CN108084711A - A kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof - Google Patents
A kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof Download PDFInfo
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- CN108084711A CN108084711A CN201711446310.6A CN201711446310A CN108084711A CN 108084711 A CN108084711 A CN 108084711A CN 201711446310 A CN201711446310 A CN 201711446310A CN 108084711 A CN108084711 A CN 108084711A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
- C08L81/02—Polythioethers; Polythioether-ethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/04—Thermoplastic elastomer
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Abstract
The invention discloses a kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof, in parts by mass, including following raw material：Major ingredient：50~80 parts of polyphenylene sulfide, auxiliary material：10~50 parts of glass, 1~5 part of silane coupling agent, 3~15 parts of toughener, 0.3~3 part of antioxidant, 0.3~3 part of heat stabilizer.Beneficial effects of the present invention：The PPS special plastics of the present invention carry out each component preferred, wherein, toughener is optionally anhydride modified ethylene analog thermoplastic elastomer, optionally styrene analog thermoplastic elastomer and unsaturated epoxy copolymer, can not only increase toughness and impact strength, and can improve PPS special plastics polarity and PPS special plastics to the wetability of epoxy glue, so as to improve the cohesive force of the PPS special plastics and epoxy resin, meet process for filling colloid demand；Processing is optimized to each component content simultaneously, improves the mechanical performance and heat resistance of PPS special plastics.
Description
Technical field
The present invention relates to special plastic technical field more particularly to a kind of extraordinary modelings of PPS good with epoxy resin associativity
Material and preparation method thereof.
Background technology
Insulation encapsulated technology is exactly that liquid compound is poured into the device equipped with electronic component, circuit with mechanical or manual mode
In part, the thermosetting polymer insulating materials haveing excellent performance is solidified under room temperature or heating condition.
The globality of strengthening electronic device improves the resistance to external shock, vibrations；It improves between internal element, circuit
Insulation, is conducive to device miniaturization, lightweight；Element, circuit is avoided directly to expose, improves waterproof, the humidity resistance of device, and
Improve performance and steadiness parameter.
Because the properties of its epoxy resin are superior, the purposes of epoxy resin embedding adhesive is also quite extensively：Extensively should
For electronic components such as：Electronic transformer, anion generator, modular power source, high voltage package, Immersible pump in aquarium, relay, electricity
Appearance, ignition coil, mutual inductor, AC/DC modules, LED, LED module, AC capacitances, (vertical, horizontal, boxlike, film) capacitance, lamp
The insulation perfusions of all kinds of electronic components such as decorations, electric appliance, moisture-proof packing etc..
Epoxy insulation casting glue technical characteristic mainly has at following 5 points：
(1) by being broadly divided into two kinds for its difference composition, one kind is single-component epoxy casting glue；One kind is two-component ring
Oxygen casting glue.It can be divided into according to color transparent, black and milky etc. according to mixed proportion, generally there is 1:1,2:1,3:1 and black
The 4 of color:1 or 5:1 etc..Better than two-component casting glue in terms of its temperature tolerance of one-component and cementability, but because condition of cure and guarantor
The limitation use deposited must be extensive not as two-component.
(2) cure shrinkage is small, minimum in the shrinking percentage of adhesive epoxy resin glue, this is also that epoxide-resin glue uses
The reason for rate is higher.(phenolic resin：8~10%, organic siliconresin glue：6~8%, polyester resin glue 4~8%, epoxy resin
Glue：1~3%)
(3) chemical-resistance is good, and the ether, phenyl ring and fat hydroxyl in curing system are not easy to be corroded by soda acid.In sea
Water, oil, kerosene, 10%H2SO4, 10%HCl, 10%HAc, 10%NH3, 10%H3PO4And 30%Na2CO3In can use two
Year, and in 50%H2SO4And 10%HNO3Soak at room temperature half a year, it is constant that 100 DEG C of 10%NaOH impregnates a property retention in month.
(4) electrical insulating property is excellent, and the breakdown voltage of epoxy resin can be more than 35kV/mm
(5) processing performance is good, product size is stable, patience is good low with water absorption rate.
The advantages of bisphenol A type epoxy resin, is no doubt good, but also has its shortcoming：
(1) it is big to operate viscosity, this some aobvious in terms of construction is inconvenient
(2) impact strength is relatively low, more crisp.
(3) peel strength is low, and good resin is seldom with epoxy resin associativity, and common resin includes polyphenylene sulfide
(PPS), polybutylene terephthalate (PBT) (PBT) and polyethylene terephthalate (PET), nylon (polyamide 6, polyamides
Amine 66, high temperature nylon PPA etc.) after encapsulating curing, there are micro gap between resin and epoxy glue, cause to insulate and seal
Property it is inadequate, especially PPS lack active group, there was only 3MPa with the bonding viscosity of epoxy glue；
It, can be with strengthening electronic device with epoxy pouring sealant with continuous improvement of the electronic and electrical equipment to product requirement
Globality improves the resistance to external shock, vibrations；Improve internal element, insulate between circuit, be conducive to device miniaturization,
Lightweight；Element, circuit is avoided directly to expose, improves waterproof, the humidity resistance of device.Typical Representative therein is electrical appliance module
With diode etc..
The chemical name of PPS is polyphenylene sulfide or poly- to an aralkyl sulfid.The polyphenylene sulfide of line style is crystallinity
Polymer, chemical molecular formula are：
Since its strand is the rigid structure that is connected by phenyl ring through sulphur atom, the property with some uniquenesses
Can, it not only has the performance of general special plastic, but also has very high thermal stability, remarkable chemical resistance, well
Flame resistance, it is nontoxic.Can be molded with a variety of methods, and can precise forming, secondary operation can also be carried out to product, as high temperature resistant
The uses such as structural material and high-temperature insulation material.
PPS not only possesses excellent heat resistance and hardness, while molding shrinkage is low, and product creep resistant is good, ruler
Very little stability is good, in addition excellent insulation and heat-resisting quantity, this causes PPS to have inherent advantage in field of electronics.
However, unmodified PPS resin there are it is apparent the shortcomings that can not be directly combined with epoxy glue：
(1) there is no active group that can be reacted with epoxide group in PPS；(2) although PPS has good fluidity smooth surface
Advantage, but still cannot meet the requirement for being combined power by force between epoxy glue.Encapsulating technology material must solve disadvantages mentioned above,
Wherein, it is that wherein most critical is also a most difficult ring to solve resin and the cohesive force of epoxy glue.
The content of the invention
In view of this, present invention offer is a kind of can be used for encapsulating technology and the good PPS special plastics of epoxy glue associativity.It should
PPS can improve toughness, polarity, processing fluidity and the wetability of PPS resin, and PPS special plastics have good shock resistance
Intensity and heat resistance, and it is excellent with epoxy glue cohesive force, reach more than 30MPa, meet process for filling colloid demand.
The invention mesh of the present invention is achieved through the following technical solutions：
A kind of PPS special plastics being combined with epoxy glue, in parts by mass, including following raw material：
Major ingredient：50~80 parts of polyphenylene sulfide,
Auxiliary material：10~50 parts of glass, 1~5 part of silane coupling agent, 3~15 parts of toughener, 0.3~3 part of antioxidant, heat are steady
Determine 0.3~3 part of agent.
Toughener of the present invention is the reactive and non-reacted elasticator (elasticizer) with active hydrogen, including：Maleic acid
Acid anhydride is grafted compatilizer, such as maleic anhydride meets POE, EVA, SBS, EPDM, PE, ABS；Carboxyl liquid nitrile rubber, end carboxyl liquid
Body nitrile rubber, polysulfide rubber, polysulfones, polyimides etc.；Unsaturated epoxy copolymer, optional styrene analog thermoplastic elasticity
Body and optional anhydride modified styrene analog thermoplastic elastomer, can not only increase toughness and impact strength, Er Qieke
To improve the wetability of the polarity of PPS special plastics and PPS special plastics to epoxy glue, so as to improve the PPS special plastics
With the cohesive force of epoxy glue, meet process for filling colloid demand；Processing is optimized to each component content simultaneously, improves PPS special types
The mechanical performance and heat resistance of plastics and the cohesive force with epoxy glue.
Preferably, the anhydride modified ethylene analog thermoplastic elastomer is selected from anhydride modified styrene/ethylene/butylene/benzene
Ethylene block copolymer and/or anhydride modified styrene/ethylene/ethylene/propylene alkene block copolymer, optimization styrene/ethylene/fourth
Alkene/styrene-grafted copolymer-maleic anhydride.
Preferably, the styrene analog thermoplastic elastomer is selected from styrene/butadiene/styrene block copolymers, benzene
Ethylene/isoprene/styrene block copolymer, styrene/ethylene/butylene/styrene block copolymer or styrene/second
One kind or at least two mixture in alkene/ethylene/propylene alkene block copolymer, optimization styrene/ethylene/butylene/styrene
Block copolymer and/or styrene/ethylene/ethylene/propylene alkene block copolymer.
It is to be noted that："/" in present copolymer represents monomeric unit before and after difference, as phenylethylene/butadiene/
Styrene block copolymer is copolymerized copolymer obtained for styrene, butadiene and styrene.
The molecular conformation of styrenic thermoplastic elastomer has two kinds of linear topology structure and stelliform connection topology configuration.It is star-like embedding
The Mooney viscosity of section copolymer is more much higher than line-type block polymer, and tensile strength is more much higher than line-type block polymer,
Heat resistance is more suitable for the application scenario of rigors also above linear structure.Styrenic thermoplastic with hub-and-spoke configuration
Elastomer is PPS resin preferably toughener.
Anhydride modified styrenic thermoplastic elastomer can also effectively change PPS trees while to PPS resin toughening
Resin system has high reaction activity, polarity and middle strong acidity, and the polarity of resin can be improved while to material toughening, changes
Acid-base property can further increase to the wetability of epoxy resin under resin melt high temperature, so as to increase between epoxy resin
Cohesive force.The high reaction activity of anhydride functional group determines that it can form stabilization with the epoxy reaction in uncured epoxy glue
Chemical bond, which further enhances the cohesive force of PPS resin and epoxy glue contact interface.
The unsaturation epoxy copolymer is selected from the copolymer of aliphatic ethylene oxidic ester and/or being total to for glycidol ether
Polymers, preferred vinyl glycidyl ether copolymers, allyl glycidyl ether copolymer, the copolymerization of Malaysia acid glycidyl ester
Object, glycidyl methacrylate copolymer or one kind in glycidyl acrylate copolymer or at least two mixing
Object, further preferred glycidyl methacrylate copolymer；
Glycidyl methacrylate (GMA) and its copolymer have certain alkalescence and polarity, and the epoxy terminated height of GMA
Reactivity cause it become special plastic enhancing it is rigidity enhanced, modified in common compatilizer, the ester functional group in copolymer is at it
Resin polarity is improved, the acid-base property for changing resin while further improves the impact flexibility of PPS, suitable polarity and acid-base property
Be also beneficial to increase under resin melt high temperature to the wellability of epoxy resin surface and, it is viscous between epoxy resin so as to increase
Tie power.The high reaction activity of GMA functional groups determines that it can form stable chemical bond with the epoxy group in uncured epoxy glue,
The process further enhances the cohesive force of resin and epoxide resin material contact interface, glycidyl methacrylate
(GMA) copolymer becomes the preferred compatibility toughener of resin in process for filling colloid.
Preferably, the PPS resin is straight chain type or cross-linking type PPS resin, under the conditions of 305 DEG C/5Kg MFR for 20~
500g/10min, preferably 50~350g/10min.MFR is excessively high, and the mechanical property of PPS resin is inadequate；MFR is too low, processing performance
Difference, it is poor to the covering property of the fillers such as glass.
Preferably, the glass fibre is long fibre and/or chopped strand, is preferably the chopped strand of 3~7mm；
After extruding pelletization, the glass fibre average length is 20~500 μm, is preferably 40~350 μm, further preferably
For 60~280 μm；The avarage fiber diameter of the glass fibre is 5~15 μm, is preferably 9~15 μm, in the present invention, average fibre
Tie up a diameter of weight average fiber diameter.
The present invention adds in glass fibre, improves heat resistance and mechanical property (such as tensile strength, bending strength, notch punching
Hit intensity), reduce shrinking percentage.The molding shrinkage of material can be greatly lowered in the present invention.
Preferably, the silane coupling agent is Y- chloropropyl triethoxysilanes (such as KH550, A1100), Y- (2,3-
The third oxygen of epoxy) in propyl trimethoxy silicon (such as KH560) or Y- (methacryloxypropyl) propyltrimethoxy silane (such as KH570)
A kind of at least two mixture.
Preferably, the antioxidant is selected from Hinered phenols antioxidant and/or phosphite ester kind antioxidant；
Preferably, the heat stabilizer is made of metallic compound and UV absorbers；
Preferably, the UV absorbers are benzophenone type ultraviolet light absorber and/or benzotriazole ultraviolet light
Absorbent is preferably benzotriazole UV absorbers；
Preferably, the colorant is selected from the inorganic toner of SUNCHEM series.
Another aspect of the present invention provides a kind of preparation method of above-mentioned PPS special plastics, and the preparation method is common using melting
Mixed means are modified PPS resin, can improve PPS special plastics toughness, polarity, processing fluidity and wetability and
Cohesive force between its PPS special plastic and epoxy glue so that modified PPS resin meets the requirement of encapsulating technical matters.
A kind of preparation method of the PPS special plastic good with connecting property of epoxy glue comprises the following steps：
(1) in parts by mass, by 50~80 parts of PPS resin, 3~15 parts of toughener, 0.3~3 part of antioxidant, heat stabilizer
0.3~3 part and 0~5 part of premixing of colorant uniformly obtain mixture；
(2) 10~50 parts of the mixture and glass fibre are put into extruder, carries out melt blending and extrusion is made
Grain, is made the PPS special plastics for encapsulating technology.
Preferably, in step (2), the heating temperature of the extruder is as follows：One 160~220 DEG C of area, two areas 210~240
DEG C, 230~280 DEG C of 3rd area, 230~280 DEG C of 4th area, 230~280 DEG C of 5th area, 230~290 DEG C of 6th area and head 240~270
℃。
Beneficial effects of the present invention：The PPS special plastics of the present invention carry out preferably each component, wherein, toughener is to appoint
The anhydride modified ethylene analog thermoplastic elastomer of selection of land, optionally styrene analog thermoplastic elastomer and unsaturation are epoxy copolymerized
Object can not only increase toughness and impact strength, but also can improve the polarity of PPS special plastics and PPS special plastics pair
The wetability of epoxy glue so as to improve the cohesive force of the PPS special plastics and epoxy resin, meets process for filling colloid demand；Together
When processing is optimized to each component content, improve the mechanical performance and heat resistance of PPS special plastics.
Description of the drawings
Fig. 1 is process for filling colloid flow chart；
Fig. 2 is the process flow chart of the present invention；
Fig. 3 is the moulding material test bars of the present invention.
Specific embodiment
The technical solution further illustrated the present invention with reference to specific embodiment.
Embodiment 1：The PPS special plastic good with epoxy resin associativity for encapsulating technology of the present embodiment, by matter
Part meter is measured, including following components：
50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, 2 parts of silane coupling agent, colorant 1
Part, 45 parts of glass.
Wherein, toughener is styrenic thermoplastic elastomer, and antioxidant is polynary hindered phenol and phosphite ester.
The above-mentioned PPS special plastic preparation method good with epoxy resin associativity is as follows：
In parts by mass, by 50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, silane coupled
2 parts of agent and 1 part of premixing of colorant uniformly obtain mixture, and 45 parts of the mixture and glass fibre are put into extruder
In, melt blending and extruding pelletization are carried out, the PPS special plastics for encapsulating technology are made.
Preparation method of the present embodiment for the PPS special plastics of encapsulating technology is same as Example 1.
Embodiment 2：The PPS special plastic good with epoxy resin associativity for encapsulating technology of the present embodiment, by matter
Part meter is measured, including following components：
50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, 2 parts of silane coupling agent, colorant 1
Part, 45 parts of glass.
Wherein, toughener is styrenic thermoplastic elastomer and GMA, GMA are toughener gross mass 20%, and antioxidant is
Polynary hindered phenol and phosphite ester.
Preparation method and implementation of the present embodiment for the PPS special plastic good with epoxy resin associativity of encapsulating technology
Example 1 is identical.
Embodiment 3：The PPS special plastic good with epoxy resin associativity for encapsulating technology of the present embodiment, by matter
Part meter is measured, including following components：
50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, 2 parts of silane coupling agent, colorant 1
Part, 45 parts of glass.
Wherein, toughener is that toughener is styrenic thermoplastic elastomer and GMA, and GMA is the 50% of toughener gross mass,
Antioxidant is polynary hindered phenol and phosphite ester.
Preparation method of the present embodiment for the PPS special plastics of encapsulating technology is same as Example 1.
Embodiment 4：The PPS special plastic good with epoxy resin associativity for encapsulating technology of the present embodiment, by matter
Part meter is measured, including following components：
50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, 2 parts of silane coupling agent, colorant 1
Part, 45 parts of glass.
Wherein, wherein, toughener is that toughener is styrenic thermoplastic elastomer and GMA, and GMA is toughener gross mass
80%, antioxidant is polynary hindered phenol and phosphite ester.
Preparation method of the present embodiment for the PPS special plastics of encapsulating technology is same as Example 1.
Embodiment 5：The PPS special plastic good with epoxy resin associativity for encapsulating technology of the present embodiment, by matter
Part meter is measured, including following components：
50 parts of PPS resin, 3 parts of toughener, 0.3 part of antioxidant, 0.3 part of heat stabilizer, 2 parts of silane coupling agent, colorant 1
Part, 45 parts of glass.
Wherein, wherein, toughener is that toughener is GMA, and antioxidant is polynary hindered phenol and phosphite ester.
Preparation method and implementation of the present embodiment for the PPS special plastic good with epoxy resin associativity of encapsulating technology
Example 1 is identical.
Performance test：Following performance test is carried out by Examples 1 to 5, to PPS special plastics obtained, as a result such as following table：
Wherein, (i.e. with the cohesive force of epoxy resin or with reference to power), standard is as follows for pulling capacity test：Moulding material test specimens
Item is injection moulded with injection molding machine, and batten size (unit mm) is 170*10*4, and batten is with epoxy resin interface bonding size
300mm2, as shown in Figure 3, utilize universal tensile testing machine carry out pulling capacity test, it follows that data can be used as judge
Bonding force size between exemplar and epoxy resin part.
By upper table it can be seen that：
Compared with Example 1, processing, the stretching of PPS special plastics obtained are optimized in embodiment 2 to constituent content
Intensity and the PPS special plastics being above with the cohesive force of epoxy in embodiment 1, it is seen then that its performance is further enhanced；
Compared with comparative example 2, the toughener added in embodiment 3 is GMA, and GMA is the 50% of toughener gross mass, is made
The mechanical performances of PPS special plastics significantly improve, especially the cohesive force with epoxy resin is increased dramatically, and reaches 30MPa,
Meet process for filling colloid requirement；
Compared with Example 3, the toughener added in embodiment 4 is styrenic thermoplastic elastomer and GMA, GMA are to increase
The 80% of tough dose of gross mass, the mechanical performance of PPS special plastics obtained significantly improve, and especially the cohesive force with epoxy resin obtains
To being substantially improved, reach 35MPa, meet process for filling colloid requirement；
Compared with Example 4, the toughener added in embodiment 5 be GMA, the mechanical performance of PPS special plastics obtained
It significantly improves, is especially further promoted with the cohesive force of epoxy resin, reach 37MPa, meet process for filling colloid requirement.
For the cohesive force of process for filling colloid requirement and epoxy resin in more than 25MPa, the present invention is used for the PPS special types of encapsulating technology
The cohesive force of plastics and epoxy resin is excellent, and pulling capacity is even up to 37MPa, meets process for filling colloid demand；Have simultaneously good
Mechanical performance and heat resistance, up to 310 DEG C of Shooting Technique can be met；Can freely it match somebody with somebody due to the use of colorant
Color, such as white, black, colour and iridescent.
It should be noted that and understand, do not departing from the spirit and scope of appended claims the present invention for required protection
In the case of, various modifications and improvements can be made to the present invention of foregoing detailed description.It is therefore desirable to the technical solution of protection
Scope from given any specific exemplary teachings limitation.
Applicant states that the present invention illustrates the detailed process equipment of the present invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological processes, that is, it is above-mentioned detailed not mean that the present invention has to rely on
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
The addition of equivalence replacement and auxiliary element to each raw material of product of the present invention, selection of concrete mode etc. all fall within the present invention's
Within protection domain and the open scope.
Claims (14)
1. a kind of PPS special plastics being combined with epoxy glue, it is characterised in that：In parts by mass, including following raw material：
Major ingredient：50~80 parts of polyphenylene sulfide,
Auxiliary material：10~50 parts of glass fibre, 1~5 part of silane coupling agent, 3~15 parts of toughener, 0.3~3 part of antioxidant, heat are steady
Determine 0.3~3 part of agent.
2. a kind of PPS special plastics being combined with epoxy glue according to claim 1, it is characterised in that：The increasing
Tough dose is the reactive and non-reacted elasticator (elasticizer) with active hydrogen, including：Maleic anhydride grafting compatilizer, carboxyl liquid fourth
Nitrile rubber, carboxyl end of the liquid acrylonitrile-butadiene rubber, polysulfide rubber, polysulfones, polyimides, unsaturated epoxy copolymer, optional benzene second
Ethylenic thermoplastic elastomer and optional anhydride modified styrene analog thermoplastic elastomer.
3. a kind of PPS special plastics being combined with epoxy glue according to claim 2, it is characterised in that：The acid anhydrides
Ethene improved analog thermoplastic elastomer is selected from anhydride modified styrene/ethylene/butylene/styrene block copolymer and/or acid anhydrides
Modified phenylethylene/ethylene/vinyl/propylene-based block copolymer.
4. a kind of PPS special plastics being combined with epoxy glue according to claim 3, it is characterised in that：The acid anhydrides
Ethene improved analog thermoplastic elastomer is selected from styrene/ethylene/butylene/styrene grafted maleic anhydride copolymer.
5. a kind of PPS special plastics being combined with epoxy glue according to claim 2, it is characterised in that：The benzene second
Ethylenic thermoplastic elastomer is selected from styrene/butadiene/styrene block copolymers, styrene/isoprene/styrene block
In copolymer, styrene/ethylene/butylene/styrene block copolymer or styrene/ethylene/ethylene/propylene alkene block copolymer
It is a kind of or at least two mixture.
6. a kind of PPS special plastics being combined with epoxy glue according to claim 5, it is characterised in that：The benzene second
Ethylenic thermoplastic elastomer is selected from styrene/ethylene/butylene/styrene block copolymer and/or styrene/ethylene/ethylene/propylene
Alkene block copolymer.
7. a kind of PPS special plastics being combined with epoxy glue according to claim 2, it is characterised in that：It is aliphatic
The copolymer of ethylene oxidic ester and/or the copolymer of glycidol ether.
8. a kind of PPS special plastics being combined with epoxy glue according to claim 7, it is characterised in that：The insatiable hunger
Vinyl glycidyl ether copolymer, allyl glycidyl ether copolymer, Malaysia acid glycidyl are selected from epoxy copolymerized object
Ester copolymer, glycidyl methacrylate copolymer or one kind in glycidyl acrylate copolymer or at least two
Mixture.
9. a kind of PPS special plastics being combined with epoxy glue according to claim 1, it is characterised in that：Straight chain type or
Cross-linking type PPS resin, MFR is 20~500g/10min under the conditions of 305 DEG C/5Kg.
10. a kind of PPS special plastics being combined with epoxy glue according to claim 9, it is characterised in that：The polyphenyl
The MFR of sulfide resin is 50~350g/10min.
11. a kind of PPS special plastics being combined with epoxy glue according to claim 1, it is characterised in that：The glass
Fiber is the chopped strand of 3~7mm.
12. a kind of PPS special plastics being combined with epoxy glue according to claim 1, it is characterised in that：The silane
Class coupling agent is Y- chloropropyl triethoxysilanes (such as KH550, A1100), Y- (2,3- the third oxygen of epoxy) propyl trimethoxy silicon
A kind of at least two mixture in (such as KH560) or Y- (methacryloxypropyl) propyltrimethoxy silane (such as KH570).
13. a kind of PPS special plastics being combined with epoxy glue according to claim 1, it is characterised in that：The antioxygen
Agent is selected from Hinered phenols antioxidant and/or phosphite ester kind antioxidant；
The heat stabilizer is made of metallic compound and UV absorbers；Wherein, UV absorbers are benzophenone
UV absorbers and/or benzotriazole UV absorbers.
14. right one of to go 1-13 arbitrary described in the PPS special plastic good with connecting property of epoxy glue preparation method, feature
It is：Comprise the following steps：
(1) in parts by mass, by 50~80 parts of PPS resin, 3~15 parts of toughener, 0.3~3 part of antioxidant, heat stabilizer 0.3
~3 parts and 0~5 part of premixing of colorant uniformly obtain mixture；
(2) 10~50 parts of the mixture and glass fibre are put into extruder, carries out melt blending and extruding pelletization, system
It must be used for the PPS special plastics of encapsulating technology；The heating temperature of the extruder is as follows：One 160~220 DEG C of area, two areas 210~
240 DEG C, 230~280 DEG C of 3rd area, 230~280 DEG C of 4th area, 230~280 DEG C of 5th area, 230~290 DEG C of 6th area and head 240~
270℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711446310.6A CN108084711A (en) | 2017-12-27 | 2017-12-27 | A kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711446310.6A CN108084711A (en) | 2017-12-27 | 2017-12-27 | A kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof |
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| CN108084711A true CN108084711A (en) | 2018-05-29 |
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| CN201711446310.6A Pending CN108084711A (en) | 2017-12-27 | 2017-12-27 | A kind of and good PPS special plastics of epoxy glue associativity and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112063334A (en) * | 2020-09-09 | 2020-12-11 | 江苏艾森半导体材料股份有限公司 | Modified polyphenylene sulfide light diffusant for LED epoxy encapsulation and preparation method thereof |
| CN112852157A (en) * | 2020-12-30 | 2021-05-28 | 上海聚威新材料股份有限公司 | Conductive PPS composite material with good epoxy adhesive force and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104845369A (en) * | 2015-05-11 | 2015-08-19 | 深圳华力兴新材料股份有限公司 | Hyperbranched resin-toughened PPS (polyphenylene sulfite) engineering plastic and preparation method thereof |
| CN104910623A (en) * | 2015-05-11 | 2015-09-16 | 深圳华力兴新材料股份有限公司 | PPS engineering plastic for NMT technology, and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104845369A (en) * | 2015-05-11 | 2015-08-19 | 深圳华力兴新材料股份有限公司 | Hyperbranched resin-toughened PPS (polyphenylene sulfite) engineering plastic and preparation method thereof |
| CN104910623A (en) * | 2015-05-11 | 2015-09-16 | 深圳华力兴新材料股份有限公司 | PPS engineering plastic for NMT technology, and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112063334A (en) * | 2020-09-09 | 2020-12-11 | 江苏艾森半导体材料股份有限公司 | Modified polyphenylene sulfide light diffusant for LED epoxy encapsulation and preparation method thereof |
| CN112063334B (en) * | 2020-09-09 | 2021-10-08 | 江苏艾森半导体材料股份有限公司 | Modified polyphenylene sulfide light diffusant for LED epoxy encapsulation and preparation method thereof |
| CN112852157A (en) * | 2020-12-30 | 2021-05-28 | 上海聚威新材料股份有限公司 | Conductive PPS composite material with good epoxy adhesive force and preparation method thereof |
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Application publication date: 20180529 |