CN108181120A - A kind of more equipment thermal cycling test devices - Google Patents
A kind of more equipment thermal cycling test devices Download PDFInfo
- Publication number
- CN108181120A CN108181120A CN201711441358.8A CN201711441358A CN108181120A CN 108181120 A CN108181120 A CN 108181120A CN 201711441358 A CN201711441358 A CN 201711441358A CN 108181120 A CN108181120 A CN 108181120A
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- China
- Prior art keywords
- equipment
- heat
- conducting plate
- plate
- thermal cycling
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/002—Thermal testing
Abstract
The invention discloses a kind of more equipment thermal cycling test devices, described device includes heat-conducting plate (1) and several equipment (3), several equipment are mounted on by fixed component on heat-conducting plate (1), heat filling (2) is filled between equipment mounting surface and heat-conducting plate (1), several ventholes (4) are opened up on heat-conducting plate (1);The heat-conducting plate be high heat conduction plate, thickness be 1.5 5cm, surface planarity≤0.2mm/100mm, surface roughness≤3.2 μm;Surface planarity≤0.2mm/100mm of the equipment mounting surface of several equipment, surface roughness≤3.2 μm.While the device examines temperature consistent when ensureing that distinct device is tested simultaneously, manpower and materials cost is substantially saved, has achieved good effect.
Description
Technical field
The invention belongs to satellite load experimental technique field, in particular it relates to a kind of more equipment thermal cycling tests
Device.
Background technology
Same system multiple devices, which are put together, carries out thermal cycling test, due to the difference of itself heat consumption of each equipment, respectively
The volume weight difference of equipment, installation site are from the factors such as hot/cold source distance difference in thermal cycle high-low temperature chamber, it is difficult to ensure institute
There is equipment all to be balanced in same temperature by examination temperature (examining temperature control monitoring point for equipment test at general selected equipment nonthermal source)
Degree point (all equilibrates in respective experiment tolerance) in high/low temperature operating mode.And satellite borne equipment needs high reliability,
Thermal cycling test be each onboard system must by one of reliability environment test, homologous ray generally requires when examining performance
More equipment, which connect, can just be such that performance is fully examined.Same system multiple devices are set when being carried out at the same time cycling environments experiment
Standby practical examination temperature be relatively inaccessible to be unanimously that each satellite of puzzlement is overall and subsystem for many years the problem of, general way is height
Only allow to be put into an equipment other equipment training mate in temperature incubator or several equipment are actually examined simultaneously into high-low temperature incubator but expansion
Nuclear temperature range.
It is spaceborne effective with the raising that modern payload task is required in precision, stability, functional diversity etc.
The complexity of load task system is higher and higher, also more and more comprising equipment, is found through overtesting, is carried out when entering tank simultaneously
The equipment of experiment is more than 3 and wherein two equipment heat consumption differences when being more than more than 10W, multiple devices carry out thermal cycle jointly
To be relatively inaccessible to the problem of consistent more notable for experiment examination temperature controlling point in each equipment during experiment.And an equipment enters tank and is tested
The way of other equipment training mate outside tank extremely expends again in human and material resources cost.
Invention content
The object of the present invention is to provide a kind of more equipment thermal cycling test device and method, which is ensureing equipment
While temperature consistency, manpower and materials cost has substantially been saved, has achieved good effect.
In order to achieve the above objectives, present invention employs following technical solutions:
A kind of more equipment thermal cycling test devices, described device include heat-conducting plate 1 and several equipment 3, several equipment
It is mounted on heat-conducting plate 1 by fixed component, heat filling 2 is filled between equipment mounting surface and heat-conducting plate 1, is opened on heat-conducting plate 1
If several ventholes 4;
The heat-conducting plate be high heat conduction plate, thickness 1.5-5cm, surface planarity≤0.2mm/100mm, rough surface
≤ 3.2 μm of degree;
Surface planarity≤0.2mm/100mm of the equipment mounting surface of several equipment, surface roughness≤3.2 μm.
Preferably, the high heat conduction plate is the metallic plate of thermal conductivity >=120W/mK.Of course, high heat conduction plate can be with
It is non-metal board.
It is further preferred that the metallic plate is aluminium alloy plate or copper plate.
Preferably, the heat filling is heat-conducting silicone grease, heat conductive pad, heat conductive insulating pad or is flexible high thermal conductivity
Metallic film.It is further preferred that the metallic film of the high thermal conductivity of the flexibility is the indium metal thin slice of thickness≤1mm.It leads
The heat conductive pad of commercialization, heat conductive insulating pad may be used in heat pad, heat conductive insulating pad.
Preferably, the fixed component is screw and/or press strip 5.
The present invention be directed to due to itself heat consumption of each equipment difference, the volume weight difference of each equipment, installation site from
The inconsistent situation of more device temperatures caused by the factors such as hot/cold source distance difference, is set using more in thermal cycle high-low temperature chamber
It is standby to be tested simultaneously into thermal cycle high-low temperature incubator, but a common heat-conducting plate is applied to multiple devices, and by more
Equipment is tightly fixed on common heat-conducting plate, and heat filling is added between equipment and heat-conducting plate.The present invention relates to more than one
Heat-conducting plate, heat filling and the equipment that equipment is installed jointly are mounted on the installation method on heat-conducting plate.The heat-conducting plate of equipment can be with
It is certain thickness metallic plate, metal can be aluminium alloy, copper plate, prepared and set according to the placement position of equipment on heat-conducting plate
Standby mounting hole holds several screw holes successfully at regular intervals in advance, and mounting bar is pressed abd fixed on heat-conducting plate by press strip
On, certain venthole is opened up on heat-conducting plate so that high temperature incubator interior air-flow circulates, the thickness of metallic plate is generally 1.5cm extremely
5cm, preferably 2-3cm, also can expanded scope, the flatness of the mounting surface of metallic plate is generally preferred over 0.1mm/100mm, at least up to
To 0.2mm/100mm, the surface roughness of metallic plate is generally preferred over 3.2 μm;Heat filling can be heat-conducting silicone grease, heat conductive pad,
Heat conductive insulating pad or the metallic film for being flexible high thermal conductivity;When equipment is installed, first installed with absolute alcohol cleaning equipment
Bottom plate cleans heat conductive pad or metallic film, heat conductive pad or metallic film is placed on equipment installation site, leads to after equipment is placed
It crosses screw foot is directly fixedly mounted or compresses installation foot by press strip, press strip is tightly fixed to what is held successfully in advance by screw
On mounting hole, to temperature measuring point is sticked at individual device nonthermal source, then tested.
Relative to the prior art, the present invention has the advantage that:
1st, multiple devices respectively test the consistency of practical examination temperature and are greatly improved;
2nd, compared with one equipment enters the mode of thermal cycle high-low temperature incubator multiple devices line training mate outside incubator, with one
If a identification grade thermal cycling test need to carry out 14 days or so, 6 equipment need at least calculate over 84 days, a system carries out
The time of thermal cycling test shortens at least 6 times, and general heat test is required for testing crew monitoring on duty in real time, using this hair
After bright device and method, human cost and experimentation cost is greatly reduced, and significantly reduce the lead time;With certain model
Example, when six distinct devices are tested simultaneously, the temperature difference of six equipment is before the device and method using this paper
The thermal cycling test temperature difference reaches 4 degree or more, using the temperature difference of equipment after the experimental rig and method of this paper reached 2 degree it
It is interior so that the temperature franchise of all devices reaches temperature range, and test period is also greatly reduced, and ensures more equipment examinations
It tests and time, human and material resources cost has substantially been saved while temperature consistency is all met the requirements.
3rd, the present invention considers equipment it is possible that can be contaminated, so being led between heat-conducting plate and equipment in addition to that can add
Hot silicone grease is also changed to the metallic film of flexible high thermal conductivity, has better resistance tocrocking, especially carries out positive sample heat and follow
When ring environment is tested.
Description of the drawings
Fig. 1 is the structure diagram of apparatus of the present invention;
Structure diagram when Fig. 2 is the present invention one equipment of installation;
Reference numeral:1st, heat-conducting plate;2nd, heat filling;3rd, equipment;4th, venthole;5th, press strip.
Specific embodiment
With the drawings and specific embodiments, the present invention is described in further detail below.
Embodiment 1
A kind of more equipment thermal cycling test devices, described device include heat-conducting plate 1 and several equipment 3, several equipment
It is mounted on heat-conducting plate 1 by fixed component, heat filling 2 is filled between equipment mounting surface and heat-conducting plate 1, is opened on heat-conducting plate 1
If several ventholes 4;
The heat-conducting plate be high heat conduction plate, thickness 1.5-5cm, surface planarity≤0.2mm/100mm, rough surface
≤ 3.2 μm of degree.
The heat consumption of at least two equipment and thermal capacity are different in several equipment, typically using certain practical spaceborne task as
Example, 6 equipment carry out thermal cycling test jointly, and equipment 1 and 2 heat consumption of equipment are all 4W, weight 1.1Kg, body dimension 150mm*
40mm*120mm;3 heat consumption 12W of equipment, weight 3.6Kg, body dimension 205mm*115mm*128mm;4 heat consumption 14W of equipment, weight
3.4Kg, body dimension 199mm*60mm*159mm;5 heat consumption 30W of equipment, weight 7.5Kg, body dimension 280mm*140mm*
198mm;6 heat consumption 36W of equipment, weight 6.4Kg, body dimension 226mm*156mm*166mm.
Surface planarity≤0.2mm/100mm of the equipment mounting surface of several equipment, surface roughness≤3.2 μm.
The high heat conduction plate is the copper plate of thermal conductivity >=120W/mK.
The heat filling is flexible the metallic film of high thermal conductivity, specially the indium metal thin slice of thickness≤1mm.
The fixed component is screw and/or press strip 5.
The mounting hole of equipment is prepared on heat-conducting plate according to the placement position of equipment, is first installed with absolute alcohol cleaning equipment
The indium metal thin slice of thickness≤1mm is placed on mounting base by bottom plate, then the mounting hole that equipment alignment has been set, and is made
It is fixed with screw or screw and press strip, is then tested.
Embodiment 2
As depicted in figs. 1 and 2, a kind of more equipment thermal cycling test devices, described device includes heat-conducting plate 1 and several set
Standby 3, several equipment are mounted on by fixed component on heat-conducting plate 1, are heat filling 2 between equipment mounting surface and heat-conducting plate 1;
The heat-conducting plate be high heat conduction plate, thickness 2-3cm, surface planarity≤0.2mm/100mm, surface roughness
≤3.2μm;
The heat consumption of different at least two equipment is different in several equipment, typically by taking certain practical spaceborne task as an example, 4
Equipment carries out thermal cycling test, 1 heat consumption 0.5W of equipment, weight 0.75Kg, body dimension 162mm*33mm*84mm jointly;Equipment 2
Heat consumption 14W, weight 6.5Kg, body dimension 270mm*174mm*195mm;3 heat consumption 15W of equipment, weight 4.2Kg, body dimension
210mm*130mm*152mm;4 heat consumption 26W of equipment, weight 10.6Kg, body dimension 284mm*159mm*244mm.
Surface planarity≤0.2mm/100mm of the equipment mounting surface of several equipment, surface roughness≤3.2 μm.
The high heat conduction plate is the aluminium alloy plate of thermal conductivity >=120W/mK.
The heat filling is heat-conducting silicone grease, and the fixed component is screw and/or press strip 4.
If the mounting hole of equipment is prepared according to the placement position of equipment on heat-conducting plate or is held successfully at regular intervals in advance
First with absolute alcohol cleaning equipment mounting base, heat-conducting silicone grease is put on mounting base for dry hole, then equipment alignment has been set
Good mounting hole, is fixed using screw or screw and press strip.To temperature measuring point is sticked at individual device nonthermal source, then carry out
Experiment.
Piglet s colibacillosis
Compared with one equipment enters the mode of thermal cycle high-low temperature incubator multiple devices line training mate outside incubator, with one
If identification grade thermal cycling test need to carry out 14 days or so, 6 equipment need at least calculate over 84 days, a system carries out heat
The time of cyclic test shortens at least 6 times, and general heat test is required for testing crew monitoring on duty in real time, using the present invention
Device and method after, human cost and experimentation cost is greatly reduced, and significantly reduce the lead time;
By taking certain model as an example, when six distinct devices are tested simultaneously, the temperature difference of six equipment is using this
The thermal cycling test temperature difference reaches 4 degree or more before the device and method of text, using equipment after the experimental rig and method of this paper
The temperature difference reached within 2 degree so that the temperature franchises of all devices reaches temperature range, and test period has also obtained substantially
It reduces, ensures and time, human and material resources cost have substantially been saved while more equipment test temperature consistencies are all met the requirements.It adopts
The system for carrying out thermal cycling test with experimental rig of the present invention and method has been launched successfully, in orbit well.
It should be noted last that the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted.Although ginseng
The present invention is described in detail according to embodiment, it will be apparent to an ordinarily skilled person in the art that the technical side to the present invention
Case is modified or replaced equivalently, and without departure from the spirit and scope of technical solution of the present invention, should all be covered in the present invention
Right in.
Claims (6)
1. a kind of more equipment thermal cycling test devices, which is characterized in that described device includes heat-conducting plate (1) and several equipment
(3), several equipment are mounted on by fixed component on heat-conducting plate (1), and heat conduction is filled between equipment mounting surface and heat-conducting plate (1)
Filler (2) opens up several ventholes (4) on heat-conducting plate (1);
The heat-conducting plate be high heat conduction plate, thickness 1.5-5cm, surface planarity≤0.2mm/100mm, surface roughness≤
3.2μm;
Surface planarity≤0.2mm/100mm of the equipment mounting surface of several equipment, surface roughness≤3.2 μm.
2. more equipment thermal cycling test devices according to claim 1, which is characterized in that the high heat conduction plate is thermal conductivity
The metallic plate of >=120W/mK.
3. more equipment thermal cycling test devices according to claim 2, which is characterized in that the metallic plate is aluminium alloy plate
Or copper plate.
4. more equipment thermal cycling test devices according to claim 1, which is characterized in that the heat filling is thermal conductive silicon
Fat, heat conductive pad, heat conductive insulating pad or the metallic film for being flexible high thermal conductivity.
5. more equipment thermal cycling test devices according to claim 4, which is characterized in that the high thermal conductivity of the flexibility
Metallic film is the indium metal thin slice of thickness≤1mm.
6. more equipment thermal cycling test devices according to claim 1, which is characterized in that the fixed component is screw
And/or press strip (5).
Priority Applications (1)
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CN201711441358.8A CN108181120A (en) | 2017-12-27 | 2017-12-27 | A kind of more equipment thermal cycling test devices |
Applications Claiming Priority (1)
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CN201711441358.8A CN108181120A (en) | 2017-12-27 | 2017-12-27 | A kind of more equipment thermal cycling test devices |
Publications (1)
Publication Number | Publication Date |
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CN108181120A true CN108181120A (en) | 2018-06-19 |
Family
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CN201711441358.8A Pending CN108181120A (en) | 2017-12-27 | 2017-12-27 | A kind of more equipment thermal cycling test devices |
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Citations (6)
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CN104007351A (en) * | 2014-06-17 | 2014-08-27 | 北京航空航天大学 | Method for determining spacecraft electronic assembly heat cycle test scheme |
CN104466305A (en) * | 2014-11-03 | 2015-03-25 | 上海卫星工程研究所 | Outer bearing cylinder aircraft storage battery thermal control device |
CN104816839A (en) * | 2015-04-22 | 2015-08-05 | 上海微小卫星工程中心 | Satellite platform modular thermal control device |
CN105928723A (en) * | 2016-04-20 | 2016-09-07 | 上海微小卫星工程中心 | Flight model satellite test method and system of minisatellite |
CN106275496A (en) * | 2016-08-12 | 2017-01-04 | 上海卫星工程研究所 | A kind of heat balance test method of the one many stars of tank |
CN106500878A (en) * | 2016-12-21 | 2017-03-15 | 四川航天计量测试研究所 | A kind of calibration of thermocouple heater |
-
2017
- 2017-12-27 CN CN201711441358.8A patent/CN108181120A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104007351A (en) * | 2014-06-17 | 2014-08-27 | 北京航空航天大学 | Method for determining spacecraft electronic assembly heat cycle test scheme |
CN104466305A (en) * | 2014-11-03 | 2015-03-25 | 上海卫星工程研究所 | Outer bearing cylinder aircraft storage battery thermal control device |
CN104816839A (en) * | 2015-04-22 | 2015-08-05 | 上海微小卫星工程中心 | Satellite platform modular thermal control device |
CN105928723A (en) * | 2016-04-20 | 2016-09-07 | 上海微小卫星工程中心 | Flight model satellite test method and system of minisatellite |
CN106275496A (en) * | 2016-08-12 | 2017-01-04 | 上海卫星工程研究所 | A kind of heat balance test method of the one many stars of tank |
CN106500878A (en) * | 2016-12-21 | 2017-03-15 | 四川航天计量测试研究所 | A kind of calibration of thermocouple heater |
Non-Patent Citations (1)
Title |
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Application publication date: 20180619 |