CN108109827A - The production method and back cover plate of a kind of back cover plate - Google Patents
The production method and back cover plate of a kind of back cover plate Download PDFInfo
- Publication number
- CN108109827A CN108109827A CN201810027038.6A CN201810027038A CN108109827A CN 108109827 A CN108109827 A CN 108109827A CN 201810027038 A CN201810027038 A CN 201810027038A CN 108109827 A CN108109827 A CN 108109827A
- Authority
- CN
- China
- Prior art keywords
- lds
- wireless charging
- wire coil
- cover plate
- charging wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
Abstract
The invention discloses the production methods and back cover plate of a kind of back cover plate.The production method includes：Step 1：One cover board substrate is provided；Step 2：Form wireless charging wire coil a at least LDS layers is integrally made on the back side of the cover board substrate.The production method will integrally be produced on the back cover plate of mobile terminal for the wireless charging wire coil of induced field, can save subsequent assembly process, assembly cost be reduced, also with good stability.
Description
Technical field
The present invention relates to the production methods and back cover plate of electronic equipment cover sheet more particularly to a kind of back cover plate.
Background technology
With the popularization of the mobile terminals such as mobile phone, tablet, wireless charging technology has obtained great development.Wireless charging skill
Art be it is a kind of using electromagnetic induction principle come the new technology to charge to mobile terminal, charging process is mainly by magnetic field transmitter
It is completed with magnetic sensors.The magnetic sensors set in mobile terminal is mainly situated in the metal on the back side of mobile terminal
Coil, this wire coil are all using external hanging type, and independent assembly connection power supply, assembly process is more, assembly cost is higher,
Stability is also bad.
The content of the invention
In order to solve above-mentioned the deficiencies in the prior art, the present invention provides a kind of production method and back cover of back cover plate
Plate.The production method will integrally be produced on the back cover plate of mobile terminal for the wireless charging wire coil of induced field
On, subsequent assembly process can be saved, assembly cost is reduced, also with good stability.
The technical problems to be solved by the invention are achieved by the following technical programs：
A kind of production method of back cover plate, including：
Step 1：One cover board substrate is provided；
Step 2：Form wireless charging wire coil a at least LDS layers is integrally made on the back side of the cover board substrate.
Further, step 2 includes：
Step 2.1：Make LDS ink layers；
Step 2.2：The surface of the LDS ink layers is activated using laser irradiation, forms activating area；
Step 2.3：Metal pattern is made on the activating area of the LDS ink；
Step 2.4：Step 2.1-2.3 is repeated, until completing the wireless charging wire coil；
Wherein, the wireless charging wire coil is made of one layer of metal pattern, alternatively, being conducted by least double layer of metal pattern
It forms, first layer LDS ink is covered on the back side of the cover board substrate, and next layer of LDS ink is covered in last layer LDS ink
On metal pattern.
Further, further include：
Step 3：The wireless charging wire coil is bound into wiring board.
Further, step 3 includes：
Step 3.1：The first FPC winding displacements and the 2nd FPC winding displacements are connected respectively in the two-port of the wireless charging wire coil；
Step 3.2：The first FPC winding displacements and the 2nd FPC winding displacements are connected to the wiring board.
Further, step 3.1 includes：
Step 3.1.1：ACF glue is respectively coated in the two-port of the wireless charging wire coil, the ACF glue is in Vertical Square
Conducting upwards, it is non-conduction in the horizontal direction；
Step 3.1.2：The first FPC winding displacements and the 2nd FPC winding displacements are pressed together on the wireless charging wire coil respectively
On ACF glue in two-port.
A kind of back cover plate includes cover board substrate and forms at least a LDS layers of wireless charging wire coil, it is described at least
One LDS layers is integrally produced on the back side of the cover board substrate.
Further, LDS ink and metal pattern are included successively from the bottom up for described LDS layers, the LDS ink is towards institute
The activated formation activating area of one side of metal pattern is stated, the metal pattern is produced on the activating area；Wherein, it is described
Wireless charging wire coil is made of one layer of metal pattern, is formed alternatively, being conducted by least double layer of metal pattern, first layer
LDS ink is covered on the back side of the cover board substrate, and next layer of LDS ink is covered in last layer LDS ink and metal pattern
On.
Further, the wireless charging wire coil binding has wiring board.
Further, the two-port of the wireless charging wire coil connects the first FPC winding displacements and the 2nd FPC rows respectively
Line, the first FPC winding displacements and the 2nd FPC winding displacements are connected to the wiring board.
Further, the first FPC winding displacements and the 2nd FPC winding displacements are pressed together on the wireless charging by ACF glue respectively
In the two-port of wire coil, the ACF glue turns in vertical direction, non-conduction in the horizontal direction.
The present invention has the advantages that：The production method will be for the wireless charging of induced field using LDS techniques
Wire coil is integrally produced on the back cover plate of mobile terminal, can not only save subsequent assembly process, reduces assembling
Cost has good stability, moreover, even if the surface of the cover board substrate is nonplanar structure, can also complete circuit
It makes.
Description of the drawings
Fig. 1 is the step block diagram of the production method of back cover plate provided by the invention；
Fig. 2 is the schematic rear view of back cover plate provided by the invention；
Fig. 3 is the diagrammatic cross-section of back cover plate provided by the invention.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
Embodiment one
As shown in Figs. 1-3, a kind of production method of back cover plate, including：
Step 1：One cover board substrate 1 is provided；
Step 2：Form wireless charging wire coil a at least LDS layers is integrally made on the back side of the cover board substrate 1
2。
LDS techniques（Laser Direct Structuring, i.e. Laser Direct Deposition technique）It is a kind of stereo circuit system
Make technology, irradiating LDS materials by laser makes the irradiation area on its surface form activating area, the organic metal in LDS materials
Compound can release metallic after laser irradiation on activating area surface, then the chemical plating metal on activating area,
The coat of metal and the metallic on activating area surface form chemical bond and are adhered to each other, and ultimately form circuit.
The production method will integrally be produced on movement using LDS techniques for the wireless charging wire coil of induced field
On the back cover plate of terminal, subsequent assembly process can be not only saved, reduces assembly cost, there is good stability, and
And even if the surface of the cover board substrate 1 is nonplanar structure, circuit production can also be completed.
In step 1, the cover board substrate 1 can be plastic base, glass substrate, sapphire substrate etc., can be
Bright substrate or colored substrate.
Wherein, step 2 includes：
Step 2.1：Make LDS ink layers 21；
Step 2.2：The surface of the LDS ink layers 21 is activated using laser irradiation, forms activating area；
Step 2.3：Metal pattern 22 is made on the activating area of the LDS ink；
Step 2.4：Step 2.1-2.3 is repeated, until completing the wireless charging wire coil；
Wherein, the wireless charging wire coil is made of one layer of metal pattern 22, alternatively, by least 22 phase of double layer of metal pattern
Conducting is formed.
Wherein, connect and lead by the electroless copper in LDS techniques or chemical gilding mode between different layers metal pattern 22
It is logical.
Organo metallic material can be blended in ink substrate and obtain by LDS ink.
In step 2, first layer LDS ink is covered on the back side of the cover board substrate 1, next layer of LDS ink covering
On last layer LDS ink and metal pattern 22, that is to say, that second layer LDS ink is covered in first layer LDS ink and metal
On pattern 22, third layer LDS ink is covered on second layer LDS ink and metal pattern 22, and so on.
The wireless charging wire coil is formed using multilayer LDS layers 2, can not only increase coil turn, improves nothing
Micro USB electrical efficiency furthermore, it is possible to increase the degree of freedom of cabling arrangement, facilitates technician to carry out wiring arrangement.
The production method of the back cover plate further includes：
Step 3：The wireless charging wire coil is bound into wiring board 5.
Driving IC 6 is welded on the wiring board 5.
Specifically, step 3 includes：
Step 3.1：The first FPC winding displacements 31 and the 2nd FPC winding displacements are connected respectively in the two-port of the wireless charging wire coil
32；
Step 3.2：The first FPC winding displacements 31 and the 2nd FPC winding displacements 32 are connected to the wiring board 5.
Wherein, step 3.1 includes：
Step 3.1.1：ACF glue 4 is respectively coated in the two-port of the wireless charging wire coil, the ACF glue 4 is vertical
It is turned on direction, it is non-conduction in the horizontal direction；
Step 3.1.2：The first FPC winding displacements 31 and the 2nd FPC winding displacements 32 are pressed together on the wireless charging metal wire respectively
On ACF glue 4 in the two-port of circle.
Embodiment two
As shown in Figures 2 and 3, a kind of back cover plate, at least LDS including cover board substrate 1 and composition wireless charging wire coil
Layer 2, an at least LDS layers 2 are integrally produced on the back side of the cover board substrate 1.
The back cover plate will be integrally produced on described using LDS techniques for the wireless charging wire coil of induced field
On the back side of cover board substrate 1, subsequent assembly process can be not only saved, reduces assembly cost, there is good stability, and
And even if the surface of the cover board substrate 1 is nonplanar structure, circuit production can also be completed.
The cover board substrate 1 can be plastic base, glass substrate, sapphire substrate etc., can be transparent substrate, also may be used
To be colored substrate.
The LDS layers 2 include LDS ink and metal pattern 22 successively from the bottom up, and the LDS ink is towards the metal
The activated formation activating area of one side of pattern 22, the metal pattern 22 are produced on the activating area；Wherein, the nothing
Micro USB electric metal coil is made of one layer of metal pattern 22, is formed alternatively, being conducted by least double layer of metal pattern 22.
Wherein, connect and lead by the electroless copper in LDS techniques or chemical gilding mode between different layers metal pattern 22
It is logical.
Organo metallic material can be blended in ink substrate and obtain by LDS ink.
Specifically, first layer LDS ink is covered on the back side of the cover board substrate 1, next layer of LDS ink is covered in
On one layer of LDS ink and metal pattern 22, that is to say, that second layer LDS ink is covered in first layer LDS ink and metal pattern
On 22, third layer LDS ink is covered on second layer LDS ink and metal pattern 22, and so on.
The wireless charging wire coil binding has wiring board 5.
Driving IC 6 is welded on the wiring board 5.
Specifically, the two-port of the wireless charging wire coil connects the first FPC winding displacements 31 and the 2nd FPC winding displacements respectively
32, the first FPC winding displacements 31 and the 2nd FPC winding displacements 32 are connected to the wiring board 5.
The first FPC winding displacements 31 and the 2nd FPC winding displacements 32 are pressed together on the wireless charging metal by ACF glue 4 respectively
In the two-port of coil, the ACF glue 4 turns in vertical direction, non-conduction in the horizontal direction.
Embodiment three
A kind of mobile terminal, including setting the back cover plate described in embodiment two on the back side and being arranged on it just
Display module on face is provided with front cover plate or touch-screen on the light-emitting surface of the display module.
Embodiment described above only expresses embodiments of the present invention, and description is more specific and detailed, but can not
Therefore the limitation to the scope of the claims of the present invention is interpreted as, as long as the skill obtained using the form of equivalent substitution or equivalent transformation
Art scheme should all be fallen within the scope and spirit of the invention.
Claims (10)
1. a kind of production method of back cover plate, which is characterized in that including：
Step 1：One cover board substrate is provided；
Step 2：Form wireless charging wire coil a at least LDS layers is integrally made on the back side of the cover board substrate.
2. the production method of back cover plate according to claim 1, which is characterized in that step 2 includes：
Step 2.1：Make LDS ink layers；
Step 2.2：The surface of the LDS ink layers is activated using laser irradiation, forms activating area；
Step 2.3：Metal pattern is made on the activating area of the LDS ink；
Step 2.4：Step 2.1-2.3 is repeated, until completing the wireless charging wire coil；
Wherein, the wireless charging wire coil is made of one layer of metal pattern, alternatively, being conducted by least double layer of metal pattern
It forms, first layer LDS ink is covered on the back side of the cover board substrate, and next layer of LDS ink is covered in last layer LDS ink
On metal pattern.
3. according to the production method of any back cover plate in claim 1-3, which is characterized in that further include：
Step 3：The wireless charging wire coil is bound into wiring board.
4. the production method of back cover plate according to claim 3, which is characterized in that step 3 includes：
Step 3.1：The first FPC winding displacements and the 2nd FPC winding displacements are connected respectively in the two-port of the wireless charging wire coil；
Step 3.2：The first FPC winding displacements and the 2nd FPC winding displacements are connected to the wiring board.
5. the production method of back cover plate according to claim 4, which is characterized in that step 3.1 includes：
Step 3.1.1：ACF glue is respectively coated in the two-port of the wireless charging wire coil, the ACF glue is in Vertical Square
Conducting upwards, it is non-conduction in the horizontal direction；
Step 3.1.2：The first FPC winding displacements and the 2nd FPC winding displacements are pressed together on the wireless charging wire coil respectively
On ACF glue in two-port.
A kind of 6. back cover plate, which is characterized in that at least LDS including cover board substrate and composition wireless charging wire coil
Layer, described at least a LDS layers is integrally produced on the back side of the cover board substrate.
7. back cover plate according to claim 6, which is characterized in that described LDS layers includes LDS ink successively from the bottom up
And metal pattern, the activated formation activating area of one side of LDS ink towards the metal pattern, the metal pattern system
Make on the activating area；Wherein, the wireless charging wire coil is made of one layer of metal pattern, alternatively, by least two
Layer metal pattern is conducted composition, and first layer LDS ink is covered on the back side of the cover board substrate, and next layer of LDS ink covers
It covers on last layer LDS ink and metal pattern.
8. the back cover plate according to claim 6 or 7, which is characterized in that the wireless charging wire coil binding is wired
Road plate.
9. back cover plate according to claim 8, which is characterized in that the two-port difference of the wireless charging wire coil
The first FPC winding displacements and the 2nd FPC winding displacements are connected, the first FPC winding displacements and the 2nd FPC winding displacements are connected to the wiring board.
10. back cover plate according to claim 9, which is characterized in that the first FPC winding displacements and the 2nd FPC winding displacements point
It not being pressed together on by ACF glue in the two-port of the wireless charging wire coil, the ACF glue turns in vertical direction,
It is non-conduction in horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810027038.6A CN108109827A (en) | 2018-01-11 | 2018-01-11 | The production method and back cover plate of a kind of back cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810027038.6A CN108109827A (en) | 2018-01-11 | 2018-01-11 | The production method and back cover plate of a kind of back cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108109827A true CN108109827A (en) | 2018-06-01 |
Family
ID=62219871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810027038.6A Pending CN108109827A (en) | 2018-01-11 | 2018-01-11 | The production method and back cover plate of a kind of back cover plate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019196732A1 (en) * | 2018-04-08 | 2019-10-17 | Oppo广东移动通信有限公司 | Device to be charged and wireless charging device |
| CN110471557A (en) * | 2019-07-09 | 2019-11-19 | 信利光电股份有限公司 | A method of making touch screen peripheral wiring |
| CN110660529A (en) * | 2019-09-16 | 2020-01-07 | 信利光电股份有限公司 | Manufacturing method of conductive circuit and conductive circuit |
| WO2021128076A1 (en) * | 2019-12-25 | 2021-07-01 | 瑞声声学科技(深圳)有限公司 | Wireless charging back shell assembly, and electronic device |
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