CN108151608A - A kind of quick mapping method of cvd diamond coating drawing die pass - Google Patents
A kind of quick mapping method of cvd diamond coating drawing die pass Download PDFInfo
- Publication number
- CN108151608A CN108151608A CN201711380770.3A CN201711380770A CN108151608A CN 108151608 A CN108151608 A CN 108151608A CN 201711380770 A CN201711380770 A CN 201711380770A CN 108151608 A CN108151608 A CN 108151608A
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- China
- Prior art keywords
- drawing die
- wire
- casement
- hot melt
- pass
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
- G01B5/20—Measuring arrangements characterised by the use of mechanical techniques for measuring contours or curvatures
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention discloses a kind of quick mapping methods of cvd diamond coating drawing die pass, solve the problems, such as that prior art mapping equipment is expensive and mapping precision is low in mapping for the small pass in aperture.The present invention be specially wire-drawing die is placed in supersonic wave cleaning machine clean 30 seconds after taking-up be placed in constant temperature drying box and toast 30 minutes, be placed on constant temperature method panel；The hot melt gun of built-in hot melt adhesive is taken to inject hot melt adhesive in wire-drawing die hole and stops injection to after lubricating at area 2/3, appropriate hot melt adhesive is reinjected after the hot melt adhesive in wire-drawing die hole solidifies and to form casement and forms collet, casement is extracted with tweezers or nipper plier later, after the pass figure in the wire-drawing die hole is drawn out with each area size of miking casement and passing through.The design of the invention is scientific and reasonable, easy to operate, and mapping is efficient, and mapping precision is high, and device therefor material is simple, of low cost.
Description
Technical field
The present invention relates to a kind of quick mapping methods of cvd diamond coating drawing die pass.
Background technology
At present, wire drawing die manufacturing enterprise needs to spot-check wire drawing die pass and size during wire drawing die is produced,
To judge that 3D surveying instruments will be used by surveying and drawing pass and size with the presence or absence of technical problem in processing.Public domain to wire drawing
There are mainly two types of the 3D instruments that die hole type and size measure, probe-type surveying instrument and optical survey instrument, probe-type surveying instrument
It is to insert a probe into wire drawing die, is analyzed by the difference to probe emission and reception signal, draw out wire drawing die pass
And calculate each area size；Optical survey instrument is made of light source, camera lens, objective table and operational analysis system, the light of light source transmitting
Signal is projected after mold endoporus into optical lens, and optical lens is transferred to after converting optical signals to electric signal at processor
Reason, processor draw out pass figure through operation and provide each positional parameter；Probe-type surveying instrument has measurement limitation, for probe
The micropore wire drawing die that can not be inserted into, probe-type surveying instrument is just helpless, and with the diminution in aperture, light scattering is more serious, light
Surveying instrument precision is learned also to decrease.
Wire drawing die pass 3D surveying instruments rely basically on import at present, and South Korea knows core technology, and import equipment is all
At million yuan or more, general wire drawing die processing enterprise can not bear such high expense, and the country has company to copy import 3D mappings
Instrument, but standard is not achieved in precision；So Chinese wire drawing die processing industry is badly in need of a kind of simple and reliable method to solve
The certainly mapping of wire drawing die pass.
Invention content
The technical problem to be solved by the present invention is to：A kind of quick mapping of cvd diamond coating drawing die pass is provided
Method, solves that prior art mapping equipment is expensive and mapping precision is low asks in mapping for the small pass in aperture
Topic.
To achieve the above object, the technical solution adopted by the present invention is as follows：
A kind of quick mapping method of cvd diamond coating drawing die pass, includes the following steps：
(1) wire-drawing die is placed in supersonic wave cleaning machine after cleaning 30 seconds and taken out；
(2) wire-drawing die after cleaning in step (1) is placed in constant temperature drying box and toasted 30 minutes；
(3) wire-drawing die after baking in step (2) with tweezers is gripped out rapidly and be placed on constant temperature method panel；
(4) hot melt gun of built-in hot melt adhesive is taken to be rapidly injected hot melt adhesive to profit along one side by the inlet region in wire-drawing die hole
Stop injection after at skating area 2/3, separated in time is after the hot melt adhesive in wire-drawing die hole is solidified to form casement, in casement
It reinjects appropriate hot melt adhesive on upper surface to bond with the casement, to form collet；
(5) after casement and collet in wire-drawing die hole solidify with tweezers or nipper plier gripping collet with by wire-drawing die
Casement is extracted in hole；
(6) size measured by each area size of casement being extracted in miking step (5) and pass through is drawn out
The pass figure in the wire-drawing die hole.
Further, in step (2), the baking temperature of the constant temperature drying box is 35 DEG C.
Further, in step (3), the temperature of the constant temperature method panel is 35 DEG C.
Further, in step (4), the operating temperature of hot melt gun is 160 DEG C.
Further, in step (4), the hot melt adhesive in wire-drawing die hole solidify to be formed casement time be 30s.
Further, in step (6), each region of the casement is respectively to lubricate area, compressional zone and sizing area.
Compared with prior art, the invention has the advantages that：
(1) the design of the invention is scientific and reasonable, easy to operate, and mapping is efficient, and mapping precision is high, and device therefor material
Simply, it is of low cost.
(2) present invention inject in measured hole after hot melt using hot melt adhesive, after hot melt adhesive solidify after just formation and measured hole
The identical casement of pass, gripped by clip after going out the size in each region of casement with miking after collet takes out casement
The pass figure of measured hole can be drawn out according to the size, the time for solidifying casement can be completed at one minute or so, measure
Casement and draw pass figure time it is also very short, survey and draw ultrahigh in efficiency, the pass of casement and measured hole is the same, mapping precision
It is high, while this method is equally feasible for the smaller hole in aperture, and surveys and draws efficiency and mapping precision will not be with measured hole
Pass size and change, device therefor material is simple, of low cost.
Description of the drawings
Fig. 1 is wire drawing die sectional view of the present invention.
Fig. 2 sectional views after heat injection melten gel in die channel for the present invention.
Fig. 3 is the casement sectional view of the Tourniquet clamping head of present invention taking-up folded out of measured hole.
Specific embodiment
The invention will be further described with embodiment for explanation below in conjunction with the accompanying drawings, and mode of the invention includes but not only limits
In following embodiment.
As shown in Figs. 1-3, the quick mapping method of a kind of cvd diamond coating drawing die pass provided by the invention,
Design is scientific and reasonable, easy to operate, and mapping is efficient, and mapping precision is high, and device therefor material is simple, of low cost.This
Invention includes the following steps：
(1) wire-drawing die is placed in supersonic wave cleaning machine after cleaning 30 seconds and taken out；
(2) wire-drawing die after cleaning in step (1) is placed in constant temperature drying box and toasted 30 minutes, the constant temperature drying
The baking temperature of case is 35 DEG C；
(3) wire-drawing die after baking in step (2) with tweezers is gripped out rapidly and be placed on constant temperature method panel, institute
The temperature for stating constant temperature method panel is 35 DEG C；
(4) hot melt gun of built-in hot melt adhesive is taken to be rapidly injected hot melt adhesive to profit along one side by the inlet region in wire-drawing die hole
Stop injection after at skating area 2/3, the operating temperature of the hot melt gun is 160 DEG C, and separated in time treats the heat in wire-drawing die hole
After melten gel solidification is to form casement, the hot melt adhesive in wire-drawing die hole solidifies to form time of casement as 30s, in casement upper surface
On reinject appropriate hot melt adhesive and the casement and bond, to form collet；
(5) after casement and collet in wire-drawing die hole solidify with tweezers or nipper plier gripping collet with by wire-drawing die
Casement is extracted in hole；
(6) size measured by each area size of casement being extracted in miking step (5) and pass through is drawn out
The pass figure in the wire-drawing die hole, each region of the casement are respectively to lubricate area, compressional zone and sizing area.
Different according to each position job specification of wire drawing die, wire drawing die endoporus is divided into five regions, by entering to going out respectively
Inlet region, lubrication area, compressional zone, sizing area and outlet area.Inlet region and lubrication area are not distinguished strictly under normal circumstances,
So being referred to as lubrication area, lubrication area undertakes the function of filling wire drawing powder, and lubricating action is played to the wire rod being drawn；Compressional zone is again
It is referred to as workspace, the wire rod being drawn starts to be compressed to become smaller in this region；Sizing area is that the wire forming being drawn is consolidated
Fixed effect, being drawn wire rod, diameter will be consistent with sizing area diameter behind sizing area；Outlet area is in wide-angle drawing shape, is
It is scraped off for preventing from being drawn unstable when wire rod exports；Fig. 1 is wire drawing die sectional view of the present invention；Fig. 2 present invention is being drawn
Sectional view after heat injection melten gel in silk die hole, Tu Zhong color region be hot melt adhesive injection zone, i.e. casement, only include sizing area, pressure
Contracting area and 2/3 lubrication area, also condense a fritter hot melt adhesive as collet again after injection in end face, convenient for by molding heat
Melten gel casement is extracted；Fig. 3 is the casement sectional view of the Tourniquet clamping head of folded out of the measured hole taking-up of the present invention, casement in Fig. 1
The pass of measured hole is the same.
The present invention is injected after hot melt in measured hole using hot melt adhesive, and the hole with measured hole is just formed after hot melt adhesive solidification
The identical casement of type is gripped by clip after going out the size in each region of casement with miking after collet takes out casement
The pass figure of measured hole is drawn out according to the size, the time for solidifying casement can be completed at one minute or so, measure casement
And the time for drawing pass figure is also very short, surveys and draws ultrahigh in efficiency, the pass striking resemblances of casement and measured hole, mapping precision pole
Height, while this method is equally feasible for the smaller hole in aperture, and surveys and draws efficiency and mapping precision will not be with measured hole
Pass size and change, device therefor material is simple, of low cost.
Above-described embodiment is only one of the preferred embodiment of the present invention, should not be taken to limit the protection model of the present invention
Enclose, as long as the present invention body design thought and that mentally makes have no the change of essential meaning or polishing, solved
The technical issues of it is still consistent with the present invention, should all be included within protection scope of the present invention.
Claims (6)
1. a kind of quick mapping method of cvd diamond coating drawing die pass, which is characterized in that include the following steps：
(1) wire-drawing die is placed in supersonic wave cleaning machine after cleaning 30 seconds and taken out；
(2) wire-drawing die after cleaning in step (1) is placed in constant temperature drying box and toasted 30 minutes；
(3) wire-drawing die after baking in step (2) with tweezers is gripped out rapidly and be placed on constant temperature method panel；
(4) hot melt gun of built-in hot melt adhesive is taken to be rapidly injected hot melt adhesive to lubricating area along one side by the inlet region in wire-drawing die hole
Stop injection after at 2/3, separated in time is after the hot melt adhesive in wire-drawing die hole is solidified to form casement, in casement upper table
It reinjects appropriate hot melt adhesive on face to bond with the casement, to form collet；
(5) after casement and collet in wire-drawing die hole solidify with tweezers or nipper plier gripping collet with will be in wire-drawing die hole
Casement is extracted；
(6) size measured by each area size of casement being extracted in miking step (5) and pass through draws out the drawing
The pass figure of silk die hole.
2. a kind of quick mapping method of cvd diamond coating drawing die pass according to claim 1, feature exist
In in step (2), the baking temperature of the constant temperature drying box is 35 DEG C.
3. a kind of quick mapping method of cvd diamond coating drawing die pass according to claim 2, feature exist
In in step (3), the temperature of the constant temperature method panel is 35 DEG C.
4. a kind of quick mapping method of cvd diamond coating drawing die pass according to claim 3, feature exist
In in step (4), the operating temperature of hot melt gun is 160 DEG C.
5. a kind of quick mapping method of cvd diamond coating drawing die pass according to claim 4, feature exist
In, in step (4), the hot melt adhesive in wire-drawing die hole solidify to be formed casement time be 30s.
6. a kind of quick mapping method of cvd diamond coating drawing die pass according to claim 5, feature exist
In in step (6), each region of the casement is respectively to lubricate area, compressional zone and sizing area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711380770.3A CN108151608A (en) | 2017-12-20 | 2017-12-20 | A kind of quick mapping method of cvd diamond coating drawing die pass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711380770.3A CN108151608A (en) | 2017-12-20 | 2017-12-20 | A kind of quick mapping method of cvd diamond coating drawing die pass |
Publications (1)
| Publication Number | Publication Date |
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| CN108151608A true CN108151608A (en) | 2018-06-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711380770.3A Pending CN108151608A (en) | 2017-12-20 | 2017-12-20 | A kind of quick mapping method of cvd diamond coating drawing die pass |
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| CN (1) | CN108151608A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109667572A (en) * | 2019-01-09 | 2019-04-23 | 中国矿业大学(北京) | A kind of underground coal mine routine drilling injection molding track locating measurement method |
| CN110953970A (en) * | 2019-12-27 | 2020-04-03 | 瓦房店轴承集团国家轴承工程技术研究中心有限公司 | Wind power bearing sealing groove detection method |
| CN115014169A (en) * | 2022-05-30 | 2022-09-06 | 沪东中华造船(集团)有限公司 | Method for measuring thickness of adjusting cushion block in narrow space of ship |
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| CN2861957Y (en) * | 2005-11-30 | 2007-01-24 | 山东大学 | Hole shape measuring apparatus for wire-drawing die inner hole |
| CN103292691A (en) * | 2012-02-29 | 2013-09-11 | 西门子公司 | Method for detecting cooling hole of combustion gas turbine blade |
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- 2017-12-20 CN CN201711380770.3A patent/CN108151608A/en active Pending
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| CN2861957Y (en) * | 2005-11-30 | 2007-01-24 | 山东大学 | Hole shape measuring apparatus for wire-drawing die inner hole |
| CN103292691A (en) * | 2012-02-29 | 2013-09-11 | 西门子公司 | Method for detecting cooling hole of combustion gas turbine blade |
| CN204514268U (en) * | 2015-02-03 | 2015-07-29 | 苏州太平洋电线电缆有限公司 | Wortle pass measurement mechanism |
| CN205200056U (en) * | 2015-11-20 | 2016-05-04 | 天津钜祥精密模具有限公司 | Low energy consumption intelligence ultrasonic wave mould washing unit device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109667572A (en) * | 2019-01-09 | 2019-04-23 | 中国矿业大学(北京) | A kind of underground coal mine routine drilling injection molding track locating measurement method |
| CN110953970A (en) * | 2019-12-27 | 2020-04-03 | 瓦房店轴承集团国家轴承工程技术研究中心有限公司 | Wind power bearing sealing groove detection method |
| CN115014169A (en) * | 2022-05-30 | 2022-09-06 | 沪东中华造船(集团)有限公司 | Method for measuring thickness of adjusting cushion block in narrow space of ship |
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Application publication date: 20180612 |
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| RJ01 | Rejection of invention patent application after publication |