CN108091632A - The compound bonding wire of electrum and its manufacturing method - Google Patents
The compound bonding wire of electrum and its manufacturing method Download PDFInfo
- Publication number
- CN108091632A CN108091632A CN201711332222.3A CN201711332222A CN108091632A CN 108091632 A CN108091632 A CN 108091632A CN 201711332222 A CN201711332222 A CN 201711332222A CN 108091632 A CN108091632 A CN 108091632A
- Authority
- CN
- China
- Prior art keywords
- palladium
- plating
- gold
- cored wire
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
Abstract
A kind of compound bonding wire of electrum, it is characterised in that including cored wire, the palladium pre-plating layer being coated on outside cored wire and the gold plate being coated on outside palladium pre-plating layer；The cored wire is by weight containing gold 51 82%, silver 18 49%；The thickness of the palladium pre-plating layer is 1 6nm；The thickness of the gold plate is 20 200nm.The present invention also provides a kind of manufacturing methods of the compound bonding wire of above-mentioned electrum.The compound bonding wire of electrum of the present invention has excellent antioxygenic property and sulfuration resistant performance, and tensile strength is high, and solder joint zygosity is good, and it is relatively low to manufacture cost.
Description
Technical field
The present invention relates to the bonding wires of IC, LED encapsulation, and in particular to a kind of compound bonding wire of electrum and its manufacture
Method.
Background technology
Bonding wire（Bonding wire, also known as bonding line）It is connection chip and outer enclosure substrate（substrate）With/
Or multilayer circuit board（PCB）Main connection mode.The development trend of bonding wire, from the line of production, mainly line footpath is subtle
Change, the high workshop service life（floor life）And high spool length；Chemically on ingredient, mainly there is copper wire（Including bare copper wire, plating
Palladium copper wire dodges gold plating palladium copper wire）Significantly substitute gold thread in semiconductor applications, and silver wire and silver alloy wire are in LED and part
IC package applies upper substitution gold thread.Another important directions is the development of alloy gold wire, to further reduce the cost and protect
Hold or improve the performance requirements of bonding process.
It is traditional by proof gold bonding wire, because its matter is soft, corrosion-resistant, electric property is good, is widely used as IC and LED bondings and draws
Line.But with rising steadily for international price of gold, the price also rising all the way of gold bonding silk, the cost for causing end product is excessively high,
It is unfavorable for enterprise and improves competitiveness；In addition, the tensile strength of gold bonding silk is relatively low（Such as the gold bonding of 20 microns of diameter
Silk, after welding, maximum pulling strength is less than 5 gram forces）, elongation percentage is not easily controlled；More than two aspect factors become hinder
Gold bonding silk is using the bottleneck with development.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of compound bonding wire of electrum and this electrum
The manufacturing method of compound bonding wire, this compound bonding wire of electrum have excellent antioxygenic property and sulfuration resistant performance,
Tensile strength is high, and solder joint zygosity is good, and it is relatively low to manufacture cost.The technical solution of use is as follows：
A kind of compound bonding wire of electrum, it is characterised in that including cored wire, the palladium pre-plating layer and bag that are coated on outside cored wire
Overlay on the gold plate outside palladium pre-plating layer；The cored wire contains gold 51-82%, silver-colored 18-49% by weight；The palladium pre-plating layer
Thickness be 1-6nm；The thickness of the gold plate is 20-200nm.
In the compound bonding wire of electrum of the present invention, silver and gold in cored wire can be fully dissolved, and play solution strengthening
Effect improves the tensile strength of wire rod；Thickness 1-6nm palladium pre-plating layers help to promote the ageing resistance of wire rod, improve encapsulation
Reliability of the product in thermal shock test can increase the intensity of welding point B point, resist the thermal expansion ability of LED packaging plastics, and
And palladium pre-plating layer can be used as crystal grain-growth initiation layer, improve the crystal grain refinement and coating uniformity of gold plate lattice arrangement, energy
1 solder-ball-type of wire rod is effectively improved, has splendid performance to the push-pull effort stability of soldering；Thickness is the gold plate of 20-200nm
As main coating, the effect of anti-oxidant and sulfuration resistant is further functioned as, and can effectively promote wire rod and chip and the engagement energy of substrate
Power effectively promotes reliability.In brief, the compound bonding wire solder joint zygosity of electrum of the invention is good, anti-oxidant sulfur resistive
Change ability is strong, tensile strength is high, and manufacture cost is relatively low.
The present invention also provides a kind of manufacturing methods of the compound bonding wire of above-mentioned electrum, it is characterised in that including following steps
Suddenly：
（1）Founding：Gold and silver are mixed in proportion, continuously draw casting process by vacuum melting and orientation, obtains a diameter of 6-8 millis
The core wires of rice；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the cored wire of a diameter of 15-40 um；
（3）Using electroplating technology in step（2）Palladium pre-plating layer is formed on the cored wire surface of acquisition, the thickness of palladium pre-plating layer is 1-
6nm obtains plating palladium line；
（4）Using electroplating technology in step（3）Gold plate is formed on obtained plating palladium line surface（Gold plate is by palladium pre-plating layer bag
It covers）, the thickness of gold plate is 20-200nm, obtains plating palladium plating gold thread；
（5）Finally anneal：Step（4）After the completion of plating, finally annealed to plating palladium plating gold thread, N is used in annealing process2
Come as annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-
120m/min；
（6）Cooling：After finally annealing, plating palladium plating gold thread is cooled to 20-30 DEG C, obtains required electrum compound keys
Plying.
It is preferred that above-mentioned steps（2）In drawing process, intermediate annealing several times is carried out to wire rod, is used in annealing process
N2As annealing atmosphere, annealing furnace effective length is 600-2000mm, and annealing temperature is 500-800 DEG C, annealing rate 30-
100m/min。
It is preferred that above-mentioned steps（3）In electroplating technology（Plate palladium）Comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The cored wire of acquisition immerses the acetone ethanol mixed liquor that temperature is 70-150 DEG C
In, it is 1.4-8 seconds to immerse the time, the organic matter on removing cored wire surface；The weight of acetone and ethyl alcohol in the acetone ethanol mixed liquor
Amount ratio is 1:5-10；
（3-2）Remove oxide process：It is 70-150 DEG C, weight percent by temperature is immersed by the cored wire of removing organic matter processing
Specific concentration is in the nitric acid of 30-50%, and it is 1.4-8 seconds to immerse the time, the oxide on removing cored wire surface；
（3-3）Surface activation process：It is 70-150 DEG C, weight percent by temperature is immersed by the cored wire of removing oxide process
Concentration is in the sulfuric acid of 10-30%, and it is 1.4-8 seconds to immerse the time, and surface activation process is carried out to cored wire；
（3-4）Plate palladium：Cored wire Jing Guo surface activation process is immersed in plating palladium liquid, in the condition that electroplating current is 0.2-0.8A
Lower plating palladium, forms the palladium pre-plating layer that thickness is 1-6nm on the surface of cored wire, which coats cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the cored wire for being coated with palladium pre-plating layer；
（3-6）Drying：The water being attached in palladium preplating layer surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（2）The cored wire of acquisition, cored wire is successively by above-mentioned de-
After organic matter processing, removing oxide process, surface activation process, plating palladium, cleaning and drying, plating palladium line and take-up are obtained.
It is preferred that above-mentioned steps（3-4）In, the plating palladium liquid of use is the mixed solution of palladium sulfate, ammonium chloride and ammonium sulfate,
The concentration of middle palladium sulfate is 1-4g/L, and the concentration of ammonium chloride is 1-4g/L, and the concentration of ammonium sulfate is 1-4g/L.Ammonium chloride and sulfuric acid
Ammonium is as conductive agent.
It is preferred that above-mentioned steps（3-5）In, using pure water as cleaning solution, twice are carried out to the cored wire for being coated with palladium pre-plating layer and are surpassed
Sound wave cleans.
It is preferred that above-mentioned steps（3-6）In, air knife air-flow is N2, flow velocity 5-20L/min.
It is preferred that above-mentioned steps（4）In electroplating technology（It is gold-plated）Comprise the following steps：
（4-1）It is gold-plated：By step（3）The plating palladium line of acquisition is immersed in the gold plating liquid that concentration is 2-4g/L, is in electroplating current
It is gold-plated under conditions of 0.2-0.8A, the gold plate that thickness is 20-200nm is formed on the surface of plating palladium line, the gold plate is by palladium
Pre-plating layer coats；
（4-2）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the plating palladium line for being coated with gold plate；
（4-3）Drying：The water being attached on gold plate surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（3）The plating palladium line of acquisition, plating palladium line is successively by upper
After stating gold-plated, cleaning and drying, plating palladium plating gold thread and take-up are obtained.
It is preferred that above-mentioned steps（4-1）In, the gold plating liquid of use is potassium auricyanide solution.
It is preferred that above-mentioned steps（4-2）In, using pure water as cleaning solution, twice are carried out to the plating palladium line for being coated with gold plate and are surpassed
Sound wave cleans.
It is preferred that above-mentioned steps（4-3）In, air knife air-flow is N2, flow velocity 5-20L/min.
The compound bonding wire of electrum of the present invention compared with prior art, has the advantages that：
（1）The compound bonding wire of electrum of the present invention has excellent antioxygenic property and sulfuration resistant performance, and tensile strength is high,
Solder joint zygosity is good, and reliability is high；
（2）Palladium pre-plating layer improves gold plate lattice as crystal grain-growth initiation layer in the compound bonding wire of electrum of the present invention
The crystal grain refinement and coating uniformity of arrangement can effectively improve 1 solder-ball-type of wire rod, have pole to the push-pull effort stability of soldering
Good performance；
（3）The compound bonding wire of electrum that the present invention obtains has the HAZ of 50-60 um scopes, significantly reduces routing
Camber；
（4）Cost is relatively low.
Specific embodiment
Embodiment 1
The compound bonding wire of electrum of the present embodiment includes cored wire, the palladium pre-plating layer being coated on outside cored wire and is coated on palladium
Gold plate outside pre-plating layer；The cored wire is by weight containing gold 70%, silver 30%；The thickness of the palladium pre-plating layer is 3nm；
The thickness of the gold plate is 120nm.
In the present embodiment, the manufacturing method of the compound bonding wire of electrum comprises the following steps：
（1）Founding：Gold and silver are mixed in proportion, continuously draws casting process by vacuum melting and orientation, obtains a diameter of 8 millimeters
Core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain a diameter of 15-40 um（Such as 20 um）Core
Line；
In drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As annealing atmosphere, annealing
Stove effective length is 1500mm, and annealing temperature is 600 DEG C, annealing rate 75m/min；
（3）Using electroplating technology in step（2）Palladium pre-plating layer is formed on the cored wire surface of acquisition, the thickness of palladium pre-plating layer is 3nm,
Obtain plating palladium line；
（4）Using electroplating technology in step（3）Gold plate is formed on obtained plating palladium line surface（Gold plate is by palladium pre-plating layer bag
It covers）, the thickness of gold plate is 120nm, obtains plating palladium plating gold thread；
（5）Finally anneal：Step（4）After the completion of plating, finally annealed to plating palladium plating gold thread, N is used in annealing process2
Come as annealing atmosphere, annealing furnace effective length is 800mm, and annealing temperature is 550 DEG C, annealing rate 80m/min；
（6）Cooling：After finally annealing, plating palladium plating gold thread is cooled to 25 DEG C, obtains the compound bonding of required electrum
Silk.
Above-mentioned steps（3）In electroplating technology（Plate palladium）Comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The cored wire of acquisition is immersed in acetone ethanol mixed liquor at a temperature of 90 °C,
It is 6 seconds to immerse the time, the organic matter on removing cored wire surface；The weight ratio of acetone and ethyl alcohol is in the acetone ethanol mixed liquor
1:8；
（3-2）Remove oxide process：The cored wire immersion temperature that will be handled by removing organic matter is 90 DEG C, weight percent is dense
It spends in the nitric acid for 40%, it is 6 seconds to immerse the time, the oxide on removing cored wire surface；
（3-3）Surface activation process：It is 90 DEG C, weight percent concentration by temperature is immersed by the cored wire of removing oxide process
It is 6 seconds in 20% sulfuric acid, to immerse the time, surface activation process is carried out to cored wire；
（3-4）Plate palladium：Cored wire Jing Guo surface activation process is immersed in plating palladium liquid, is plated under conditions of electroplating current is 0.4A
Palladium, forms the palladium pre-plating layer that thickness is 3nm on the surface of cored wire, which coats cored wire；
This step（3-4）In, the plating palladium liquid of use is the mixed solution of palladium sulfate, ammonium chloride and ammonium sulfate, wherein palladium sulfate
Concentration is 3g/L, and the concentration of ammonium chloride is 2g/L, and the concentration of ammonium sulfate is 2g/L；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the cored wire for being coated with palladium pre-plating layer；
（3-6）Drying：The water being attached in palladium preplating layer surface is blown away using air knife（Air knife air-flow is N2, flow velocity 12L/
min）；
When being electroplated, with the continuous release steps of the speed of 10m/min（2）The cored wire of acquisition, cored wire pass through above-mentioned removing successively
After organic matter processing, removing oxide process, surface activation process, plating palladium, cleaning and drying, plating palladium line and take-up are obtained.
Above-mentioned steps（4）In electroplating technology（It is gold-plated）Comprise the following steps：
（4-1）It is gold-plated：By step（3）The plating palladium line of acquisition is immersed in the gold plating liquid that concentration is 3g/L（Gold plating liquid is potassium auricyanide
Solution）, it is gold-plated under conditions of electroplating current is 0.6A, the gold plate that thickness is 120nm is formed on the surface of plating palladium line, it should
Gold plate coats palladium pre-plating layer；
（4-2）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the plating palladium line for being coated with gold plate；
（4-3）Drying：The water being attached on gold plate surface is blown away using air knife（Air knife air-flow is N2, flow velocity 10L/
min）；
When being electroplated, with the continuous release steps of the speed of 10m/min（3）The plating palladium line of acquisition, plating palladium line is successively by above-mentioned
After gold-plated, cleaning and drying, plating palladium plating gold thread and take-up are obtained.
Embodiment 2
The compound bonding wire of electrum of the present embodiment includes cored wire, the palladium pre-plating layer being coated on outside cored wire and is coated on palladium
Gold plate outside pre-plating layer；The cored wire is by weight containing gold 81%, silver 19%；The thickness of the palladium pre-plating layer is 1nm；
The thickness of the gold plate is 180nm.
In the present embodiment, the manufacturing method of the compound bonding wire of electrum comprises the following steps：
（1）Founding：Gold and silver are mixed in proportion, continuously draws casting process by vacuum melting and orientation, obtains a diameter of 7 millimeters
Core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain a diameter of 15-40 um（Such as 20 um）Core
Line；
In drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As annealing atmosphere, annealing
Stove effective length is 700mm, and annealing temperature is 800 DEG C, annealing rate 50m/min；
（3）Using electroplating technology in step（2）Palladium pre-plating layer is formed on the cored wire surface of acquisition, the thickness of palladium pre-plating layer is 1nm,
Obtain plating palladium line；
（4）Using electroplating technology in step（3）Gold plate is formed on obtained plating palladium line surface（Gold plate is by palladium pre-plating layer bag
It covers）, the thickness of gold plate is 180nm, obtains plating palladium plating gold thread；
（5）Finally anneal：Step（4）After the completion of plating, finally annealed to plating palladium plating gold thread, N is used in annealing process2
Come as annealing atmosphere, annealing furnace effective length is 1000mm, and annealing temperature is 350 DEG C, annealing rate 60m/min；
（6）Cooling：After finally annealing, plating palladium plating gold thread is cooled to 20 DEG C, obtains the compound bonding of required electrum
Silk.
Above-mentioned steps（3）In electroplating technology（Plate palladium）Comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The cored wire of acquisition is immersed in the acetone ethanol mixed liquor that temperature is 75 DEG C,
It is 7.5 seconds to immerse the time, the organic matter on removing cored wire surface；The weight ratio of acetone and ethyl alcohol in the acetone ethanol mixed liquor
For 1: 10；
（3-2）Remove oxide process：The cored wire immersion temperature that will be handled by removing organic matter is 75 DEG C, weight percent is dense
It spends in the nitric acid for 32%, it is 7.5 seconds to immerse the time, the oxide on removing cored wire surface；
（3-3）Surface activation process：It is 75 DEG C, weight percent concentration by temperature is immersed by the cored wire of removing oxide process
It is 7.5 seconds in 30% sulfuric acid, to immerse the time, surface activation process is carried out to cored wire；
（3-4）Plate palladium：Cored wire Jing Guo surface activation process is immersed in plating palladium liquid, is plated under conditions of electroplating current is 0.2A
Palladium, forms the palladium pre-plating layer that thickness is 1nm on the surface of cored wire, which coats cored wire；
This step（3-4）In, the plating palladium liquid of use is the mixed solution of palladium sulfate, ammonium chloride and ammonium sulfate, wherein palladium sulfate
Concentration is 1g/L, and the concentration of ammonium chloride is 4g/L, and the concentration of ammonium sulfate is 1g/L；
（3-5）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the cored wire for being coated with palladium pre-plating layer；
（3-6）Drying：The water being attached in palladium preplating layer surface is blown away using air knife（Air knife air-flow is N2, flow velocity 6L/
min）；
When being electroplated, with the continuous release steps of the speed of 6m/min（2）The cored wire of acquisition, cored wire pass through above-mentioned removing successively
After organic matter processing, removing oxide process, surface activation process, plating palladium, cleaning and drying, plating palladium line and take-up are obtained.
Above-mentioned steps（4）In electroplating technology（It is gold-plated）Comprise the following steps：
（4-1）It is gold-plated：By step（3）The plating palladium line of acquisition is immersed in the gold plating liquid that concentration is 4g/L（Gold plating liquid is potassium auricyanide
Solution）, it is gold-plated under conditions of electroplating current is 0.8A, the gold plate that thickness is 180nm is formed on the surface of plating palladium line, it should
Gold plate coats palladium pre-plating layer；
（4-2）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the plating palladium line for being coated with gold plate；
（4-3）Drying：The water being attached on gold plate surface is blown away using air knife（Air knife air-flow is N2, flow velocity 6L/
min）；
When being electroplated, with the continuous release steps of the speed of 6m/min（3）The plating palladium line of acquisition, plating palladium line is successively by above-mentioned
After gold-plated, cleaning and drying, plating palladium plating gold thread and take-up are obtained.
Embodiment 3
The compound bonding wire of electrum of the present embodiment includes cored wire, the palladium pre-plating layer being coated on outside cored wire and is coated on palladium
Gold plate outside pre-plating layer；The cored wire is by weight containing gold 52%, silver 48%；The thickness of the palladium pre-plating layer is 6nm；
The thickness of the gold plate is 20nm.
In the present embodiment, the manufacturing method of the compound bonding wire of electrum comprises the following steps：
（1）Founding：Gold and silver are mixed in proportion, continuously draws casting process by vacuum melting and orientation, obtains a diameter of 6 millimeters
Core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain a diameter of 15-40 um（Such as 20 um）Core
Line；
In drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As annealing atmosphere, annealing
Stove effective length is 2000mm, and annealing temperature is 500 DEG C, annealing rate 100m/min；
（3）Using electroplating technology in step（2）Palladium pre-plating layer is formed on the cored wire surface of acquisition, the thickness of palladium pre-plating layer is 6nm,
Obtain plating palladium line；
（4）Using electroplating technology in step（3）Gold plate is formed on obtained plating palladium line surface（Gold plate is by palladium pre-plating layer bag
It covers）, the thickness of gold plate is 20nm, obtains plating palladium plating gold thread；
（5）Finally anneal：Step（4）After the completion of plating, finally annealed to plating palladium plating gold thread, N is used in annealing process2
Come as annealing atmosphere, annealing furnace effective length is 600mm, and annealing temperature is 550 DEG C, annealing rate 60m/min；
（6）Cooling：After finally annealing, plating palladium plating gold thread is cooled to 30 DEG C, obtains the compound bonding of required electrum
Silk.
Above-mentioned steps（3）In electroplating technology（Plate palladium）Comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The cored wire of acquisition is immersed in the acetone ethanol mixed liquor that temperature is 145 DEG C,
It is 1.8 seconds to immerse the time, the organic matter on removing cored wire surface；The weight ratio of acetone and ethyl alcohol in the acetone ethanol mixed liquor
For 1:9；
（3-2）Remove oxide process：It is 145 DEG C, weight percent by temperature is immersed by the cored wire of removing organic matter processing
Concentration is in 50% nitric acid, and it is 1.8 seconds to immerse the time, the oxide on removing cored wire surface；
（3-3）Surface activation process：The cored wire immersion temperature that removing oxide process will be passed through is 145 DEG C, weight percent is dense
It spends in the sulfuric acid for 15%, it is 1.8 seconds to immerse the time, and surface activation process is carried out to cored wire；
（3-4）Plate palladium：Cored wire Jing Guo surface activation process is immersed in plating palladium liquid, is plated under conditions of electroplating current is 0.8A
Palladium, forms the palladium pre-plating layer that thickness is 6nm on the surface of cored wire, which coats cored wire；
This step（3-4）In, the plating palladium liquid of use is the mixed solution of palladium sulfate, ammonium chloride and ammonium sulfate, wherein palladium sulfate
Concentration is 4g/L, and the concentration of ammonium chloride is 2g/L, and the concentration of ammonium sulfate is 4g/L；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the cored wire for being coated with palladium pre-plating layer；
（3-6）Drying：The water being attached in palladium preplating layer surface is blown away using air knife（Air knife air-flow is N2, flow velocity 20L/
min）；
When being electroplated, with the continuous release steps of the speed of 30m/min（2）The cored wire of acquisition, cored wire pass through above-mentioned removing successively
After organic matter processing, removing oxide process, surface activation process, plating palladium, cleaning and drying, plating palladium line and take-up are obtained.
Above-mentioned steps（4）In electroplating technology（It is gold-plated）Comprise the following steps：
（4-1）It is gold-plated：By step（3）The plating palladium line of acquisition is immersed in the gold plating liquid that concentration is 2g/L（Gold plating liquid is potassium auricyanide
Solution）, it is gold-plated under conditions of electroplating current is 0.3A, the gold plate that thickness is 20nm is formed on the surface of plating palladium line, it should
Gold plate coats palladium pre-plating layer；
（4-2）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the plating palladium line for being coated with gold plate；
（4-3）Drying：The water being attached on gold plate surface is blown away using air knife（Air knife air-flow is N2, flow velocity 20L/
min）；
When being electroplated, with the continuous release steps of the speed of 30m/min（3）The plating palladium line of acquisition, plating palladium line is successively by above-mentioned
After gold-plated, cleaning and drying, plating palladium plating gold thread and take-up are obtained.
The above example 1-3 compound bonding wires of electrum obtained are tested for the property（Comparative example is used and bought in the market
Conventional 80%Au alloy gold wires）.
1st, the test method of HAZ length
Embodiment 1-3 and the wire rod of comparative example are subjected to the cutting of FIB (Focused Ion beam) focused ion beam, utilize SEM
(scanning electron microscopy) scanning electron microscope is observed, by comparing the crystal size of different wire positions
Variation, the length information of HAZ can be obtained.
2nd, ageing testing method
Obtained by embodiment 1-3 and comparative example wire rod in the difference of reliability mainly in thermal shock part.Specific degradation item
Part such as table 1.Experiment packing forms be LED encapsulation in SMD2835, BSOB routings, packaging silicon rubber use DOW CORNING OE6650,
For packaged sample after each thermal shock for completing 50 Xun Huans, seeing whether can also be electric bright, records the number for the dead lamp that fails.
Table 1
| Test condition | Duration (Hour)/bout (Cycle) |
| 305 alloy, 8 warm area standard circumfluence welds (265 DEG C) | 1 |
| - 40 DEG C of * 30min-100 DEG C * 30min (conversion time is less than 20 seconds) | 50/100/…/500 |
3rd, test method is vulcanized
The good sample lamp bead of embedding is positioned in closed container（Distil certain sulphur concentration）, 85 DEG C of constant temperature；One timing of vulcanization
Between after take out test light decay.
The performance test results are as shown in table 2.
Table 2
Note：Shape-changeable ball out of roundness number of non-compliances is the summation of the undesirable alternating compression ball of out of roundness and eccentric sphere.
Above-mentioned the performance test results show：
1st, the HAZ that the compound bonding wire of the electrum of 1-3 of the embodiment of the present invention obtains is less than the wire rod of comparative example, is conducive to low arc
The shaping of degree.
2nd, the soldered ball spherical shape of the compound bonding wire of the electrum of 1-3 of the embodiment of the present invention makes crystal grain refinement because of its alloying,
Ensure good balling-up.
3rd, the compound bonding wire of the electrum of 1-3 of the embodiment of the present invention is compared with comparative example, the reliability of lamp bead after bonding wire
It is promoted.
The compound bonding wire of electrum of 1-3 of the embodiment of the present invention is after the thermal shock of 450 Xun Huans, still without failure
Dead lamp situation；And has then there is the dead lamp that fails in comparative example（Comparative example can only be subjected to the thermal shock of 400 Xun Huans）.This illustrates this
The reliability higher of inventive technique wire rod.
4th, vulcanize
The compound bonding wire of the electrum of 1-3 of the embodiment of the present invention is tested by vulcanization, because of the effect of its coating, when light decay ability
Stablize below 18%；Better than comparative example light decay 25%.This illustrates that the sulfuration resistant ability of the technology of the present invention wire rod is stronger.
Claims (9)
1. a kind of compound bonding wire of electrum, it is characterised in that including cored wire, the palladium pre-plating layer being coated on outside cored wire and
The gold plate being coated on outside palladium pre-plating layer；The cored wire contains gold 51-82%, silver-colored 18-49% by weight；The palladium preplating
The thickness of layer is 1-6nm；The thickness of the gold plate is 20-200nm.
2. the manufacturing method of the compound bonding wire of electrum described in claim 1, it is characterised in that comprise the following steps：
（1）Founding：Gold and silver are mixed in proportion, continuously draw casting process by vacuum melting and orientation, obtains a diameter of 6-8 millis
The core wires of rice；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the cored wire of a diameter of 15-40 um；
（3）Using electroplating technology in step（2）Palladium pre-plating layer is formed on the cored wire surface of acquisition, the thickness of palladium pre-plating layer is 1-
6nm obtains plating palladium line；
（4）Using electroplating technology in step（3）Gold plate is formed on obtained plating palladium line surface, the thickness of gold plate is 20-
200nm obtains plating palladium plating gold thread；
（5）Finally anneal：Step（4）After the completion of plating, finally annealed to plating palladium plating gold thread, N is used in annealing process2
Come as annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate 60-
120m/min；
（6）Cooling：After finally annealing, plating palladium plating gold thread is cooled to 20-30 DEG C, obtains required electrum compound keys
Plying.
3. the manufacturing method of the compound bonding wire of electrum according to claim 2, it is characterized in that：Step（2）In wire drawing
In the process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As annealing atmosphere, annealing furnace effective length
For 600-2000mm, annealing temperature is 500-800 DEG C, annealing rate 30-100m/min.
4. the manufacturing method of the compound bonding wire of electrum according to Claims 2 or 3, it is characterised in that step（3）In
Electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The cored wire of acquisition immerses the acetone ethanol mixed liquor that temperature is 70-150 DEG C
In, it is 1.4-8 seconds to immerse the time, the organic matter on removing cored wire surface；The weight of acetone and ethyl alcohol in the acetone ethanol mixed liquor
Amount ratio is 1:5-10；
（3-2）Remove oxide process：It is 70-150 DEG C, weight percent by temperature is immersed by the cored wire of removing organic matter processing
Specific concentration is in the nitric acid of 30-50%, and it is 1.4-8 seconds to immerse the time, the oxide on removing cored wire surface；
（3-3）Surface activation process：It is 70-150 DEG C, weight percent by temperature is immersed by the cored wire of removing oxide process
Concentration is in the sulfuric acid of 10-30%, and it is 1.4-8 seconds to immerse the time, and surface activation process is carried out to cored wire；
（3-4）Plate palladium：Cored wire Jing Guo surface activation process is immersed in plating palladium liquid, in the condition that electroplating current is 0.2-0.8A
Lower plating palladium, forms the palladium pre-plating layer that thickness is 1-6nm on the surface of cored wire, which coats cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the cored wire for being coated with palladium pre-plating layer；
（3-6）Drying：The water being attached in palladium preplating layer surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（2）The cored wire of acquisition, cored wire is successively by above-mentioned de-
After organic matter processing, removing oxide process, surface activation process, plating palladium, cleaning and drying, plating palladium line and take-up are obtained.
5. the manufacturing method of the compound bonding wire of electrum according to claim 4, it is characterised in that：Step（3-4）In,
The plating palladium liquid of use is the mixed solution of palladium sulfate, ammonium chloride and ammonium sulfate, wherein the concentration of palladium sulfate be 1-4g/L, ammonium chloride
Concentration for 1-4g/L, the concentration of ammonium sulfate is 1-4g/L.
6. the manufacturing method of the compound bonding wire of electrum according to claim 4, it is characterised in that：Step（3-6）In,
Air knife air-flow is N2, flow velocity 5-20L/min.
7. the manufacturing method of the compound bonding wire of electrum according to Claims 2 or 3, it is characterised in that step（4）In
Electroplating technology comprise the following steps：
（4-1）It is gold-plated：By step（3）The plating palladium line of acquisition is immersed in the gold plating liquid that concentration is 2-4g/L, is in electroplating current
It is gold-plated under conditions of 0.2-0.8A, the gold plate that thickness is 20-200nm is formed on the surface of plating palladium line, the gold plate is by palladium
Pre-plating layer coats；
（4-2）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the plating palladium line for being coated with gold plate；
（4-3）Drying：The water being attached on gold plate surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（3）The plating palladium line of acquisition, plating palladium line is successively by upper
After stating gold-plated, cleaning and drying, plating palladium plating gold thread and take-up are obtained.
8. the manufacturing method of the compound bonding wire of electrum according to claim 7, it is characterised in that：Step（4-1）In,
The gold plating liquid of use is potassium auricyanide solution.
9. the manufacturing method of the compound bonding wire of electrum according to claim 7, it is characterised in that：Step（4-3）In,
Air knife air-flow is N2, flow velocity 5-20L/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711332222.3A CN108091632B (en) | 2017-12-13 | 2017-12-13 | Gold-silver alloy composite bonding wire and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711332222.3A CN108091632B (en) | 2017-12-13 | 2017-12-13 | Gold-silver alloy composite bonding wire and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108091632A true CN108091632A (en) | 2018-05-29 |
| CN108091632B CN108091632B (en) | 2020-04-14 |
Family
ID=62175659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711332222.3A Active CN108091632B (en) | 2017-12-13 | 2017-12-13 | Gold-silver alloy composite bonding wire and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108091632B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109457143A (en) * | 2018-10-30 | 2019-03-12 | 深圳粤通应用材料有限公司 | A kind of pure nickel plating palladium high-temperature electric conduction silk and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586830A (en) * | 2011-01-10 | 2012-07-18 | 深圳市奥美特科技有限公司 | Equipment and method for plating gold or plating palladium on surface of metal wire |
| CN103219249A (en) * | 2013-03-01 | 2013-07-24 | 溧阳市虹翔机械制造有限公司 | Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire |
| US20130233593A1 (en) * | 2012-03-12 | 2013-09-12 | Wire Technology Co., Ltd. | Composite wire of silver-palladium alloy coated with metallic thin film and method thereof |
| CN103681570A (en) * | 2013-12-05 | 2014-03-26 | 昆山矽格玛材料科技有限公司 | Bonding wire for packaging and preparing method of bonding wire |
-
2017
- 2017-12-13 CN CN201711332222.3A patent/CN108091632B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102586830A (en) * | 2011-01-10 | 2012-07-18 | 深圳市奥美特科技有限公司 | Equipment and method for plating gold or plating palladium on surface of metal wire |
| US20130233593A1 (en) * | 2012-03-12 | 2013-09-12 | Wire Technology Co., Ltd. | Composite wire of silver-palladium alloy coated with metallic thin film and method thereof |
| CN103219249A (en) * | 2013-03-01 | 2013-07-24 | 溧阳市虹翔机械制造有限公司 | Manufacturing method of palladium-plated gold-plated double-plating bonding copper wire |
| CN103681570A (en) * | 2013-12-05 | 2014-03-26 | 昆山矽格玛材料科技有限公司 | Bonding wire for packaging and preparing method of bonding wire |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109457143A (en) * | 2018-10-30 | 2019-03-12 | 深圳粤通应用材料有限公司 | A kind of pure nickel plating palladium high-temperature electric conduction silk and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108091632B (en) | 2020-04-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107665874A (en) | A kind of compound bonding wire of billon and its manufacture method for coating gold | |
| TWI647766B (en) | Bonding wire for semiconductor device | |
| TWI534835B (en) | Bonding wire and manufacturing method thereof | |
| CN108122877B (en) | Thin gold-copper alloy wire and method for manufacturing same | |
| JP7168779B2 (en) | Palladium-coated copper bonding wire, method for producing palladium-coated copper bonding wire, semiconductor device using the same, and method for producing the same | |
| CN1575512A (en) | Bonding wire | |
| WO2003081661A1 (en) | Bonding wire and integrated circuit device using the same | |
| CN102130067A (en) | Surface palladium-plated bonding brass wire | |
| JPWO2015163297A1 (en) | Bonding wires for semiconductor devices | |
| CN108922876B (en) | Gold alloy bonding wire and manufacturing method thereof | |
| JP2010245390A (en) | Bonding wire | |
| JP2004006740A (en) | Bonding wire and integrated circuit device using the same | |
| JP5109881B2 (en) | Copper bonding wire | |
| CN108823453A (en) | The low golden billon bonding wire of one kind and its manufacturing method | |
| CN108091632A (en) | The compound bonding wire of electrum and its manufacturing method | |
| CN108796285B (en) | Silver alloy bonding wire and manufacturing method thereof | |
| CN110718525B (en) | Insulating corrosion-resistant inorganic amorphous coating bonding wire and preparation method thereof | |
| CN108198795A (en) | A kind of compound bonding wire of gold-palladium silver alloy and its manufacturing method | |
| CN110117733A (en) | A kind of electrum bonding wire and its manufacturing method | |
| CN108091631A (en) | The compound bonding wire of billon and its manufacturing method with golden clad | |
| CN108231718A (en) | The compound bonding wire of gold and silver aluminium copper and its manufacturing method with golden clad | |
| TWI525726B (en) | Preparation method of package wire with skin layer and its finished product | |
| CN109390309A (en) | A kind of coated copper alloy wire in surface and its manufacturing method | |
| CN109637993A (en) | The coated copper bonding wire in surface and its manufacturing method | |
| CN109411438A (en) | A kind of copper alloy wire and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |