CN108110597A - A kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device - Google Patents
A kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device Download PDFInfo
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- CN108110597A CN108110597A CN201810108299.0A CN201810108299A CN108110597A CN 108110597 A CN108110597 A CN 108110597A CN 201810108299 A CN201810108299 A CN 201810108299A CN 108110597 A CN108110597 A CN 108110597A
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- Prior art keywords
- sapphire
- interlayer
- heat
- bundling device
- bonding
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 146
- 239000010980 sapphire Substances 0.000 title claims abstract description 146
- 239000013307 optical fiber Substances 0.000 title claims abstract description 33
- 239000011229 interlayer Substances 0.000 claims abstract description 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000010437 gem Substances 0.000 claims description 8
- 229910001751 gemstone Inorganic materials 0.000 claims description 8
- 241001062009 Indigofera Species 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910018516 Al—O Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 10
- 239000013078 crystal Substances 0.000 description 7
- 239000000835 fiber Substances 0.000 description 6
- 238000005086 pumping Methods 0.000 description 5
- 239000004575 stone Substances 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003708 ampul Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000010583 slow cooling Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Lasers (AREA)
Abstract
The invention discloses a kind of bonding sapphire radiator structure parts for high power optical fibre laser bundling device, including metal outer frame, interlayer sapphire, top layer sapphire, sapphire lid and sapphire heat-radiating rod are provided in the metal outer frame, the sapphire pedestal top is provided with interlayer sapphire and sapphire heat-radiating rod, sapphire heat-radiating rod is located in the sapphire of interlayer, the interlayer sapphire top is provided with top layer sapphire and sapphire lid, and sapphire lid is located above sapphire heat-radiating rod.The present invention, sapphire coefficient of thermal expansion is more much smaller than metal, this structure can carry the laser of 23 kw of power, when bearing the laser of more powerful multikilowatt, the expansion of sapphire bonding structure is relatively small, it has almost no change, therefore the stability of bundling device and reliability are substantially improved.
Description
Technical field
The present invention relates to optical fiber laser bundling device technical field of heat dissipation, are specifically that a kind of high power optical fibre laser that is used for closes
The bonding sapphire radiator structure part of beam device.
Background technology
With the rapid development of internal optical fiber laser and fiber amplifier in recent years, processed in laser weapon, material（Swash
Light mark, laser welding）, light sensing, the numerous areas such as laser radar and optical-fibre communications be required for high-capacity optical fiber laser and
Fiber amplifier.And the realization of high-capacity optical fiber laser and fiber amplifier be unable to do without the pumping based on cladding pumping technique and closes
Beam device.Cladding pumping technique is realized by doubly clad optical fiber, and doubly clad optical fiber adds inner cladding compared to ordinary optic fibre,
And cross-sectional area and numerical aperture allow multimode fibre to be transmitted in covering all much larger than core diameter, and multimode light compared to
Single mode coupling efficiency higher, then conversion amplification is absorbed by the Active Optical Fiber of rare earth doped element, make high power multimode pumping
Light is converted into high power single-mode laser.
Although China's optical fiber laser and fiber amplifier are in the period of rapid development, compared with American-European countries
It starts late, there are many more the development that the problem for failing to capture constrains bundling device for high power cladding pumping technology.It is wherein maximum
Problem be exactly multikilowatt optical fiber laser safe heat dissipation problem.The bundling device research institute of present comparative maturity in the world
There are the IPG in the U.S., the OFS in the U.S., Canadian ITF and French HIGHWAVE etc..And at home, main conjunction beam
Device R＆D and production producer has Shanghai to step a series of high-tech productions such as qi, Shanghai ray machine institute of the Chinese Academy of Sciences, Xi'an ray machine institute of the Chinese Academy of Sciences
Research and develop unit.
The common bundling device of existing market it is most of by the use of quartz ampoule as the heat-radiating rod of conjunction beam.But due to quartzy thermal conductivity
Difference is only used for the low-power bundling device of below 20W.The direct radiating modes of 20-100W are radiated using sapphire
Optical fiber is encapsulated in sapphire heat-radiating rod by stick, and heat-radiating rod is fixed in metallic aluminium box, due to sapphire material good in itself
Heat conduction translucency, this mode effectively raises heat-sinking capability compared to quartz ampoule, reduces the surface temperature of optical fiber.But i.e.
Just also there are two the further promotions that problem limits bearing optical fiber power for this mode：1. optical fiber welding ends unavoidably exists
Light and heat sheds, and due to sapphire stick limited length, single side light transmission heat conduction, this causes its heat-sinking capability to receive very big limit
System, this partial function energy can not effectively shed may eventually form thermal energy improve heat-radiating rod temperature, limit load power into
One step is promoted；2. in the case that power is further promoted（More than 100W）, the thermal expansion that can cause metallic aluminium box is obvious,
Cause entire bundling device stability and reliability poor.
The content of the invention
It is an object of the invention to provide a kind of bonding sapphire radiator structures for high power optical fibre laser bundling device
Part, to solve the problems of the prior art.
To achieve the above object, the present invention provides following technical solution：It is a kind of for high power optical fibre laser bundling device
Sapphire radiator structure part is bonded, including metal outer frame, it is blue precious that interlayer sapphire, top layer are provided in the metal outer frame
Stone, sapphire lid and sapphire heat-radiating rod, the sapphire pedestal top are provided with interlayer sapphire and sapphire heat dissipation
Stick, sapphire heat-radiating rod are located in the sapphire of interlayer, and the interlayer sapphire top is provided with top layer sapphire and indigo plant is precious
Stone lid, sapphire lid are located above sapphire heat-radiating rod.
Preferably, the metal outer frame is arranged to aluminum alloy frame.
Preferably, Al-O ionic bonds are passed through between the interlayer sapphire and sapphire pedestal and top layer sapphire
Atomic force combines.
Preferably, the sapphire pedestal, interlayer sapphire, top layer sapphire, sapphire lid and sapphire heat dissipation
The surface of stick is disposed as polishing structure.
Preferably, the length of the sapphire pedestal is arranged to 75mm, and the width of sapphire pedestal is arranged to 8.5m, Lan Bao
The height of stone pedestal is arranged to 2.5mm.
Preferably, the sapphire length in the interlayer is arranged to 75mm, and the sapphire width in interlayer is arranged to 2mm,
The sapphire height in interlayer is arranged to 2.2mm.
Preferably, the length of the sapphire lid is arranged to 75mm, and the width of sapphire lid is arranged to 4.4mm,
The height of sapphire lid is arranged to 2.2mm.
Preferably, the length of the sapphire heat-radiating rod is arranged to 75mm, and the width of sapphire heat-radiating rod is arranged to
2.3mm, the height of sapphire heat-radiating rod are arranged to 2.3mm.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention 1. uses the intrinsic superiority of bonding structure：Key
The fixation for closing structure is the fixation that chemical bond mode is formed, and guide-lighting thermal conductivity is good, acid-fast alkali-proof high temperature resistant, is had greatly superior
Property.2. heat dissipation effect is obviously improved：Due to sapphire bonding structure compared to sapphire stick increase optical fiber heat dissipation surface area, phase
BELAND gem stick single side heat dissipation, six face heat-sinking capabilities of sapphire bonding structure are more preferable, thus the light of optical fiber weld port and
Heat almost can effectively shed.3. reliability greatly improves：This structure can carry the laser of 2-3 kw of power, Lan Bao
The coefficient of thermal expansion of stone is more much smaller than metal, when bearing the laser of more powerful multikilowatt, sapphire bonding structure
It expands relatively small, has almost no change, therefore the stability of bundling device and reliability are substantially improved.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is the sectional view of the present invention.
In figure：1- sapphire pedestals；2- interlayers sapphire；3- top layer sapphires；4- sapphire lids；5- sapphires dissipate
Hot pin；6- metal outer frames.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment belongs to the scope of protection of the invention.
Please refer to Fig.1-2, in the embodiment of the present invention, a kind of bonding sapphire for high power optical fibre laser bundling device dissipates
Thermojunction component including metal outer frame 6, is provided with interlayer sapphire 2, top layer sapphire 3, sapphire lid 4 in metal outer frame 6
With sapphire heat-radiating rod 5, interlayer sapphire 2,5 total of top layer sapphire 3, sapphire lid 4 and sapphire heat-radiating rod
It is positioned in metal outer frame 6, is screwed, 1 top of sapphire pedestal is provided with interlayer sapphire 2 and sapphire heat dissipation
Stick 5, sapphire heat-radiating rod 5 are located in interlayer sapphire 2, and sapphire 2 top in interlayer is provided with top layer sapphire 3 and indigo plant is precious
Stone lid 4, sapphire lid 4 are located at 5 top of sapphire heat-radiating rod, and metal outer frame 6 is arranged to aluminum alloy frame, and interlayer is blue precious
Combined between stone 2 and sapphire pedestal 1 and top layer sapphire 3 by the atomic force of Al-O ionic bonds, sapphire pedestal 1, in
Interbed sapphire 2, top layer sapphire 3, the surface of sapphire lid 4 and sapphire heat-radiating rod 5 are disposed as polishing structure, Lan Bao
The length of stone pedestal 1 is arranged to 75mm, and the width of sapphire pedestal 1 is arranged to 8.5m, and the height of sapphire pedestal 1 is arranged to
2.5mm, the length of interlayer sapphire 2 are arranged to 75mm, and the width of interlayer sapphire 2 is arranged to 2mm, interlayer sapphire
2 height is arranged to 2.2mm, and the length of sapphire lid 4 is arranged to 75mm, and the width of sapphire lid 4 is arranged to
4.4mm, the height of sapphire lid 4 are arranged to 2.2mm, and the length of sapphire heat-radiating rod 5 is arranged to 75mm, sapphire heat-radiating rod
5 width is arranged to 2.3mm, and the height of sapphire heat-radiating rod 5 is arranged to 2.3mm.
The present invention operation principle be：It is needed before crystal bonding to the precise polished processing of plane of crystal, it is desirable that crystal bonding
Surface smoothness reaches atom magnitude level；Clean crystal surface, to plane of crystal cleaning treatment before bonding, can with 30% salt
When acid soak crystal 3 is small, then it is cleaned by ultrasonic 20 minutes in deionized water, dries in the air naturally after dipping in absolute ethyl alcohol wiping with alcohol swab
It is dry；Bonding carries out in high temperature high vacuum furnace, and sapphire pedestal 1, interlayer sapphire 2, top are fixed using iraurite fixture
Layer 3 crystal of sapphire, and pressurize along perpendicular to the direction of bottom surface, pressure size 10N -100N carries out High temperature diffusion bonding,
1750-1950 DEG C of temperature, vacuum degree are better than 1.0 × 10-2Pa, 24-48h are kept the temperature, then by certain procedures slow cooling to room temperature
It takes out；The fixation of bonding structure is the fixation that chemical bond mode is formed, and guide-lighting thermal conductivity is good, acid-fast alkali-proof high temperature resistant, has pole
Big superiority；Due to sapphire bonding structure compared to sapphire stick increase optical fiber heat dissipation surface area, compared to sapphire stick
Single side heat dissipation, six face heat-sinking capabilities of sapphire bonding structure are more preferable, therefore the light and heat of optical fiber weld port almost can
Effectively shed；Sapphire coefficient of thermal expansion is more much smaller than metal, blue when bearing the laser of more powerful multikilowatt
The expansion of jewel bonding structure is relatively small, has almost no change, therefore the stability of bundling device and reliability are substantially improved.
It is obvious to a person skilled in the art that the invention is not restricted to the details of above-mentioned exemplary embodiment, Er Qie
In the case of without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Profit requirement rather than above description limit, it is intended that all by what is fallen within the meaning and scope of the equivalent requirements of the claims
Variation is included within the present invention.Any reference numeral in claim should not be considered as to the involved claim of limitation.
Claims (8)
1. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device, including metal outer frame（6）, it is special
Sign is：The metal outer frame（6）Inside it is provided with interlayer sapphire（2）, top layer sapphire（3）, sapphire lid（4）And indigo plant
Jewel heat-radiating rod（5）, the sapphire pedestal（1）Top is provided with interlayer sapphire（2）With sapphire heat-radiating rod（5）, it is blue
Jewel heat-radiating rod（5）Positioned at interlayer sapphire（2）It is interior, the interlayer sapphire（2）Top is provided with top layer sapphire（3）
With sapphire lid（4）, sapphire lid（4）Positioned at sapphire heat-radiating rod（5）Top.
2. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The metal outer frame（6）It is arranged to aluminum alloy frame.
3. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The interlayer sapphire（2）With sapphire pedestal（1）With top layer sapphire（3）Between by Al-O from
The atomic force of sub-key combines.
4. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The sapphire pedestal（1）, interlayer sapphire（2）, top layer sapphire（3）, sapphire lid（4）And indigo plant
Jewel heat-radiating rod（5）Surface be disposed as polishing structure.
5. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The sapphire pedestal（1）Length be arranged to 75mm, sapphire pedestal（1）Width be arranged to 8.5m, it is blue
Jewel base（1）Height be arranged to 2.5mm.
6. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The interlayer sapphire（2）Length be arranged to 75mm, interlayer sapphire（2）Width be arranged to
2mm, interlayer sapphire（2）Height be arranged to 2.2mm.
7. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The sapphire lid（4）Length be arranged to 75mm, sapphire lid（4）Width be arranged to
4.4mm, sapphire lid（4）Height be arranged to 2.2mm.
8. a kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device according to claim 1,
It is characterized in that：The sapphire heat-radiating rod（5）Length be arranged to 75mm, sapphire heat-radiating rod（5）Width be arranged to
2.3mm, sapphire heat-radiating rod（5）Height be arranged to 2.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810108299.0A CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810108299.0A CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108110597A true CN108110597A (en) | 2018-06-01 |
| CN108110597B CN108110597B (en) | 2024-01-26 |
Family
ID=62220652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810108299.0A Active CN108110597B (en) | 2018-02-02 | 2018-02-02 | Bonded sapphire heat dissipation structural member for high-power optical fiber laser beam combiner |
Country Status (1)
| Country | Link |
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| CN (1) | CN108110597B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050008051A1 (en) * | 2003-05-15 | 2005-01-13 | Sumida David S. | Numerical aperture optimization using doped cladding layers |
| US20090087146A1 (en) * | 2007-09-27 | 2009-04-02 | Rolston David R | Method for assembling a two substrate parallel optical sub-assembly |
| CN104242026A (en) * | 2014-08-27 | 2014-12-24 | 清华大学 | Optical fiber wrapping layer light filter-out device and forming method thereof |
| CN204347293U (en) * | 2015-01-22 | 2015-05-20 | 迈岐光电科技(上海)有限公司 | A kind of optical-fiber bundling device with encapsulating structure |
| CN104901155A (en) * | 2015-06-17 | 2015-09-09 | 中国人民解放军国防科学技术大学 | High-power fiber laser pump light coupling and signal light beam expanding output apparatus |
| CN204903803U (en) * | 2015-08-06 | 2015-12-23 | 深圳市创鑫激光股份有限公司 | Fiber combiner |
| CN205809346U (en) * | 2016-07-06 | 2016-12-14 | 莱特尔科技（深圳）有限公司 | A kind of fibre cladding power stripper |
| CN107065081A (en) * | 2016-11-01 | 2017-08-18 | 天津恒瑜晶体材料股份有限公司 | The attachment structure of sapphire nut and sapphire single-crystal capillary |
| CN206432553U (en) * | 2016-11-17 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | A kind of optical fiber laser cladding light stripper |
| CN207884062U (en) * | 2018-02-02 | 2018-09-18 | 迈岐光电科技(上海)有限公司 | A kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device |
-
2018
- 2018-02-02 CN CN201810108299.0A patent/CN108110597B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050008051A1 (en) * | 2003-05-15 | 2005-01-13 | Sumida David S. | Numerical aperture optimization using doped cladding layers |
| US20090087146A1 (en) * | 2007-09-27 | 2009-04-02 | Rolston David R | Method for assembling a two substrate parallel optical sub-assembly |
| CN104242026A (en) * | 2014-08-27 | 2014-12-24 | 清华大学 | Optical fiber wrapping layer light filter-out device and forming method thereof |
| CN204347293U (en) * | 2015-01-22 | 2015-05-20 | 迈岐光电科技(上海)有限公司 | A kind of optical-fiber bundling device with encapsulating structure |
| CN104901155A (en) * | 2015-06-17 | 2015-09-09 | 中国人民解放军国防科学技术大学 | High-power fiber laser pump light coupling and signal light beam expanding output apparatus |
| CN204903803U (en) * | 2015-08-06 | 2015-12-23 | 深圳市创鑫激光股份有限公司 | Fiber combiner |
| CN205809346U (en) * | 2016-07-06 | 2016-12-14 | 莱特尔科技（深圳）有限公司 | A kind of fibre cladding power stripper |
| CN107065081A (en) * | 2016-11-01 | 2017-08-18 | 天津恒瑜晶体材料股份有限公司 | The attachment structure of sapphire nut and sapphire single-crystal capillary |
| CN206432553U (en) * | 2016-11-17 | 2017-08-22 | 大族激光科技产业集团股份有限公司 | A kind of optical fiber laser cladding light stripper |
| CN207884062U (en) * | 2018-02-02 | 2018-09-18 | 迈岐光电科技(上海)有限公司 | A kind of bonding sapphire radiator structure part for high power optical fibre laser bundling device |
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| CN108110597B (en) | 2024-01-26 |
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