CN102148102A - Lead structure of membrane switch and manufacturing method of lead structure of membrane switch - Google Patents
Lead structure of membrane switch and manufacturing method of lead structure of membrane switch Download PDFInfo
- Publication number
- CN102148102A CN102148102A CN2010101258046A CN201010125804A CN102148102A CN 102148102 A CN102148102 A CN 102148102A CN 2010101258046 A CN2010101258046 A CN 2010101258046A CN 201010125804 A CN201010125804 A CN 201010125804A CN 102148102 A CN102148102 A CN 102148102A
- Authority
- CN
- China
- Prior art keywords
- lead
- conductive layer
- thin film
- conductive
- separator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Push-Button Switches (AREA)
Abstract
The invention relates to the technical field of electronic switches and provides a lead structure of a membrane switch and a manufacturing method for the lead structure of the membrane switch. The invention provides the lead structure of the membrane switch, which comprises a membrane basic layer, a conductive layer and a protective layer, wherein the conductive layer is printed on the membrane basic layer; the protective layer is covered on the conductive layer and the membrane basic layer; a conductive interface is reserved at the tail end of the lead; the conductive interface is also connected with a lead terminal; and the lead terminal is electrically connected with a conductive line of the conductive layer in vertical direction. According to the lead structure of the membrane switch and the manufacturing method for the lead of the membrane switch provided by the invention, the lead is adhered to a flexible printed circuit (FPC) wire or a flexible flat cable (FFC) wire outside the membrane switch, so inconvenient operation and processing during adhesion at an outlet of the lead of the membrane switch are avoided, adoption of a gold-plating wire material for a conductive line of the whole lead is also avoided, and manufacturing cost is saved.
Description
Technical field
The present invention relates to the electronic switching technology field, relate in particular to a kind of thin film switch, a kind of pin configuration and manufacture method thereof of thin film switch is provided.
Background technology
Thin film switch is by having a kind of multilayer planar type key switch that certain flexible electric conducting material and insulation material layer are formed.Because its good looking appearance, in light weight, characteristic such as cost is low are widely used in all trades and professions, in various products such as intelligent electronic instrument, Medical Instruments, Digit Control Machine Tool, communication apparatus, office appliances, household electrical appliances, computor-keyboard.The structure of thin film switch mainly comprises the film surface layer, goes up conductive layer, lower conductiving layer, separator and output lead, last conductive layer and lower conductiving layer be printing conductive inks (conductive silver slurry or carbon slurry) and the formation of non-conductive property dielectric ink on nonconducting film surface layer, isolates by separator between the upper and lower conductive layer.When the film surface layer was not pressed, separator played buffer action to circuit up and down, when the film surface layer is pressed, last circuit is pressed in the lump and overlaps with following circuit, make line conduction, link tester is crossed output lead and is given the outside instrument that connects with signal after the conducting, realizes its function corresponding.
The output lead of existing thin film switch, the conductive layer of the contact portion of its termination and extraneous conductor does not have protective layer, directly easily produces oxide etch with extraneous the contact, has reduced useful life.As shown in Figure 1, it is the pin configuration of a kind of thin film switch of prior art, in film basic unit 10, be printed with electrically conductive ink (silver slurry or carbon slurry) and form conductive layer 20, film upper strata 30 is covered on the conducting wire 20, be connected with external conductor for the ease of thin film switch, film upper strata 30 can not be covered in the electrically conductive ink top of conducting wire 20 ends, and this terminal electrically conductive ink must be exposed in the air, so that the thin film switch operate as normal.Yet this electrically conductive ink is subjected to the air oxidation meeting to form stratum disjunction gradually, causes to the end opening circuit and end-of-life, and this is the easiest out of order place of thin film switch, is mainly determined by environment, no matter whether use, the physical damage time is 3-10.Especially in the process of using, the exposed electrically conductive ink of this lead terminal is subjected to the pollution or the corrosion of greasy dirt etc. easily, and the plug process also causes wearing and tearing easily, thereby causes thin film switch to lose efficacy, and influences useful life.If adopt gold-plated conducting wire layer to substitute electrically conductive ink as the conducting wire, because of the gold-plated golden finger that forms has wear-resistant, corrosion resistant characteristics, can effectively improve the disabled status that above-mentioned electrically conductive ink causes, but increase cost, cause the wasting of resources.
Summary of the invention
At above-mentioned the deficiencies in the prior art, the invention provides a kind of pin configuration of thin film switch, can anti-oxidation effectively oil resistant dirt, the anti-wear characteristics that come off make the thin film switch long service life, and production cost is low, is convenient to production and processing.
The present invention also provides a kind of manufacture method of thin film switch pin configuration, and this method is simple effectively, be convenient to process operation, cost-saved.
According to above-mentioned purpose, technical scheme of the present invention is achieved in that
A kind of pin configuration of thin film switch; comprise film basic unit, conductive layer and protective layer; wherein; described conductive layer is printed in the film basic unit, and described protective layer is covered in conductive layer and the film basic unit, and leaves conductive interface at the end of lead-in wire; promptly be not coated with protective layer on this conductive interface; also be connected to lead ends on the described conductive interface, the conductive materials on the protection lead terminal conductive interface prevents its oxidation deactivation.Wherein, the conductive layer of pin configuration is the line layer of establishing side by side.
Further, on conductive interface, different side's glue electrically conducts the conducting wire of described conductive layer and lead ends to described lead ends in vertical direction, not conducting of horizontal direction by different side's glue (Anisotropically conductive glue) thermo-compression bonding.Wherein, described lead ends is gold-plated or silver-plated FPC line, or gold-plated or silver-plated FFC line, and FPC line or FFC line make described conductive interface be isolated from the outside, and by FPC line or FFC line and extraneous conduction.The golden finger of thin film switch by FPC line or FFC contacts with external conductor and is connected, golden finger can plug repeatedly and be difficult for oxidation deactivation.
Further, described protective layer comprises separator and sealant, and described separator is the UV separator, and this UV separator is printed in conductive layer and the film basic unit, and conductive layer is isolated from the outside, and prevents outside air and pernicious gas oxidation and corrosion conductive layer.Described sealant is covered in the top of separator, and the sealing layer is the PET glue-line, prevents that hard thing from scratching the UV separator, and its thickness is 0.03～0.08mm.
A kind of manufacture method of thin film switch lead-in wire may further comprise the steps:
(1) prints conductive layer, printed conductive layer in film basic unit;
(2) increase protective layer, adopt the silk-screen mode to be printed in conductive layer and the film basic unit separator, on separator, be covered with sealant then;
(3) hot pressing, at the conductive interface place by different side's glue with lead ends hot pressing on conductive layer, lead ends and conductive layer vertical direction electrically conduct.
Further, in this method, described lead ends is FPC line or FFC line.Described sealant and film basic unit all are PET glue-lines, and described sealant covers earlier in the film basic unit.Described different side's glue is processed into different side's film before hot pressing, the big I of this different side's film covers whole conductive interface fully.To be FPC line or FFC line cover on the conductive interface hot repressing by different side's glue to described lead ends closes, and cuts out and be processed into lead-in wire.
The pin configuration of thin film switch provided by the invention, the design of adopting lead-in wire to combine with the termination segmentation makes it can anti-oxidation effectively oil resistant dirt, anti-wear coming off, increase the service life, reduce production costs simultaneously, the anti-wear performance index and the life test of thin film switch are significantly improved.In addition, because the length of whole lead-in wire is about 10cm, the present invention only adopts FPC line or FFC line on lead ends, also avoided the conducting wire of whole lead-in wire to adopt gold-plated wire rod, saves manufacturing cost.The manufacture method of thin film switch provided by the invention, effectively simple, its separator adopts the mode of printing to be printed on the conductive layer, is convenient to operation, and cost is low.The manufacture method of its disclosed thin film switch lead-in wire is to bond in the thin film switch outside by adopting with FPC line or FFC line, has avoided the processing that is awkward when boning at thin film switch lead outlet place.
Description of drawings
Fig. 1 is the pin configuration schematic diagram of existing thin film switch;
Fig. 2 is the pin configuration schematic diagram of thin film switch of the present invention;
Fig. 3 is the pin configuration exploded view of thin film switch of the present invention.
Embodiment
The present invention is further described for existing accompanying drawings and embodiment.
Consult Fig. 2 and shown in Figure 3; the pin configuration of a kind of thin film switch provided by the invention; comprise film basic unit 1; conductive layer 2; separator 31 and sealant 32; wherein; described conductive layer 2 is printed in the film basic unit 1; described separator 31 is covered in conductive layer 2 and the film basic unit 1; and the lead-in wire the end leave conductive interface; promptly the lead-in wire conductive interface on not covered by the protective layer 3; described sealant 32 is covered on the separator 31; also be bonded with lead ends 4 on the described conductive interface, the conductive materials on the protection lead terminal conductive interface prevents its oxidation deactivation.On conductive interface, different side's glue electrically conducts the described conductive layer 2 and the conducting wire of lead ends 4 to described lead ends 4 in vertical direction by different side's glue (Anisotropically conductive glue) thermo-compression bonding.Wherein, described lead ends 4 is gold-plated or silver-plated FPC line or FFC lines.Thin film switch is that the golden finger by FPC line or FFC contacts with external conductor and is connected.
Further, described separator 31 is UV separators, and this UV separator is printed in conductive layer 2 and the film basic unit 1, and conductive layer is isolated from the outside.Described sealant 32 is PET glue-lines, prevents that hard thing from scratching the UV separator, and its thickness is 0.08mm.
A kind of manufacture method of thin film switch lead-in wire may further comprise the steps: elder generation's printed conductive layer on the PET of film basic unit glue-line; In conductive layer and film basic unit, adopt the silk-screen mode to print separator again, and on separator, be covered with the PET glue-line as sealant; Carry out hot pressing then, before hot pressing, earlier different side's glue is cut into the different side film bigger than conductive interface, described sealant covers earlier in the film basic unit during hot pressing, to be FPC line or FFC line cover on the conductive interface hot repressing by different side's glue to described lead ends closes, and cuts out and be processed into lead-in wire.Described different side's glue electrically conducts the conducting wire of FPC line and the conductive layer in the film basic unit in vertical direction.
In like manner, described FPC line can be substituted with the FFC line, its manufacture method is identical, so do not give unnecessary details at this.
The thin film switch of producing according to said method, through wearability test and life test, the lead-in wire anti-wear performance of thin film switch of the present invention obviously improves, and its plug number of times can reach 50 times, can satisfy the user demand of thin film switch, prolong the useful life of thin film switch.
The above only is preferred embodiment of the present invention, and is in order to restriction the present invention, within the spirit and principles in the present invention not all, any modification of being made, is equal to replacement, improvement etc., all should be included within the scope of protection of the invention.
Claims (10)
1. the pin configuration of a thin film switch; comprise film basic unit (1), conductive layer (2) and protective layer (3); described conductive layer (2) is printed in the film basic unit (1); it is characterized in that: described protective layer (3) is covered in conductive layer (2) and the film basic unit (1); and the lead-in wire end leave conductive interface, also be connected to lead ends (4) on the described conductive interface.
2. the pin configuration of thin film switch according to claim 1, it is characterized in that: on conductive interface, different side's glue electrically conducts the described conductive layer (2) and the conducting wire of lead ends (4) to described lead ends (4) in vertical direction by the thermo-compression bonding of different side's glue.
3. the pin configuration of thin film switch according to claim 1 and 2, it is characterized in that: described lead ends (4) is FPC line or FFC line.
4. the pin configuration of thin film switch according to claim 1, it is characterized in that: described protective layer (3) comprises separator (31) and sealant (32), described sealant (32) is covered in separator (31) top.
5. the pin configuration of thin film switch according to claim 4, it is characterized in that: described separator (31) is the UV separator, this UV separator is printed in conductive layer (2) and the film basic unit (1).
6. the pin configuration of thin film switch according to claim 4, it is characterized in that: described sealant (32) is the PET glue-line, its thickness is 0.03～0.08mm.
7. the manufacture method of thin film switch lead-in wire is characterized in that: may further comprise the steps:
(1) prints conductive layer, printed conductive layer in film basic unit;
(2) increase protective layer, adopt the silk-screen mode to be printed in conductive layer and the film basic unit separator, and on separator, be covered with sealant;
(3) hot pressing, at the conductive interface place by different side's glue with lead ends hot pressing on conductive layer, lead ends and conductive layer vertical direction electrically conduct.
8. the manufacture method of thin film switch lead-in wire according to claim 7, it is characterized in that: described lead ends is FPC line or FFC line.
9. the manufacture method of thin film switch lead-in wire according to claim 7, it is characterized in that: described sealant and film basic unit all are PET glue-lines.
10. the manufacture method of thin film switch lead-in wire according to claim 7, it is characterized in that: described different side's glue is processed into different side's film earlier before hot pressing, the big I of described different side's film covers whole conductive interface fully.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101258046A CN102148102A (en) | 2010-02-06 | 2010-02-06 | Lead structure of membrane switch and manufacturing method of lead structure of membrane switch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101258046A CN102148102A (en) | 2010-02-06 | 2010-02-06 | Lead structure of membrane switch and manufacturing method of lead structure of membrane switch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102148102A true CN102148102A (en) | 2011-08-10 |
Family
ID=44422301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101258046A Pending CN102148102A (en) | 2010-02-06 | 2010-02-06 | Lead structure of membrane switch and manufacturing method of lead structure of membrane switch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102148102A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373817A (en) * | 2015-07-21 | 2017-02-01 | 祯信股份有限公司 | Thin film switch and circuit setting method thereof |
| CN106404841A (en) * | 2016-08-24 | 2017-02-15 | 浙江朗德电子科技有限公司 | Sensor chip structure |
| CN108109827A (en) * | 2018-01-11 | 2018-06-01 | 信利光电股份有限公司 | The production method and back cover plate of a kind of back cover plate |
| CN109798557A (en) * | 2017-11-17 | 2019-05-24 | 美的集团股份有限公司 | Electromagnetic heating apparatus temp measuring system and electromagnetic heating apparatus |
| CN114281203A (en) * | 2021-11-26 | 2022-04-05 | 温州长江汽车电子有限公司 | Preparation method of automobile touch operation LENS assembly and preparation method of panel assembly |
-
2010
- 2010-02-06 CN CN2010101258046A patent/CN102148102A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106373817A (en) * | 2015-07-21 | 2017-02-01 | 祯信股份有限公司 | Thin film switch and circuit setting method thereof |
| CN106404841A (en) * | 2016-08-24 | 2017-02-15 | 浙江朗德电子科技有限公司 | Sensor chip structure |
| CN109798557A (en) * | 2017-11-17 | 2019-05-24 | 美的集团股份有限公司 | Electromagnetic heating apparatus temp measuring system and electromagnetic heating apparatus |
| CN108109827A (en) * | 2018-01-11 | 2018-06-01 | 信利光电股份有限公司 | The production method and back cover plate of a kind of back cover plate |
| CN114281203A (en) * | 2021-11-26 | 2022-04-05 | 温州长江汽车电子有限公司 | Preparation method of automobile touch operation LENS assembly and preparation method of panel assembly |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102148102A (en) | Lead structure of membrane switch and manufacturing method of lead structure of membrane switch | |
| WO2006100682A3 (en) | Method and system for digital pen assembly | |
| TW200618419A (en) | Power contact having current flow guiding feature and electrical connector containing same | |
| WO2008093739A1 (en) | Connector | |
| WO2008048338A3 (en) | Electrode compositions containing carbon nanotubes for solid electrolyte capacitiors | |
| MX2008001195A (en) | Interdigital force switches and sensors. | |
| US20080230362A1 (en) | Membrane switch | |
| EP1049118A3 (en) | Electrical apparatus having improved electrical contact and electrical contact used therewith | |
| CN201655614U (en) | Lead wire structure of membrane switch | |
| CN104795518A (en) | Battery and electronic equipment containing battery | |
| CN201499375U (en) | Flexible printed circuit board for connection | |
| CN101533319B (en) | Touch panel and manufacture method thereof | |
| CN201725303U (en) | Matrix touch panel | |
| CN105430886B (en) | Flexible circuit board and mobile terminal | |
| CN1859826A (en) | Touch sensing circuit board and manufacturing method thereof | |
| CN100524175C (en) | Flexible keystroke structure | |
| CN212342517U (en) | Corrosion-resistant membrane switch, microwave oven and oven | |
| CN206672835U (en) | A kind of thin film switch structure-improved | |
| TW201126837A (en) | Intelligent structured cabling system and jack | |
| CN211181693U (en) | Flexible flat wire of FFC | |
| CN208506706U (en) | Passive stylus | |
| CN201846329U (en) | Electrically conductive ink approach induction press key | |
| CN101034778A (en) | Improvement of connector structure | |
| CN216980410U (en) | Conductive key structure of PCB (printed Circuit Board) and mechanical equipment with same | |
| CN209861274U (en) | Waterproof keyboard concatenation circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110810 |