CN108174534B

CN108174534B - Antenna embedded type KU waveband converter circuit board air cavity manufacturing process

Info

Publication number: CN108174534B
Application number: CN201810018686.5A
Authority: CN
Inventors: 陈国兴; 陈伟; 焦鹏云; 周国新
Original assignee: Guangzhou Ttm Electronic Technologies Co ltd
Current assignee: Guangzhou Ttm Electronic Technologies Co ltd
Priority date: 2018-01-09
Filing date: 2018-01-09
Publication date: 2021-06-01
Anticipated expiration: 2038-01-09
Also published as: CN108174534A

Abstract

The invention discloses an antenna embedded KU waveband converter circuit board air cavity manufacturing process, which comprises the following steps: l1-2 layer process flow; l3-8 layers of manufacturing process; l1-8 layer process flow. Wherein the specific flow of L1-L2: cutting the L1 layer and the L2 layer, transferring the inner layer pattern to the L1 layer and the L2 layer, etching the L1 layer and the L2 layer, punching, performing AOI automatic optical detection on the L1-L2 layer, performing oxidation treatment on the inner layer of the L1-L2 layer, and finally attaching a barrier film to the bottom of the L2 layer to obtain an L1-2 layer; the invention has the beneficial effects that: the scheme is used for manufacturing the microwave antenna in an L2 layer open cavity: the process is simple, need not add the bed course, also need not gong empty P piece, directly mills off L3-8 layers of lid behind the finished product, if gong empty P piece, add the gasket, have the cavity and be doing the risk that wet flow oozed liquid medicine, the lamination rear surface is uneven, and follow-up processing procedure is difficult to go on.

Description

Antenna embedded type KU waveband converter circuit board air cavity manufacturing process

Technical Field

The invention relates to the technical fields of radar, navigation, electronic countermeasure, microwave communication and space, in particular to an air cavity manufacturing process of a KU band converter circuit board with an embedded antenna.

Background

The microwave solid state source integrated circuit has been developed rapidly in recent years, and has been widely used in the fields of satellite communication, television relay, relay communication, data and image transmission, radar, remote control and shake, guided weapons, etc., the existing KU band converter antenna is independent, and external antennas are required for receiving and transmitting signals, for example, an external antenna is required for being erected for receiving satellite digital televisions, and with the continuous development of modern electronic systems such as mobile communication, mobile radar, guided weapons, etc., the external antenna has large volume and heavy weight, and is inconvenient to move and carry, so that the antenna and the converter need to be integrated on the same circuit board.

The existing converter circuit board manufacturing process is a manufacturing process of a common single board: inner layer process, pressing plate, mechanical drilling, chemical copper deposition, electroplating, pattern transfer, electroplating, etching, green oil, forming and surface treatment.

Disclosure of Invention

The invention aims to solve the problems in the background art by providing an air cavity manufacturing process of a KU band converter circuit board with an embedded antenna type, wherein a board-mounted antenna generates a high-frequency microwave signal through a cavity design and is suitable for mobile equipment.

In order to achieve the purpose, the invention provides the following technical scheme:

an antenna embedded KU band converter circuit board air cavity manufacturing process comprises the following steps:

1) l1-2 layer process flow;

2) l3-8 layers of manufacturing process;

3) l1-8 layer process flow.

The specific process of the L1-2 layer manufacturing comprises the following steps: cutting the L1 layer and the L2 layer, transferring the inner layer pattern to the L1 layer and the L2 layer, etching the L1 layer and the L2 layer, punching, performing AOI automatic optical detection on the L1-L2 layer, performing oxidation treatment on the inner layer of the L1-L2 layer, and finally attaching a barrier film to the bottom of the L2 layer to obtain the L1-2 layer.

The process for manufacturing the L3-8 layer specifically comprises the following steps: mechanically drilling an inner-layer flow pressing plate on the L3-L8 layer, then carrying out chemical copper deposition/electroplating treatment, carrying out dry film treatment on the L3-8 layer under the conditions of the temperature of 20 +/-1 ℃ and the humidity of 60 +/-5%, then sequentially carrying out hole plating, film stripping, hole plugging and plate grinding, 2ND copper deposition and plate electrical treatment on the L3-8 layer, and finally sequentially carrying out 2ND pattern transfer, electroplating/etching, inner-layer AOI automatic optical detection, inner-layer oxidation and plate arrangement treatment to obtain the L3-8 layer.

The process for manufacturing the L1-8 layer specifically comprises the following steps: performing secondary pressing plate treatment on the L1-2 layer and the L3-8 layer to obtain an L1-L8 layer, performing laser drilling treatment on the L1-8 layer by using a laser drilling machine, performing hole cleaning treatment on holes subjected to the laser drilling treatment, and performing mechanical drilling by using the drilling machine; then sequentially carrying out glue removal, chemical copper deposition/electroplating, dry film, hole plating, film stripping, hole plugging, plate grinding, mechanical drilling, 2ND copper deposition, plate electroplating, 2ND pattern transfer and electroplating/etching treatment on the circuit board, and carrying out outer layer AOI automatic optical detection and outer layer inspection on the treated circuit board; coating the green oil on a circuit board and a base material which do not need to be welded, and then printing characters on the circuit board; and (4) routing L3-8 layers, performing electrical measurement detection on the circuit, and finally performing surface treatment, silver deposition and packaging on the circuit board to obtain the manufactured KU band converter circuit board embedded with the antenna.

Compared with the prior art, the invention has the beneficial effects that: the scheme is used for manufacturing the microwave antenna in an L2 layer open cavity: the process is simple, need not add the bed course, also need not gong empty P piece, directly mills off L3-8 layers of lid behind the finished product, if gong empty P piece, add the gasket, have the cavity and be doing the risk that wet flow oozed liquid medicine, the lamination rear surface is uneven, and follow-up processing procedure is difficult to go on.

Drawings

Fig. 1 is a schematic structural diagram of an 8-layer antenna board processed by an air cavity manufacturing process of a KU-band converter circuit board with an embedded antenna.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Referring to fig. 1, a process for manufacturing an air cavity of a KU-band converter circuit board embedded in an antenna,

for an 8-layer antenna board, the antenna portion of the L2 layer needs to be exposed, and for this purpose, a two-lamination scheme is used:

the inner layer circuit of L1-L2 layers is manufactured, and the circuit of the converter part is manufactured by laminating L3-L8 layers.

And adding a barrier film at the position of the antenna of the L2 layer, and pressing the L1-L2 layer and the L3-L8 layer together to form an outer layer pattern.

And milling L3-L8 layers by depth control milling to expose L2 layers of antennas.

The KU wave band converter circuit board air cavity manufacturing process of embedding antenna formula specifically makes the flow: comprises that

L1-2 layer manufacturing procedure: cutting the L1 layer and the L2 layer, transferring the inner layer pattern to the L1 layer and the L2 layer, etching the L1 layer and the L2 layer, punching, performing AOI automatic optical detection on the L1-L2 layer, performing oxidation treatment on the inner layer of the L1-L2 layer, and finally attaching a barrier film to the bottom of the L2 layer to obtain the L1-2 layer.

L3-8 layer manufacturing flow:

mechanically drilling an inner-layer flow pressing plate on the L3-L8 layer, then carrying out chemical copper deposition/electroplating treatment, carrying out dry film treatment on the L3-8 layer under the conditions of the temperature of 20 +/-1 ℃ and the humidity of 60 +/-5%, then sequentially carrying out hole plating, film stripping, hole plugging and plate grinding, 2ND copper deposition and plate electrical treatment on the L3-8 layer, and finally sequentially carrying out 2ND pattern transfer, electroplating/etching, inner-layer AOI automatic optical detection, inner-layer oxidation and plate arrangement treatment to obtain the L3-8 layer.

L1-8 layer manufacturing process:

performing secondary pressing plate treatment on the L1-2 layer and the L3-8 layer to obtain an L1-L8 layer, performing laser drilling treatment on the L1-8 layer by using a laser drilling machine, performing hole cleaning treatment on holes subjected to the laser drilling treatment, and performing mechanical drilling by using the drilling machine; then sequentially carrying out glue removal, chemical copper deposition/electroplating, dry film, hole plating, film stripping, hole plugging, plate grinding, mechanical drilling, 2ND copper deposition, plate electroplating, 2ND pattern transfer and electroplating/etching treatment on the circuit board, and carrying out outer layer AOI automatic optical detection and outer layer inspection on the treated circuit board; coating the green oil on a circuit board and a base material which do not need to be welded, and then printing characters on the circuit board; and (4) routing L3-8 layers, performing electrical measurement detection on the circuit, and finally performing surface treatment, silver deposition and packaging on the circuit board to obtain the manufactured KU band converter circuit board embedded with the antenna.

Although the preferred embodiments of the present patent have been described in detail, the present patent is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present patent within the knowledge of those skilled in the art.

Claims

1. The air cavity manufacturing process of the KU band converter circuit board embedded with the antenna needs to expose the antenna part of the L2 layer for the 8-layer antenna board, and a two-time laminating scheme is adopted for the process: firstly, an inner layer circuit of L1-L2 layers is manufactured, a circuit of a converter part is manufactured by laminating L3-L8 layers, a barrier film is added on an antenna position of the L2 layer, then the L1-L2 layers and the L3-L8 layers are pressed together to form an outer layer pattern, and the L3-L8 layers are milled out through depth control milling to expose an L2 layer antenna, and the method is characterized by comprising the following steps of:

1) l1-2 layer process flow; the process for manufacturing the L1-2 layer specifically comprises the following steps: cutting the L1 layer and the L2 layer, transferring the inner layer pattern to the L1 layer and the L2 layer, etching the L1 layer and the L2 layer, punching, performing AOI automatic optical detection on the L1-L2 layer, performing oxidation treatment on the inner layer of the L1-L2 layer, and finally attaching a barrier film to the bottom of the L2 layer to obtain an L1-2 layer;

2) l3-8 layers of manufacturing process; the process for manufacturing the L3-8 layer specifically comprises the following steps: mechanically drilling an inner-layer flow pressing plate on an L3 layer-L8 layer, then carrying out chemical copper deposition/electroplating treatment, carrying out dry film treatment on the L3-8 layer under the conditions that the temperature is 20 +/-1 ℃ and the humidity is 60 +/-5%, then sequentially carrying out hole plating, film stripping, hole plugging and plate grinding, 2ND copper deposition and plate electrical treatment on the L3-8 layer, and finally sequentially carrying out 2ND pattern transfer, electroplating/etching, inner-layer AOI automatic optical detection, inner-layer oxidation and plate arrangement treatment to obtain an L3-8 layer;

3) the L1-8 layer manufacturing process comprises the following specific steps: performing secondary pressing plate treatment on the L1-2 layer and the L3-8 layer to obtain an L1-L8 layer, performing laser drilling treatment on the L1-8 layer by using a laser drilling machine, performing hole cleaning treatment on holes subjected to the laser drilling treatment, and performing mechanical drilling by using the drilling machine; then sequentially carrying out glue removal, chemical copper deposition/electroplating, dry film, hole plating, film stripping, hole plugging, plate grinding, mechanical drilling, 2ND copper deposition, plate electroplating, 2ND pattern transfer and electroplating/etching treatment on the circuit board, and carrying out outer layer AOI automatic optical detection and outer layer inspection on the treated circuit board; coating the green oil on a circuit board and a base material which do not need to be welded, and then printing characters on the circuit board; and (4) routing L3-8 layers, performing electrical measurement detection on the circuit, and finally performing surface treatment, silver deposition and packaging on the circuit board to obtain the manufactured KU band converter circuit board embedded with the antenna.