CN108107515A - Multi-channel parallel ballistic device - Google Patents
Multi-channel parallel ballistic device Download PDFInfo
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- CN108107515A CN108107515A CN201711362260.3A CN201711362260A CN108107515A CN 108107515 A CN108107515 A CN 108107515A CN 201711362260 A CN201711362260 A CN 201711362260A CN 108107515 A CN108107515 A CN 108107515A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
Abstract
The present invention relates to a kind of ballistic devices, belong to technical field of photo communication, are specifically related to a kind of multi-channel parallel ballistic device.Including at least one encapsulation unit, the encapsulation unit includes the chip of laser that at least two-way axial symmetry is set, and the chip of laser is coupled into all the way by multiplex device and passes through isolator and is coupled in optical fiber.The device have size is small, functional, high reliability, easily coupling, can mass, easy interchangeability, can be applied to CWDM, LWDM wavelength, can be packaged in the modules such as QSFP28, QSFP DD.
Description
Technical field
The present invention relates to a kind of ballistic devices, belong to technical field of photo communication, are specifically related to a kind of multi-channel parallel hair
Emitter part.
Background technology
Optical module below the 100Gbps rates such as QSFP28, the PSM4 received and dispatched parallel using multichannel optical signal now is more
Optical signal is transmitted using 4 channel fashions, such as 4*25G types, for the light path mainstream of device level there are two types of mode, a kind of mode is device
It is internally integrated, i.e., Interleave muiltiplexing component element is integrated in device inside, such as patent CN201310751180.2, another way is mould
Block is internally integrated, i.e., discrete device is integrated in module using large scale, tail fiber type wavelength division multiplexer.This is that two kinds of techniques are put down
Platform has their own advantages.But with the rapid development of optical communications industry, the optical module of 200Gbps and 400Gbps are more and more
Research.By taking 200G as an example, whether there is problem to be captured in 4*50Gbps or 8*25Gbps, such as the former is difficult to obtain
Commercial and batch 50Gbps chips are obtained, the latter is because port number is excessive, it is difficult to realize that the miniaturization of device integrates.For more ripples
The technical solution of long multiplex usually has following several：First, waveguide type, such as AWG and etching type grating, two, optical filter type, such as Z
Font or the combination of W types optical filter, three, polarized composite wave, as PBS, reflector plate and the polarizer combine.These types of type common practice
It is integrated in inside optical device, using small Insertion Loss, small size as requirement.But for the device level scheme of 8*25Gbps types, 8 ripples
Long multiplex is all less applicable in using three of the above mode, such as one, AWG types, the AWG chips of 8 ripples this body length at least 10mm, and
And waveguide needs convergent lens to couple with chip of laser, and device overall length can be caused long and be unsatisfactory for device encapsulation and want
It asks；2nd, optical filter type, by taking 8 tablet filter formula Z-shaped optical filter boxes as an example, because each element freely mounts, the public affairs of attachment
Difference can accumulate several passages to the end, and the manufacturing tolerance for causing last passage is very sensitive, for example the filter elements of the 1st passage are deposited
In 0.1 degree of angular deviation, then when paths are to 8 passage, which is amplified 12 times, i.e., the angle of deviation becomes 1.2
Degree, and the angle allowance of parallel optical coupling is no more than the angle allowance of reliability requirement 0.2 degree not by 1 degree, while can make
It into serious transversion malposition, causes the 8th passage coupling efficiency extremely low, to ensure the tolerance of last several passages, can only require former
The optical element of passage has very high placement accuracy and reliability requirement.Therefore the passage of front end influences whether in this structure
The technique of rear end passage.The optical filter type is difficult to meet decoupling calls and reliability requirement, therefore improper batch making；
3rd, polarized composite wave, PBS elements assembled dimension is very wide very big, can seriously limit the width and length of device.
However, if the Insertion Loss cost of system is enough, to sacrifice coupling efficiency as cost, meeting the requirement of device size
Under, 8 wavelength multiplex are can be achieved on, such as 8 path shunt devices, 4 path shunt devices and 3dB splitters.
The purpose of this patent be propose using sacrifice coupling efficiency for cost realize device encapsulate feasible method and knot
Structure, to solve the problems, such as the encapsulation of the device of 8*25Gbps and module level.
The content of the invention
The present invention mainly solves the technical issues of above-mentioned present in the prior art, provides a kind of multi-channel parallel hair
Emitter part.The device have size is small, functional, high reliability, easily coupling, can mass, easy interchangeability, can be applied to
CWDM, LWDM wavelength and DWDM can be packaged in the modules such as QSFP28, QSFP DD and QSFP56.
The above-mentioned technical problem of the present invention is mainly what is be addressed by following technical proposals：
A kind of multi-channel parallel ballistic device, including at least one encapsulation unit, the encapsulation unit includes at least two-way
The chip of laser that axial symmetry is set, the chip of laser are coupled by multiplex device and are coupled in light all the way and through isolator
In fibre.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the multiplex device is coupled lens, the laser
Chip is compared with the symmetry axis coupled lens incident at a certain angle so as to fulfill multiplex.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the encapsulation unit further include axial symmetry and set extremely
Few two backlight detection chips, are arranged at the chip of laser rear.
Preferably, a kind of above-mentioned multi-channel parallel ballistic device, the encapsulation unit are arranged on TO pedestals；The TO
Pedestal has an elongated area in the horizontal direction, and the transition block of a protrusion is provided on the elongated area, and the encapsulation is single
Member is arranged in the transition block；Be provided with a TO caps on the elongated area, the TO calottes residence state encapsulation unit and its
Interior hermetic seal.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the encapsulation unit are multiple, are packaged in a BOX
In shell, pass through four-way splitter multiplex.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, sets collimator before the isolator, the light after multiplex
Signal is coupled in by collimator in optical fiber.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the encapsulation unit are two or more, divide multi-tier arrangement
It is closed in BOX shells, different interlayers are by collimation lens multiplex in optical fiber.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the ceramic electrical interface of tail end insertion of BOX shells, ceramics
The working region of electrical interface is divided into four parts, including：Upper and lower surface is located at the perimeter of shell, and upper surface is under
Surface is located at the interior zone of shell, and the pad in two regions of upper and lower surface is arranged in order by the definition of pad pin, circuit is continuous
And it is impedance matching.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the multiplex device include collimating mirror, filtering assembly,
The filtering assembly includes glass supporter, and the glass supporter both sides set optical filter and speculum respectively；On the speculum
At least one regional transmission is set；The light of the chip of laser transmitting enters glass through optical filter again after being collimated by collimating mirror
Stent finally pools through speculum reflection and is coupled to isolator through the regional transmission all the way.
Preferably, above-mentioned a kind of multi-channel parallel ballistic device, the chip of laser are 8, form 8 passages,
In four passages be coupled in for one group in a collimator, pass through 3dB splitter multiplex between two collimators.
Therefore, the invention has the advantages that：Two kinds of forms are encapsulated using the encapsulation of TO types and BOX, have that size is small, performance
Well, high reliability, easily coupling, can mass, easy interchangeability, can be applied to CWDM, LWDM wavelength and DWDM, can be packaged in
In the modules such as QSFP28, QSFP DD and QSFP56.
Description of the drawings
Attached drawing 1 is small-sized TO encapsulation types device schematic diagram；
Attached drawing 2 is small-sized TO encapsulation types device index path；
Attached drawing 3 is that TO types device encapsulates 8 channel module schematic diagrames 1；
Attached drawing 4 is that BOX types device encapsulates 8 channel module schematic diagrames 2；
Attached drawing 5 is small-sized TO encapsulation combination collimator type device schematic diagram；
Attached drawing 6 is small-sized TO encapsulation combination collimator type device index path；
Attached drawing 7 is four collimator type device multiplex schematic diagrames；
Attached drawing 8 is BOX type collimator device multiplex schematic diagrames；
Attached drawing 9 is the schematic diagram (top view) that 1~4 passage is mounted on lower plane
Attached drawing 10 is the schematic diagram (top view) that 5~8 passages are mounted on plane
Attached drawing 11 is BOX types layered structure device schematic diagram (side view) up and down
Attached drawing 12a is lower layer components COC side views；
Attached drawing 12b is lower layer components COC top views；
Attached drawing 12c is upper component COC side views；
Attached drawing 12d is upper component COC top views；
Attached drawing 13a is that layered structure is identical towards schematic diagram up and down for BOX- optical filter multiplex type；
Attached drawing 13b is BOX- optical filter multiplex type layered structure device schematic diagram up and down；
Attached drawing 14 is the schematic diagram (top view) that 1-4 passages are mounted on lower plane；
Attached drawing 15 is the schematic diagram (top view) that 5-8 passages are mounted on plane；
Attached drawing 16a is lower layer components COC side views；
Attached drawing 16b is lower layer components COC side views；
Attached drawing 16c is upper component COC side views；
Attached drawing 16d is upper component COC top views；
Attached drawing 17 is optical filter box coupling optical path schematic diagram.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Parallel light emitter part described in this patent can be applied to CWDM and LWDM or 8 channel wavelengths of other specific requirements
The situation worked at the same time, for the ease of stating, 8 channels for CWDM illustrate exemplified by receiving optical device below, wherein
Operation wavelength uses but is not restricted to common 8 wavelength or the combination of CWDM：λ1、λ2、λ3、λ4、λ5、λ6、λ7And λ8, such as 1271nm,
1291nm, 1311nm, 1331nm, 1471nm, 1491nm, 1511nm, 1531nm etc..
For convenience of description, for the explanation of attached drawing, there are orientation word, such as upper and lower, front, rear, left and right vocabulary, be with
Patent document attached drawing is foundation, and sight is under the depression angle observation of paper, using the body dimension of reader as reference.
These embodiments are not intended to limit this patent, and those of ordinary skill in the art are made according to these embodiments
Structure, method or conversion functionally be all contained in the protection domain of this patent.
This patent proposes three kinds of embodiments：
1. first way, device uses the small-sized TO using TO38 types device as representative to encapsulate, and single TO encapsulates two and swashs
Light device chip, TO and multimode fibre are packaged into independent device, and module is logical using 4 in module level altogether using 4 independent devices
Road multimode fibre splitter is by 4 independent device multiplex.
2. the second way, device is encapsulated using BOX, 8 chip of laser of encapsulation, each two chip of laser in device
For one group, totally four groups, each group couples with a multimode fibre or multimode collimator, multimode fibre or multimode collimator connector
4 passage multimode fibre splitters of part periphery carry out multiplex.
3. the third mode, for device by the way of upper and lower lamination, superimposed layer and lower lamination respectively encapsulate No. 4 laser cores
Piece, 4 road chip of laser carry out primary multiplex using 4 passage Z-type optical filter boxes, and the optical signal of two primary multiplex passes through
3dB splitters carry out secondary multiplex, and three-dB coupler is encapsulated in module level.
Embodiment one, small-sized TO encapsulation types
Ballistic device uses the device of small-sized TO encapsulation, and type is not restricted to TO38 types.Single TO encapsulates two lasers
Chip, TO and multimode fibre are packaged into independent device, and module is more using 4 passages in module level altogether using 4 independent devices
Mould fibre splitter is by 4 independent device multiplex.
Specific as follows, as shown in Figure 1, small-sized TO encapsulation types device includes two chip of laser 1011,1012, backlight is visited
Survey device chip 1021,1022, coupled lens 1031,1032, optical fiber 104.Chip of laser 1011,1012, back light detector core
Piece 1021,1022, coupled lens 1031,1032 and optical fiber 104 are symmetrical arranged compared with symmetry axis 105.Chip of laser 1011,
1012, back light detector chip 1021,1022, coupled lens 1031,1032 are mounted in transition block 106, and transition block 106 is set
On the elongated area of TO pedestals 108 107, back light detector chip 1021,1022 is mounted on chip of laser 1011,1012
Rear, coupled lens 1031,1032 are mounted on the front of chip of laser 1011,1012.Chip of laser 1011,1012 tilts
Attachment is tilted down to light direction close to symmetry axis 105 wherein before chip of laser 1011, to going out before chip of laser 1012
Light direction is inclined upwardly close to symmetry axis 105.The TO encapsulation TO caps 109 mounted, form level Hermetic Package, and TO caps 109 are flat window
Type TO caps.It is connected between optical fiber 104 and the TO of encapsulation using coaxial type tube body 110.Coaxial type tube body 110 can be metal type pipe
Body or shaped plastics tube body.Optical fiber 104 is located at the outside of coaxial type tube body 110 (right side in figure), by laser welding or
Adhesive means are fixed.Optoisolator 111 can be also set between the TO of encapsulation and optical fiber 104, the reflected light of two passages is believed
Number simultaneously there are isolation features.Since two passage relative symmetry axis 105 are symmetrical, to avoid the surface of optoisolator 111
The influence to chip of laser, 111 preferred magneto-optical isolator of optoisolator are reflected, internal crystal is in 4~10 degree (preferably 8
Degree) overturning angle is set, and inclined direction tilts (compared with overlook direction) upward so that and the reflected light of crystal is not in main optical path
It is propagated in plane, the light between two passages is avoided to disturb.
In addition it is encapsulated in view of two device chips inside small-sized TO, chip of laser caloric value is big, can be in transition
Frigistor (abbreviation TEC, Thermo Electric Cooler) is mounted between block 106 and pedestal extension 107.
Optical fiber 104 recommends multimode fibre or single mode optical fiber, end face are preferably UPC faces or PC faces.To reduce end
End face can be plated anti-reflection film by the return loss in face.Device index path is as shown in Figure 2.Two channel light relative symmetry axis 105 symmetrically divide
Cloth, by coupled lens 1031 (1032), (upward) inclination converges to the forward light of chip of laser 1011 (1012) transmitting downwards
In optical fiber 104, because 104 preferred multimode fibre of optical fiber, each passage are easy to couple, the coupling in a manner of maximum coupling efficiency
It closes.
To ensure coupling efficiency and considering other optical indexes such as isolation, chip of laser 1011 (1012) angle of inclination
It is relatively small, with ensure by coupled lens 1031 (1032) assemble light beam the direction of propagation angle of inclination 201 be located at 2~
Between 8 degree, angle suitably changes according to different coupled lens.
Due between chip of laser 1011 (1012) and optical fiber 104 only with a convergence type lens 1031 (1032),
And between different passages independently of each other, there is no the influence of the placement accuracy of optical module, have that light path is simple, space ruler
The characteristics of very little small, distribution is flexible, high coupling tolerance, coupling angle allowance can allow +/- 5 degree, be much better than optical filter type
Parallel photo structure.
The coupling of single chip of laser and multimode fibre simultaneously, in the case of preferred non-globe lens, coupling efficiency can carry
More than 80%, the i.e. Insertion Loss of 1dB are raised to, considers the 6dB losses of 4 path shunt devices of rear end, total losses can be controlled in 7dB,
Consider reserved coupling tolerance 1.5dB, can be controlled in 8.5dB.For the high-speed laser chip of 8 passages, common light extraction work(
Rate is+5~+8dBm, therefore the structure can control the light power of optical module between -2.5~-0.5dBm, meet light
Module index.
For the combination of 8 passages, as shown in Figure 3, Figure 4.Packaged type shown in Fig. 3 passes through 4 for 4 TO type devices
Path shunt device multiplex.The optical port of 4 TO types devices 3011,3012,3013 and 3014 is respectively 3021,3022,3023 and
3024, it is welded together between optical port 3021,3022,3023,3024 and 4 path shunt device multiplex 303 by multimode fibre, respectively
Single channels as 4 path shunt device multiplex 303.Because each passage of 4 path shunt device multiplex is uniformly drawn, four
The Insertion Loss value of a passage is essentially identical, about 6dB losses.
Packaged type shown in Fig. 4 be by 8 chip packages in a BOX shell, pass through 4 path shunt device multiplex.
It is similar with small-sized TO types structure shown in FIG. 1, by chip of laser, back light detector chip, coupled lens, isolator and optical fiber
(can be added as needed on TEC) is assembled into one group of unit, and assembling mode is no longer described in detail with reference to Fig. 1, each unit 4011,4012,
4013rd, 4014 optical port is respectively 4021,4022,4023,4024, four optical ports and four multimode light of 4 path shunt devices 403
Fibre is welded together, respectively as the single channels of 4 path shunt device multiplex 403.Four units 4011,4012,4013,4014
It is mutually encapsulated into inside BOX shells 404.Because four multimode fibres of 4 path shunt devices 403 are needed through shell 404, therefore
Shell 404 is fabricated to non-hermetically sealed encapsulation type under normal conditions, and four multimode fibres are penetrated in the light window of shell 404, Zhi Hou
Seal protection glue is added at the light window of shell 404.
Embodiment two, small-sized TO encapsulation combination collimator types
Device uses the small-sized TO using TO38 types device as representative to encapsulate, and single TO encapsulates two chip of laser, TO and
Multimode collimator is packaged into independent device, and module using 4 independent devices, is divided altogether in module level using 4 passage multimodes are fine
Road device is by 4 independent device multiplex.
As shown in figure 5, device includes chip of laser 5011,5012, collimation lens 5021,5022, back light detector core
Piece 5031,5032, tail fiber type collimator 504, transition block 505, TO pedestals 507, flat window cap 508, shell 509 may be selected to set
Isolator 510.Chip of laser 5011,5012, collimation lens 5021,5022 and back light detector chip 5031,5032 mount
In transition block 505, transition block 505 is arranged on the elongated area 506 of TO pedestals 507, back light detector chip 5031,5032
The rear of chip of laser 5011,5012 is mounted on, coupled lens 5021,5022 are mounted on chip of laser 5011,5012
Front.Chip of laser 5011,5012, back light detector chip 5031,5032, coupled lens 5021,5022 and collimator 504
It is symmetrical arranged compared with symmetry axis 511.Chip of laser 5011,5012 is mounted parallel to symmetry axis 511, to ensure that two passages are sent out
The preceding light penetrated is parallel to symmetry axis 511.The TO level Hermetic Package TO caps 508 mounted, TO caps 508 are flat window type TO caps.Collimator
It is connected between 504 and the TO of encapsulation using coaxial type tube body 509.Coaxial type tube body 509 can be metal mold tube body or
Shaped plastics tube body can be sealed and welded on TO pedestals 507, can also laser welding on flat window cap 508.One of collimator 504
(preferably greater than 1/2 length) is divided to pass through laser welding or adhesive means embedded in 509 one side of coaxial type tube body (right side in figure)
It is fixed on coaxial type tube body 509.Optoisolator 510 can be also set between the TO of encapsulation and collimator 504, to two passages
Reflected light signal there are isolation features simultaneously.Since two passage relative symmetry axis 511 are symmetrical, to avoid optoisolator
The influence to chip of laser, 510 preferred magneto-optical isolator of optoisolator are reflected in 510 surface, and internal crystal is in 4~10
It spends (preferably 8 degree) overturning angle to set, and inclined direction is downwardly inclined (compared with overlook direction) so that the reflected light of crystal is not
It is propagated in main optical path plane, the light between two passages is avoided to disturb.
In addition it is encapsulated in view of two device chips inside small-sized TO, chip of laser caloric value is big, can be in transition
TEC is mounted between block 505 and pedestal extension 506.
The tail optical fiber 5041 of collimator 504 is recommended using multimode fibre or single mode optical fiber, and collimator type can be C-
Lens, G-lens, D-lens, non-globe lens and other kinds of collimator.Device index path is as shown in Figure 6.Two passage light
Road relative symmetry axis 511 is symmetrical, and the forward light of chip of laser 5011 (5012) hair passes through coupled lens 5021 (5022)
It is traveled to parallel to symmetry axis 511 in the form of quasi-parallel light in the collimation lens of collimator 504, collimated lens converge to tail
In fibre 5041.Because 5041 preferred multimode fibre of tail optical fiber, each passage are easy to couple, the coupling in a manner of maximum coupling efficiency
It closes.
To ensure coupling efficiency and considering other optical indexes such as isolation, between chip of laser 5011 and 5012 away from
Small as far as possible to ensure to reach the spacing of the two-beam of 504 front end face of collimator from relatively small, spacing can be saturating according to collimation
The size of mirror 5021,5022 is changed accordingly, and preferred spacing is 500um or 750um.
To ensure enough clear aperture and angle allowance, collimator 504 uses preferred G-lens types heavy caliber model.
Due between chip of laser 5011 (5012) and collimator 04 only with a collimation-type lens 5021 (5022), need not be into
Traveling wave length selection, and, there is no the influences of the placement accuracy of optical module, have light path between different passages independently of each other
Simply, the characteristics of bulk is small, distribution is flexible, high coupling tolerance, coupling angle allowance can allow +/- 1.2 degree, be better than
The parallel photo structure of optical filter type.
The coupling of single chip of laser and multimode fibre simultaneously, in the case of preferred non-globe lens, coupling efficiency can carry
More than 80%, the i.e. Insertion Loss of 1dB are raised to, considers the 6dB losses of 4 path shunt devices of rear end, total losses can be controlled in 7dB,
Consider reserved coupling tolerance 1.5dB, can be controlled in 8.5dB.For the high-speed laser chip of 8 passages, common light extraction work(
Rate is+5~+8dBm, therefore the structure can control the light power of optical module between -2.5~-0.5dBm, meet light
Module index.
For the combination of 8 passages, as shown in Figure 7.Packaged type shown in Fig. 7 passes through 4 passages for 4 TO types devices
Splitter multiplex.Each TO types device is not described in detail herein with reference to figure 5.4 6011,6012,6013 and of TO types device
6014 collimator tail optical fiber is respectively 6021,6022,6023 and 6024, tail optical fiber 6021,6022,6023 and 6024 and 4 passages point
It is welded together between road device multiplex 603 by multimode fibre, respectively as the single channels of 4 path shunt device multiplex 603.Because
Each passage of 4 path shunt device multiplex is uniformly drawn, and the Insertion Loss value of four passages is essentially identical, about 6dB losses.
Embodiment three, BOX encapsulation combination collimator types
The characteristics of the type is 8 chip of laser of encapsulation in a BOX shell, and 4 path shunts are connected in device exterior
Device carries out multiplex.Two kinds can be subdivided into according to the difference of spatial distribution, one kind is that 8 passages mount in a plane, separately
One kind is that 4 passages are mounted on lower plane, and in addition 4 passages are mounted on plane, the spatial distribution of lower leaf in implementation.
For the 8 passages attachment of the first in a plane, as shown in Figure 8.The packaged type is by 8 chip packages
In a BOX shell, pass through 4 path shunt device multiplex.It is similar with small-sized TO types structure shown in FIG. 1, by chip of laser,
Back light detector chip, coupled lens, isolator and collimator (can be added as needed on TEC) are assembled into one group of unit, each list
The assembling mode of member is no longer described in detail, four units are mutually encapsulated on the bottom plate of a plane with reference to Fig. 1.8 passage compositions
Four units 7011,7012,7013,7014, corresponding collimator output terminal tail optical fiber are respectively 7021,7022,7023,7024,
Four multimode fibres of four tail optical fibers and 4 path shunt devices 703 are welded together, respectively as 4 path shunt device multiplex 703
Single channels.Four units 7011,7012,7013,7014 are mutually encapsulated into inside BOX shells 704.Because 4 path shunt devices
703 four multimode fibres are needed through shell 704, therefore shell 704 is fabricated to non-hermetically sealed encapsulation type under normal conditions, four
Multimode fibre is penetrated in the light window of shell 704, adds seal protection glue at the light window of shell 704 afterwards.
The mode of levels is mounted on as shown in Fig. 9~Figure 12 d for second of 8 passages.1~4 passage is mounted on down
Layer, 5~8 passages are mounted on upper strata, the spatial distribution of lower leaf in implementation.As shown in figure 11, the optical element of understructure
Optical axis is respectively positioned in lower datum plane 814 or parallel to lower datum plane 814, and the optical axis of the optical element of superstructure is respectively positioned on
In upper datum plane 815 or parallel to upper datum plane 815.Since device is using upper and lower layered structure, for ease of the envelope of device
Dress, chip of laser, back light detector chip, coupled lens are mounted on jointly on a bottom plate, form COC (Chip on
Carrier) component.Fig. 9 show the schematic diagram that 1~4 passage is mounted on understructure, and understructure includes two collimators
8011st, 8012, lower floor's COC components 802, stent 8041,8042, BOX shells 805 also may be selected to set isolator 812, wherein
The effect of stent 8041 and 8042 is to place the COC components 803 of superstructure, close positioned at the both sides of lower floor's COC components 802
The two side attachment of shell 805.8041 and 8042 height of stent is identical, can also be fabricated to a U-shaped structure stent.Figure 10 institutes
The schematic diagram that 5~8 passages are mounted on superstructure is shown as, superstructure includes two collimators 8013,8014, upper strata COC groups
Part 803, BOX shells 805 also may be selected to set isolator 812, and wherein COC components 803 are placed on stent 8041 and 8042.
The ceramic electrical interface 806 of tail end insertion of BOX shells 805, part inlay is inside shell 805, positioned at COC components
802 left side.The working region of ceramic electrical interface 806 can be subdivided into four parts, upper surface 80611,80612 and lower surface
80621st, 80622, wherein upper surface 80611 and lower surface 80621 is located at the perimeter of shell, upper surface 80612 and following table
Face 80622 is located at the interior zone of shell.Upper surface 80611,80612 and lower surface 80621,80622 correspond to upper strata knot respectively
Structure and understructure.Upper surface 80611,80612 is towards the top of ceramic electrical interface 806.It is set on upper surface 80611,80612
High speed signal pad and direct current signal pad are equipped with, all pads in 80611 and 80612 the two regions of upper surface are all by weldering
Disk pin define be arranged in order, circuit is continuous and is impedance matching, drawn by high-frequency design emulation and pass through experiment
It verifies repeatedly.Pad on shell interior zone 80612 and upper strata COC are by gold wire bonding into the interconnection of horizontal electrical signal.
Ceramic electrical interface lower surface slightly has complexity, and lower surface area 80621 is towards the lower section of ceramic electrical interface 806, and area
Domain 80622 is towards the top of ceramic electrical interface 806.Likewise, high speed signal weldering is provided in lower surface area 80621,80622
Disk and direct current signal pad, all pads in 80621 and 80622 the two regions of lower surface are defined successively by pad pin
Arrangement, circuit is continuous and is impedance matching, is drawn by high-frequency design emulation and passes through experiment and verified repeatedly.Positioned at pipe
Pad on shell interior zone 80622 and upper strata COC are by gold wire bonding into the interconnection of horizontal electrical signal.
As shown in Figure 12 a, b, lower layer components COC 802 includes chip of laser 8081,8082,8083,8084, and backlight is visited
Survey device chip 8091,8092,8093,8094, collimation lens 8071,8072,8073,8074, transition block 8111,8112, substrate
8101, isolator 8121,8122,8123,8124 can add TEC if necessary.Since the thickness of collimation lens 807 is more than laser
The thickness of device chip 808 can select to pad a small-sized transition block below laser 808 and back light detector chip 809,
Transition block 811 can also be made to two step shapes, reserve the height space of collimation lens 807.1st, the laser of 2 passages
Chip 8081,8082, back light detector chip 8091,8092 and collimation lens 8071,8072 are mounted on transition block 8111 jointly
Top, ensure the light shaft coaxle of optical element during design and positioned at lower datum plane 815.3rd, the laser core of 4 passages
Piece 8083,8084, back light detector chip 8093,8094 and collimation lens 8073,8074 are mounted on transition block 8112 jointly
Top ensures the light shaft coaxle of optical element during design and positioned at lower datum plane 815.Four passages are mounted on substantially
8101 tops.The chip of laser of four passages is concordant, collimation lens is concordant, to ensure that the light path of four passages is identical.Transition
Block 8111,8112 materials can be the highly heat-conductive materials, preferably aluminium nitride ceramics such as red copper, tungsten copper, ceramics.Substrate 8101 can be fabricated to
L-type can also be fabricated to plate, and material can be the highly heat-conductive materials, preferably tungsten copper such as red copper, tungsten copper, ceramics.
As shown in Figure 12 c, d, upper component COC 803 includes chip of laser 8085,8086,8087,8088, and backlight is visited
Survey device chip 8095,8096,8097,8098, collimation lens 8075,8076,8077,8078, transition block 8113,8114, substrate
8102, isolator 8125,8126,8127,8128 can add TEC if necessary.Since the thickness of collimation lens 807 is more than laser
The thickness of device chip 808 can select to pad a small-sized transition block below laser 808 and back light detector chip 809,
Transition block 811 can also be made to two step shapes, reserve the height space of collimation lens 807.5th, the laser of 6 passages
Chip 8085,8086, back light detector chip 8095,8096 and collimation lens 8075,8076 are mounted on transition block 8113 jointly
Top, ensure the light shaft coaxle of optical element during design and positioned at upper datum plane 814.7th, the laser core of 8 passages
Piece 8087,8088, back light detector chip 8097,8098 and collimation lens 8077,8078 are mounted on transition block 8114 jointly
Top ensures the light shaft coaxle of optical element during design and positioned at upper datum plane 814.Four passages are mounted on substantially
8102 tops.The chip of laser of four passages is concordant, collimation lens is concordant, to ensure that the light path of four passages is identical.Transition
Block 8113,8114 materials can be the highly heat-conductive materials, preferably aluminium nitride ceramics such as red copper, tungsten copper, ceramics.Substrate 8102 can be fabricated to
L-type can also be fabricated to plate, and material can be the highly heat-conductive materials, preferably tungsten copper such as red copper, tungsten copper, ceramics.Substrate 8102 because
Superstructure is arranged on, its width and length increases.
Each two passage (the such as the 1st, 2 tunnels) is coupled with a collimator 801 by the form of directional light.Paths please join
See that Fig. 6 is described, be no longer described in detail herein.For the mode of 8 passages unification, using 807 multiplex of splitter of 4 passages.4 path shunts
Tail optical fiber of four passages of device 807 respectively with four collimators is welded together.The common port of 4 path shunt devices is according to module
Agreement is different to use different optical interfaces, such as LC types.
Example IV, optical filter type primary multiplex, the secondary multiplex of 3dB splitters
Device is encapsulated using BOX, can be fabricated to level Hermetic Package, can be also fabricated to non-hermetically sealed encapsulation.Using up and down in device
Layered structure, 4 passages are encapsulated per layer structure, and every 4 passages carry out multiplex using optical filter box and public collimator.Multiplex
Double-layer structure afterwards uses 3dB splitters (i.e. two path shunt roads) by double-layer structure multiplex again.According to the difference of spatial distribution
Two kinds can be subdivided into, first way is that the direction of double-layer structure is identical, two layers of lamination that space is realized by way of stent,
As depicted in fig. 13 a, the second way is the direction of double-layer structure on the contrary, double-layer structure is mounted on by centre respectively using partition plate
On partition plate 920, upper and lower two layers symmetrical compared with partition plate 920.The optical texture of two kinds of structures is identical, and there are mechanical aspects
Shell is different and technique coupling sequence is different.Wherein the mechanical structure of first way is similar with Figure 11 in example three,
Shell belongs to general type, i.e. the bottom surface of only shell is that closing, top surface are vacancies, attachment in the upper and lower layer structure of device,
Parallel soldering and sealing is carried out to top surface after the completion of the techniques such as routing, coupling.The second way, because upper and lower two layerings are towards on the contrary, it is managed
Shell belongs to abnormity, i.e., the bottom surface of shell and top surface are all vacancies, in works such as the attachment of the upper and lower layer structure of device, routing, couplings
After the completion of skill, respectively to bottom surface and the parallel soldering and sealing of top surface progress.The advantages of second way is substantially independent upper and lower two layers, only
Want frock making in process excellent, in the case of the stress influence very little of fixture, upper and lower two layers of process is substantially without mutual shadow
It rings, man-hour work efficiency can be improved.
As shown in Figure 13 a~Figure 17.1~4 passage is mounted on lower floor, and 5~8 passages are mounted on upper strata, lower leaf in implementation
Spatial distribution.As shown in fig. 13 a-b, the optical axis of the optical element of understructure is respectively positioned in lower datum plane 918 or parallel
In lower datum plane 918, the optical axis of the optical element of superstructure is respectively positioned in datum plane 919 or is put down parallel to upper benchmark
Face 919.Since device is using upper and lower layered structure, for ease of the encapsulation of device, by chip of laser, back light detector chip,
Coupled lens are mounted on jointly on a bottom plate, form COC components.Figure 14 show 1~4 passage and is mounted on showing for understructure
It is intended to, understructure includes collimator 9011, and lower floor's COC components 902, stent 9041,9042, BOX shells 905 also may be selected
Isolator 9171 is set, and the effect of wherein stent 9041 and 9042 is to place the COC components 903 of superstructure, positioned at lower floor COC
The both sides of component 902 are mounted close to the two side of shell 905.9041 and 9042 height of stent is identical, can also be fabricated to one
U-shaped structure stent.Figure 15 show the schematic diagram that 5~8 passages are mounted on superstructure, and superstructure includes collimator 9012,
Upper strata COC components 903, BOX shells 805 also may be selected to set isolator 9172, and wherein COC components 903 are placed on stent 9041
On 9042.
It is similar with example three on electrical interface.For Figure 13 a, the ceramic electrical interface of tail end insertion of BOX shells 905
906, part inlay is inside shell 905, positioned at the left side of COC components 902.The working region of ceramic electrical interface 906 can be segmented
Into four parts, upper surface 90611,90612 and lower surface 90621,90622, wherein upper surface 90611 and lower surface 90621
Positioned at the perimeter of shell, upper surface 90612 and lower surface 90622 are located at the interior zone of shell.Upper surface 90611,
90612 and lower surface 90621,90622 correspond to superstructure and understructure respectively.Upper surface 90611,90612 is towards pottery
The top of porcelain electrical interface 906.High speed signal pad and direct current signal pad, upper surface are provided on upper surface 90611,90612
All pads in 90611 and 90612 the two regions are all by the definition of pad pin is arranged in order, circuit is continuous and is resistance
It is anti-matched, it is drawn by high-frequency design emulation and passes through experiment and verified repeatedly.Pad on shell interior zone 90612
With upper strata COC by gold wire bonding into the interconnection of horizontal electrical signal.Ceramic electrical interface lower surface area 90621 is towards ceramic electrical interface
906 lower section, and region 90622 is towards the top of ceramic electrical interface 906.Likewise, it is set in lower surface area 90621,90622
High speed signal pad and direct current signal pad are equipped with, all pads in 90621 and 90622 the two regions of lower surface are all by weldering
Disk pin define be arranged in order, circuit is continuous and is impedance matching, drawn by high-frequency design emulation and pass through experiment
It verifies repeatedly.Pad on shell interior zone 90622 and upper strata COC are by gold wire bonding into the interconnection of horizontal electrical signal.
For Figure 13 b, towards the lower section of ceramic electrical interface 906, other are set and Figure 13 a for lower surface 90621 and 90623
It is identical.Because double-layer structure opposed separators 920 are symmetrical up and down in Figure 13 b, the structure of electrical interface 906 is relatively easy.
As shown in Figure 16 a, b, lower layer components COC 902 includes chip of laser 9081,9082,9083,9084, and backlight is visited
Survey device chip 9091,9092,9093,9094, collimation lens 9071,9072,9073,9074, transition block 9161, substrate 9151,
TEC can be added if necessary.Since the thickness of collimation lens 907 is more than the thickness of chip of laser 908, can select in laser
908 and the lower section of back light detector chip 909 one small-sized transition block of pad, transition block 9161 can also be made to two steps
Shape reserves the height space of collimation lens 907.1st, 2,3, the chip of laser 9081,9082,9083,9084 of 4 passages, the back of the body
Photo detector chip 9091,9092,9093,9094 and collimation lens 9071,9072,9073,9074 are mounted on transition jointly
9161 top ensures the light shaft coaxle of optical element during design and positioned at lower datum plane 918.The laser of four passages
Chip is concordant, collimation lens is concordant.
Optical filter box include four channel filters 9101,9102,9103,9104, glass supporter 9111, reflectance coating or
Reflector plate 9121 and transmission film 9131.Four channel filters 9101,9102,9103,9104 are bandpass filter, only to this
The light transmission of band of channles to the light reflection of its all band, is mounted on the left side of glass supporter 9111, close to collimation lens 908.
Reflectance coating or reflector plate 9121 are total reflection film or total reflection piece, the right side of glass supporter are made or be mounted on, close to collimator
901, transmission film 9131 is the public domain of four passages, for anti-reflection film, the optical window as optical filter box.Glass supporter 9111
Can be that solid construction can also be hollow-core construction.The setting of entire optical filter box needs to ensure that four-way has good one
Cause property.
9161 material of transition block can be the highly heat-conductive materials, preferably aluminium nitride ceramics such as red copper, tungsten copper, ceramics.Substrate 9151
L-shaped, which can be made, can also be fabricated to plate, and material can be the highly heat-conductive materials, preferably tungsten copper such as red copper, tungsten copper, ceramics.
As shown in Figure 16 c, d, upper component COC 903 includes chip of laser 9085,9086,9087,9088, and backlight is visited
Survey device chip 9095,9096,9097,9098, collimation lens 9075,9076,9077,9078, transition block 9162, substrate 9152,
TEC can be added if necessary.Since the thickness of collimation lens 907 is more than the thickness of chip of laser 908, can select in laser
908 and the lower section of back light detector chip 909 one small-sized transition block of pad, transition block 9162 can also be made to two steps
Shape reserves the height space of collimation lens 907.5th, 6,7, the chip of laser 9085,9086,9087,9088 of 8 passages, the back of the body
Photo detector chip 9095,9096,9097,9098 and collimation lens 9075,9076,9077,9078 are mounted on transition block jointly
9162 top ensures the light shaft coaxle of optical element during design and positioned at upper datum plane 919.The laser of four passages
Chip is concordant, collimation lens is concordant.
Optical filter box include four channel filters 9105,9106,9107,9108, glass supporter 9112, reflectance coating or
Reflector plate 9122 and transmission film 9132.Four channel filters 9105,9106,9107,9108 are bandpass filter, only to this
The light transmission of band of channles to the light reflection of its all band, is mounted on the left side of glass supporter 9112, close to collimation lens 908.
Reflectance coating or reflector plate 9122 are total reflection film or total reflection piece, the right side of glass supporter are made or be mounted on, close to collimator
901, transmission film 9132 is the public domain of four passages, for anti-reflection film, the optical window as optical filter box.Glass supporter 9112
Can be that solid construction can also be hollow-core construction.The setting of entire optical filter box needs to ensure that four-way has good one
Cause property.
9162 material of transition block can be the highly heat-conductive materials, preferably aluminium nitride ceramics such as red copper, tungsten copper, ceramics.Substrate 9152
L-shaped, which can be made, can also be fabricated to plate, and material can be the highly heat-conductive materials, preferably tungsten copper such as red copper, tungsten copper, ceramics.It is right
Because being arranged on superstructure, its width and length increases substrate 9152 in Figure 13 a.
Optoisolator 9171,9172 at upper and lower layering can be arranged on device inside, can also be embedded in shell 905
At optical port, it can also be arranged on outside shell.For the device of level Hermetic Package, collimator 9011,9012 is arranged on 905 light of shell
On the outside of mouthful, for the device of non-hermetically sealed encapsulation, collimator 9011,9012 can be embedded at 905 optical port of shell.
For light path, by taking understructure as an example, chip of laser 9081 emits divergent pencil, linear polarization subject to the polarization of light
Light, divergent pencil are collimated afterwards by collimation lens 9071, are propagated in optical filter box in the form of quasi-parallel light, first thoroughly
The immediate vicinity of optical filter 9101 is crossed, then is propagated in glass supporter, then reaches reflectance coating or reflector plate 9121 and is reflected, because
Filter sheet structure is set, it is ensured that the light beam after reflection reaches the immediate vicinity of the optical filter 9102 of second channel, because filtering
Piece 9102 reflects the wave band of first passage, and light beam is reflected into glass supporter again, arrives again at reflectance coating or anti-afterwards
It penetrates piece 9121 and is reflected, reach the immediate vicinity of the optical filter 9103 of third channel afterwards, glass is reflected by optical filter 9103
In stent, reflectance coating or reflector plate 9121 are arrived again at afterwards and is reflected, reach the optical filter 9104 of fourth lane afterwards
Immediate vicinity is reflected by optical filter 9104 in glass stent, is reached regional transmission 9131 afterwards, is arrived afterwards through isolator 9171
Up to collimator 9011, it is coupled in the tail optical fiber of collimator.Second and third, the light path on four tunnels and the first via it is essentially identical, simply reflect
Number is different.
For the structure as a result of upper and lower layered structure, light path is actual to be equivalent to two independent four-way structures, because
This structure only needs to consider the coupling tolerance of four-way and reliability tolerance.
The coupling of single chip of laser and multimode collimator optical fiber simultaneously, in the case of preferred aspheric collimation lens, coupling
The 3dB losses for the 3dB splitters for more than 80%, the i.e. Insertion Loss of 1dB, considering rear end can be promoted by closing efficiency, and total losses can be controlled
System can be controlled in 5.5dB in 4dB, the reserved coupling tolerance 1.5dB of consideration.It is usual for the high-speed laser chip of 8 passages
Light power for+5~+8dBm, therefore the structure light power of optical module can be controlled -0.5~+2.5dBm it
Between, meet optical module index, and with larger surplus.
For the mode of 8 passages unification, using 907 multiplex of 3dB splitters.Two passages of 3dB splitters 907 respectively with
The tail optical fiber of two collimators 9011,9012 is welded together.The common port of 3dB splitters is different using not according to the agreement of module
Same optical interface, such as LC types.Specific embodiment described herein is only to spirit explanation for example of the invention.The present invention
Person of ordinary skill in the field can do various modifications or additions or using class to described specific embodiment
As mode substitute, but without departing from the spirit or beyond the scope of the appended claims of the present invention.
Claims (10)
1. a kind of multi-channel parallel ballistic device, which is characterized in that including at least one encapsulation unit, the encapsulation unit includes
The chip of laser that at least two-way axial symmetry is set, the chip of laser are coupled by multiplex device all the way and through isolator
It is coupled in optical fiber.
2. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the multiplex device is coupling
Lens, the chip of laser is compared with the symmetry axis coupled lens incident at a certain angle so as to fulfill multiplex.
3. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the encapsulation unit further includes
At least two backlight detection chips that axial symmetry is set, are arranged at the chip of laser rear.
4. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the encapsulation unit is arranged at
On TO pedestals；The TO pedestals have an elongated area in the horizontal direction, and the mistake of a protrusion is provided on the elongated area
Block is crossed, the encapsulation unit is arranged in the transition block；A TO caps are provided on the elongated area, the TO calottes residence is stated
Encapsulation unit and its interior hermetic seal.
5. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the encapsulation unit is more
It is a, it is packaged in a BOX shell, passes through four-way splitter multiplex.
6. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that set before the isolator accurate
Straight device, the optical signal after multiplex are coupled in by collimator in optical fiber.
7. a kind of multi-channel parallel ballistic device according to claim 5, which is characterized in that the encapsulation unit is two
More than, multi-tier arrangement is divided to be closed in BOX shells, different interlayers are by collimation lens multiplex in optical fiber.
A kind of 8. multi-channel parallel ballistic device according to claim 6, which is characterized in that the tail end insertion of BOX shells
Ceramic electrical interface, the working region of ceramic electrical interface are divided into four parts, including：Upper and lower surface is located at the outside of shell
Region, upper and lower surface are located at the interior zone of shell, the pad in two regions of upper and lower surface by pad pin define according to
Secondary arrangement, circuit is continuous and is impedance matching.
9. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the multiplex device includes standard
Straight mirror, filtering assembly, the filtering assembly include glass supporter, and the glass supporter both sides set optical filter and reflection respectively
Mirror；At least one regional transmission is set on the speculum；The light of chip of laser transmitting collimated by collimating mirror after again
Enter glass supporter through optical filter, finally pooled all the way through the regional transmission coupled to isolation through speculum reflection
Device.
10. a kind of multi-channel parallel ballistic device according to claim 1, which is characterized in that the chip of laser is 8
It is a, 8 passages are formed, wherein four passages are coupled in for one group in a collimator, are closed between two collimators by 3dB splitters
Ripple.
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| CN113759473A (en) * | 2020-06-05 | 2021-12-07 | 华为技术有限公司 | Transmitting-receiving optical assembly, electronic equipment and optical communication system |
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