly
- cutting
- absorbing platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 68
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000001179 sorption measurement Methods 0.000 claims abstract description 29
- 238000010521 absorption reaction Methods 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims description 15
- 238000003698 laser cutting Methods 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract description 2
- 238000000429 assembly Methods 0.000 abstract description 2
- 239000000758 substrate Substances 0.000 description 16
- 239000011521 glass Substances 0.000 description 9
- 238000009304 pastoral farming Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention discloses a kind of bearing assemblies, for flexible media to be cut to be connected to vacuum absorbing platform, the bearing assembly includes support ontology, the support ontology includes opposite first surface and second surface, for carrying the flexible media, the second surface is used to ontology will be supported to be connected to vacuum absorbing platform the first surface；The first groove body being open towards the first surface is offered in the support ontology, first groove body is also connected to the second surface, for the vacuum adsorption force that vacuum absorbing platform generates to be transferred to the first surface from the second surface, with the fixed flexible media of absorption；The opening of first groove body on the first surface extends along the track of the cutting line corresponding to the flexible media, to form the space for avoiding cutting action.The invention also discloses one kind to include bearing assembly cutting equipment as described above, also discloses the cutting method of the flexible media using the cutting equipment.
Description
Technical field
Production technology more particularly to a kind of carrying group for being used to cut flexible media the present invention relates to flexible display panels
Part and cutting equipment further relate to a kind of cutting method of flexible media.
Background technology
Organic electroluminescent LED (Organic light-emitting diodes, OLED) display panel has certainly
It shines, the advantages that contrast is high, thickness is thin, visual angle is wide and reaction speed is fast, is the representative of flat panel display technology of new generation, it is more next
More praised highly by industry.Flexible OLED display panel is one of important development trend, and flexible OLED display panel is not
Only can be more frivolous in volume, and power consumption can be reduced, so as to help to promote the cruising ability of corresponding product.Together
When, flexible and flexibility due to flexible OLED display panel, robustness is also above ordinary rigid display panel.It is soft
Property OLED display panel can be widely applied in the various products with display function, for example, can be applied to tablet computer, TV,
In mobile terminal and all kinds of wearable devices.
The defects of flexible OLED display panel also has itself while series of advantages is brought, due to flexible base board
It the problems such as with flexible and thermal expansivity, makes troubles to the processing of display device, is susceptible to that substrate is sagging or even generation pleat
Wrinkle or fracture, it is difficult to accurately carry out the preparation section of subsequent film.In order to solve this problem, it needs flexible base board being connected to
On rigid substrate such as glass substrate, to support and fix formation of the flexible base board in favor of film.It makes on flexible substrates
Standby each layer elements for forming display panel and then by stripping technology, rigid substrates are peeled away from flexible base board, from
And complete the preparation work of flexible display panels.
The production method of the flexible OLED display panel of mainstream includes at present：
Step S1, using glass substrate as carrier, strata acid imide (PI) film is coated on whole face glass substrate as soft
Property substrate, prepare to form OLED display master blanks on flexible substrates, the OLED display master blanks include multiple OLED display panels.
Step S2, using cutting technique, glass substrate and OLED display master blanks cutting splitting are shown multiple OLED
Panel is mutually divided, and forms the OLED display panel of monolithic.
Step S3, for the OLED display panel of each monolithic, using laser lift-off (Laser lift off, LLO) work
Skill detaches PI films with glass substrate to get to flexible OLED display panel.
In above processing step, for the cutting technique of step S2, laser cutting device is typically used.Many institute's weeks
To know, laser cutting device is that more expensive and equipment use cost is also higher, and in above step S2, it is carrying out
It also needs to cut glass substrate during laser cutting parameter, not only consumes working hour and material, also increase laser cutting
The loss of equipment and use cost.
In order to improve the problem of mentioned above, the solution of the prior art is：It is that will be shown including multiple OLED first
The OLED display master blanks of panel are removed from glass substrate；Then OLED display master blanks are cut multiple OLED display panels again
Mutually segmentation forms the flexible OLED display panel of monolithic.That is, in above processing step S1~S3, step S1 is being carried out
Later, it first carries out step S3 and carries out step S2 again, do not need to glass-cutting substrate.
The OLED display master blanks after being removed from glass substrate are usually known as Grazing condition OLED display master blanks in the industry, for
The cutting technique of Grazing condition display master blank is to be absorbed and fixed at Grazing condition OLED display master blanks 1 very first refering to Fig. 1 and Fig. 2
On empty absorption platform, the vacuum absorbing platform 1 includes adsorption hole 2；Then using laser cutting device 3 along scheduled cutting
Line 4 cuts Grazing condition OLED display master blanks 5, and multiple OLED display panels 6 are (merely exemplary in Fig. 1 and Fig. 2 to show
One of OLED display panel 6) it is separated from each other.This cutting technique there is it is following the problem of：
(1), refering to Fig. 1, cutting line 4 (edge of OLED display panel 6) is usually located between adsorption hole 2, cutting line 4 with
There is a certain distance, after laser cutting parameter is carried out, the edge of OLED display panel 6 easily generates between adsorption hole 2
The problem of warpage.
(2), it referring to Fig.2, when carrying out laser cutting parameter, needs to completely cut through in the position corresponding to cutting line 4 complete soft
Property OLED display master blanks 5, the surface of vacuum absorbing platform 1 is often by damage from laser at this time.
Therefore, the prior art has yet to be improved and developed.
Invention content
In view of the shortcomings of the prior art, the present invention provides a kind of bearing assembly and cutting equipment, applied to flexibility
The cutting technique of medium (being, for example, flexible OLED display panel), can occur asking for warpage to avoid the edge of flexible media
Topic, and the surface of vacuum absorbing platform can also be avoided to be cut damage.
To achieve the above object, present invention employs following technical solutions：
A kind of bearing assembly, for flexible media to be cut to be connected to vacuum absorbing platform, the bearing assembly
Including supporting ontology, the support ontology includes opposite first surface and second surface, and the first surface is used to carry institute
Flexible media is stated, the second surface is used to the support ontology being connected to the vacuum absorbing platform；Wherein, the support
The first groove body being open towards the first surface is offered in ontology, first groove body is also connected to the second surface,
For the vacuum adsorption force that the vacuum absorbing platform generates to be transferred to the first surface from the second surface, with absorption
The fixed flexible media；The opening of first groove body on the first surface is along cutting corresponding to the flexible media
The track extension of secant, to form the space for avoiding cutting action.
Wherein, the second groove body being open towards the second surface, second slot are further opened in the support ontology
Body is connected with first groove body, and first groove body is connected to the second surface by second groove body.
Wherein, the vacuum absorbing platform includes adsorption hole, opening packet of second groove body on the second surface
Enclose multiple adsorption holes.
Wherein, the bearing assembly further includes sealing element, and the second surface is connected to described true by the sealing element
Empty absorption platform, the sealing ring is around the edge for being set to second groove body.
Wherein, the sealing element is silica gel.
Wherein, multiple interface channels are provided between second groove body and first groove body.
Wherein, the opening structure in closed ring shape of first groove body on the first surface.
The present invention also provides a kind of cutting equipment, including vacuum absorbing platform and laser cutting device, wherein, it is described
Bearing assembly as described above is connected on vacuum absorbing platform.
Another aspect of the present invention is to provide a kind of cutting method of flexible media, including：Offer is cut as described above
Cut equipment；Flexible media to be cut is positioned on the first surface of the support ontology, and makes cutting for the flexible media
Secant is right against the opening of first groove body on the first surface；The vacuum absorbing platform is controlled to generate vacuum suction
Flexible media absorption is fixed on the first surface by power；The laser cutting device is controlled along the cutting line
The flexible media is cut.
Wherein, the flexible media is flexible OLED display panel.
An embodiment of the present invention provides a kind of bearing assemblies, are carried out to flexible media (being, for example, Grazing condition display master blank)
During cutting, flexible media is positioned on bearing assembly and is connected to vacuum absorbing platform, offered and correspond on bearing assembly
First groove body of the cutting line of flexible media, and the adsorption capacity that vacuum absorbing platform provides is to act on flexibility by the first groove body
Medium, therefore when carrying out cutting technique, flexible media has sufficiently large adsorption capacity at the edge of cutting line, and edge is avoided to send out
The problem of raw warpage.In addition, since flexible media is to be connected to vacuum absorbing platform by bearing assembly, when being cut not
The surface of vacuum absorbing platform can be damaged.Further, the first groove body of bearing assembly corresponds to the cutting line of flexible media
Setting can also form the space for avoiding cutting action, the bearing assembly will not be damaged when being cut.
Description of the drawings
Fig. 1 is overlooking the structure diagram when being cut in the prior art to Grazing condition display master blank；
Fig. 2 is cross-sectional view when being cut in the prior art to Grazing condition display master blank；
Fig. 3 is the cross-sectional view of bearing assembly provided in an embodiment of the present invention, also shows to provide in figure
The vacuum absorbing platform of adsorption capacity and the flexible media with cutting；
Fig. 4 is the overlooking the structure diagram of bearing assembly provided in an embodiment of the present invention；
Fig. 5 is the overlooking the structure diagram being positioned over flexible media in the embodiment of the present invention on bearing assembly；
Fig. 6 is the structure diagram of cutter device provided in an embodiment of the present invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the accompanying drawings to the specific reality of the present invention
The mode of applying is described in detail.The example of these preferred embodiments is illustrated in the accompanying drawings.Shown in attached drawing and according to
The embodiments of the present invention of attached drawing description are only exemplary, and the present invention is not limited to these embodiments.
Here, it should also be noted that, in order to avoid because having obscured the present invention during unnecessary details, in the accompanying drawings only
It shows the structure and/or processing step closely related with scheme according to the present invention, and is omitted little with relationship of the present invention
Other details.
The present embodiment provides firstly a kind of bearing assembly, and the bearing assembly is applied to the cutting technique of flexible media
In, the flexible media is, for example, flexible OLED display panel.It is described when carrying out cutting technique to flexible media refering to Fig. 3
Bearing assembly 100 is used to flexible media 200 to be cut being connected to vacuum absorbing platform 300, the vacuum absorbing platform
300 include adsorption hole 301 and can generate vacuum adsorption force, and the vacuum adsorption force that the vacuum absorbing platform 300 generates passes through
The flexible media 200 is adsorbed fixation by the transmission of the bearing assembly 100.
Wherein, as shown in Figure 3 and Figure 4, the bearing assembly 100 includes support ontology 10, and the support ontology 10 includes
Opposite first surface 10a and second surface 10b, the first surface 10a are for carrying the flexible media 200, and described the
Two surface 10b are used to the support ontology 10 being connected to the vacuum absorbing platform 300.It is offered in the support ontology 10
The first groove body 11 being open towards the first surface 10a, first groove body 11 are also connected to the second surface 10b, institute
The first groove body 11 is stated for the vacuum adsorption force that the vacuum absorbing platform 300 generates to be transferred to from the second surface 10b
The first surface 10a, with the fixed flexible media 200 of absorption.
Wherein, refering to Fig. 3 and Fig. 5, opening of first groove body 11 on the first surface 10a is along corresponding to institute
The track extension of the cutting line 201 of flexible media 200 is stated, to form the space for avoiding cutting action.In the present embodiment, it is described
Opening in closed ring shape structure of first groove body 11 on the first surface 10a, is completely corresponding to the flexible media 200
Cutting line 201 track, when flexible media 200 to be cut is positioned over it is described support ontology 10 first surface 10a on
When, the cutting line 201 of the flexible media 200 projects opening positioned at first groove body 11 on the first surface 10a
In mouthful.In some other embodiments, the opening shape of first groove body 11 is in addition to comprising being completely corresponding to the cutting
Except the track of line 201, other interconnected branch shapes can also be further included, to increase adsorption capacity.Total comes
It says, the opening shape of first groove body 11 will at least be completely corresponding to the track of the cutting line 201.It should be noted that
The first groove body 11 positioned at 200 lower section of flexible media is shown using the view of perspective in Fig. 5.
In the present embodiment, as shown in figure 3, being further opened with opening towards the second surface 10b in the support ontology 10
Second groove body 12 of mouth, second groove body 12 are connected with first groove body 11, and first groove body 11 passes through described second
Groove body 12 is connected to the second surface 10b.Specifically, it is provided between second groove body 12 and first groove body 11 more
A interface channel 13.When by it is described support ontology 10 be connected on the vacuum absorbing platform 300 when, second groove body 12 with
The adsorption hole 301 of the vacuum absorbing platform 300 is to connect, second groove body 12,13 and first groove body of interface channel
11 constitute the fluid channel in the support ontology 10, and the vacuum adsorption force that the vacuum absorbing platform 300 generates passes through institute
State the first surface 10a that fluid channel is transferred to the support ontology 10.
In the present embodiment, as shown in Figure 3 and Figure 4, opening packet of second groove body 12 on the second surface 10b
Multiple adsorption holes 301 are enclosed, are inhaled it is possible thereby to obtain sufficiently large vacuum on the first surface 10a of the support ontology 10
Attached power.Further, the bearing assembly 100 further includes sealing element 20, and the second surface 10b of the support ontology 10 passes through institute
It states sealing element 20 and is connected to the vacuum absorbing platform 300, the sealing element 20 is around the side for being set to second groove body 12
Edge.The sealing element 20 to be tightly connected between the support ontology 10 and the vacuum absorbing platform 300, prevents described
When vacuumizing gas leakage occurs for vacuum absorbing platform 300.Preferably, the sealing element 20 is silica gel, and the sealing element 20
It is the cyclic structure of closing.It should be noted that it is shown in Fig. 4 using the view of perspective positioned at 10 lower section of support ontology
Sealing element 20 and adsorption hole 301.
The present embodiment additionally provides a kind of cutting equipment, as shown in fig. 6, the cutting equipment is provided including above-described embodiment
Bearing assembly 100, vacuum absorbing platform 300 and laser cutting device 400.
Wherein, the vacuum absorbing platform 300 is used for as work top and generates vacuum adsorption force；The bearing assembly
100 are connected on the vacuum absorbing platform 300, and the flexible media 200, the bearing assembly 100 are cut for carrying belt
It is additionally operable to the vacuum adsorption force that the vacuum absorbing platform 300 generates being transferred to the flexible media 200, by the flexibility
The absorption of medium 200 is fixed on the bearing assembly 100；The laser cutting device 400 is set to the vacuum absorbing platform
300 relatively above, for being cut to the flexible media 200.
With reference to the course of work of cutting equipment as described above, a kind of cutting method of flexible media is introduced.
Specifically, with reference to attached drawing 5 and Fig. 6, a kind of cutting method of flexible media is present embodiments provided, in the present embodiment
In, the flexible media refers to flexible OLED display panel, particularly relates to the Grazing condition OLED after being removed from glass substrate
Display panel.The cutting method includes step：
Cutting equipment described in S10, offer present invention.
S20, refering to Fig. 5, flexible OLED display panel 200 to be cut is positioned over to the first table of the support ontology 10
On the 10a of face, and the cutting line 201 of the flexible OLED display panel 200 is made to be right against first groove body 11 described first
Opening on the 10a of surface.
S30, refering to Fig. 6, the vacuum absorbing platform 300 is controlled to generate vacuum adsorption force, will by the bearing assembly 100
The vacuum adsorption force that the vacuum absorbing platform 300 generates is transferred to the flexible OLED display panel 200, by the flexibility
OLED display panel 200, which is adsorbed, to be fixed on the first surface 10a of the support ontology 10.
S40, refering to Fig. 6, the laser cutting device 400 is controlled to be shown along the cutting line 201 to the flexibility OLED
Show that panel 200 is cut, complete the cutting technique of flexible OLED display panel 200.
The cutter device and flexible media that above example is provided are cutting methods, increase and are provided with bearing assembly,
When being cut to flexible media, flexible media is positioned on bearing assembly and is connected to vacuum absorbing platform, carrying group
Offer the first groove body of the cutting line corresponding to flexible media on part, and the adsorption capacity that vacuum absorbing platform provides is by the
One groove body acts on flexible media, therefore when carrying out cutting technique, and flexible media has sufficiently large at the edge of cutting line
Adsorption capacity avoids the problem that warpage occurs for edge.In addition, since flexible media is to be connected to vacuum suction by bearing assembly to put down
Platform will not damage the surface of vacuum absorbing platform when being cut.Further, the first groove body of bearing assembly corresponds to
The cutting line setting of flexible media, can also form the space for avoiding cutting action, institute will not be damaged when being cut
State bearing assembly.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any this practical relationship or sequence.Moreover, term " comprising ", "comprising" or its any other variant are intended to
Non-exclusive inclusion, so that process, method, article or equipment including a series of elements not only will including those
Element, but also including other elements that are not explicitly listed or further include as this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
Also there are other identical elements in process, method, article or equipment including the element.
The above is only the specific embodiment of the application, it is noted that for the ordinary skill people of the art
For member, under the premise of the application principle is not departed from, several improvements and modifications can also be made, these improvements and modifications also should
It is considered as the protection domain of the application.
Claims (10)
1. a kind of bearing assembly, for flexible media to be cut to be connected to vacuum absorbing platform, which is characterized in that described
Bearing assembly includes support ontology, and the support ontology includes opposite first surface and second surface, and the first surface is used
In carrying the flexible media, the second surface is used to the support ontology being connected to the vacuum absorbing platform；
Wherein, the first groove body being open towards the first surface is offered in the support ontology, first groove body also connects
The second surface is passed to, for the vacuum adsorption force that the vacuum absorbing platform generates to be transferred to institute from the second surface
First surface is stated, with the fixed flexible media of absorption；The opening of first groove body on the first surface is along correspondence
In the track extension of the cutting line of the flexible media, to form the space for avoiding cutting action.
2. bearing assembly according to claim 1, which is characterized in that be further opened in the support ontology towards described the
Second groove body of two surface openings, second groove body are connected with first groove body, and first groove body passes through described second
Groove body is connected to the second surface.
3. bearing assembly according to claim 2, which is characterized in that the vacuum absorbing platform includes adsorption hole, described
Opening of second groove body on the second surface surrounds multiple adsorption holes.
4. bearing assembly according to claim 2, which is characterized in that the bearing assembly further includes sealing element, and described
Two surfaces are connected to the vacuum absorbing platform by the sealing element, and the sealing ring is around being set to second groove body
Edge.
5. bearing assembly according to claim 4, which is characterized in that the sealing element is silica gel.
6. bearing assembly according to claim 2, which is characterized in that set between second groove body and first groove body
It is equipped with multiple interface channels.
7. bearing assembly according to claim 1, which is characterized in that first groove body opening on the first surface
Mouth structure in closed ring shape.
A kind of 8. cutting equipment, including vacuum absorbing platform and laser cutting device, which is characterized in that the vacuum absorbing platform
The upper connection bearing assembly any just like claim 1-6.
9. a kind of cutting method of flexible media, which is characterized in that including：
Cutting equipment as claimed in claim 8 is provided；
Flexible media to be cut is positioned on the first surface of the support ontology, and makes the cutting line of the flexible media
It is right against the opening of first groove body on the first surface；
The vacuum absorbing platform is controlled to generate vacuum adsorption force, the first surface is fixed in flexible media absorption
On；
The laser cutting device is controlled to be cut along the cutting line to the flexible media.
10. the cutting method of flexible media according to claim 9, which is characterized in that the flexible media is flexibility
OLED display panel.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465231.XA CN108198772B (en) | 2017-12-28 | 2017-12-28 | Bearing assembly, cutting equipment and cutting method of flexible medium |
| PCT/CN2018/073064 WO2019127715A1 (en) | 2017-12-28 | 2018-01-17 | Bearing assembly and cutting device, and method for cutting flexible medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711465231.XA CN108198772B (en) | 2017-12-28 | 2017-12-28 | Bearing assembly, cutting equipment and cutting method of flexible medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108198772A true CN108198772A (en) | 2018-06-22 |
| CN108198772B CN108198772B (en) | 2020-11-17 |
Family
ID=62585885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711465231.XA Active CN108198772B (en) | 2017-12-28 | 2017-12-28 | Bearing assembly, cutting equipment and cutting method of flexible medium |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108198772B (en) |
| WO (1) | WO2019127715A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817715A (en) * | 2018-09-10 | 2018-11-16 | 广东正业科技股份有限公司 | A kind of vacuum absorption device |
| CN109326629A (en) * | 2018-09-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | The motherboard structure and cutting method of flexible OLED display panel |
| CN110625828A (en) * | 2019-10-24 | 2019-12-31 | 云谷（固安）科技有限公司 | Cutting device and cutting method |
| CN110860811A (en) * | 2019-11-29 | 2020-03-06 | 上海精测半导体技术有限公司 | Laser cutting microscope carrier |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11188554A (en) * | 1997-12-25 | 1999-07-13 | Shinx Ltd | Vacuum table device of machine tool |
| US6176652B1 (en) * | 1999-07-08 | 2001-01-23 | Chunghwa Picture Tubes, Ltd. | Drilling machine with vacuum suction table |
| CN101170075A (en) * | 2006-10-27 | 2008-04-30 | 株式会社迪思科 | Wafer dividing method and apparatus |
| CN101722370A (en) * | 2009-12-25 | 2010-06-09 | 奇瑞汽车股份有限公司 | Laser cutting device for battery pole piece |
| CN101774087A (en) * | 2009-12-25 | 2010-07-14 | 奇瑞汽车股份有限公司 | Vacuum adsorption device of battery pole piece |
| CN203184838U (en) * | 2013-03-07 | 2013-09-11 | 奇瑞汽车股份有限公司 | Vacuum suction device and base thereof |
| CN106181053A (en) * | 2015-04-29 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Prevent from cutting pollution cuts localization tool and dust outlet geometry thereof and method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104096980B (en) * | 2014-06-26 | 2016-01-20 | 长春光华微电子设备工程中心有限公司 | laser cutting vacuum absorbing platform |
| CN104759765B (en) * | 2015-02-04 | 2017-02-01 | 大族激光科技产业集团股份有限公司 | fixture for laser cutting |
-
2017
- 2017-12-28 CN CN201711465231.XA patent/CN108198772B/en active Active
-
2018
- 2018-01-17 WO PCT/CN2018/073064 patent/WO2019127715A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11188554A (en) * | 1997-12-25 | 1999-07-13 | Shinx Ltd | Vacuum table device of machine tool |
| US6176652B1 (en) * | 1999-07-08 | 2001-01-23 | Chunghwa Picture Tubes, Ltd. | Drilling machine with vacuum suction table |
| CN101170075A (en) * | 2006-10-27 | 2008-04-30 | 株式会社迪思科 | Wafer dividing method and apparatus |
| CN101722370A (en) * | 2009-12-25 | 2010-06-09 | 奇瑞汽车股份有限公司 | Laser cutting device for battery pole piece |
| CN101774087A (en) * | 2009-12-25 | 2010-07-14 | 奇瑞汽车股份有限公司 | Vacuum adsorption device of battery pole piece |
| CN203184838U (en) * | 2013-03-07 | 2013-09-11 | 奇瑞汽车股份有限公司 | Vacuum suction device and base thereof |
| CN106181053A (en) * | 2015-04-29 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Prevent from cutting pollution cuts localization tool and dust outlet geometry thereof and method |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108817715A (en) * | 2018-09-10 | 2018-11-16 | 广东正业科技股份有限公司 | A kind of vacuum absorption device |
| CN108817715B (en) * | 2018-09-10 | 2020-07-28 | 广东正业科技股份有限公司 | Vacuum adsorption device |
| CN109326629A (en) * | 2018-09-17 | 2019-02-12 | 武汉华星光电半导体显示技术有限公司 | The motherboard structure and cutting method of flexible OLED display panel |
| WO2020057054A1 (en) * | 2018-09-17 | 2020-03-26 | 武汉华星光电半导体显示技术有限公司 | Motherboard structure for flexible oled display panel and cutting method |
| CN109326629B (en) * | 2018-09-17 | 2021-02-02 | 武汉华星光电半导体显示技术有限公司 | Motherboard structure of flexible OLED display panel and cutting method |
| CN110625828A (en) * | 2019-10-24 | 2019-12-31 | 云谷（固安）科技有限公司 | Cutting device and cutting method |
| CN110860811A (en) * | 2019-11-29 | 2020-03-06 | 上海精测半导体技术有限公司 | Laser cutting microscope carrier |
| CN111730218A (en) * | 2020-06-23 | 2020-10-02 | 深圳市合川医疗科技有限公司 | Laser cutting method for microfluidic chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108198772B (en) | 2020-11-17 |
| WO2019127715A1 (en) | 2019-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108198772A (en) | Bearing assembly and cutting equipment, the cutting method of flexible media | |
| CN108188590B (en) | Cutting method of flexible medium | |
| US9950505B2 (en) | Method for manufacturing flexible display device | |
| CN101386223B (en) | Stripping device of polarizer sheet | |
| WO2007129554A1 (en) | Thin-sheet glass laminate, process for manufacturing display apparatus using the laminate, and supporting glass substrate | |
| WO2003040049A1 (en) | Method and device for parting glass substrate, liquid crystal panel, and liquid crystal panel manufacturing device | |
| TWI659849B (en) | Peeling device and method of laminated body, and manufacturing method of electronic device | |
| WO2008157108A3 (en) | Metal plugged substrates with no adhesive between metal and polyimide | |
| CN101634809B (en) | Method for exposing single-sided flexible circuit board | |
| WO2007044685A3 (en) | Multi-layer optical article with holders | |
| CN103441087A (en) | Method and device for manufacturing flexible substrate | |
| CN112571892A (en) | Laminated glass plate and method for manufacturing laminated glass plate | |
| CN106415375B (en) | Display unit manufacturing method and optical film laminating system | |
| TW201318095A (en) | Thin substrate supporting apparatus and the fabricating method thereof | |
| CN112408805A (en) | Ultrathin glass thinning bearing device and thinning device | |
| KR100615217B1 (en) | Method of manufacturing flat panel display device | |
| TWI467037B (en) | Glass substrate stacking structure, apparatus and method for film coating process | |
| CN105773853B (en) | Side thin lens drilling ware component | |
| KR100669792B1 (en) | Method of manufacturing a forming substrate, method of manufacturing a flat panel display device thereused, and pre-bonding apparatus of flexible substrate | |
| CN107046778A (en) | A kind of preparation method of buried capacitor printed circuit board | |
| CN206537605U (en) | Bearing substrate | |
| CN104391394B (en) | Display panel motherboard, display panel, display device and manufacture method | |
| TWI659848B (en) | Peeling device and method of laminated body, and manufacturing method of electronic device | |
| JPH01154712A (en) | Semiconductor wafer mounter | |
| TWM542319U (en) | Carrier structure and carrier substrate thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |