CN108083804B - 一种高导电石墨滑块及其制备方法 - Google Patents

一种高导电石墨滑块及其制备方法 Download PDF

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CN108083804B
CN108083804B CN201711363509.2A CN201711363509A CN108083804B CN 108083804 B CN108083804 B CN 108083804B CN 201711363509 A CN201711363509 A CN 201711363509A CN 108083804 B CN108083804 B CN 108083804B
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吴沣
陈文来
梁冉
杜国强
康进才
王志强
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Henan Kaitan new material design and Research Institute Co., Ltd
Kaifeng Pingmei new carbon material technology Co., Ltd
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Abstract

本发明属于石墨制品技术领域,涉及一种高导电石墨滑块及其制备方法。该高导电石墨滑块由以下质量百分比的原料制成:镀铜石墨粉与镀铜焦粉的混合物69‑99.5%、石墨粉0‑5%、导电炭黑0‑3%、改质沥青或酚醛树脂0‑30%、硬脂酸0.5‑2%。本发明采用镀铜焦粉和镀铜石墨粉的配合使用可以根据需求调节石墨滑块的导电性和耐磨性。

Description

一种高导电石墨滑块及其制备方法
技术领域
本发明属于石墨制品技术领域,涉及一种高导电石墨滑块及其制备方法。
背景技术
高性能的滑动导电材料在电力机车受电弓滑板、发电机、电动机电刷和滑动电触头等电接触领域有广阔的应用前景。滑动导电材料作为一种滑动接触件,在许多电气设备中得到广泛的应用。滑动导电材料的材质主要有焦炭、石墨、浸脂石墨、金属( 含铜,银) 石墨,在不同的应用场合其强度、硬度等要求也不一样,但是高导电性、高耐磨性是该类型滑块的共同要求。
现有的技术条件下生产的导电滑块主要材质为碳或石墨,这也决定了该类滑块的耐磨性较差,因此人们普遍通过加入复合材料提高来提高其耐磨性。其中,有通过加入沥青、高分子树脂或其他金属等来改善其整体的耐磨性的方式。目前国内最经常使用的材料是石墨-金属复合材料,主要采用传统的粉末冶金方法制备,即将金属粉、石墨粉(焦炭粉)和少量添加元素(如能提高流动烧结性的铅、锡、镍等低熔点金属)混合均匀后烧结而成。但是该方法制得的石墨-金属复合材料中金属相呈独立的岛屿状分布,不利于金属导电性能的发挥,同时不利于改善石墨-金属复合材料的滑动磨损性能。因此,如何获得导电性能良好同时耐磨性良好的滑动导电材料是目前本领域的研究方向。
发明内容
有鉴于此,本发明的目的在于提供一种同时具有良好的导电性能和耐磨性能的石墨滑块,同时本发明还提供该石墨滑块的制备方法。。
本发明所采用的技术方案为:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉与镀铜焦粉的混合物69-99.5%、石墨粉0-5%、导电炭黑0-3%、改质沥青或酚醛树脂0-30%、硬脂酸0.5-2%。
进一步优选,高导电石墨滑块由以下质量百分比的原料制成:镀铜石墨粉与镀铜焦粉的混合物75-90%、石墨粉2-5%、导电炭黑2-3%、改质沥青或酚醛树脂5-30%、硬脂酸0.5-2%。
镀铜石墨粉与镀铜焦粉的混合物中镀铜石墨粉与镀铜焦粉的比例为1:0-0:1。
所述镀铜石墨粉中铜含量30-50wt%,粒度100目以下;所述镀铜焦粉中铜含量30-50wt%,粒度100目以下。最佳镀铜石墨粉中铜含量40 wt%,最佳镀铜焦粉中铜含量40wt%。
制备高导电石墨滑块的方法,采用方法A或方法B制得,方法A包括以下步骤:1)将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行混捏,然后加入改质沥青或酚醛树脂湿混,再加入硬脂酸混捏,出糊料,糊料经过模压或挤压后焙烧,焙烧品加工成需要的外形即得成品;
当原料不含有石墨粉、导电炭黑、改质沥青或酚醛树时采用方法B,方法B包括以下步骤:将镀铜焦粉、镀铜石墨粉及硬脂酸按比例干混,将干混好的干料加入到模具内模压,模压后的生坯进行焙烧,焙烧品加工成需要的外形即得成品。
方法A中,混捏时至少30min,混捏温度150-175℃,加入改质沥青或酚醛树脂湿混时至少30min,加入硬脂酸混捏时至少10min,模压时压强200-300MPa,挤压时压强100 -200MPa,焙烧温度800-1000℃,焙烧时间1-1.5h。
方法B中,干混时1-2h,模压时压强300-400MPa,焙烧温度800-1000℃,焙烧时间1-1.5h。
本发明的高导电石墨滑块的主要原料采用镀铜焦粉和镀铜石墨粉的配合使用可以根据需求调节石墨滑块的导电性和耐磨性。具体在调节时,随着镀铜石墨粉含量的增加,高导电石墨滑块的导电性能增强、硬度减小,随着镀铜焦粉含量的增加,高导电石墨滑块的硬度增大,导电性能有所减弱。那么可以根据不同场合的需求来调整含量,如果需要导电性能优越的炭质滑块,增大镀铜石墨粉含量,如果需要硬度较大的石墨滑块,则增大镀铜焦粉的含量,最终通过调整镀铜焦粉和镀铜石墨粉的含量,可以调整生产的石墨滑块的肖氏硬度在10-90之间变化,可以调整石墨滑块的电阻率最低为2μΩ·m。当产品对耐磨性能要求比较高时,则加入石墨粉和导电炭黑,可在原来的基础上增大石墨滑块耐磨性,以满足产品的需求。
最终本发明的高导电石墨滑块采用了镀铜焦粉和/或镀铜石墨粉作为主要原料,可以使导电石墨滑块中金属相分布均匀且形成连续的三维网络状结构,金属相的导电性和石墨相的自润滑性能都能得到有效地发挥,采用镀金属的石墨(焦炭)作为制备高性能导电滑块的主要原料可以很好的实现制备高性能导电滑块的目标。
具体实施方式
下面结合实施例来说明本发明的具体实施方式,但以下实施例只是用来详细说明本发明,并不以任何方式限制本发明的范围。
以下实施例中所使用的镀铜石墨粉中铜含量40wt%,粒度100目以下,所使用的镀铜焦粉中铜含量40wt%,粒度100目以下。
实施例1:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉40%、镀铜焦粉59.5%、硬脂酸0.5%。
镀铜石墨粉中铜含量30wt%,粒度100目以下,所使用的镀铜焦粉中铜含量30wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时,包括以下步骤:将镀铜焦粉、镀铜石墨粉及硬脂酸按比例干混1.5h,将干混好的干料加入到模具内350MPa模压,模压后的生坯进行焙烧,焙烧温度900℃,焙烧时间1.5h,焙烧品加工成需要的外形即得成品。
实施例2:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉30%、镀铜焦粉60.5%、石墨粉2%、导电炭黑2%、改质沥青或酚醛树脂5%、硬脂酸0.5%。镀铜石墨粉中铜含量40wt%,粒度100目以下,所使用的镀铜焦粉中铜含量40wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时,包括以下步骤:1)将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行30min混捏,混捏温度150℃,然后加入改质沥青或酚醛树脂湿混30min,再加入硬脂酸混捏10min,出糊料,糊料经过200MPa模压后焙烧,焙烧温度800℃,焙烧时间1.5h,焙烧品加工成需要的外形即得成品
实施例3:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉40%、镀铜焦粉41%、石墨粉5%、导电炭黑3%、改质沥青或酚醛树脂10%、硬脂酸1%。镀铜石墨粉中铜含量50wt%,粒度100目以下,所使用的镀铜焦粉中铜含量50wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时,包括以下步骤:1)将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行40min混捏,混捏温度175℃,然后加入改质沥青或酚醛树脂湿混40min,再加入硬脂酸混捏15min,出糊料,糊料经过300MPa模压后焙烧,焙烧温度1000℃,焙烧时间1h,焙烧品加工成需要的外形即得成品。
实施例4:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉10%、镀铜焦粉59%、石墨粉1%、导电炭黑1%、改质沥青或酚醛树脂27.5%、硬脂酸1.5%。镀铜石墨粉中铜含量40wt%,粒度100目以下,所使用的镀铜焦粉中铜含量40wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时,包括以下步骤:1)将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行30min混捏,混捏温度160℃,然后加入改质沥青或酚醛树脂湿混30min,再加入硬脂酸混捏10min,出糊料,糊料经过100MPa挤压后焙烧,焙烧温度900℃,焙烧时间1h,焙烧品加工成需要的外形即得成品。
实施例5:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉62%、镀铜焦粉10%、石墨粉4%、导电炭黑2%、改质沥青或酚醛树脂20%、硬脂酸2%。镀铜石墨粉中铜含量30wt%,粒度100目以下,所使用的镀铜焦粉中铜含量30wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时,包括以下步骤:1)将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行30min混捏,混捏温度170℃,然后加入改质沥青或酚醛树脂湿混30min,再加入硬脂酸混捏10min,出糊料,糊料经过200MPa挤压后焙烧,焙烧温度850℃,焙烧时间1h,焙烧品加工成需要的外形即得成品。
实施例6:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜石墨粉81%、石墨粉5%、导电炭黑3%、改质沥青或酚醛树脂10%、硬脂酸1%。镀铜石墨粉中铜含量50wt%,粒度100目以下,所使用的镀铜焦粉中铜含量50wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时步骤同实施例2。
实施例7:
一种高导电石墨滑块,由以下质量百分比的原料制成:镀铜焦粉72%、石墨粉4%、导电炭黑2%、改质沥青或酚醛树脂20%、硬脂酸2%。
镀铜石墨粉中铜含量40wt%,粒度100目以下,所使用的镀铜焦粉中铜含量40wt%,粒度100目以下。
本实施例的高导电石墨滑块制备时步骤同实施例4。
采用行业标准方法对实施例1-7制得的高导电石墨滑块的肖氏硬度和电阻率进行检测,检测结果如下表:
Figure DEST_PATH_IMAGE001
以上检验结果表明,采用本发明的方法所制得的高导电石墨滑块的性能完全符合产品的要求,最低导电率可以达到2μΩ·m,肖氏硬度最高可达90,根据实际产品的需求,可以调整镀铜焦粉、镀铜石墨粉的比例来调整产品的导电性能和耐磨性能。
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,本领域普通技术人员对本发明的技术方案所做的其他修改或者等同替换,只要不脱离本发明技术方案的精神和范围,均应涵盖在本发明的权利要求范围当中。

Claims (3)

1.一种高导电石墨滑块的制备方法,由以下质量百分比的原料制成:镀铜石墨粉与镀铜焦粉的混合物75-90%、石墨粉2-5%、导电炭黑2-3%、改质沥青或酚醛树脂5-10%、硬脂酸0.5-2%,其特征在于,所述混合物中镀铜石墨粉与镀铜焦粉的质量百分比为(30:60.5)—(40:41),包括以下步骤:将镀铜焦粉、镀铜石墨粉、石墨粉及导电炭黑按比例进行混捏,然后加入改质沥青或酚醛树脂湿混,再加入硬脂酸混捏,出糊料,糊料经过模压或挤压后焙烧,模压时压强200-300MPa,挤压时压强100 -200MPa,焙烧温度800-1000℃,焙烧时间1-1.5h,焙烧品加工成需要的外形即得成品。
2.根据权利要求1所述高导电石墨滑块的制备方法,其特征在于:所述镀铜石墨粉中铜含量40wt%,粒度100目以下;所述镀铜焦粉中铜含量40wt%,粒度100目以下。
3.根据权利要求1或2所述高导电石墨滑块的制备方法,其特征在于:混捏时至少30min,混捏温度150-175℃,加入改质沥青或酚醛树脂湿混时至少30min,加入硬脂酸混捏时至少10min。
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