CN108129587A - A kind of high adhesion force resin and its preparation method and application - Google Patents

A kind of high adhesion force resin and its preparation method and application Download PDF

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Publication number
CN108129587A
CN108129587A CN201711476394.8A CN201711476394A CN108129587A CN 108129587 A CN108129587 A CN 108129587A CN 201711476394 A CN201711476394 A CN 201711476394A CN 108129587 A CN108129587 A CN 108129587A
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acid
resin
high adhesion
methacrylate
adhesion force
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CN108129587B (en
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杨德彬
唐东明
刘泽鹏
贾国忠
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GUANGZHOU WUX MATERIAL TECHNOLOGY Co.,Ltd.
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New Mstar Technology Ltd Of Handong Guangzhou
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/14—Esterification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Emergency Medicine (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)

Abstract

The invention belongs to technical field of macromolecule polymerization, disclose a kind of high adhesion force resin and its preparation method and application.The high adhesion force resin is to be obtained by the resin that side chain contains at least two more than epoxy group and the acid containing polyphenol structure by condensation reaction；The molar ratio that the acid containing polyphenol structure contains the epoxy group in the resin of at least two more than epoxy group with side chain is (0.1~1)：1, the acid containing polyphenol structure is acid and/or other acid for containing polyphenol structure with ortho position polyphenol structure, and the acid with ortho position polyphenol structure is the 50~100% of the mass fraction of the acid containing polyphenol structure.The resin shows splendid adhesive force to hardly possible attachment base material, adhesion promoter or interim protective coating available for glass, metal, plastic cement etc..

Description

A kind of high adhesion force resin and its preparation method and application
Technical field
The invention belongs to technical field of macromolecule polymerization, more particularly, to a kind of high adhesion force resin and its preparation side Method and application.
Background technology
Adhesion promoter has a wide range of applications in fields such as coating and printing inks, particularly with the surface of low-surface-energy.Often The adhesion promoter of rule usually contains phosphate or siloxane group, and bound phosphate groups have stronger acidity, with other trees The compatibility of fat is poor, and only to metal etc., a small number of base materials have preferable effect.And make during phosphate is prepared With a large amount of phosphide, there is larger harm to environment and health.Contain the adhesion promoter of siloxane group as phosphorus The substitute of acid esters has more extensive purposes, but siloxanes adhesive force facilitation effect is weaker, has stronger delustring effect Fruit, curing rate is slower, and the stability in acid, alkalinity and water-based system is poor, it is difficult to meet actual needs.
Invention content
In order to solve above-mentioned the shortcomings of the prior art, a kind of high adhesion force resin is provided.The high adhesion force Resin has used the compound of polyphenol class formation, and as adhesion promoter, the compound of polyphenol structure is present in biomass mostly In, to health and environment without potential hazard, it almost can generate special physical chemistry with all base materials and be bonded, with splendid attached Put forth effort, and property is mild, it is preferable with the compatibility of other resins.
Another object of the present invention is to provide the preparation method of above-mentioned high adhesion force resin.This method is efficiently easy, can Required high adhesion force resin is produced in the case where not influencing environment and health.
It is still another object of the present invention to provide the applications of above-mentioned high adhesion force resin.
The purpose of the present invention is realized by following technical proposals：
A kind of high adhesion force resin is with containing polyphenol structure by the resin that side chain contains at least two more than epoxy group Acid obtained by condensation reaction, the acid containing polyphenol structure contains the tree of at least two more than epoxy group with side chain The molar ratio of epoxy group in fat is (0.1~1)：1, the acid containing polyphenol structure is with ortho position polyphenol structure Acid and/or other contain the acid of polyphenol structure.
Preferably, the resin that the side chain contains at least two more than epoxy group is acrylic acid epoxy resin or phenolic aldehyde Epoxy resin.
Preferably, the acrylic acid epoxy resin is contracted by acrylate and/or methacrylate with methacrylic acid Water glyceride is obtained by free radical polymerization, the side chain carbon number in the acrylate and methacrylate for C1~ 18。
Preferably, the synthetic method of the acrylic acid epoxy resin is：Four-hole boiling flask with condenser pipe is warming up to 70~75 DEG C, nitrogen filling, add in methacrylate monomers and/or acrylate monomer, glycidyl methacrylate, Dipropylene glycol monomethyl ether solvent and azodiisobutyronitrile initiator, heat preservation obtain.
It is further preferable that the glycidyl methacrylate is methacrylate monomers and/or acrylate Monomer gross mass 10~50%, the gross mass and dipropyl of the methacrylate monomers and/or acrylate monomer The mass ratio of glycol monomethyl ether solvent is 1：1, the azodiisobutyronitrile initiator is methacrylate monomers and/or third The 0.5~0.7% of olefin(e) acid ester monomer gross mass, the temperature of the heat preservation are 70~75 DEG C, time of the heat preservation for 12~ 13h。
It is further preferable that the methacrylate monomers are methyl methacrylate, ethyl methacrylate, methyl Butyl acrylate, isobornyl methacrylate, Tert-butyl Methacrylate, n octyl methacrylate, methacrylic acid are different In monooctyl ester, isodecyl methacrylate, Tert-butyl Methacrylate, lauryl methacrylate or stearyl methacrylate More than one；The acrylate monomer is methyl acrylate, ethyl acrylate, butyl acrylate, Isooctyl acrylate monomer, third Olefin(e) acid isodecyl ester, n-octyl, isobornyl acrylate, tert-butyl acrylate, lauryl acrylate or stearyl acrylate One or more of ester.
Preferably, the acid with ortho position polyphenol structure is Gallic Acid, 2,3,4- trihydroxy benzenes One or more of formic acid, 2,3- dihydroxy-benzoic acids or 3,4- dihydroxy-benzoic acids；Other described contain polyphenol structure Acid is 2,4,6- trihydroxybenzoic acids, 3,5- dihydroxy-benzoic acids, 2,5- dihydroxy-benzoic acids, 2,6- dihydroxy-benzoic acids or 2, One or more of 4- dihydroxy-benzoic acids；The acid with ortho position polyphenol structure accounts for the quality of the acid containing polyphenol structure Score is 50~100%.
The preparation method of the high adhesion force resin is to add in the resin with 2 or more epoxy groups with cold In the four-hole boiling flask of solidifying pipe, 140~150 DEG C are warming up to, is kept the temperature after adding in the acid containing polyphenol structure, cooling discharging obtains height Adhesive force resin.
Preferably, the temperature of the heat preservation is 140~150 DEG C, and the time of the heat preservation is 6~7h.
Application of the high adhesion force resin in plastic cement, metal, glass, timber field.
Compared with prior art, the invention has the advantages that：
1. the compound present invention uses polyphenol class formation, as adhesion promoter, the compound of polyphenol structure is most Be present in biomass, the high adhesion force resin provided without health and environmental hazard, it is environmentally protective, almost all base materials are shown Splendid adhesive force effect, it is good with the compatibilities such as most of resins, coating, ink, it dissolves each other completely.
2. the high adhesion force resin of the present invention available for surfaces such as plastic cement, metal, glass, timber, increases coating and ground Between adhesive force.
Specific embodiment
The content further illustrated the present invention with reference to specific embodiment, but should not be construed as limiting the invention. Unless otherwise specified, the conventional means that technological means used in embodiment is well known to those skilled in the art.Except non-specifically Illustrate, reagent that the present invention uses, method and apparatus is the art conventional reagent, method and apparatus.
The synthesis of 1 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen filling adds in methyl methacrylate 30g, third Olefin(e) acid butyl ester 30g, Isooctyl acrylate monomer 30g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 10g, azo two Isobutyronitrile initiator 0.5g, 70 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P1 for 13 hours.
2. the synthesis of high adhesion force resin：P1 resins are added in the four-hole boiling flask with condenser pipe, are warming up to 140 DEG C, Gallic Acid 12g is added in, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force resin needed, point It does not scratch in 10cm2Tinplate, on glass plate and PVC plastic offset plate, it is 0 grade to measure adhesive force after dry.
The synthesis of 2 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen filling adds in methyl acrylate 20g, methyl-prop Olefin(e) acid butyl ester 30g, isodecyl acrylate 30g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 20g, azo two Isobutyronitrile initiator 0.7g, 75 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P2 for 12 hours.
2. adding in P2 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 2,3,4- trihydroxy benzene first Sour 12g, 2,4,6- trihydroxybenzoic acid 11.9g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force tree needed Fat is scratched respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, it is 0 grade to measure adhesive force after dry.
The synthesis of 3 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen is filled, addition Tert-butyl Methacrylate 20g, N-octyl 30g, isodecyl methacrylate 20g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 30g, azodiisobutyronitrile initiator 0.5g, 70 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P3 for 12 hours.
2. adding in P3 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 2,3,4- trihydroxy benzene first Sour 23.9g, 3,5- dihydroxy-benzoic acids 10.8g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force tree needed Fat is scratched respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, it is 0 grade to measure adhesive force after dry.
The synthesis of 4 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen filling, butyl acrylate 30g, acrylic acid are different pungent Ester 20g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 50g, azodiisobutyronitrile initiator 0.5g, 70 DEG C Heat preservation discharges for 12 hours, obtains acrylic acid epoxy resin, is denoted as P4.
2. adding in P4 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 2,3- dihydroxy-benzoic acids 5.4g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force resin needed, is scratched respectively in 10cm2Tinplate On plate, glass plate and PVC plastic offset plate, adhesive force is measured after dry as 0 grade of tinplate, 1 grade of glass plate, 1 grade of PVC plastic offset plate.
The synthesis of 5 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen filling adds in isobornyl methacrylate 30g, isodecyl acrylate 40g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 30g, azodiisobutyronitrile draw Agent 0.5g is sent out, 70 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P5 for 12 hours.
2. adding in P5 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 2,3,4- trihydroxy benzene first Sour 10.8g, 140 DEG C are reacted 7 hours, and cooling discharging is the high adhesion force resin needed, is scratched respectively in 10cm2Ma Kou On iron plate, glass plate and PVC plastic offset plate, adhesive force is measured after dry as 0 grade of tinplate, 1 grade of glass plate, PVC plastic offset plate 1 Grade.
The synthesis of 6 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen is filled, isobornyl acrylate 70g, dipropyl two Alcohol monomethyl ether 100g, glycidyl methacrylate 30g, azodiisobutyronitrile initiator 0.5g, 70 DEG C of heat preservations go out for 12 hours Material, obtains acrylic acid epoxy resin, is denoted as P6.
2. adding in P6 resins in the four-hole boiling flask with condenser pipe, 150 DEG C are warming up to, adds in 3,4-Dihydroxybenzoic acid 16.3g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force resin needed, is scratched respectively in 10cm2Tinplate On plate, glass plate and PVC plastic offset plate, adhesive force is measured after dry as 0 grade of tinplate, 1 grade of glass plate, 1 grade of PVC plastic offset plate.
The synthesis of 7 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen is filled, tert-butyl acrylate 50g, the acrylic acid moon Osmanthus ester 10g, stearyl acrylate acid esters 10g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 30g, azo two are different Butyronitrile initiator 0.5g, 70 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P7 for 12 hours.
2. adding in P7 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 3,4-Dihydroxybenzoic acid 13g, 2,6-DHBA 9.8g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force resin needed, respectively It scratches in 10cm2Tinplate, on glass plate and PVC plastic offset plate, it is 0 grade to measure adhesive force after dry.
The synthesis of 8 acrylic acid epoxy resin of embodiment
1. the four-hole boiling flask with condenser pipe is warming up to 70 DEG C, nitrogen is filled, Tert-butyl Methacrylate 50g, methyl Lauryl acrylate 10g, stearyl methacrylate 10g, dipropylene glycol monomethyl ether 100g, glycidyl methacrylate 30g, azodiisobutyronitrile initiator 0.5g, 70 DEG C of heat preservations discharge, obtain acrylic acid epoxy resin, be denoted as P8 for 12 hours.
2. adding in P8 resins in the four-hole boiling flask with condenser pipe, 140 DEG C are warming up to, adds in 3,4-Dihydroxybenzoic acid 16.7g, 3,5- dihydroxy-benzoic acids 5g, 2,4,6- trihydroxybenzoic acid 10.8g, 140 DEG C are reacted 6 hours, and cooling discharging to obtain the final product To the high adhesion force resin of needs, scratched respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, measured after dry Adhesive force is 0 grade.
The synthesis of 9 high adhesion force resin of embodiment
P1 acrylic acid epoxy resins are added in the four-hole boiling flask with condenser pipe, are warming up to 140 DEG C, add in 3,4,5- tri- Hydroxybenzoic acid 12g, 140 DEG C are reacted 6 hours, and cooling discharging is the high adhesion force resin needed, is scratched respectively in 10cm2 Tinplate, on glass plate and PVC plastic offset plate, it is 0 grade to measure adhesive force after dry.
The synthesis of 10 high adhesion force resin of embodiment
Novolac epoxy resin 100g is added in the four-hole boiling flask with condenser pipe, is warming up to 140 DEG C, adds in 3,4- dihydroxies Yl benzoic acid 30g, 2,4- dihydroxy-benzoic acids 10g, 2,6-DHBA 20g, 140 DEG C are reacted 6 hours, and cooling discharging is The high adhesion force resin needed, scratches respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, surveyed after dry It is 0 grade to obtain adhesive force.
Embodiment 11
P2 acrylic acid epoxy resins are added in the four-hole boiling flask with condenser pipe, are warming up to 140 DEG C, add in 2,3,4- tri- Hydroxybenzoic acid 12g, 2,4,6- trihydroxybenzoic acid 11.9g, 140 DEG C are reacted 6 hours, and cooling discharging is that the height needed is attached Put forth effort resin, scratched respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, it is 0 to measure adhesive force after dry Grade.
Embodiment 12
Novolac epoxy resin 100g is added in the four-hole boiling flask with condenser pipe, is warming up to 140 DEG C, adds in 2,3,4- tri- Hydroxybenzoic acid 20g, 2,4,6- trihydroxybenzoic acid 45g, Gallic Acid 25g, 140 DEG C are reacted 6 hours, cooling The high adhesion force resin that discharging is needed, scratches respectively in 10cm2Tinplate, on glass plate and PVC plastic offset plate, do It is 0 grade that adhesive force is measured after dry.
Embodiment 13
According to national standard《The scratch experiment of GBT9286-1998 paint and varnish paint films》Carry out adhesive force test, test Method is as follows：
Using cross-cut tester, edge of a knife width is about 10mm~12mm, is interval per 1mm~1.2mm, shares 10 lattice, straight line is drawn It will appear 10 identical straight line tool marks in interval when lower, under being drawn in the upright position of straight line tool marks, become 100 lattice for 10*10 Square, cross-cut tester, which is drawn when going down, should be deep into ground, can not only cut on coating, otherwise test invalid.
After cross-cut tester has been drawn, 600 adhesive tape tests of Transparent Tape produced using 3M companies can or can not take off It falls, first, adhesive tape is affixed on hundred cases and puts, and is closely attached adhesive tape, then torn up adhesive tape with the power of moment, mesh with finger pressure Whether there is obscission depending on the coating on material.
Ranking method and standard：
0 grade：The edge of notch is completely smooth, and grid edge does not have any peeling.
1 grade：There is small pieces peeling in the intersection of notch, actual spoilage≤5% in Hua Ge areas.
2 grades：The edge and/or intersection of notch, which have, to be peeled off, and area is more than 5%~15%.
3 grades：There is part to peel off along notching edge or whole sheet peels off or partial grid is peeled off by full wafer, the area of peeling More than 15%~35%.
4 grades：The peeling/of notching edge sheet or some grid parts are partly or entirely peeled off, and area is more than Hua Ge areas 35%~65%.
5 grades：There is sheet of peeling paint at the edge of scribing line and intersection, and the gross area that comes off is more than 65%.
According to the ratio that table 1 is recorded, under stirring at low speed, the high adhesion force resin of 1-12 in embodiment is added to 55g Acrylic resin (AC-261, ROHM AND HAAS) in, after stirring evenly, then add in 2g wetting agents (270, enlightening is high), 1.5g streams Flat agent (BYK333, Bi Ke), 0.5g antifoaming agent (Foamex810, enlightening are high) and 34.5g deionized waters, and add in ammonium hydroxide tune PH extremely 8,1g thickeners (TT-935, ROHM AND HAAS) are added in, 30min is stirred, obtains clear coat composition.
Composition and ratio in 1 embodiment 1-12 of table
Obtained A1-A13 clear coat compositions are applied respectively and are scraped in 10cm2Tinplate, glass plate and PVC plastic offset plate On, after dry, adhesive force is carried out respectively and the transparency is evaluated, the results are shown in Table 2.
The applicating evaluating table of table 2A1-13
As known from Table 2, the coating of the high adhesion force resin of the present invention is not added in, adhesive force is compared with the height for adding the present invention The poor adhesive force of adhesive force resin illustrates that the high adhesion force resin for adding in the present invention can increase the attachment between coating and ground Power, and the transparent preferable of coating is prepared in the high adhesion force resin for adding in the present invention, illustrates the high adhesion force tree of the present invention The compatibility of fat and base resin is good.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine and simplification, Equivalent substitute mode is should be, is included within protection scope of the present invention.

Claims (10)

1. a kind of high adhesion force resin, which is characterized in that the high adhesion force resin is to contain at least two more than epoxy by side chain The resin of group is obtained with the acid containing polyphenol structure by condensation reaction；The acid containing polyphenol structure contains with side chain The molar ratio of epoxy group in the resin of at least two more than epoxy group is (0.1~1)：1, described contains polyphenol structure Acid for the acid with ortho position polyphenol structure and/or other contain acid of polyphenol structure.
2. high adhesion force resin according to claim 1, which is characterized in that the side chain contains at least two more than ring The resin of oxygen groups is acrylic acid epoxy resin or novolac epoxy resin.
3. high adhesion force resin according to claim 2, which is characterized in that the acrylic acid epoxy resin is by acrylic acid Ester and/or methacrylate are obtained with glycidyl methacrylate by free radical polymerization, the acrylate or Side chain carbon number in methacrylate is C1~18.
4. the high adhesion force resin according to claims 2, which is characterized in that the synthesis of the acrylic acid epoxy resin Method is：Four-hole boiling flask with condenser pipe is warming up to 70~75 DEG C, nitrogen filling, add in methacrylate monomers and/ Or acrylate monomer, glycidyl methacrylate, dipropylene glycol monomethyl ether solvent and azodiisobutyronitrile initiator, it protects Temperature obtains.
5. the high adhesion force resin according to claims 4, which is characterized in that the glycidyl methacrylate It is the 10~50% of methacrylate monomers and/or the monomer gross mass of acrylate, the methacrylate monomers And/or the mass ratio of the gross mass of acrylate monomer and dipropylene glycol monomethyl ether solvent is 1：1, the azodiisobutyronitrile Initiator is the 0.5~0.7% of methacrylate monomers and/or acrylate monomer gross mass, and the temperature of the heat preservation is 70~75 DEG C, the time of the heat preservation is 12~13h.
6. the high adhesion force resin according to claims 4, which is characterized in that the methacrylate monomers are first The tertiary fourth of base methyl acrylate, ethyl methacrylate, butyl methacrylate, isobornyl methacrylate, methacrylic acid Ester, n octyl methacrylate, isooctyl methacrylate, isodecyl methacrylate, lauryl methacrylate or methyl One or more of stearyl acrylate acid esters；The acrylate monomer is methyl acrylate, ethyl acrylate, acrylic acid fourth Ester, Isooctyl acrylate monomer, isodecyl acrylate, n-octyl, isobornyl acrylate, tert-butyl acrylate, acrylic acid One or more of lauryl or stearyl acrylate acid esters.
7. high adhesion force resin according to claim 1, which is characterized in that the acid with ortho position polyphenol structure is In 3,4,5-trihydroxy benzoic acid, 2,3,4 trihydroxybenzoic acid, 2,3- dihydroxy-benzoic acids or 3,4- dihydroxy-benzoic acids More than one；Other described acid for containing polyphenol structure are 2,4,6- trihydroxybenzoic acids, 3,5- dihydroxy-benzoic acids, 2,5- One or more of dihydroxy-benzoic acid, 2,6- dihydroxy-benzoic acids or 2,4- dihydroxy-benzoic acids；Described is more with ortho position The acid of phenol structure is the 50~100% of the mass fraction of the acid containing polyphenol structure.
8. according to the preparation method of claim 1-7 any one of them high adhesion force resins, which is characterized in that being will be with 2 The resin of a Yi Shang epoxy group is added in the four-hole boiling flask with condenser pipe, is warming up to 140~150 DEG C, addition contains polyphenol It is kept the temperature after the acid of structure, cooling discharging obtains high adhesion force resin.
9. the preparation method of high adhesion force resin according to claim 8, which is characterized in that the temperature of the heat preservation is 140~150 DEG C, the time of the heat preservation is 6~7h.
10. application of the claim 1-7 any one of them high adhesion force resins in plastic cement, metal, glass, timber field.
CN201711476394.8A 2017-12-29 2017-12-29 High-adhesion resin and preparation method and application thereof Active CN108129587B (en)

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JP7458378B2 (en) 2018-08-27 2024-03-29 ビーエーエスエフ コーティングス ゲゼルシャフト ミット ベシュレンクテル ハフツング Pigment dispersant for coatings

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