CN108099278A - High density thermal insulation board based on aluminosilicate fiberboard - Google Patents
High density thermal insulation board based on aluminosilicate fiberboard Download PDFInfo
- Publication number
- CN108099278A CN108099278A CN201711235539.5A CN201711235539A CN108099278A CN 108099278 A CN108099278 A CN 108099278A CN 201711235539 A CN201711235539 A CN 201711235539A CN 108099278 A CN108099278 A CN 108099278A
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- Prior art keywords
- partition
- plate
- substrate
- top plate
- middle plate
- Prior art date
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- 238000009413 insulation Methods 0.000 title claims abstract description 29
- 239000011094 fiberboard Substances 0.000 title claims abstract description 19
- 229910000323 aluminium silicate Inorganic materials 0.000 title claims abstract description 16
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 238000005192 partition Methods 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 52
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 34
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 20
- 239000010959 steel Substances 0.000 claims abstract description 20
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000009970 fire resistant effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002939 oilproofing Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/304—Insulating
Landscapes
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Building Environments (AREA)
Abstract
The invention discloses the high density thermal insulation boards based on aluminosilicate fiberboard, including substrate connected in sequence from bottom to up, first partition, middle plate, second partition, top plate, substrate, first partition, middle plate, second partition, top plate is mutually parallel, substrate, middle plate is connected with first partition, middle plate, top plate is connected with second partition, the first partition includes first rectangular frame, the more steel wires parallel with first rectangular frame long side are installed in the first rectangular frame, the second partition includes second rectangular frame, the more steel wires parallel with first rectangular frame broadside are installed in the second rectangular frame, the substrate, middle plate, top plate is high density silicate aluminum board.Steel wire is added in the present invention one, not only there is the thermal insulation of traditional silicate aluminum board, but also with higher intensity.
Description
Technical field
The present invention relates to a kind of silicate aluminum boards, and in particular to the high density thermal insulation board based on aluminosilicate fiberboard.
Background technology
Through 2000 DEG C or more furnace meltings, fiber and uniform is blown out by mechanical spray by selected high-quality flint clay for silicate aluminum board
Special binding agent is added in, oil-proofing agent, hydrophober is heated to be cured.It is mainly used for power industry, electric boiler, steam turbine
And nuclear power is heat-insulated, the fire-proof and thermal-insulation of the fire-proof and thermal-insulation of shipping industry, construction industry, fire resistant doorsets, chemical engineering industry high-temperature reaction equipment and
Wall liner, automobile, train manufacturing industry, fire prevention, heat-insulated, kiln lining-up, fire door, the head cover of heating equipment are close.
At present, China's silicate aluminum board heat-insulation and heat-preservation product category is various, all with good heat insulation and preservation effect, but intensity
It is low, do not possess high-strength and overpressure resistant, resistance to drawing, so cannot be applied in the like environments such as cement plant rotation kiln cylinder body, limit
The application environment of silicate aluminum board is made.
The content of the invention
The technical problems to be solved by the invention are that the intensity of existing silicate aluminum board is low, and it is an object of the present invention to provide based on alumina silicate
The high density thermal insulation board of fiberboard solves the problems, such as that the intensity of existing silicate aluminum board is low.
The present invention is achieved through the following technical solutions:
High density thermal insulation board based on aluminosilicate fiberboard, including substrate connected in sequence from bottom to up, first partition, in
Plate, second partition, top plate, substrate, first partition, middle plate, second partition, top plate are mutually parallel, substrate, middle plate with first every
Plate connects, and middle plate, top plate are connected with second partition, and the first partition includes first rectangular frame, first rectangle frame
The more steel wires parallel with first rectangular frame long side are installed, the second partition includes second rectangular frame, described in frame
The more steel wires parallel with first rectangular frame broadside are installed, the substrate, middle plate, top plate are height in second rectangular frame
Density silicate aluminum board.
The present invention changes the structure of traditional silicate aluminum board, and the present invention had not only had the thermal insulation of traditional silicate aluminum board, but also tool
There is higher intensity;Traditional silicate aluminum board position is an integral molding structure, and the present invention constitutes silicate aluminum board using multilayered structure,
And the first partition with steel wire, second partition are added in multilayered structure, steel wire can increase the intensity of silicate aluminum board, make
Silicate aluminum board is pressure-resistant, resistance to drawing;The present invention realization principle be:Substrate, first partition, middle plate, the are sequentially compressed from bottom to up
Two partition plates, top plate, middle plate between first partition and second partition so that in plate maximum intensity, have it is stronger it is pressure-resistant,
Cutting resistance;First partition plays supporting role to substrate, top plate respectively with second partition, and substrate, top plate play
The heat-blocking action of superficial layer;When external force pulls the high density thermal insulation board the present invention is based on aluminosilicate fiberboard, it is necessary to by inside
Steel wire break and high intensity alumina silicate thermal insulation board can be torn, and steel wire is difficult to break, and therefore, the present invention is based on alumina silicate
The intensity of the high density thermal insulation board of fiberboard is big, solves the problems, such as that the intensity of existing silicate aluminum board is low;Present invention employs more
The mode of layer architecture, once, breakage occurs for a certain layer structure, can directly replace and work as layer structure, other layers can still use, and
Existing silicate aluminum board is integral, whole all to use if being damaged, and therefore, silicate aluminum board of the invention uses the longevity
Life length, stock utilization is high, at low cost.
Fixed plate is provided between substrate and top plate, the fixed plate is located at the side of substrate and top plate, substrate and top plate
Fixed plate is both provided on two sides in relative position, is provided with what is be connected with top plate upper face at the top of the fixed plate
First transverse slat, the base portion of the fixed plate are provided with the second transverse slat being connected with substrate lower face, fixed plate coated substrate,
First partition, middle plate, second partition, the side of top plate.In the present invention fixed plate by substrate, first partition, middle plate, second every
Plate, the side of top plate all connect, and compression, fixation are played to each layer;It only needs to consolidate the first transverse slat with top plate
It is fixed, the second transverse slat is fixed with substrate, it becomes possible to compress each layer to centre, therefore, the height of fixed plate is less than substrate, first
The height that the uncompressed preceding heap of partition plate, middle plate, second partition, top plate comes;Connected between each plate it is closer, silicate aluminum board it is strong
Degree is higher.The present invention can just be compressed substrate, first partition, middle plate, second partition, top plate using simple fixed plate,
It is easy to operate, it is at low cost, convenient for improving production efficiency.
Convex block is both provided on the two sides of the upper face of the first partition, the both sides of lower face, is set on substrate, middle plate
It is equipped with the groove being connected with the convex block in first partition;On the two sides of the upper face of the second partition, the both sides of lower face
Convex block is both provided with, the groove that connection is matched with the convex block on second partition is provided on top plate, middle plate.In the present invention each plate it
Between be connected by convex block and groove, steel wire is enabled to closely to be connected with each layer.
Second partition is both connected to the convex block in the same side in first partition in the same groove of middle plate.On middle plate
Groove connect second partition and first partition simultaneously, cost-effective, the number of openings in reduction on plate, be conducive to improve in plate
Intensity.
The thickness of the middle plate is more than the thickness of top plate, and the thickness of top plate is equal with the thickness of substrate.The intensity of middle plate is most
Greatly, in the case where silicate aluminum board thickness really is certain, the thickness of plate in increase, it becomes possible to effectively enhance entire silicate aluminum board
Intensity.
Compared with prior art, the present invention it has the following advantages and advantages:
1st, the present invention is based on steel wire is added in the high density thermal insulation board of aluminosilicate fiberboard, both there is traditional silicate aluminum board
Thermal insulation, and with higher intensity;
2nd, the high density thermal insulation board the present invention is based on aluminosilicate fiberboard employs the mode of multi-layer framework, once, it is a certain
Breakage occurs for layer structure, can directly replace and work as layer structure, and service life is long, and stock utilization is high;
3rd, the high density thermal insulation board the present invention is based on aluminosilicate fiberboard also has at low cost, and density is big, and production efficiency is high
The characteristics of.
Description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings:
Fig. 1 is schematic structural view of the invention.
Mark and corresponding parts title in attached drawing:
1- substrates, 2- first partitions, plate in 3-, 4- second partitions, 5- top plates, 6- fixed plates, the first transverse slats of 7-, 8- second
Transverse slat, 9- convex blocks, 10- grooves.
Specific embodiment
Understand to make the object, technical solutions and advantages of the present invention clearer, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment 1
As shown in Figure 1, the present invention is based on the high density thermal insulation board of aluminosilicate fiberboard, including connected in sequence from bottom to up
Substrate 1, first partition 2, middle plate 3, second partition 4, top plate 5, substrate 1, first partition 2, middle plate 3, second partition 4,5 phase of top plate
Mutually parallel, substrate 1, middle plate 3 are connected with first partition 2, and middle plate 3, top plate 5 are connected with second partition 4, the first partition
2 include first rectangular frame, and the more steel wires parallel with first rectangular frame long side, institute are equipped in the first rectangular frame
Stating second partition 4 includes second rectangular frame, and be equipped with more in the second rectangular frame puts down with first rectangular frame broadside
Capable steel wire, the substrate 1, middle plate 3, top plate 5 are high density silicate aluminum board.The thickness of the middle plate 3 is more than the thickness of top plate 5
Degree, the thickness of top plate 5 are equal with the thickness of substrate 1.
The present invention changes the structure of traditional silicate aluminum board, and the present invention had not only had the thermal insulation of traditional silicate aluminum board, but also tool
There is higher intensity;Traditional silicate aluminum board position is an integral molding structure, and the present invention constitutes silicate aluminum board using multilayered structure,
And the first partition with steel wire, second partition are added in multilayered structure, steel wire can increase the intensity of silicate aluminum board, make
Silicate aluminum board is pressure-resistant, resistance to drawing;The present invention realization principle be:Substrate, first partition, middle plate, the are sequentially compressed from bottom to up
Two partition plates, top plate, middle plate between first partition and second partition so that in plate maximum intensity, have it is stronger it is pressure-resistant,
Cutting resistance;First partition plays supporting role to substrate, top plate respectively with second partition, and substrate, top plate play
The heat-blocking action of superficial layer;When external force pulls the high density thermal insulation board the present invention is based on aluminosilicate fiberboard, it is necessary to by inside
Steel wire break and high intensity alumina silicate thermal insulation board can be torn, and steel wire is difficult to break, and therefore, the present invention is based on alumina silicate
The intensity of the high density thermal insulation board of fiberboard is big, solves the problems, such as that the intensity of existing silicate aluminum board is low;Present invention employs more
The mode of layer architecture, once, breakage occurs for a certain layer structure, can directly replace and work as layer structure, other layers can still use, and
Existing silicate aluminum board is integral, whole all to use if being damaged, and therefore, silicate aluminum board of the invention uses the longevity
Life length, stock utilization is high, at low cost.
Embodiment 2
Based on embodiment 1, fixed plate 6 is provided between substrate 1 and top plate 5, the fixed plate 6 is located at substrate 1 and top plate 5
Side, substrate 1 and top plate 5, which are on the two sides of relative position, is both provided with fixed plate 6, and the top of the fixed plate 6 is set
The first transverse slat 7 being connected with 5 upper face of top plate is equipped with, the base portion of the fixed plate 6 is provided with what is be connected with 5 lower face of substrate
Second transverse slat 8, fixed plate 6 have coated substrate 1, first partition 2, middle plate 3, second partition 4, the side of top plate 5.
Fixed plate all connects the side of substrate, first partition, middle plate, second partition, top plate in the present invention, right
Each layer plays compression, fixation;It only needs to fix the first transverse slat with top plate, the second transverse slat be fixed with substrate, with regard to energy
Enough to compress each layer to centre, therefore, the height of fixed plate is less than substrate, first partition, middle plate, second partition, top plate and does not press
The height that heap comes before contracting;Connect closer between each plate, the intensity of silicate aluminum board is higher.The present invention is using simply admittedly
Fixed board can just compress substrate, first partition, middle plate, second partition, top plate, easy to operate, at low cost, be produced convenient for improving
Efficiency.
Embodiment 3
Based on above-described embodiment, it is both provided on the two sides of upper face of the first partition 2, the both sides of lower face convex
Block 9 is provided with the groove 10 being connected with the convex block 9 in first partition 2 on substrate 1, middle plate 3;The upper face of the second partition 4
Two sides, lower face both sides on be both provided with convex block 9, be provided on top plate 5, middle plate 3 and the convex block 9 on second partition 4
Match the groove 10 of connection.Second partition 4 is both connected to the same of middle plate 3 with being in the convex block 9 of the same side in first partition 2
In groove 10.
It is connected in the present invention between each plate by convex block and groove, steel wire is enabled to closely to be connected with each layer.In
Groove on plate connects second partition and first partition simultaneously, cost-effective, and the number of openings in reduction on plate is conducive to improve
The intensity of middle plate.
Above-described specific embodiment has carried out the purpose of the present invention, technical solution and advantageous effect further
It is described in detail, it should be understood that the foregoing is merely the specific embodiments of the present invention, is not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done should all include
Within protection scope of the present invention.
Claims (5)
1. the high density thermal insulation board based on aluminosilicate fiberboard, which is characterized in that including substrate connected in sequence from bottom to up
(1), first partition (2), middle plate (3), second partition (4), top plate (5), substrate (1), first partition (2), middle plate (3), second
Partition plate (4), top plate (5) are mutually parallel, and substrate (1), middle plate (3) are connected with first partition (2), and middle plate (3), top plate (5) are equal
It is connected with second partition (4), the first partition (2) includes first rectangular frame, is equipped in the first rectangular frame more
The root steel wire parallel with first rectangular frame long side, the second partition (4) include second rectangular frame, second rectangle frame
The more steel wires parallel with first rectangular frame broadside are installed, the substrate (1), middle plate (3), top plate (5) are height in frame
Density silicate aluminum board.
2. the high density thermal insulation board according to claim 1 based on aluminosilicate fiberboard, which is characterized in that substrate (1) with
Be provided with fixed plate (6) between top plate (5), the fixed plate (6) is located at the side of substrate (1) and top plate (5), substrate (1) with
Top plate (5), which is on the two sides of relative position, is both provided with fixed plate (6), is provided with and pushes up at the top of the fixed plate (6)
The first transverse slat (7) of plate (5) upper face connection, the base portion of the fixed plate (6) is provided with to be connected with substrate (5) lower face
Second transverse slat (8), fixed plate (6) have coated substrate (1), first partition (2), middle plate (3), second partition (4), top plate (5)
Side.
3. the high density thermal insulation board according to claim 1 based on aluminosilicate fiberboard, which is characterized in that described first every
Be both provided with convex block (9) on the two sides of upper face of plate (2), the both sides of lower face, be provided on substrate (1), middle plate (3) with
The groove (10) of convex block (9) connection in first partition (2);The two sides of the upper face of the second partition (4), lower face
Convex block (9) is both provided on both sides, is provided on top plate (5), middle plate (3) and matches connection with the convex block (9) on second partition (4)
Groove (10).
4. the high density thermal insulation board according to claim 3 based on aluminosilicate fiberboard, which is characterized in that second partition
(4) it is both connected to the convex block (9) in the same side in first partition (2) in the same groove (10) of middle plate (3).
5. the high density thermal insulation board according to claim 1 based on aluminosilicate fiberboard, which is characterized in that the middle plate
(3) thickness is more than the thickness of top plate (5), and the thickness of top plate (5) is equal with the thickness of substrate (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711235539.5A CN108099278A (en) | 2017-11-30 | 2017-11-30 | High density thermal insulation board based on aluminosilicate fiberboard |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711235539.5A CN108099278A (en) | 2017-11-30 | 2017-11-30 | High density thermal insulation board based on aluminosilicate fiberboard |
Publications (1)
Publication Number | Publication Date |
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CN108099278A true CN108099278A (en) | 2018-06-01 |
Family
ID=62208025
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201711235539.5A Withdrawn CN108099278A (en) | 2017-11-30 | 2017-11-30 | High density thermal insulation board based on aluminosilicate fiberboard |
Country Status (1)
Country | Link |
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CN (1) | CN108099278A (en) |
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2017
- 2017-11-30 CN CN201711235539.5A patent/CN108099278A/en not_active Withdrawn
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