CN108101366A - A kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof - Google Patents

A kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof Download PDF

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Publication number
CN108101366A
CN108101366A CN201711415207.5A CN201711415207A CN108101366A CN 108101366 A CN108101366 A CN 108101366A CN 201711415207 A CN201711415207 A CN 201711415207A CN 108101366 A CN108101366 A CN 108101366A
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China
Prior art keywords
glass
low dielectric
pelletizing
electronic packaging
preparation
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CN201711415207.5A
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Chinese (zh)
Inventor
彭寿
操芳芳
马立云
王巍巍
曹欣
倪嘉
崔介东
王萍萍
高强
赵凤阳
韩娜
仲召进
单传丽
石丽芬
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China Triumph International Engineering Co Ltd
CNBM Bengbu Design and Research Institute for Glass Industry Co Ltd
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CNBM Bengbu Design and Research Institute for Glass Industry Co Ltd
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Priority to CN201711415207.5A priority Critical patent/CN108101366A/en
Publication of CN108101366A publication Critical patent/CN108101366A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)

Abstract

The present invention discloses a kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof, by weight percentage including following components：65~75% SiO2, 20~30% B2O3, 2~3% Al2O3, 0.1~0.5% CaO, 0.1~0.5% MgO, 0.5~1.5% K2O, the Li of 0.2~0.5% BaO and 0.2~0.5%2O；Corresponding raw material is taken, passes through mixing, melting successively, deionized water cools down, pulverizes ball milling, low dielectric glass pelletizing is prepared in scattered and granulation step；The present invention uses SiO2‑B2O3‑Al2O3Glass system, the SiO of appropriate proper ratio2With B2O3The dielectric constant and dielectric loss of glass, Al can be significantly reduced2O3Glass crystallization tendency can be reduced, helps to improve the chemical stability of glass；Also introduce CaO, MgO, BaO and Li simultaneously2O、K2O optimizes glass properties, reduces manufacture difficulty.

Description

A kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof
Technical field
The present invention relates to packaged glass manufacturing technology field, be specifically a kind of low dielectric glass pelletizing used for electronic packaging and Its preparation method.
Background technology
It is improved rapidly with the integrated level of integrated circuit, the operating frequency ranges such as radio frequency connector, microwave device are also significantly It improves, in order to reduce the impedance delay thus brought and power attenuation, in addition to using low resistivity metal, it is important that reduce The parasitic capacitance of dielectric layer.Since capacitance C are directly proportional to permittivity ε, advanced low-k materials can be used and make connected medium, Reduce impedance delay, so as to meet the needs of integrated circuit development.Low dielectric glass is exactly a kind of highly desirable candidate material, tool Commercioganic demand property and following tendency.
Low dielectric glass has relatively low dielectric constant and dielectric loss, they are basically unchanged with test temperature and frequency, High voltage insulating materials are used frequently as, there is good high voltagehigh frequency insulating properties.Low dielectric glass played in Electronic Packaging as The effects that protecting circuit, isolated insulation and preventing distorted signals.The low dielectric enclosure glass used under the conditions of high-frequency microwave, it is main The input and output of module, the microwave signal of component and control signal are used for, therefore it is required that this glass requires low Jie Electric constant and low dielectric loss.Low-k is to reduce the relaxation of signal and cross jamming, and low-dielectric loss is In order to reduce the heat consumption under high frequency and big resistivity it is excessive, preferably necessary to heat dissipation.
The content of the invention
It is an object of the invention to provide a kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof, the glass Pelletizing has the characteristics that dielectric constant is low, dielectric loss is low, mobile performance is good, and preparation method is simple.
The technical solution adopted by the present invention to solve the technical problems is：
A kind of low dielectric glass pelletizing used for electronic packaging, by weight percentage including following components：65~75% SiO2、20 ~30% B2O3, 2~3% Al2O3, 0.1~0.5% CaO, 0.1~0.5% MgO, 0.5~1.5% K2O, 0.2~0.5% BaO and 0.2~0.5% Li2O。
The present invention also provides a kind of preparation method of low dielectric glass pelletizing used for electronic packaging, technical solution is：
A kind of preparation method of low dielectric glass pelletizing used for electronic packaging, comprises the following steps：
S1, the raw material of following weight percent is uniformly mixed：65~75% SiO2, 20~30% B2O3, 2~3% Al2O3, 0.18~0.9% CaCO3, 0.1~0.5% MgO, 0.73~2.2% K2CO3, 0.26~0.64% BaCO3And 0.49~1.23% Li2CO3；
S2, uniformly mixed raw material is melt into glass metal, then glass metal is poured into deionized water, obtain glass fragment；
S3, glass fragment is crushed to the glass coarse powder that grain size is 0.5~1mm, then by glass coarse powder ball milling into 1~5 μm of grain size Glass dust；
S4, glass dust is scattered in the liquid phase being made of solvent, dispersant and binding agent, obtains glass dust slurry, glass dust, The mass ratio of solvent, dispersant and binding agent is 65：28：2：5；
S5, glass dust slurry is placed in spray dryer it is granulated, obtains low dielectric glass described in claim 1 and be granulated Powder, the grain size of low dielectric glass pelletizing is 100~400 μm.
Further, solvent, dispersant and the binding agent of the step S4 is respectively absolute ethyl alcohol, polyacrylic acid ammonia with gathering Vinyl butyral.
Further, the charging rate when step S5 spray dryers are granulated is 10 ± 2 ml/min, nozzle air current Amount pressure is 0.08~0.1MPa.
Further, when the step S3 is to glass coarse powder ball milling, using deionized water as grinding aid, ZrO2Ball is grinding Medium, 5~10h of ball milling, glass coarse powder, ZrO2Ball and the mass ratio of deionized water are 1：2 ：1.
The beneficial effects of the invention are as follows：The present invention uses SiO2-B2O3-Al2O3Glass system, wherein containing high level SiO2、B2O3With Al2O3, SiO2And B2O3It is strong with higher key, it is not easy to polarize under the action of external electric field, is not easy to generate electricity It the losses such as leads and relaxes, the SiO of appropriate proper ratio2With B2O3The dielectric constant and dielectric loss of glass can be significantly reduced； Al2O3It plays an important role in glass system, it directly participates in the formation of network, appropriate Al2O3Glass crystallization can be reduced to incline To helping to improve the chemical stability of glass.CaO, MgO and BaO are also introduced simultaneously, they are all the network outer bodies of divalent Oxide, CaO can reduce the viscosity of glass at high temperature, promote the fusing and clarification of glass, play fluxing action；A small amount of MgO can make the setting rate of glass slack-off, improve the processability of glass；A small amount of BaO can accelerate the fusing of glass, while energy Increase refractive index, density, gloss and the chemical stability of glass.In addition, also introduce a small amount of Li2O、K2O alkali metal, although glass Alkali metal ion is more in glass, and ion activation can be lower, and the electrical conductivity of glass is bigger, and dielectric properties are poorer, but big The big high-temperature viscosity for reducing glass, so the dosage control of alkali metal is also the key point of the present invention.It is in addition, of the invention by glass Spheric granules of the grain size between 100~400 μm is made by mist projection granulating in glass powder, and intergranular contact area is small, therefore flows Dynamic property is preferable.
Description of the drawings
The present invention is further described with reference to the accompanying drawings and examples：
Fig. 1 is the SEM figures of low dielectric glass pelletizing of the present invention.
Specific embodiment
The present invention provides a kind of low dielectric glass pelletizing used for electronic packaging, by weight percentage including following components：65 ~75% SiO2, 20~30% B2O3, 2~3% Al2O3, 0.1~0.5% CaO, 0.1~0.5% MgO, 0.5~1.5% K2O, the Li of 0.2~0.5% BaO and 0.2~0.5%2O。
The present invention also provides a kind of preparation methods of low dielectric glass pelletizing used for electronic packaging, comprise the following steps：
S1, the raw material of following weight percent is uniformly mixed：65~75% SiO2, 20~30% B2O3, 2~3% Al2O3, 0.18~0.9% CaCO3, 0.1~0.5% MgO, 0.73~2.2% K2CO3, 0.26~0.64% BaCO3And 0.49~1.23% Li2CO3；
S2, uniformly mixed raw material at 1550~1650 DEG C is kept the temperature into 2~4h, is melt into glass metal, then glass metal is poured into In deionized water, glass fragment is obtained；
S3, glass fragment is crushed to the glass coarse powder that grain size is 0.5~1mm, then by glass coarse powder ball milling into 1~5 μm of grain size Glass dust；During to glass coarse powder ball milling, using deionized water as grinding aid, ZrO2Ball is abrasive media, 5~10h of ball milling, glass Glass coarse powder, ZrO2Ball and the mass ratio of deionized water are 1：2 ：1；
S4, glass dust is scattered in the liquid phase being made of solvent, dispersant and binding agent, obtains glass dust slurry, glass dust, The mass ratio of solvent, dispersant and binding agent is 65：28：2：5；Solvent, dispersant and binding agent are respectively absolute ethyl alcohol, poly- third Olefin(e) acid ammonia and polyvinyl butyral；
S5, glass dust slurry is placed in spray dryer it is granulated, charging rate during granulation is 10 ± 2 ml/min, spray Mouth throughput pressure is 0.08~0.1MPa, obtains low dielectric glass pelletizing described in claim 1, and low dielectric glass is granulated The grain size of powder is 100~400 μm.
After tested, the low dielectric glass pelletizing dielectric constant obtained<4.0, dielectric loss<0.0020, coefficient of thermal expansion For 3.0~3.2K-1, Log3 viscosity temperature<1200 DEG C, density is 2.1~2.2 g/cm3, it is a kind of electronic seal of function admirable Dress low dielectric glass pelletizing.
This specification provides 4 groups of embodiments to illustrate raw material proportioning relation, for convenience of description, arranges in a tabular form below The dielectric for the low dielectric glass pelletizing for going out 4 groups of embodiments and being prepared by this preparation method, every group of embodiment is normal Number, dielectric loss, coefficient of thermal expansion, Log3 viscositys temperature and density, specifically see the table below：
The above described is only a preferred embodiment of the present invention, not make limitation in any form to the present invention；It is any ripe Know those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above method and Technology contents make technical solution of the present invention many possible changes and modifications or are revised as the equivalence enforcement of equivalent variations Example.Therefore, every content without departing from technical solution of the present invention, technical spirit according to the invention is to made for any of the above embodiments Any simple modification, equivalent substitution, equivalence changes and modification, still fall within technical solution of the present invention protection in the range of.

Claims (5)

1. a kind of low dielectric glass pelletizing used for electronic packaging, which is characterized in that by weight percentage including following components：65~ 75% SiO2, 20~30% B2O3, 2~3% Al2O3, 0.1~0.5% CaO, 0.1~0.5% MgO, 0.5~1.5% K2O, the Li of 0.2~0.5% BaO and 0.2~0.5%2O。
2. a kind of preparation method of low dielectric glass pelletizing used for electronic packaging, which is characterized in that comprise the following steps：
S1, the raw material of following weight percent is uniformly mixed：65~75% SiO2, 20~30% B2O3, 2~3% Al2O3、 0.18~0.9% CaCO3, 0.1~0.5% MgO, 0.73~2.2% K2CO3, 0.26~0.64% BaCO3And 0.49 ~1.23% Li2CO3；
S2, uniformly mixed raw material is melt into glass metal, then glass metal is poured into deionized water, obtain glass fragment；
S3, glass fragment is crushed to the glass coarse powder that grain size is 0.5~1mm, then by glass coarse powder ball milling into 1~5 μm of grain size Glass dust；
S4, glass dust is scattered in the liquid phase being made of solvent, dispersant and binding agent, obtains glass dust slurry, glass dust, The mass ratio of solvent, dispersant and binding agent is 65：28：2：5；
S5, glass dust slurry is placed in spray dryer it is granulated, obtains low dielectric glass described in claim 1 and be granulated Powder, the grain size of low dielectric glass pelletizing is 100~400 μm.
3. a kind of preparation method of low dielectric glass pelletizing used for electronic packaging according to claim 2, which is characterized in that Solvent, dispersant and the binding agent of the step S4 is respectively absolute ethyl alcohol, polyacrylic acid ammonia and polyvinyl butyral.
4. a kind of preparation method of low dielectric glass pelletizing used for electronic packaging according to claim 2, which is characterized in that Charging rate when the step S5 spray dryers are granulated is 10 ± 2 ml/min, nozzle air current amount pressure for 0.08~ 0.1MPa。
5. a kind of preparation method of low dielectric glass pelletizing used for electronic packaging according to claim 2, which is characterized in that When the step S3 is to glass coarse powder ball milling, using deionized water as grinding aid, ZrO2Ball is abrasive media, 5~10h of ball milling, Glass coarse powder, ZrO2Ball and the mass ratio of deionized water are 1：2 ：1.
CN201711415207.5A 2017-12-25 2017-12-25 A kind of low dielectric glass pelletizing used for electronic packaging and preparation method thereof Pending CN108101366A (en)

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108383378A (en) * 2018-06-04 2018-08-10 中建材蚌埠玻璃工业设计研究院有限公司 A kind of glass with low dielectric constant
CN108975689A (en) * 2018-09-03 2018-12-11 中建材蚌埠玻璃工业设计研究院有限公司 A kind of low-k low dielectric-loss glass
CN109399937A (en) * 2018-12-27 2019-03-01 中建材蚌埠玻璃工业设计研究院有限公司 A kind of glass with low dielectric constant powder and preparation method thereof
CN111138081A (en) * 2019-12-31 2020-05-12 西安赛尔电子材料科技有限公司 Improved preparation method of glass sealing material
CN112679094A (en) * 2020-12-29 2021-04-20 西安赛尔电子材料科技有限公司 Preparation method of slurry for spray granulation of borosilicate glass powder
CN112707638A (en) * 2021-01-12 2021-04-27 成都光明光电股份有限公司 Glass composition
CN112777931A (en) * 2021-01-12 2021-05-11 成都光明光电股份有限公司 Low dielectric constant glass
CN113213756A (en) * 2021-06-21 2021-08-06 成都光明光电有限责任公司 Glass material
CN114213025A (en) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 Preparation method and sealing process for tantalum capacitor cover group sealing glass
CN114315160A (en) * 2021-12-20 2022-04-12 西安赛尔电子材料科技有限公司 Low dielectric sealing glass granulation powder and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101012105A (en) * 2006-12-21 2007-08-08 泰山玻璃纤维股份有限公司 Glass fiber with low permittivity
CN101033114A (en) * 2007-02-12 2007-09-12 洛玻集团洛阳晶纬玻璃纤维有限公司 Glass with low dielectric constant
CN101696089A (en) * 2009-10-29 2010-04-21 四川省玻纤集团有限公司 Glass fiber with low dielectric constant for high frequency high-density circuit board
CN103274601A (en) * 2013-06-07 2013-09-04 福州大学 Nb2O5-containing seal glass and its preparation and application methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101012105A (en) * 2006-12-21 2007-08-08 泰山玻璃纤维股份有限公司 Glass fiber with low permittivity
CN101033114A (en) * 2007-02-12 2007-09-12 洛玻集团洛阳晶纬玻璃纤维有限公司 Glass with low dielectric constant
CN101696089A (en) * 2009-10-29 2010-04-21 四川省玻纤集团有限公司 Glass fiber with low dielectric constant for high frequency high-density circuit board
CN103274601A (en) * 2013-06-07 2013-09-04 福州大学 Nb2O5-containing seal glass and its preparation and application methods

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108383378A (en) * 2018-06-04 2018-08-10 中建材蚌埠玻璃工业设计研究院有限公司 A kind of glass with low dielectric constant
CN108975689A (en) * 2018-09-03 2018-12-11 中建材蚌埠玻璃工业设计研究院有限公司 A kind of low-k low dielectric-loss glass
CN109399937A (en) * 2018-12-27 2019-03-01 中建材蚌埠玻璃工业设计研究院有限公司 A kind of glass with low dielectric constant powder and preparation method thereof
CN111138081A (en) * 2019-12-31 2020-05-12 西安赛尔电子材料科技有限公司 Improved preparation method of glass sealing material
CN112679094A (en) * 2020-12-29 2021-04-20 西安赛尔电子材料科技有限公司 Preparation method of slurry for spray granulation of borosilicate glass powder
CN112707638A (en) * 2021-01-12 2021-04-27 成都光明光电股份有限公司 Glass composition
CN112777931A (en) * 2021-01-12 2021-05-11 成都光明光电股份有限公司 Low dielectric constant glass
CN112777931B (en) * 2021-01-12 2022-04-15 成都光明光电股份有限公司 Low dielectric constant glass
CN113213756A (en) * 2021-06-21 2021-08-06 成都光明光电有限责任公司 Glass material
CN114213025A (en) * 2021-12-15 2022-03-22 西安赛尔电子材料科技有限公司 Preparation method and sealing process for tantalum capacitor cover group sealing glass
CN114315160A (en) * 2021-12-20 2022-04-12 西安赛尔电子材料科技有限公司 Low dielectric sealing glass granulation powder and preparation method thereof

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Application publication date: 20180601