CN104014790A - 3D ink-jet printer for printing electronic circuit board through ultrasonic atomization nanometer suspending liquid - Google Patents

3D ink-jet printer for printing electronic circuit board through ultrasonic atomization nanometer suspending liquid Download PDF

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Publication number
CN104014790A
CN104014790A CN201410163785.4A CN201410163785A CN104014790A CN 104014790 A CN104014790 A CN 104014790A CN 201410163785 A CN201410163785 A CN 201410163785A CN 104014790 A CN104014790 A CN 104014790A
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suspending liquid
ink
circuit board
electronic circuit
nanometer
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CN201410163785.4A
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张远明
李豹
黄淋芳
张雨霞
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张远明
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Abstract

The invention discloses a 3D ink-jet printer for printing an electronic circuit board through ultrasonic atomization nanometer suspending liquid. The 3D ink-jet printer comprises an ultrasonic atomization nanometer suspending liquid device, a nanometer fine ink-jet printing device, an industrial positioning camera, a video monitor, an infrared laser micro-fusion-covering device, a heatable vacuum absorption workbench, a three-coordinate movable sliding table and a control portion. According to the 3D ink-jet printer, the nanometer suspending liquid to be printed is atomized based on an ultrasonic double-cavity atomization method, the nanometer suspending liquid is sent to a controllable nanometer fine ink-jet printing device through a guide pipe under the action of auxiliary gas and is directly printed on a substrate in a non-contact mode through a fine ceramic nozzle, the printed nanometer sizing agent is solidified and dried through the method of bottom plate heating or infrared laser micro fusion covering, evaporation of the solvent in the sizing agent, gasification of an organic clad layer and fusion of nanometer particles are accelerated, and therefore the electronic circuit board with high conductivity and micron-size line width is formed. The 3D ink-jet printer can directly print a conducting layer, an insulating layer, a protective layer and a solder mask and can print semiconductor components and parts.

Description

A kind of electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid
Technical field
The present invention relates to a kind of electronic circuit board 3D inkjet printing field of atomization nano suspending liquid, be particularly applicable to directly print small semiconductor function device and 3D member.
Background technology
In traditional PCB electronic circuit board manufacturing industry, no matter be common rigidity electronic circuit board or the production of flexible electronic wiring board in recent years, all will finally make by a series of complicated procedures of forming, common operation comprises the image of copper-clad plate, heavy copper, circuit, plating, etching, welding resistance, word and surface treatment etc.This mode of production, on the one hand, the input ratio of production equipment is larger, and very inconvenient for the production of small lot or the making of personalization, industrial waste gas and waste water that particularly plating and etching work procedure produce have all brought the broken ring to operator and environment.On the other hand, said electronic circuit board be all copper-clad plate taking plane as main, be difficult to implement online embedded plate-making for complicated 3D structure.
Recently for over ten years, it is an emerging technology that 3D printing technique is shooting up in manufacture field, this printing technique so-called " 3D printing ", " rapid shaping ", " manufacturing fast ", or " increasing material processing ".This manufacture method does not need proembryo and mould, just can be directly according to computer graphics data, and the method for printing stack material by layer generates needed parts, the plastics FMD melt extruded 3D printer of more common 3D Systems company.In recent years, along with scientific and technical development, there is titanium alloy powder, magnesium alloy powder, nickel-base alloy, Co-based alloy powder, the rapid shaping 3D metal printer of powder of stainless steel.This metalloid printer adopts the mode that laser or electron beam partial selectively melt SLS successively to print required parts, as the electron beam melting metal 3D printer of ARCAM company of Sweden, the lf metal 3D printer of Britain Renishaw, but can notice that these 3D printing devices are all taking print machinery type component as object, and not print electronic circuit board.
Recently, some scholar has proposed whether can complete the imagination that electronic circuit board is directly printed by common ink-jet printer, but can note the printing for microfine circuit, and common ink-jet printer is difficult to meet the requirement of industrial product in printing precision.Because common printing of inkjet printer shower nozzle is very little with the gap of printing goods, the electronic products of stereochemical structure is also not easy to realize.Because nano suspending liquid is different from the ink of common ink-jet printer, if use common ink-jet printer to be easy to make shower nozzle that the phenomenon of blocking occurs, the important indicator such as flow and viscosity that simultaneously also cannot On-line Control liquid, the solidifying and drying and also bring very large inconvenience as ink to subsequent handling.
Therefore; from above-mentioned background; can find to be necessary very much the electronic circuit board 3D ink-jet printer of the nano suspending liquid of inventing a kind of novelty; can directly print electric function parts, semiconductor components and devices and trickle 3D structure; comprise and print conductive layer, insulating barrier, protective layer, solder mask, and the 3D member of the functional part such as the resistance strain gage of wire, pad, resistance, inductance, electric capacity, diode, triode, operational amplifier and combination thereof, thermocouple, electronic mark, electronic antenna, FRID mark, SIM and trickle engineering.
Summary of the invention
The invention provides a kind of electronic circuit board 3D ink-jet printer based on ultrasonic atomization nano suspending liquid.This printer mainly solves the atomization of nano suspending liquid, and direct printing and the deposition of nano suspending liquid realize the 3D structural member of directly printing electric function parts, semiconductor components and devices and trickle engineering.
To achieve these goals, the present invention realizes by following technical solution:
A kind of electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid, comprise ultrasonic atomization nanoparticle suspension liquid device, the fine inkjet-printing device of nanometer, industry location camera, video monitor, the micro-cladding apparatus of infrared laser, heatable vacuum-adsorption working table, three-dimensional motion slide unit and control section.
The nano suspending liquid that the described mode atomization based on the atomization of ultrasonic wave two-chamber will be printed.
Described nano suspending liquid comprises Nano Silver, Nanometer Copper, nm of gold, nanometer nickel-base alloy, the nano metal powder of nanometer cobalt-based alloy type and the nano nonmetal powder of nano ceramics class, and corresponding plated film and organic dispersion solvent and solution.
Described atomization nano suspending liquid is delivered to the fine inkjet-printing device of controlled nanometer through conduit under assist gas effect, is directly printed on non-contactly on substrate through fine ceramic nozzle.
5 microns to 500 microns of described fine ceramic nozzle diameters, in print procedure, nozzle head is to 1 millimeter to 30 millimeters of printed substrate noncontact distance, and described printing substrate comprises flexible electronic circuit board, metal surface, PET, glass and ceramic substrate and 3 D stereo member thereof.
The described mode of passing through bottom plate heating or the micro-cladding of infrared laser is solidified the nano pulp that oven dry is printed, and accelerates the evaporation of slurry internal solvent, the gasification of organic coating and the fusing of nano particle, the electronic circuit board of the micron order live width of formation high conductivity.
Described three-dimensional motion slide unit is that high accuracy slide unit is fixed on marble pedestal.
Described heatable vacuum-adsorption working table is fixed on a high-precision cross slid platform, connects vavuum pump and heater, and goods are fixed by vacuum suction, heatable articles simultaneously, and temperature is controlled to be shown.
The described electronic circuit board 3D ink-jet printer based on ultrasonic atomization nano suspending liquid; not only can directly print conductive layer, insulating barrier, protective layer and solder mask; and can print semiconductor components and devices, comprise and print the functional part such as resistance strain gage, thermocouple, electronic mark, FRID mark, SIM of wire, pad, resistance, inductance, electric capacity, diode, triode, operational amplifier and combination thereof and the 3D structural member of trickle engineering.
The present invention has actively useful effect:
1. this printer adopts two-chamber ultrasonic atomization nano suspending liquid, mainly solves the direct Printing Problem of nano suspending liquid, nano pulp, and human-machine operation safe ready, need to be by expensive electronic circuit board production equipment.
2. this printer has solved nano suspending liquid slurry class material by bottom-heated and the micro-melting and coating technique of infrared laser and cannot print complicated 3D geometrical construction, and the problem of subsiding or collapsing appears in layer after printing and piling up.
3. this printer is the nano suspending liquid slurry form at hygrometric state, after ultrasonic atomization, directly print electronic circuit board, do not need traditional operation such as plating and corrosion, greatly reduce the destruction to environment and the harm to operator, meanwhile, greatly reduce Production Time.
4. this printer has adopted marble framework, is equipped with high-precision three-dimensional driven by servomotor slide unit, industrial camera location, and printing precision is high, the 3D structural member of printable fine electronic circuit board and trickle engineering, range of application is very extensive.
Brief description of the drawings
Below in conjunction with drawings and Examples, the present invention is further described.
Fig. 1 is general illustration of the present invention.
Fig. 2 is two-chamber supersonic atomizer schematic diagram of the present invention.
Fig. 3 is nano suspending liquid printing equipment schematic diagram of the present invention.
Fig. 4 is heatable vacuum-adsorption working table schematic diagram of the present invention.
In figure, each serial number name is as follows:
In figure, 101 is marble pedestal, 102 is marble column, 103 at marble crossbeam, 104 is left side ultrasonic wave nano suspending liquid atomising device, 105 is Z axis slide unit, 106 is right side ultrasonic wave nano suspending liquid atomising device, 107 is infrared laser, 108 is Z axis slide block and fixture, 109 is right side nano suspending liquid printing equipment, 110 is left side nano suspending liquid printing equipment, 111 is industrial camera locator, 112 is XY cross slid platform, 113 is product working table, 201 export for after nano suspending liquid atomization, 202 is mist pipe sealing-plug, 203 is auxiliary gas entry, 204 is mist pipe height adjusting nut, 205 is mist pipe angle adjuster, 206 is mist pipe left and right adjuster, 207 is ultrasonic resonator chamber, 208 is liquid level indicator interface, 209 is cooling water inlet, 210 is ultrasonic resonator device, 211 nano suspending liquids for printing, 212 is mist pipe, 213 is coolant outlet, 301 for cutting off shutter position correcting mechanism, 302 is atomized slurry entrance, 303 is atomized slurry heater, 304 is atomized slurry conduit, 305 is nozzle locking nut, 306 is ultra-fine ceramic nozzle, 307 is atomized slurry cut-out shutter, 308 is atomized slurry shutter controller, 401 is workbench inner chamber, 402 is can attemperating unit interface, 403 is vacuum absorption device interface.
Detailed description of the invention
The invention provides a kind of electronic circuit board 3D ink-jet printer based on ultrasonic atomization nano suspending liquid.In Fig. 1, this printer comprises that one by marble pedestal 101, and marble column 102 and marble crossbeam 103 form a stable marble gantry frame.On marble pedestal 101, fix the XY cross slid platform 112 of a high-precision servo-drive, be equipped with in the above a product working table 113, can carry out the moving interpolation of XY axle.A Z axis servo-drive slide unit 105 has been installed on marble column 102, this slide unit is furnished with a Z axis slide block and fixture 108, for assembly industry camera locator 111, left side nano suspending liquid printing equipment 110, right side nano suspending liquid printing equipment 109 and infrared laser 107, can complete location, printing and laser sintered function.Be equipped with respectively left side ultrasonic wave nano suspending liquid atomising device 104 and right side ultrasonic wave nano suspending liquid atomising device 106 in these marble framework both sides, the slurries after atomization are sent to respectively corresponding slurry printing equipment.Fig. 2 is two-chamber supersonic atomizer schematic diagram of the present invention.In Fig. 2, mist pipe 212 is placed in ultrasonic resonator chamber 207.At the in-built nano suspending liquid that will print to some extent 211 of this mist pipe, at its head, mist pipe sealing-plug 202 and auxiliary gas entry 203 are housed.This mist pipe underwater penetration, mist pipe height adjusting nut 204 can be passed through in angle of inclination and position, left and right thereof, mist pipe angle adjuster 205 and mist pipe left and right adjuster 206 thereof calibrate until the full and uniform atomization in mist pipe of the nano suspending liquid 211 that will print, export 201 after delivering to nano suspending liquid atomization under assist gas left and right.In order to ensure that this nano suspending liquid atomising device normally works, liquid level indicator interface 208 and ultrasonic resonator device 210 and water-cooling apparatus thereof are housed in this ultrasonic resonator chamber, cooling water inlet 209 and coolant outlet 213.Fig. 3 is nano suspending liquid printing equipment schematic diagram of the present invention.In Fig. 3, the nano pulp of atomization, is entered slurry conduit 304 and nozzle locking nut 305 and delivers to ultra-fine ceramic nozzle 306 through can further adjusting after the viscosity of slurry by heater 303 by atomized slurry entrance 302.Below this nozzle, be equipped with slurry and cut off shutter 307 and shutter controller 308 and shutter position calibrator 301, in print procedure, tripper is carried out a small wobbling action makes nozzle unobstructed, slurry is directly printed on goods, printing under time-out and non-print state, shutter return is as the collector of slurry.In Fig. 4, the goods of printing are placed in workbench top, this workbench comprises workbench inner chamber 401, in this chamber, outfit can be solidified the nano pulp that oven dry is printed by the mode of heating by attemperating unit interface 402, can fix the goods of printing by the mode of vacuum suction with vacuum absorption device interface 403, after printing completes, discharge vacuum, take out the goods of printing.
The electronic circuit board 3D ink-jet printer course of work of nano suspending liquid of the present invention is as follows:
This is a kind of electronic circuit board 3D ink-jet printer based on ultrasonic atomization nano suspending liquid, comprise ultrasonic atomization nanoparticle suspension liquid device 104 and 106, the fine inkjet-printing device 110 and 109 of nanometer, industry location camera 111 and video monitor, the micro-cladding apparatus 107 of infrared laser, heatable vacuum-adsorption working table 113, three-dimensional motion slide unit 112 and 105 and control section.First the fine 3D model of drawing the electronic circuit board of printing or will printing with mapping software, according to the requirement of printing precision, arranges floor height, produce mechanical hand discernible path movement locus and control routine, complete program making, online, after path simulation emulation is correct, prepare to start to print.By on the goods work platform for placing 113 that will print, connect vavuum pump absorbent articles 403, by industrial camera 111 position that accurately location will be printed.Set heating-up temperature, open ultrasonic resonator device 210 and cooling device thereof, adjust nano pulp atomizer position until after slurry uniform atomizing, open assist gas 203, under assist gas effect, deliver to the fine inkjet-printing device of controlled nanometer through conduit, directly be printed on non-contactly on substrate through fine ceramic nozzle 306, mode by bottom plate heating or infrared laser 107 micro-claddings is solidified the nano pulp that oven dry is printed, accelerate the evaporation of slurry internal solvent, the gasification of organic coating and the fusing of nano particle, form the conductive layer of the electronic circuit board of the micron order live width of high conductivity.Meanwhile, one of them printing equipment also can be used for printing nonmetallic nano pulp, prints insulating barrier, solder mask or protective layer.This electronic circuit board 3D ink-jet printer based on ultrasonic atomization nano suspending liquid; not only can directly print conductive layer, insulating barrier, protective layer and solder mask; and can print semiconductor components and devices, comprise and print the functional part such as resistance strain gage, thermocouple, electronic mark, FRID mark, SIM of wire, pad, resistance, inductance, electric capacity, diode, triode, operational amplifier and combination thereof and the 3D member of fine engineering.
Although above the present invention is described in detail with a general description of the specific embodiments, on basis of the present invention, can make some modifications or improvements it, this will be apparent to those skilled in the art.Therefore, these modifications or improvements on the basis of not departing from work of the present invention and manufacturing process, all belong to the scope of protection of present invention.

Claims (9)

1. the electronic circuit board 3D ink-jet printer of a ultrasonic atomization nano suspending liquid, it is characterized in that: described electronic circuit board 3D ink-jet printer comprises ultrasonic atomization nanoparticle suspension liquid device, the fine inkjet-printing device of nanometer, industry location camera, video monitor, the micro-cladding apparatus of infrared laser, heatable vacuum-adsorption working table, three-dimensional motion slide unit and control section.
2. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1, is characterized in that: the nano suspending liquid that the described mode atomization based on the atomization of ultrasonic wave two-chamber will be printed, it is controlled that mist pipe position is adjustable.
3. the nano suspending liquid that will print according to claim 2, it is characterized in that: described nano suspending liquid comprises Nano Silver, Nanometer Copper, nm of gold, nanometer nickel-base alloy, the nano nonmetal powder of the nano metal powder of nanometer cobalt-based alloy type and nano ceramics base polymer class, and corresponding plated film and organic dispersion solvent and solution.
4. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1, its feature exists: described atomization nano suspending liquid is delivered to the fine inkjet-printing device of controlled nanometer through conduit under assist gas effect, is directly printed on non-contactly on substrate through fine ceramic nozzle.
5. fine ceramic nozzle according to claim 4, it is characterized in that: 1 micron to 300 microns of described fine ceramic nozzle diameter, in print procedure, nozzle head is 1 millimeter to 30 millimeters to printed substrate noncontact distance, and described printing substrate comprises flexible electronic circuit board, PET, metal surface, glass and ceramic substrate and 3 D stereo member thereof.
6. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1, it is characterized in that: the described mode of passing through bottom plate heating or the micro-cladding of infrared laser is solidified the nano pulp that oven dry is printed, accelerate the evaporation of slurry internal solvent, the gasification of organic coating and the fusing of nano particle, the electronic circuit board of the micron order live width of formation high conductivity.
7. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1, is characterized in that: described three-dimensional motion slide unit be high accuracy slide unit and be fixed on marble pedestal and marble framework on.
8. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1, it is characterized in that: described heatable vacuum-adsorption working table is fixed on a high-precision cross slid platform, connect vavuum pump and heater, goods are fixed by vacuum suction, the viscosity of heatable articles or adjustment slurry simultaneously, temperature is controlled to be shown.
9. the electronic circuit board 3D ink-jet printer of ultrasonic atomization nano suspending liquid according to claim 1; it is characterized in that: not only can directly print conductive layer, insulating barrier, protective layer and solder mask; and can print semiconductor components and devices, comprise functional part and the small 3D structural member such as resistance strain gage, thermocouple, electronic mark, FRID mark, SIM of printing fine wire, pad, resistance, inductance, electric capacity, diode, triode, operational amplifier and combination thereof.
CN201410163785.4A 2014-04-23 2014-04-23 3D ink-jet printer for printing electronic circuit board through ultrasonic atomization nanometer suspending liquid Pending CN104014790A (en)

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801712A (en) * 2015-04-22 2015-07-29 华南理工大学 Laser and microbeam plasma composite 3D (3-dimensional) printing equipment and method
CN104858422A (en) * 2015-05-22 2015-08-26 东莞劲胜精密组件股份有限公司 Stainless steel composite powder for 3D printing and preparation method of stainless steel composite powder for 3D printing
CN104889394A (en) * 2015-06-11 2015-09-09 湖南科瑞特科技股份有限公司 Production method of copper or silver electronic circuit board and electronic circuit printing head
CN105082544A (en) * 2015-09-08 2015-11-25 电子科技大学 3D printer and method for printing object through 3D printer
CN105538721A (en) * 2016-01-26 2016-05-04 西安电子科技大学 Three-dimensional printing device and method for printing conductive pattern on folded hook surface
JP2016172893A (en) * 2015-03-17 2016-09-29 セイコーエプソン株式会社 Three-dimensional formation device and three-dimensional formation method
CN106256463A (en) * 2015-06-16 2016-12-28 精工爱普生株式会社 Three-dimensionally formed device and three-dimensionally formed method
CN106273491A (en) * 2016-08-22 2017-01-04 吉林大学 The controlled ultrasonic droplet ejection of spray angle increases material and manufactures device and method
CN106862748A (en) * 2017-01-24 2017-06-20 中北大学 Amorphous/metal micro-laminated composite material ultrasonic wave accumulation manufacture method
CN106937486A (en) * 2015-12-31 2017-07-07 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus
CN108340570A (en) * 2018-01-05 2018-07-31 西北工业大学 Using the 3D salting liquids printing equipment and Method of printing of evaporation accumulation molding technology

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1135732A (en) * 1993-10-20 1996-11-13 联合技术公司 Temp.-controlled laser sintering
US20020104973A1 (en) * 2001-02-08 2002-08-08 Kerekes Thomas A. Surface scanning system for selective deposition modeling
US20020171178A1 (en) * 2001-04-19 2002-11-21 David Dean Fabrication of a polymeric prosthetic implant
EP1524098A1 (en) * 2003-10-14 2005-04-20 Hewlett-Packard Development Company, L.P. Hybrid organic-inorganic composition for solid freeform fabrication and solid freeform fabrication method
US20100127433A1 (en) * 2005-03-31 2010-05-27 Francisco Medina Methods and Systems for Integrating Fluid Dispensing Technology With Stereolithography
CN102992260A (en) * 2011-08-17 2013-03-27 波音公司 Method and system of fabricating PZT nanoparticle ink based piezoelectric sensor
KR20130057239A (en) * 2011-11-23 2013-05-31 (주)뉴옵틱스 Method for forming nano-micro pattern using sintering of organic-inorganic composite material
CN103407296A (en) * 2013-07-29 2013-11-27 南京鼎科纳米技术研究所有限公司 Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1135732A (en) * 1993-10-20 1996-11-13 联合技术公司 Temp.-controlled laser sintering
US20020104973A1 (en) * 2001-02-08 2002-08-08 Kerekes Thomas A. Surface scanning system for selective deposition modeling
US20020171178A1 (en) * 2001-04-19 2002-11-21 David Dean Fabrication of a polymeric prosthetic implant
EP1524098A1 (en) * 2003-10-14 2005-04-20 Hewlett-Packard Development Company, L.P. Hybrid organic-inorganic composition for solid freeform fabrication and solid freeform fabrication method
US20100127433A1 (en) * 2005-03-31 2010-05-27 Francisco Medina Methods and Systems for Integrating Fluid Dispensing Technology With Stereolithography
CN102992260A (en) * 2011-08-17 2013-03-27 波音公司 Method and system of fabricating PZT nanoparticle ink based piezoelectric sensor
KR20130057239A (en) * 2011-11-23 2013-05-31 (주)뉴옵틱스 Method for forming nano-micro pattern using sintering of organic-inorganic composite material
CN103407296A (en) * 2013-07-29 2013-11-27 南京鼎科纳米技术研究所有限公司 Method for achieving high-melting-point material 3D printing through nanometer ink together with laser melting

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016172893A (en) * 2015-03-17 2016-09-29 セイコーエプソン株式会社 Three-dimensional formation device and three-dimensional formation method
CN104801712A (en) * 2015-04-22 2015-07-29 华南理工大学 Laser and microbeam plasma composite 3D (3-dimensional) printing equipment and method
CN104858422A (en) * 2015-05-22 2015-08-26 东莞劲胜精密组件股份有限公司 Stainless steel composite powder for 3D printing and preparation method of stainless steel composite powder for 3D printing
CN104889394B (en) * 2015-06-11 2016-11-30 湖南科瑞特科技股份有限公司 Copper or the silver manufacture method of electronic circuit board and electronic circuit printhead
CN104889394A (en) * 2015-06-11 2015-09-09 湖南科瑞特科技股份有限公司 Production method of copper or silver electronic circuit board and electronic circuit printing head
CN106256463A (en) * 2015-06-16 2016-12-28 精工爱普生株式会社 Three-dimensionally formed device and three-dimensionally formed method
CN106256463B (en) * 2015-06-16 2020-03-06 精工爱普生株式会社 Three-dimensional forming apparatus and three-dimensional forming method
CN105082544A (en) * 2015-09-08 2015-11-25 电子科技大学 3D printer and method for printing object through 3D printer
CN106937486B (en) * 2015-12-31 2019-11-05 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus
CN106937486A (en) * 2015-12-31 2017-07-07 苏州市迪飞特电子有限公司 A kind of pcb board surface automatic processing apparatus
CN105538721A (en) * 2016-01-26 2016-05-04 西安电子科技大学 Three-dimensional printing device and method for printing conductive pattern on folded hook surface
CN106273491A (en) * 2016-08-22 2017-01-04 吉林大学 The controlled ultrasonic droplet ejection of spray angle increases material and manufactures device and method
CN106273491B (en) * 2016-08-22 2018-09-18 吉林大学 The controllable ultrasonic droplet ejection increasing material manufacturing device and method of spray angle
CN106862748A (en) * 2017-01-24 2017-06-20 中北大学 Amorphous/metal micro-laminated composite material ultrasonic wave accumulation manufacture method
CN108340570A (en) * 2018-01-05 2018-07-31 西北工业大学 Using the 3D salting liquids printing equipment and Method of printing of evaporation accumulation molding technology
CN108340570B (en) * 2018-01-05 2020-02-14 西北工业大学 3D saline solution printing device and method adopting evaporation accumulation molding technology

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Application publication date: 20140903

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