CN108156765A - The device and method of polyimide media layer and electronic circuit is prepared on a kind of curved surface - Google Patents
The device and method of polyimide media layer and electronic circuit is prepared on a kind of curved surface Download PDFInfo
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- CN108156765A CN108156765A CN201810140815.8A CN201810140815A CN108156765A CN 108156765 A CN108156765 A CN 108156765A CN 201810140815 A CN201810140815 A CN 201810140815A CN 108156765 A CN108156765 A CN 108156765A
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- electric slurry
- curved surface
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The present invention proposes to prepare the device and method of polyimide media layer and electronic circuit on a kind of curved surface, a certain concentration polyimides precursor solution being configured is printed on curved surface base material based on motion platform combination 3D printing technique, electric slurry is printed on molding film again and forms electronic circuit, assisted heating device heats metal base in print procedure, solvent in polyimides precursor solution is promoted quickly to volatilize, and prevents from causing membrane thickness unevenness since flowing occurs for gravity in print procedure.The technology can solve after conventional films printed circuit the problems such as figuration low precision and complex forming technology caused by figuration cementation process again.Primary property polyimide media layer and electronic circuit can be prepared on non-deployed curved surface using after the technology, carry out fast verification for palm model involved in the fields R＆D processes such as intelligence wearing, conformal antenna, photovoltaic, shorten the research and development of products period.
Description
Technical field
The present invention relates to preparing polyimide media layer and electronic circuit technology field on curved surface, on specially a kind of curved surface
Prepare the device and method of polyimide media layer and electronic circuit.
Background technology
Now with the development of electronics industry, in industries such as photovoltaic, antenna for mobile phone and microwave antennas for curved surface electric wire
The demand on road is more and more apparent.Polyimides is one of best high-molecular organic material of comprehensive performance, high temperature resistant up to 400 DEG C with
On, high insulating property, 103 hertz of lower dielectric constants 4.0, dielectric loss only 0.004~0.007, therefore frequently as microstrip antenna and
The dielectric layer of flexible circuit uses.
The manufacture craft of conventional microstrip antenna is to be combined together copper foil and polyimides by the way of hot pressing, is led to
The stripping of unwanted region is left electronic circuitry part by overetched mode, is finally used microstrip antenna according to product demand
Cementing mode fits in required product surface.The electronic circuit of part antenna for mobile phone and photovoltaic industry is then using printing
Mode electronic circuit is printed in required region.In addition the electronic circuit on curved surface is directed to then using in base material
The special organic material of upper entirety spraying plating metal ion or whole sprayed metal layer, the exposure activation for again passing by ultraviolet light will
Metal ion is precipitated to form conductive layer or remove metalling non-active area with laser explosure etching and form camberline
Road.It can be seen that its fabrication processing is cumbersome by the processing technology of more than conventional electronics, it is complicated, and the period is long.Together
When be printed in the microstrip antenna of polyimides or thin film circuit is limited when final figuration is in product by product design shape,
The problem of non-deployed curved surface can not then carry out figuration, and ruled surface figuration also relates to precision.Current manufacturing process limits
The application of dielectric layer and electronic circuit on curved surface and different in nature base material, therefore it is badly in need of a kind of new process to cope with current add
Work manufactures problem.
Invention content
For the above-mentioned problems in the prior art, the present invention propose to prepare on a kind of curved surface polyimide media layer and
The device and method of electronic circuit is, it can be achieved that microstrip antenna, the preparation of antenna for mobile phone and PCB circuits and repairing etc. on curved surface.It should
Process can be realized on Curved surface metal base material polyimide media layer and electronic circuit disposable manufacture or can be independent
Realize individual item of content therein.In addition the process can derive other application direction, such as curved surface dispensing.
To achieve the above object, the technical solution adopted in the present invention is：
The device of polyimide media layer and electronic circuit is prepared on a kind of curved surface, it is characterised in that：Including movement
Platform, footstock, heating unit, motor, jet printing appts, temperature measuring equipment and central controller；
The footstock and motor installation are on the moving platform；The motion platform can be moved down in central controller controls
It is dynamic；The metal base both ends of curved surface are mounted between footstock and motor, and motor can be in central controller controls lower band moving surface
Metal base is rotated around the geometric centre axes of curved surface；The heating unit is mounted on footstock, can be in central controller control
The lower heating metal base of system；The temperature measuring equipment can measure the surface temperature of metal base, and feed back to central controller；
Electric slurry can be also printed upon by the jet printing appts by PAA solution coatings on metal base curved surface
It is printed upon on molding PI films on molding PAA films or by electric slurry；The PAA solution is obtained using procedure below：PMDA
It,, will after carrying out froth in vacuum processing to solution using 0.3~0.35g/ml solution that DMAc is configured to as solvent after being matched with ODA
Solution places 0-5 DEG C of environment preservation and treats that monomer reaction is complete；The nozzle pluggage size of the jet printing appts is 0.2-0.4mm.
Further preferred embodiment prepares the device of polyimide media layer and electronic circuit on a kind of curved surface,
It is characterized in that：The heating unit can be by metallic substrate surface preheating temperature to 60 DEG C ± 5 DEG C, and can be in central controller
Metallic substrate surface temperature is warming up to 100 DEG C from 60 DEG C of heating rates with 30~60 DEG C/h under control and is kept the temperature, makes PAA molten
Solvent in liquid volatilizees to form PAA films.
Further preferred embodiment prepares the device of polyimide media layer and electronic circuit on a kind of curved surface,
It is characterized in that：The heating unit can make PAA films dehydrating polycondensation form PI the PAA film elevated cures of metallic substrate surface
Film, and the electric slurry being printed upon on PI films is sintered.
Further preferred embodiment prepares the device of polyimide media layer and electronic circuit on a kind of curved surface,
It is characterized in that：The heating unit can heat up to the PAA films of metallic substrate surface and the electric slurry being printed upon on PAA films
Curing makes PAA films dehydrating polycondensation form PI films, and at the same time realizing the sintering of electric slurry.
Further preferred embodiment prepares the device of polyimide media layer and electronic circuit on a kind of curved surface,
It is characterized in that：Heater box is further included, metal base is placed in heater box and realizes that PAA films dehydrating polycondensation forms PI films, and
The electric slurry being printed upon on PI films is sintered；Or metal base is placed in heater box and realizes that PAA film dehydrating polycondensations are formed
PI films realize the sintering of electric slurry simultaneously.
Further preferred embodiment prepares the device of polyimide media layer and electronic circuit on a kind of curved surface,
It is characterized in that：The jet printing appts include storing pipe, syringe needle, gas circuit, pressure reducing valve and air compressor, and air compressor generates high
PAA solution in storing pipe is spread evenly across on metal base curved surface or by storing pipe by body of calming the anger by pressure reducing valve and gas circuit
Interior electric slurry is printed upon on molding PAA moulds or on PI films.
The method that polyimide media layer and electronic circuit are prepared on curved surface is realized using above device, it is characterised in that：
Include the following steps：
Step 1：After PMDA and ODA proportionings, using 0.3~0.35g/ml solution that DMAc is configured to as solvent, to solution
After carrying out froth in vacuum processing, solution is placed into 0-5 DEG C of environment preservation and treats that monomer reaction is complete, obtains PAA solution；
Step 2：PAA solution is fitted into the storing pipe of jet printing appts；Central controller controls motion platform moves, and makes spray
The spout that printing equipment is put meets sets requirement with metallic substrate surface distance；
Step 3：Central controller controls heating unit by metallic substrate surface preheating temperature according to the feedback of temperature measuring equipment
To 60 DEG C ± 5 DEG C；Then central controller controls jet printing appts squeeze out PAA solution, and central controller controls motor band
Dynamic metallic matrix rotation, is realized PAA solution coatings on metal base；
Step 4：Central controller is according to the feedback of temperature measuring equipment, and control heating unit is by metallic substrate surface temperature with 30
The heating rate of~60 DEG C/h is warming up to 100 DEG C and keeps the temperature, and the solvent in PAA solution is made to volatilize to form PAA films；
Step 5：Change the outfit electric slurry in the storing pipe of jet printing appts, and the sintering curing temperature of the electric slurry is not high
In the durable temperature of PI films；Central controller rotates, and control spray according to the movement of setting model controlled motion platform and motor
Printing equipment, which is put, squeezes out electric slurry, and realization prints Selective Laser Sintering with electric slurry on PAA films；
Step 6：Central controller according to the feedback of temperature measuring equipment, control heating unit by metallic substrate surface temperature according to
The PAA film dehydrating and curings heating curve variation of setting realizes that PAA films dehydrating polycondensation forms PI films and realizes electric slurry simultaneously
Sintering；The PAA film dehydrating and curing heating curves set as：2-3h is kept the temperature, then be warming up to 200 after being warming up to 120 DEG C ± 5 DEG C
1-2h is kept the temperature after DEG C ± 5 DEG C, 0.5-1h is kept the temperature after being finally warming up to 280 DEG C ± 5 DEG C.
Further preferred embodiment, the method that polyimide media layer and electronic circuit are prepared on a kind of curved surface,
It is characterized in that：Metal base is placed in heater box in step 6, control heater box temperature is dehydrated solid according to the PAA films of setting
Change heating curve variation, realize that PAA films dehydrating polycondensation forms the sintering that PI films realize electric slurry simultaneously.
Further preferred embodiment, the method that polyimide media layer and electronic circuit are prepared on a kind of curved surface,
It is characterized in that：Step 5 is：Metallic substrate surface is formed after PAA films, coordinates thermometric by central controller controls heating unit
Device changes metallic substrate surface temperature according to the PAA film dehydrating and curings heating curve of setting, realizes PAA film dehydrating polycondensation shapes
It is placed in heater box into PI films or by metal base, control heater box temperature heats up according to the PAA films dehydrating and curing of setting
Curvilinear motion realizes that PAA films dehydrating polycondensation forms PI films；
Step 6：Change the outfit electric slurry in the storing pipe of jet printing appts, and the sintering curing temperature of the electric slurry is not high
In the durable temperature of PI films；Central controller rotates, and control spray according to the movement of setting model controlled motion platform and motor
Printing equipment, which is put, squeezes out electric slurry, and realization prints Selective Laser Sintering with electric slurry on PI films；
Step 7：Temperature measuring equipment is coordinated to increase metallic substrate surface temperature to electricity by central controller controls heating unit
The sintering curing temperature of sub- slurry, realizes the sintering of electric slurry；Or metal base is placed in heater box, control heater box
Temperature is increased to the sintering curing temperature of electric slurry, realizes the sintering of electric slurry.
Advantageous effect
Compared with prior art, the invention has the advantages that：
1) present invention by way of printing by PAA solution coatings on Curved surface metal base material selection area, auxiliary heating
Device and subsequent curing process can form PI films on curved surface.Solves figuration precision on Kapton (PI films) face
On poor and non-deployed curved surface can not figuration the problem of.
2) present invention can prepare electronic circuit on formed PAA films, have film and circuit integrated molding
Function, greatly simplify manufacturing process's flow, facilitate the verification work of design phase palm model, and make it in Curved surface metal base
Microstrip antenna is prepared on material to be possibly realized.
3) present invention can derive other application function, as by motion platform with can prepare if plane warm table plane and
Curved surface film can be used for curved surface dispensing, PCB mends line etc..
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Significantly and it is readily appreciated that, wherein：
Fig. 1：The present invention is a kind of to make schematic diagram based on the technique that polyimide media layer and electronic circuit are prepared on curved surface；
Wherein：1st, motion platform 2, motor 3, motion controller 4, computer 5, air compressor 6, scroll chuck
7th, pressure reducing valve 8, gas circuit 9, storing pipe 10, syringe needle 11, footstock 12, CCD camera 13, metal base 14, metallic circuit
15th, PAA solution films 16, heating unit；
Fig. 2：PAA films are dehydrated imidization process curve.
Specific embodiment
The embodiment of the present invention is described below in detail, the embodiment is exemplary, it is intended to for explaining the present invention, and
It is not considered as limiting the invention.
The basic principle of the present invention is in gold using the mode of printing by the precursor solution PAA solution coatings of polyimides
Belong on base material, and form PAA films, print electronic circuit again on PAA films or printing electronic circuit is dehydrated in PAA films and generates
PI films on, assisted heating device in the process, disposal molding.
As shown in Figure 1, the device of polyimide media layer and electronic circuit is prepared on curved surface in the present embodiment, including fortune
Moving platform, footstock, heating unit, motor, jet printing appts, temperature measuring equipment and central controller.
The footstock and motor installation are on the moving platform；The motion platform can be moved down in central controller controls
It is dynamic；The metal base both ends of curved surface are mounted between footstock and motor, and motor can be in central controller controls lower band moving surface
Metal base is rotated around the geometric centre axes of curved surface；The heating unit is mounted on footstock, can be in central controller control
The lower heating metal base of system；The temperature measuring equipment can measure the surface temperature of metal base, and feed back to central controller.
Electric slurry can be also printed upon by the jet printing appts by PAA solution coatings on metal base curved surface
It is printed upon on molding PI films on molding PAA films or by electric slurry；The PAA solution is obtained using procedure below：PMDA
It,, will after carrying out froth in vacuum processing to solution using 0.3~0.35g/ml solution that DMAc is configured to as solvent after being matched with ODA
Solution places 0-5 DEG C of environment preservation and treats that monomer reaction is complete；The nozzle pluggage size of the jet printing appts is 0.2-0.4mm.This
In solution concentration the extremely important range of selection, the concentration of 0.3~0.35g/ml is the selection result value for having certain effects,
With the nozzle pluggage dimensional fits of 0.2-0.4mm, realize after ensureing that solution is packed into jet printing appts, be unlikely in nozzle in gravity
The lower nature outflow of effect hangs liquid, while ensure the levelling effect after its printability and printing again.Concentration is excessive, and printing property is poor
And solution levelling effect is bad is susceptible to pit, non-volatile bubble, membrane thickness unevenness after curing；And concentration is too small is then beating
Print head, which easily hangs liquid, influences printing effect, and prints and be difficult to control on curved surface.
The jet printing appts include storing pipe, syringe needle, gas circuit, pressure reducing valve and air compressor, and air compressor generates high
PAA solution in storing pipe is spread evenly across on metal base curved surface or by storing pipe by body of calming the anger by pressure reducing valve and gas circuit
Interior electric slurry is printed upon on molding PAA moulds.
In the present embodiment, the heating unit can be by metallic substrate surface preheating temperature to 60 DEG C ± 5 DEG C, and can be
Metallic substrate surface temperature is warming up to 100 DEG C from 60 DEG C of heating rates with 30~60 DEG C/h under central controller controls and is protected
Temperature makes the solvent in PAA solution volatilize to form PAA films.In addition, heating unit also can be to the PAA film liters of metallic substrate surface
Temperature curing makes PAA films dehydrating polycondensation form PI films, and the electric slurry being printed upon on PI films is sintered.Or to Metal Substrate
The PAA films on material surface and the electric slurry elevated cure being printed upon on PAA films make PAA films dehydrating polycondensation form PI films, and
And the sintering of electric slurry is realized simultaneously.
Certainly, if heating unit power suffers restraints in itself, it can additionally increase heater box, metal base is placed on
Realize that PAA films dehydrating polycondensation forms PI films, and the electric slurry being printed upon on PI films is sintered in heater box；Or by Metal Substrate
Material, which is placed in heater box, realizes that PAA films dehydrating polycondensation forms the sintering that PI films realize electric slurry simultaneously.
The method that polyimide media layer and electronic circuit are prepared on curved surface is realized using above device, including following step
Suddenly：
Step 1：By pyromellitic acid anhydride (PMDA, g) and 4,4- diaminodiphenyl ethers (ODA, g) in molar ratio 1.02:1
After proportioning, with N, N-2 methylacetamides (DMAc, ml) are 0.3~0.35g/ml solution that solvent is configured to, wherein first by ODA
Solution is configured to DMAc, is placed it in ice-bath ultrasonic wave after ODA is dissolved completely in DMAc solution, PMDA is added portionwise,
Auxiliary stirring 1h or so.After solution is carried out froth in vacuum processing again, the solution handled well is packed into the storing seal of tube and places 0-5
It is preserved for 24 hours in DEG C refrigerator environment, treats that monomer reaction obtains PAA solution completely.
Step 2：Central controller controls motion platform moves, and makes the spout of jet printing appts and metallic substrate surface distance full
Sufficient sets requirement.
Step 3：Central controller controls heating unit by metallic substrate surface preheating temperature according to the feedback of temperature measuring equipment
To 60 DEG C ± 5 DEG C；Then central controller controls jet printing appts squeeze out PAA solution, and central controller controls motor band
Dynamic metallic matrix rotation, is realized PAA solution coatings on metal base.The high pressure gas that wherein jet printing appts use is as crowded
Potential source squeezes source pressure 0.1-0.4Mpa.
Step 4：Central controller is according to the feedback of temperature measuring equipment, and control heating unit is by metallic substrate surface temperature with 30
The heating rate of~60 DEG C/h is warming up to 100 DEG C and keeps the temperature, and the solvent in PAA solution is made to volatilize to form PAA films.Here heating
Rate is too fast solution can be caused to occur solvent volatilization is too fast to cause film to crack, the excessively slow then curing efficiency of heating rate is lower, and molten
Liquid causes membrane thickness unevenness since gravity flows.
Step 5：The range of viscosities that changes the outfit in the storing pipe of jet printing appts is the electric slurry of 10Pa.s~300Pa.s, and
The sintering curing temperature of the electric slurry is not higher than the durable temperature of PI films.Central controller is according to setting model controlled motion
Platform is mobile and motor rotates, and jet printing appts is controlled to squeeze out electric slurry, and realization is printed with electric slurry on PAA films
Selective Laser Sintering.
Step 6：Central controller according to the feedback of temperature measuring equipment, control heating unit by metallic substrate surface temperature according to
The PAA film dehydrating and curings heating curve variation of setting realizes that PAA films dehydrating polycondensation forms PI films and realizes electric slurry simultaneously
Sintering；The PAA film dehydrating and curing heating curves set as：2-3h is kept the temperature, then be warming up to 200 after being warming up to 120 DEG C ± 5 DEG C
1-2h is kept the temperature after DEG C ± 5 DEG C, 0.5-1h is kept the temperature after being finally warming up to 280 DEG C ± 5 DEG C
Certainly, in step 6, if heating unit underpower, metal base can be also placed in heater box, control heating
Box temperature degree changes according to the PAA film dehydrating and curings heating curve of setting, realizes that PAA films dehydrating polycondensation forms PI films and realizes simultaneously
The sintering of electric slurry.
In addition, according to the difference of matched electric slurry, it can also be used and PAA films dehydrating polycondensation is first formed into PI films,
Selective Laser Sintering is printed on PI films, re-sinters the mode of electric slurry, i.e.,
Step 5 is：Metallic substrate surface is formed after PAA films, coordinates thermometric by central controller controls heating unit
Device changes metallic substrate surface temperature according to the PAA film dehydrating and curings heating curve of setting, realizes PAA film dehydrating polycondensation shapes
It is placed in heater box into PI films or by metal base, control heater box temperature heats up according to the PAA films dehydrating and curing of setting
Curvilinear motion realizes that PAA films dehydrating polycondensation forms PI films；
Step 6：Change the outfit electric slurry in the storing pipe of jet printing appts, and the sintering curing temperature of the electric slurry is not high
In the durable temperature of PI films；Central controller rotates, and control spray according to the movement of setting model controlled motion platform and motor
Printing equipment, which is put, squeezes out electric slurry, and realization prints Selective Laser Sintering with electric slurry on PI films；
Step 7：Temperature measuring equipment is coordinated to increase metallic substrate surface temperature to electricity by central controller controls heating unit
The sintering curing temperature of sub- slurry, realizes the sintering of electric slurry；Or metal base is placed in heater box, control heater box
Temperature is increased to the sintering curing temperature of electric slurry, realizes the sintering of electric slurry.
As shown in Figure 1, metallic matrix is aluminium alloy sandblasting pole in the present embodimentIt is fixed on scroll chuck,
Rotary shaft rotating speed is 12r/min, and nozzle pluggage size is 0.31mm.It is 60 DEG C to preheat aluminum alloy base material temperature, after the completion of printing
It is performed according to Fig. 2 curing process.
1 PAA solution print parameters of table
Remarks：Adhesion strength refers to ASTM3359-09《Standard Test Methods for Measuring
Adhesion by Tape Test》
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example
Property, it is impossible to limitation of the present invention is interpreted as, those of ordinary skill in the art are not departing from the principle of the present invention and objective
In the case of can make changes, modifications, substitutions and variations to the above described embodiments within the scope of the invention.
Claims (9)
1. the device of polyimide media layer and electronic circuit is prepared on a kind of curved surface, it is characterised in that：Including motion platform, top
Seat, heating unit, motor, jet printing appts, temperature measuring equipment and central controller；
The footstock and motor installation are on the moving platform；The motion platform can move under central controller controls；It is bent
The metal base both ends in face are mounted between footstock and motor, and motor can be in central controller controls lower band moving surface Metal Substrate
Material is rotated around the geometric centre axes of curved surface；The heating unit is mounted on footstock, can be added under central controller controls
Thermometal base material；The temperature measuring equipment can measure the surface temperature of metal base, and feed back to central controller；
Electric slurry can be also printed upon molding by the jet printing appts by PAA solution coatings on metal base curved surface
PAA films on or electric slurry is printed upon on molding PI films；The PAA solution is obtained using procedure below：PMDA and ODA
After proportioning, using 0.3~0.35g/ml solution that DMAc is configured to as solvent, after carrying out froth in vacuum processing to solution, by solution
It places 0-5 DEG C of environment preservation and treats that monomer reaction is complete；The nozzle pluggage size of the jet printing appts is 0.2-0.4mm.
2. preparing the device of polyimide media layer and electronic circuit on a kind of curved surface according to claim 1, feature exists
In：The heating unit can be by metallic substrate surface preheating temperature to 60 DEG C ± 5 DEG C, and can be under central controller controls
Metallic substrate surface temperature is warming up to 100 DEG C from 60 DEG C of heating rates with 30~60 DEG C/h and is kept the temperature, is made in PAA solution
Solvent volatilizees to form PAA films.
3. preparing the device of polyimide media layer and electronic circuit on a kind of curved surface according to claim 2, feature exists
In：The heating unit can make PAA films dehydrating polycondensation form PI films the PAA film elevated cures of metallic substrate surface, and
The electric slurry being printed upon on PI films is sintered.
4. preparing the device of polyimide media layer and electronic circuit on a kind of curved surface according to claim 2, feature exists
In：The heating unit can to the PAA films of metallic substrate surface and the electric slurry elevated cure being printed upon on PAA films,
PAA films dehydrating polycondensation is made to form PI films, and at the same time realizing the sintering of electric slurry.
5. preparing the device of polyimide media layer and electronic circuit on a kind of curved surface according to claim 2, feature exists
In：Heater box is further included, metal base is placed in heater box and realizes that PAA films dehydrating polycondensation forms PI films, and will printing
Electric slurry sintering on PI films；Or metal base is placed in heater box and realizes that PAA films dehydrating polycondensation forms PI films
The sintering of electric slurry is realized simultaneously.
6. the device of polyimide media layer and electronic circuit is prepared on any one curved surface according to claims 2 to 5,
It is characterized in that：The jet printing appts include storing pipe, syringe needle, gas circuit, pressure reducing valve and air compressor, and air compressor generates high
PAA solution in storing pipe is spread evenly across on metal base curved surface or by storing pipe by body of calming the anger by pressure reducing valve and gas circuit
Interior electric slurry is printed upon on molding PAA moulds or on PI films.
7. the method that polyimide media layer and electronic circuit are prepared on curved surface is realized using claim 6 described device, it is special
Sign is：Include the following steps：
Step 1：After PMDA and ODA proportionings, using 0.3~0.35g/ml solution that DMAc is configured to as solvent, solution is carried out
After froth in vacuum processing, solution is placed into 0-5 DEG C of environment preservation and treats that monomer reaction is complete, obtains PAA solution；
Step 2：PAA solution is fitted into the storing pipe of jet printing appts；Central controller controls motion platform moves, and fills spray printing
The spout put meets sets requirement with metallic substrate surface distance；
Step 3：Central controller controls heating unit by metallic substrate surface preheating temperature to 60 according to the feedback of temperature measuring equipment
℃±5℃；Then central controller controls jet printing appts squeeze out PAA solution, and central controller controls motor drives gold
Belong to matrix rotation, realize PAA solution coatings on metal base；
Step 4：Central controller is according to the feedback of temperature measuring equipment, and control heating unit is by metallic substrate surface temperature with 30~60
DEG C/heating rate of h is warming up to 100 DEG C and keeps the temperature, the solvent in PAA solution is made to volatilize to form PAA films；
Step 5：Change the outfit electric slurry in the storing pipe of jet printing appts, and the sintering curing temperature of the electric slurry is not higher than PI
The durable temperature of film；Central controller rotates, and spray printing is controlled to fill according to the movement of setting model controlled motion platform and motor
It puts and squeezes out electric slurry, realization prints Selective Laser Sintering with electric slurry on PAA films；
Step 6：Central controller is according to the feedback of temperature measuring equipment, and control heating unit is by metallic substrate surface temperature according to setting
The variation of PAA film dehydrating and curings heating curve, realize that PAA films dehydrating polycondensations forms the burning that PI films realize electric slurry simultaneously
Knot；The PAA film dehydrating and curing heating curves set as：2-3h is kept the temperature, then be warming up to 200 DEG C after being warming up to 120 DEG C ± 5 DEG C
1-2h is kept the temperature after ± 5 DEG C, 0.5-1h is kept the temperature after being finally warming up to 280 DEG C ± 5 DEG C.
8. preparing the method for polyimide media layer and electronic circuit on a kind of curved surface according to claim 7, feature exists
In：Metal base is placed in heater box in step 6, control heater box temperature heats up according to the PAA films dehydrating and curing of setting
Curvilinear motion realizes that PAA films dehydrating polycondensation forms the sintering that PI films realize electric slurry simultaneously.
9. preparing the method for polyimide media layer and electronic circuit on a kind of curved surface according to claim 7, feature exists
In：Step 5 is：Metallic substrate surface is formed after PAA films, coordinates temperature measuring equipment will by central controller controls heating unit
Metallic substrate surface temperature changes according to the PAA film dehydrating and curings heating curve of setting, and it is thin to realize that PAA films dehydrating polycondensation forms PI
Metal base is placed in heater box by film, and control heater box temperature becomes according to the PAA film dehydrating and curings heating curve of setting
Change, realize that PAA films dehydrating polycondensation forms PI films；
Step 6：Change the outfit electric slurry in the storing pipe of jet printing appts, and the sintering curing temperature of the electric slurry is not higher than PI
The durable temperature of film；Central controller rotates, and spray printing is controlled to fill according to the movement of setting model controlled motion platform and motor
It puts and squeezes out electric slurry, realization prints Selective Laser Sintering with electric slurry on PI films；
Step 7：Temperature measuring equipment is coordinated to increase metallic substrate surface temperature to electronics by central controller controls heating unit to starch
The sintering curing temperature of material, realizes the sintering of electric slurry；Or metal base is placed in heater box, control heater box temperature
The sintering curing temperature of electric slurry is increased to, realizes the sintering of electric slurry.
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