CN108172664A - 一种mwt组件预粘接加热方法 - Google Patents
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 18
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- 239000011521 glass Substances 0.000 claims description 7
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- 238000003475 lamination Methods 0.000 abstract description 4
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- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本发明公开了一种MWT组件预粘接加热方法，使用红外线灯照射MWT组件，使红外线产生的热量穿透玻璃传导至EVA，通过控制时间，让EVA熔融态下与电池片相互粘连。通过应用红外线技术，使能量传递的方式发生质的改变，极大的提高热的辐射效应，使热穿透力增强。本发明预粘接效率高，基本避免翻转或层压过程电池片偏移造成的不良，提高产品合格率，使用安全，过程操作方便，降低企业生产成本，为企业创造经济价值。
Description
技术领域
本发明涉及一种MWT组件预粘接加热方法，属于MWT太阳能电池组件应用技术领域。
背景技术
MWT组件的全背电池互连设计可以有效减少现有双面互连H型太阳能电池的阻抗，从而降低从电池到组件的CTM损失，可呈现更小巧、更轻量化、更高效的特性。MWT组件电池片通过集成芯板汇聚电流，无焊带互连，层叠后翻转进行层压，由于电池片之间相互独立，翻转过程中很容易发生偏移，由于MWT组件特有的封装方法，因此有必要提供一种MWT组件预粘接加热原理，解决翻转或层压过程中出现电池片偏移的问题。
发明内容
发明目的：针对现有技术中存在的问题与不足，本发明提供一种MWT组件预粘接加热方法，目的在于减少MWT组件因翻转或层压过程电池片偏移造成的不良，降低生产成本，提高产品合格率，为企业创造经济价值。
技术方案：一种MWT组件预粘接加热方法，使用红外线灯照射MWT组件，使红外线产生的热量穿透玻璃传导至EVA，通过控制时间，让EVA熔融态下与电池片、绝缘层粘接。通过应用红外线技术，使能量传递的方式发生质的改变，极大的提高热的辐射效应，使热穿透力增强。
有益效果：与现有技术相比，本发明所提供的MWT组件预粘接加热方法，具有如下优点：预粘接效率高，基本避免翻转或层压过程电池片偏移造成的不良，提高产品合格率，使用安全，过程操作方便，降低企业生产成本，为企业创造经济价值。
附图说明
图1为本发明实施例的MWT组件加热预粘接热量传输原理图；
图2为本发明实施例的预粘接完成后玻璃表面示意图。
具体实施方式
下面结合具体实施例，进一步阐明本发明，应理解这些实施例仅用于说明本发明而不用于限制本发明的范围，在阅读了本发明之后，本领域技术人员对本发明的各种等价形式的修改均落于本申请所附权利要求所限定的范围。
如图1所示，MWT组件预粘接加热方法，使用红外线灯照射MWT组件，使红外线产生的热量穿透玻璃1传导至EVA6，通过控制时间，让EVA6熔融态下与电池片2相互粘连，图1中标号3为GPS，标号4为导电芯板，标号5为背板；如图1所示，红外线灯管加热时，热量通过辐射穿透至玻璃1内部，如公式Q＝Q1+Q2+Q3，因为玻璃1透光性好，吸热性差，所以大多数热量穿透到达EVA6处，EVA6很快受热，熔融状态下与电池片2粘连。
预粘接完成后玻璃1表面呈圆点状，预粘接点7分布如图2所示。
红外线灯电压15V，功率150W，直径5.1mm，镀金灯泡；红外线灯泡加热，灯泡分为四组，每组12个，按组交替加热，灯泡距离MWT层叠件玻璃1上方1-2cm，预加热时间控制在1-2秒，合理调整预加热时间，一方面保证电池片2与EVA6、绝缘层粘接，另一方面要避免EVA6老化和电池片2隐裂的出现。过程采取全自动化控制，无需人工干预，因加热面积小时间短，层叠件移动过程中自然冷却，无需特殊冷却方式进行处理。
Claims (6)
1.一种MWT组件预粘接加热方法，其特征在于：使用红外线加热MWT组件，使红外线产生的热量穿透玻璃传导至EVA，融化EVA，使电池片与EVA、绝缘层粘接。
2.如权利要求1所述的MWT组件预粘接加热方法，其特征在于：所述红外线加热方式为利用红外线灯照射MWT层叠件。
3.如权利要求2所述的MWT组件预粘接加热方法，其特征在于：采用四组红外线灯，每组12个，阵列放置，按组循环对层叠件进行加热。
4.如权利要求1所述的MWT组件预粘接加热方法，其特征在于：红外线灯泡工作电压为15V，功率150W，灯泡直径5.1mm，镀金灯泡。
5.如权利要求1所述的MWT组件预粘接加热方法，其特征在于：红外线灯布置在MWT层叠件的玻璃上方1-2cm。
6.如权利要求4所述的MWT组件预粘接加热方法，其特征在于：红外线灯加热时间为1-2秒。
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786504A (zh) * | 2018-12-29 | 2019-05-21 | 江苏日托光伏科技股份有限公司 | 一种降低mwt组件枝状隐裂的方法 |
| CN117525208A (zh) * | 2023-12-04 | 2024-02-06 | 广州高景太阳能科技有限公司 | 一种用于光伏组件加工的胶膜固定装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355751A (zh) * | 2015-10-16 | 2016-02-24 | 英利集团有限公司 | Mwt太阳能电池及其制备方法 |
| CN105489704A (zh) * | 2015-12-23 | 2016-04-13 | 英利集团有限公司 | 一种背接触光伏组件的制备方法 |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105355751A (zh) * | 2015-10-16 | 2016-02-24 | 英利集团有限公司 | Mwt太阳能电池及其制备方法 |
| CN105489704A (zh) * | 2015-12-23 | 2016-04-13 | 英利集团有限公司 | 一种背接触光伏组件的制备方法 |
Non-Patent Citations (1)
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| 高宏伟: "《电子封装工艺与装备技术基础教程》", 31 July 2017 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109786504A (zh) * | 2018-12-29 | 2019-05-21 | 江苏日托光伏科技股份有限公司 | 一种降低mwt组件枝状隐裂的方法 |
| CN117525208A (zh) * | 2023-12-04 | 2024-02-06 | 广州高景太阳能科技有限公司 | 一种用于光伏组件加工的胶膜固定装置 |
| CN117525208B (zh) * | 2023-12-04 | 2024-05-10 | 广州高景太阳能科技有限公司 | 一种用于光伏组件加工的胶膜固定装置 |
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Application publication date: 20180615 |