CN108109929A - Upside-down mounting detects the method for integrated apparatus and its upside-down mounting detection and the method for encapsulation - Google Patents
Upside-down mounting detects the method for integrated apparatus and its upside-down mounting detection and the method for encapsulation Download PDFInfo
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- CN108109929A CN108109929A CN201611059456.0A CN201611059456A CN108109929A CN 108109929 A CN108109929 A CN 108109929A CN 201611059456 A CN201611059456 A CN 201611059456A CN 108109929 A CN108109929 A CN 108109929A
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- chip
- bonding
- upside
- down mounting
- automated inspection
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The invention discloses the methods of the method and encapsulation of a kind of upside-down mounting detection integrated apparatus and its upside-down mounting detection.The upside-down mounting detection integrated apparatus includes chip and removes pickup unit, chip bonding measuring unit and chip position processing unit, the chip bonding measuring unit includes NI Vision Builder for Automated Inspection and hollow bonding platform, the hollow bonding platform is equipped with the hollow cavity for housing the NI Vision Builder for Automated Inspection, the hollow bonding platform carries slide glass to be bonded using transparent table top, NI Vision Builder for Automated Inspection identification chip in a manner of from the bottom to top, before the chip position processing unit is bonded according to the data that the NI Vision Builder for Automated Inspection is sent after the position of chip and bonding chip position.The upside-down mounting detection integrated apparatus is combined the measuring device of chip position with upside-down mounting equipment, chip is made to complete the on-line measurement of chip position while completing bonding, measurement data can be exported to exposure technology, reduced the chip position time of measuring of exposure technology, improved production efficiency.
Description
Technical field
The present invention relates to the methods of the method and encapsulation of a kind of upside-down mounting detection integrated apparatus and its upside-down mounting detection.
Background technology
In recent years, since Fanout techniques (being fanned out to technique) have, thickness was thin, the good advantage of thermal characteristics, while was deposited compared with BGA
In larger cost advantage, occupation rate of the Fanout techniques in market is higher and higher, and there are the potentiality of explosive development, it is domestic
Outer package factory is all being studied, some producers have been introduced into the substantive volume production stage.More traditional Fanin technique (fan-ins
Technique), Fanout needs to increase by 4 processes, is respectively thinned, cuts, C2W is bonded (patch bonding), wherein injection, C2W keys
It closes there are two major class techniques, one kind is the face-down technique of graphics chip, and another kind is the face-up technique of chip.Chip is upward
Process costs advantage it is little, be suitble to the manufacturing process of high-end chip, the producer of existing low and middle-end is substantially all face-down with chip
Technique, in the market use most wide technique.For the face-down technique of chip, C2W bonding technologies use upside-down mounting
Machine, current traditional flip machine can generally be abstracted into the structure such as Fig. 1, such as ASM, Besi, AMICRA, KS company all use and is somebody's turn to do
The flip machine of class formation.
As shown in Figure 1, without considering material transferring unit, the main unit of Conventional flip machine is made of three parts：Chip is shelled
From pick-up area 100, chip alignment area 300, C2W bonding regions 400.Chip is removed pick-up area 100 and is picked up by bonding head 110, chip
Structure 120 and blue film platform 150 form.Chip 130 is attached on blue film platform 150, and chip pick-up structure 120 coordinates blue film platform 150
Internal ejector pin mechanism completes the pickup of chip 130, and after pickup is completed, chip pick-up structure 120 overturns 180 degree, by chip 130
It is attached on bonding head 110, after the pickup for completing chip 130, bonding head 110 moves to chip alignment area 300；Chip alignment area
300 are mainly made of the NI Vision Builder for Automated Inspection 310 and frame 320 that look up, and the NI Vision Builder for Automated Inspection 310 is arranged on the frame
On frame 320, bonding head 110 moves to the surface of NI Vision Builder for Automated Inspection 310, and NI Vision Builder for Automated Inspection 310 measures 130 surface of chip
Mark, so as to calculate the alignment position of chip 130, complete chip 130 to locating tab assembly after, bonding head 110 moves to
C2W bonding regions 400；C2W bonding regions 400 are mainly made of bonding platform 440, slide glass sucker 430 and slide glass 420, and slide glass 420 adsorbs
On slide glass sucker 430, slide glass sucker 430 is arranged on bonding platform 440.Bonding head 110 is moved to after C2W bonding regions 400,
It is bonded platform 440 and movement or bonding head 110 is completed according to the alignment metrical information according to the metrical information of chip alignment area 300
One step moves in place, and after the compensation for completing alignment position, bonding head 110 moves down, completes the bonding of C2W.The kind equipment
The times of exercise that one single chip completes bonding is more, and yield and bonding precision are a pair of very prominent contradiction.
For Fanout techniques, it is necessary to be exposed technique, to grow RDL, (distribution is drawn after C2W bondings, injection
Line).Exposure quality is improved in order to use step photo-etching machine, means relatively common at present are：The each core of off-line measurement
The physical location of piece, and the average alignment position in one stepping exposure field of off-line calculation, are then mended in litho machine
It repays.As shown in Fig. 2, on off-line measurement slide glass 420 each chip 130 position P1~P16, then least square fitting go out the exposure
Average alignment position in light field, then compensates in litho machine.The efficiency of such method is extremely low, seriously affects
The volume production rhythm of Fanout techniques.
Except step photo-etching machine, it is exposed and an option of producer using laser direct writing equipment, but either
It is still exposed with step photo-etching machine with laser direct writing equipment, is required for being known in advance the physical location of each chip, and one
Often there are thousands of chips even tens thousand of a chips on silicon chip, if using step photo-etching machine or laser direct writing equipment,
Or individually detection device carries out the measurement of chip position, will all take very much, the influence to producing line overall efficiency is all very
Greatly.
The content of the invention
The present invention provides a kind of upside-down mountings to detect integrated apparatus, cannot be by yield and key to solve Conventional flip device
Close the problem of precision combines.
In order to solve the above-mentioned technical problem, the technical scheme is that：
A kind of upside-down mounting detects integrated apparatus, and pickup unit, chip bonding measuring unit and chip are removed including chip
Position processing unit, the chip bonding measuring unit include NI Vision Builder for Automated Inspection and hollow bonding platform, the hollow bonding platform
Equipped with the hollow cavity for housing the NI Vision Builder for Automated Inspection, the hollow bonding platform carries slide glass to be bonded, institute using transparent table top
NI Vision Builder for Automated Inspection identification chip in a manner of from the bottom to top is stated, the chip position processing unit is according to the machine vision system
The position of chip and the position of chip after bonding before the data that system is sent are bonded.
Preferably, the hollow bonding platform includes frame, the frame is set circumferentially around the NI Vision Builder for Automated Inspection,
The transparent table top is set on said frame.
Preferably, the transparent table top is chosen as slide glass sucker.
Preferably, the transparent table top is chosen as transparent crystal.
Preferably, the upside-down mounting detection integrated apparatus further includes to carry the frame and the machine vision system
The pedestal of system, the relatively described pedestal of the frame have X, Y, Rz to Three Degree Of Freedom.
Preferably, the upside-down mounting detection integrated apparatus further includes to carry the frame and the machine vision system
The pedestal of system, the relatively described pedestal of the frame have X, Y, Rz to Three Degree Of Freedom, the relatively described bottom of the NI Vision Builder for Automated Inspection
Seat tool has X, Y-direction degree of freedom.
Preferably, the relatively described pedestal of the NI Vision Builder for Automated Inspection has Z-direction degree of freedom.
Preferably, the NI Vision Builder for Automated Inspection includes drive system and performs system, the execution system is to chip position
Measurement is put, the drive system drives the execution system motion.
Preferably, the chip, which removes pickup unit, includes bonding head, chip mechanism for picking and blue film platform, the bonding
Head is removed in the chip and moved back and forth between pickup unit and the chip bonding measuring unit, and chip is arranged on the blue film
On platform, the chip mechanism for picking picks up chip from the blue film platform and passes to the bonding head after overturning.
Upside-down mounting of the present invention is combined the measuring device of chip position with upside-down mounting equipment with detecting integrated device, is made
When obtaining chip completion bonding, while the on-line measurement of chip position is completed, simplify the structure of device, saved and be produced into
This；In addition, measurement data can be exported to post-exposure technique, for the alignment position control of chip exposure, reduce exposure work
The chip time of measuring of skill, improves production efficiency.
The invention also discloses the method that above-mentioned upside-down mounting detection integrated apparatus carries out upside-down mounting detection, step is as follows：Chip
Pickup unit, which is removed, through the chip is transferred to the chip bonding measuring unit progress chip bonding, before chip bonding, institute
It states NI Vision Builder for Automated Inspection and the chip is identified in a manner of from the bottom to top, the chip position processing unit receives the machine and regards
The data that feel system is sent calculate the position of chip before bonding, adjust the phase of the relatively described slide glass to be bonded of the chip afterwards
To position, chip alignment bonding is realized；After chip bonding, the NI Vision Builder for Automated Inspection again identifies that the chip, the core
The position of chip after bonding is calculated in piece position processing unit.
Preferably, when realizing the chip alignment bonding, the NI Vision Builder for Automated Inspection is moved along Z-direction, after making bonding
Chip is located in the visual range of the NI Vision Builder for Automated Inspection.
The method of upside-down mounting detection of the present invention does not have individual alignment procedures, and alignment procedures are bound to bonding steps,
The production time is saved, improves yield.
The invention also discloses a kind of method being packaged using above-mentioned upside-down mounting detection integrated apparatus, step is as follows：
Chip removes pickup unit through the chip and is transferred to the chip bonding measuring unit progress chip bonding, in chip bonding
Before, the NI Vision Builder for Automated Inspection identifies the chip in a manner of from the bottom to top, described in the chip position processing unit receives
The data that NI Vision Builder for Automated Inspection is sent calculate the position of chip before bonding, adjust the relatively described load to be bonded of the chip afterwards
The relative position of piece realizes chip alignment bonding；After chip bonding, the NI Vision Builder for Automated Inspection again identifies that the chip,
The position of chip after bonding is calculated in the chip position processing unit, by the position of chip after the bonding for subsequently exposure
Light technique.
The method of encapsulation of the present invention exports the on-line measurement data for measuring chip position to post-exposure technique, uses
In the alignment position control of chip exposure, the chip time of measuring of post-exposure technique is reduced, improves the life of entire producing line
Produce efficiency.
Description of the drawings
Fig. 1 is the structure diagram of flip machine of the prior art；
Fig. 2 is the position view of chip on slide glass of the prior art；
Fig. 3 is the structure diagram of the upside-down mounting detection integrated apparatus of a specific embodiment of the invention.
Shown in Fig. 1~2：100- chips remove pick-up area, 300- chips alignment area, 400-C2W bonding regions, 110- bondings
Head, 120- chips pick-up structure, 130- chips, 150- indigo plant films platform, 310- NI Vision Builder for Automated Inspections, 320- frames, 420- slide glasses,
430- slide glasses sucker, 440- bonding platforms；
Shown in Fig. 3：100- chips remove pickup unit, 110- bonding heads, 120- chips mechanism for picking, 130- indigo plant films
Platform, 200- chip bondings measuring unit, 210- transparent table tops, 220- slide glasses to be bonded, 230- bondings glue, 240- frames, 250-
Pedestal, 260- drive systems, 270- perform system.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.It should be noted that attached drawing of the present invention uses simplified form and uses non-essence
Accurate ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Fig. 3 is referred to, a kind of upside-down mounting detects integrated apparatus, and pickup unit 100, chip bonding measurement are removed including chip
Unit 200 and chip position processing unit (not shown), the chip bonding measuring unit 200 include machine vision system
System and hollow bonding platform, the hollow bonding platform are equipped with the hollow cavity for housing the NI Vision Builder for Automated Inspection, the hollow bonding platform
Slide glass 220 to be bonded is carried using transparent table top 210, there is bonding glue 230, the machine vision on the slide glass 220 to be bonded
System identification chip in a manner of from the bottom to top, the number that the chip position processing unit is sent according to the NI Vision Builder for Automated Inspection
According to the position of chip after the position of chip before being bonded and bonding.
The hollow bonding platform includes frame 240, and the frame 240 is set circumferentially around the NI Vision Builder for Automated Inspection, institute
Transparent table top 210 is stated to be arranged on the frame 240.The transparent table top 210 is slide glass sucker prepared by transparent crystal.
The upside-down mounting detection integrated apparatus further includes to carry the bottom of the frame 240 and the NI Vision Builder for Automated Inspection
Seat 250, the relatively described pedestal 250 of the frame 240 have X, Y, Rz to Three Degree Of Freedom, and the NI Vision Builder for Automated Inspection is relatively described
Pedestal 250 have X, Y, Z-direction degree of freedom, can also relatively described pedestal 250 have X, Y-direction degree of freedom, can also be relatively described
Pedestal 250 has Z-direction degree of freedom, can also be fixed on the pedestal 250, relatively described pedestal 250 is stationary.The machine
The configuration of the degree of freedom of device vision system is determined by the precision of upside-down mounting, if a chip needs two marks of alignment, needs X
It is moved to two degree of freedom of Y-direction NI Vision Builder for Automated Inspection being driven to move progress horizontal direction；If the precision of one single chip alignment will
It asks, while the depth of field of NI Vision Builder for Automated Inspection is enough, then Z-direction degree of freedom is not required.
The NI Vision Builder for Automated Inspection includes drive system 260 and performs system 270, and the execution system 270 is to chip position
Measurement is put, the drive system 260 drives the execution system 270 to move.
The chip, which removes pickup unit 100, includes bonding head 110, chip mechanism for picking 120 and blue film platform 130, described
Bonding head 110 is removed in the chip and moved back and forth between pickup unit 100 and the chip bonding measuring unit 200, chip
It is arranged on the blue film platform 130, the chip mechanism for picking 120 picks up chip from the blue film platform 130 and passed after overturning
Pass the bonding head 110.
Chip removes pickup unit 100 from the chip by the bonding head 110 and is transferred to the chip bonding measurement
Unit 200 carries out chip bonding.Before chip bonding, NI Vision Builder for Automated Inspection identification chip in a manner of from the bottom to top, institute
It states chip position processing unit and receives the data that the NI Vision Builder for Automated Inspection is sent, calculate the position of chip before bonding, adjust afterwards
The relative position of the relatively described slide glass to be bonded 220 of whole chip, the hollow bonding platform horizontal direction movement carry out chip alignment
Compensation, while the bonding head 110 moves downward, and realizes chip alignment bonding；With the relatively described bottom of the NI Vision Builder for Automated Inspection
Exemplified by seat 250 has Z-direction degree of freedom, when realizing chip alignment bonding, the NI Vision Builder for Automated Inspection is moved along Z-direction, makes bonding
Chip is located in the visual range of the NI Vision Builder for Automated Inspection afterwards；After chip bonding, the NI Vision Builder for Automated Inspection again identifies that
Chip, the chip position processing unit are calculated the position of chip after bonding, the position of chip after the bonding are used for
Post-exposure technique.
The upside-down mounting detection integrated apparatus is combined the measuring device of chip position with upside-down mounting equipment, and key is completed in chip
When conjunction, while the on-line measurement of chip position is completed, measurement data can be exported to post-exposure technique, exposed for chip
The alignment position control of light, reduces the chip time of measuring of exposure technology, improves the production efficiency of entire producing line, reduce
Production cost；In addition, the upside-down mounting detection integrated apparatus is simple in structure, further reduce costs.
Compared with Conventional flip equipment, there is no chip alignment area, the bonding head 110 among the upside-down mounting detection integrated apparatus
Reduce from pickup to the distance of bonding, times of exercise reduces, and the time of one single chip bonding shortens, and improves yield.
Those skilled in the art can carry out invention spirit and model of the various modification and variations without departing from the present invention
It encloses.In this way, if these modifications and changes of the present invention belongs within the scope of the claims in the present invention and its equivalent technologies, then
The present invention is also intended to including these modification and variations.
Claims (12)
1. a kind of upside-down mounting detects integrated apparatus, which is characterized in that removes pickup unit, chip bonding measuring unit including chip
And chip position processing unit, the chip bonding measuring unit includes NI Vision Builder for Automated Inspection and hollow bonding platform, in described
Dead key closes platform and is equipped with the hollow cavity for housing the NI Vision Builder for Automated Inspection, and the hollow bonding platform is carried to be bonded using transparent table top
Slide glass, NI Vision Builder for Automated Inspection identification chip in a manner of from the bottom to top, the chip position processing unit is according to the machine
The position of chip and the position of chip after bonding before the data that device vision system is sent are bonded.
2. upside-down mounting according to claim 1 detects integrated apparatus, which is characterized in that the hollow bonding platform includes frame
Frame, the frame are set circumferentially around the NI Vision Builder for Automated Inspection, and the transparent table top is set on said frame.
3. upside-down mounting according to claim 1 detects integrated apparatus, which is characterized in that the transparent table top is chosen as slide glass
Sucker.
4. upside-down mounting according to claim 1 detects integrated apparatus, which is characterized in that the transparent table top is chosen as transparent
Crystal.
5. upside-down mounting according to claim 2 detects integrated apparatus, which is characterized in that the upside-down mounting detects integrated apparatus
Further include to carry the pedestal of the frame and the NI Vision Builder for Automated Inspection, the relatively described pedestal of the frame has X, Y, Rz
To Three Degree Of Freedom.
6. upside-down mounting according to claim 2 detects integrated apparatus, which is characterized in that further includes to carry the frame
With the pedestal of the NI Vision Builder for Automated Inspection, the relatively described pedestal of the frame has X, Y, Rz to Three Degree Of Freedom, and the machine regards
The relatively described pedestal of feel system has X, Y-direction degree of freedom.
7. upside-down mounting according to claim 5 or 6 detects integrated apparatus, which is characterized in that the NI Vision Builder for Automated Inspection phase
There is Z-direction degree of freedom to the pedestal.
8. upside-down mounting according to claim 1 detects integrated apparatus, which is characterized in that the NI Vision Builder for Automated Inspection includes driving
Dynamic system and execution system, the execution system measure chip position, and the drive system drives the execution system motion.
9. upside-down mounting according to claim 1 detects integrated apparatus, which is characterized in that the chip removes pickup unit bag
It includes bonding head, chip mechanism for picking and blue film platform, the bonding head and removes pickup unit and the chip bonding in the chip
It is moved back and forth between measuring unit, chip is arranged on the blue film platform, and the chip mechanism for picking is picked up from the blue film platform
The bonding head is passed to after coring piece and overturning.
10. a kind of method for carrying out upside-down mounting detection using upside-down mounting as described in claim 1 detection integrated apparatus, feature exist
In step is as follows：Chip removes pickup unit through the chip and is transferred to the chip bonding measuring unit progress chip bonding,
Before chip bonding, the NI Vision Builder for Automated Inspection identifies the chip in a manner of from the bottom to top, and the chip position processing is single
Member receives the data that the NI Vision Builder for Automated Inspection is sent, and calculates the position of chip before bonding, adjusts the chip afterwards with respect to institute
The relative position of slide glass to be bonded is stated, realizes chip alignment bonding；After chip bonding, the NI Vision Builder for Automated Inspection again identifies that
The position of chip after bonding is calculated in the chip, the chip position processing unit.
11. the method for upside-down mounting detection according to claim 10, which is characterized in that realizing the chip alignment bonding
When, the NI Vision Builder for Automated Inspection is moved along Z-direction, and chip is located in the visual range of the NI Vision Builder for Automated Inspection after making bonding.
A kind of 12. method being packaged using upside-down mounting as described in claim 1 detection integrated apparatus, which is characterized in that
Step is as follows：Chip removes pickup unit through the chip and is transferred to the chip bonding measuring unit progress chip bonding,
Before chip bonding, the NI Vision Builder for Automated Inspection identifies the chip, the chip position processing unit in a manner of from the bottom to top
The data that the NI Vision Builder for Automated Inspection is sent are received, the position of chip before bonding is calculated, it is relatively described to adjust the chip afterwards
The relative position of slide glass to be bonded realizes chip alignment bonding；After chip bonding, the NI Vision Builder for Automated Inspection again identifies that institute
Chip is stated, the position of chip after bonding is calculated in the chip position processing unit, and the position of chip after the bonding is used
In post-exposure technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611059456.0A CN108109929B (en) | 2016-11-25 | 2016-11-25 | Flip-chip detection integrated device, flip-chip detection method and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611059456.0A CN108109929B (en) | 2016-11-25 | 2016-11-25 | Flip-chip detection integrated device, flip-chip detection method and packaging method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN108109929A true CN108109929A (en) | 2018-06-01 |
| CN108109929B CN108109929B (en) | 2021-05-28 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987316A (en) * | 2018-09-26 | 2018-12-11 | 广东工业大学 | A kind of flip-chip substrate space level device and system |
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| JPH08148896A (en) * | 1994-11-17 | 1996-06-07 | Sanyo Electric Co Ltd | Correction of positional deviation of mounting and mounting position measuring device |
| JP2002110733A (en) * | 2001-08-23 | 2002-04-12 | Matsushita Electric Ind Co Ltd | Method for bonding electronic component |
| CN101292129A (en) * | 2005-10-17 | 2008-10-22 | 琳得科株式会社 | Measuring device |
| CN105448752A (en) * | 2015-12-01 | 2016-03-30 | 华天科技（昆山）电子有限公司 | Fan-out package method of embedded silicon substrate |
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2016
- 2016-11-25 CN CN201611059456.0A patent/CN108109929B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08148896A (en) * | 1994-11-17 | 1996-06-07 | Sanyo Electric Co Ltd | Correction of positional deviation of mounting and mounting position measuring device |
| JP2002110733A (en) * | 2001-08-23 | 2002-04-12 | Matsushita Electric Ind Co Ltd | Method for bonding electronic component |
| CN101292129A (en) * | 2005-10-17 | 2008-10-22 | 琳得科株式会社 | Measuring device |
| CN105448752A (en) * | 2015-12-01 | 2016-03-30 | 华天科技（昆山）电子有限公司 | Fan-out package method of embedded silicon substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108987316A (en) * | 2018-09-26 | 2018-12-11 | 广东工业大学 | A kind of flip-chip substrate space level device and system |
| CN108987316B (en) * | 2018-09-26 | 2024-03-26 | 广东工业大学 | Space leveling equipment and system for flip chip substrate |
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| Publication number | Publication date |
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| CN108109929B (en) | 2021-05-28 |
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