CN108074852B - Buffer table for unloading printing machine - Google Patents
Buffer table for unloading printing machine Download PDFInfo
- Publication number
- CN108074852B CN108074852B CN201711307348.5A CN201711307348A CN108074852B CN 108074852 B CN108074852 B CN 108074852B CN 201711307348 A CN201711307348 A CN 201711307348A CN 108074852 B CN108074852 B CN 108074852B
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- frame
- silicon wafer
- unloading
- wafer storage
- baffle
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 92
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 92
- 239000010703 silicon Substances 0.000 claims abstract description 92
- 235000012431 wafers Nutrition 0.000 claims abstract description 87
- 238000003860 storage Methods 0.000 claims abstract description 39
- 230000007246 mechanism Effects 0.000 claims abstract description 27
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 23
- 230000005540 biological transmission Effects 0.000 claims description 4
- 230000001939 inductive effect Effects 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 239000003814 drug Substances 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Screen Printers (AREA)
Abstract
The invention aims to solve the technical problem of providing a buffer table for unloading a printing machine, which can improve the production continuity of the printing machine, improve the production efficiency and reduce the production cost. The automatic feeding and discharging device comprises a frame (3) positioned at the front end of a feeding and discharging machine (2) of a printing machine (1), wherein a cover plate (4) is arranged at the top of the frame (3), and two exhaust openings (5) are formed in the cover plate (4); four sides of the upper part of the frame (3) are provided with baffle plates (6), wherein the baffle plates (6) positioned on the front side and the rear side are respectively provided with a feed inlet (7) and a discharge outlet (8), the feed inlet (7) corresponds to the discharge end of the printing machine (1), and the discharge outlet (8) corresponds to the feed end of the blanking machine (2); a driving mechanism for driving the silicon wafer storage rack (9) to slide up and down is arranged on the frame (3) below the silicon wafer storage rack (9); the inner side of the baffle plate (6) provided with the feed inlet (7) is provided with a receiving and feeding mechanism for receiving and sending out silicon wafers.
Description
Technical Field
The invention relates to the technical field of photovoltaic cell production, in particular to a buffer table for unloading a printer for producing photovoltaic cells and silicon wafers.
Background
In the process of printing the photovoltaic cell silicon wafer on a printing machine (also called an etching machine), the blanking machine is required to be used for blanking after the printing is finished, but in the production process, once the printing machine has a problem, workers need to clean residual silicon wafers on equipment, otherwise, the equipment cannot be maintained, the residual silicon wafers need to be additionally placed, and the silicon wafers are easy to mix, so that the subsequent procedures of the silicon wafers cannot be carried out; when the blanking machine is in a problem, the front-end printing machine is stopped to maintain the blanking machine, so that the production of the equipment is stopped, the production continuity of the equipment is affected, the production efficiency of the equipment is reduced, and the production cost is high.
Disclosure of Invention
The invention aims to solve the technical problem of providing a buffer table for unloading a printing machine, which can improve the production continuity of the printing machine, improve the production efficiency and reduce the production cost.
The technical scheme of the invention is that the buffer table for unloading the printing machine comprises a frame positioned at the front end of a loading and unloading machine of the printing machine, wherein a cover plate is arranged at the top of the frame, and two exhaust openings are arranged on the cover plate; the four sides of the upper part of the frame are provided with baffle plates, wherein the baffle plates positioned on the front side and the rear side are respectively provided with a feed inlet and a discharge outlet, the feed inlet corresponds to the discharge end of the printer, and the discharge outlet corresponds to the feed end of the blanking machine; the inside of the frame is connected with a silicon wafer storage rack in a vertical sliding manner, and a driving mechanism for driving the silicon wafer storage rack to slide up and down is arranged on the frame below the silicon wafer storage rack; the inner side of the baffle plate provided with the feed inlet is provided with a receiving and feeding mechanism for receiving and feeding out silicon wafers.
After adopting the structure, compared with the prior art, the invention has the following advantages:
due to the arrangement of the invention, when the printer is temporarily maintained, the silicon wafers coming out of the printer can be temporarily stored on the silicon wafer storage rack, and when equipment is maintained in time, the situation that the temporarily stored silicon wafers are forgotten or mixed can be effectively prevented, thereby being convenient for reducing the loss of the silicon wafers in the production process; meanwhile, when the blanking machine is temporarily maintained, the silicon wafers from the printing machine can be temporarily stored on the silicon wafer storage rack, so that the printing machine can continue to work without stopping, the continuity of equipment production is ensured, the production efficiency of the equipment is further improved, and the production cost of products is finally reduced; after the exhaust port is arranged, residual medicament on the silicon wafer can be timely discharged, and the influence of residual medicament volatile matters on the upper silicon wafer is prevented, so that the consistency of the product quality is ensured.
The cover plate is divided into a fixed plate and two movable plates, the fixed plate is positioned between the two movable plates, and the fixed plate is fixedly connected with the frame; the two exhaust openings are positioned on the fixed plate, and pipe joints are arranged at the two exhaust openings on the fixed plate; the two movable plates are hinged with the fixed plate, and handles are arranged on the upper end faces of the two movable plates; after the arrangement, the movable plate can be opened at any time under the condition of no shutdown to observe the condition on the silicon wafer storage rack so as to manually intervene in the blanking speed of the blanking machine.
The driving mechanism comprises two first air cylinders and two air flow controllers, and the two air flow controllers are respectively and correspondingly connected with one first air cylinder; the silicon wafer storage rack is divided into a left frame and a right frame, the left frame corresponds to the right frame one by one, and the left frame and the right frame are both in sliding connection with the rack through sliding blocks; the piston rods of the two first cylinders are respectively connected with the corresponding sliding blocks of the left frame and the right frame, and synchronously control the left frame and the right frame to slide up and down; after the arrangement, the heights of the left side and the right side can be independently adjusted, so that residual liquid on the silicon wafer can quickly slide down, and the quality consistency of the silicon wafer is ensured.
The receiving and feeding mechanism comprises a bracket, wherein the bracket is positioned below the feeding hole, one end of the bracket is connected with the baffle plate or the rack, the other end of the bracket is folded upwards, the other end of the bracket is rotatably connected with a rotating shaft, wheels for receiving and feeding are arranged at two ends of the rotating shaft, and the bracket is also provided with a power mechanism for driving the rotating shaft to rotate; the structure is simple, the parts are fewer, the whole volume is smaller, and the use stability is better.
One end of the bracket is hinged with the baffle plate or the frame; a second air cylinder is hinged on the baffle plate between the bracket and the feed inlet, and a piston rod of the second air cylinder is hinged with the bracket and used for controlling the bracket to rotate around a hinged position at one end; then set up the back like this for thereby the support rotates the upper and lower position of adjusting the wheel, and then the frictional force between adjustable wheel and the silicon chip, thereby guarantee that the silicon chip can be timely by the transmission, guarantee the availability factor of receiving and sending material mechanism, even after the wheel wearing and tearing simultaneously, also accessible second cylinder adjusts, with the frictional force between assurance wheel and the silicon chip, thereby the life of extension wheel reduces the maintenance cost of equipment.
The peripheral surface of the wheel is coated with a buffer layer made of flexible materials; the friction force influence of the liquid on the wheel and the silicon wafer is weakened, so that the friction force between the wheel and the silicon wafer is improved.
The power mechanism comprises a motor, the motor is fixed on the bracket, a belt pulley is arranged on the rotating shaft, and the motor is in transmission connection with the belt pulley through a belt; after the device is arranged in this way, the structure is simple, and the belt can effectively prevent the influence of the residual liquid medicament on the silicon wafer on the power mechanism.
An inductor for inducing the silicon wafer to enter the feeding hole is arranged below the feeding hole on the baffle; the inductor is arranged, so that the receiving and feeding mechanism acts more timely, the condition of a striker is prevented, and the upper and lower positions of the wheels are convenient to adjust timely.
Two parallel sectional materials are arranged below the silicon wafer storage rack on the rack, the two sectional materials are in one-to-one correspondence with the two first air cylinders, the sectional materials are provided with long-strip-shaped T-shaped fixing grooves, the two first air cylinders are respectively fixed on the sectional materials corresponding to the two first air cylinders through fixing blocks, and the fixing blocks are fixed on the sectional materials through the combination of bolts and the fixing grooves; after the arrangement, the front and back positions of the two first air cylinders can be adjusted so as to adapt to silicon wafers of different types and silicon wafer storage racks, and therefore the use cost of the equipment is reduced.
A baffle is arranged below the silicon wafer storage rack on the frame and is fixed on the upper end surfaces of the two parallel sectional materials; the baffle can prevent the residual medicament of the silicon chip on the silicon chip storage rack from directly dripping on the ground, thereby being convenient for the cleaning of workers in the production process.
Drawings
Fig. 1 is a schematic view of the structure of the buffer table for unloading a printing press according to the present invention in use.
Fig. 2 is a schematic structural view of a buffer table for unloading a printer according to the present invention.
Fig. 3 is a side view of the buffer table for unloading a printer according to the present invention.
Fig. 4 is an enlarged view of the left frame and the first cylinder of the buffer table for unloading a printer according to the present invention.
Fig. 5 is an enlarged view of the buffer table receiving and feeding mechanism for unloading a printing press according to the present invention.
Fig. 6 is an enlarged view of the rotating shaft and wheels of the buffer table for unloading the printing press according to the present invention.
Fig. 7 is an enlarged view of a portion a in fig. 2.
The figure shows: 1. the printing machine comprises a printing machine, 2, a blanking machine, 3, a frame, 4, a cover plate, 41, a fixed plate, 42, a movable plate, 43, a handle, 5, an exhaust port, 6, a baffle, 7, a feed inlet, 8, a discharge port, 9, a silicon wafer storage rack, 91, a left frame, 92, a right frame, 10, a pipe joint, 11, a first cylinder, 12, a sliding block, 13, a bracket, 14, a rotating shaft, 15, wheels, 16, a second cylinder, 17, a motor, 18, a belt pulley, 19, a belt, 20, an inductor, 21, a section bar, 22, a fixed groove, 23, a fixed block, 24 and a partition plate.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 to 7, the buffer table for unloading a printing machine of the present invention comprises a frame 3 positioned at the front end of a feeding machine 2 on a printing machine 1, wherein the frame 3 is positioned at one side of a discharging hole of the printing machine 1 and at one side of a feeding hole of the feeding machine 2, a cover plate 4 is arranged at the top of the frame 3, and two exhaust holes 5 are arranged on the cover plate 4; the four sides of the upper part of the frame 3 are respectively provided with a baffle 6, wherein the baffles 6 positioned at the front side and the rear side are respectively provided with a feed inlet 7 and a discharge outlet 8, the feed inlet 7 corresponds to the discharge end of the printer 1, and a conveying belt at the discharge end of the printer 1 faces the feed inlet 7, so that silicon wafers coming out of the printer 1 can directly enter the feed inlet 7; the discharge hole 8 corresponds to the feeding end of the blanking machine 2, and the discharge hole 8 faces to the conveying belt of the feeding end of the blanking machine 2, so that the silicon wafer coming out of the discharge hole 8 can be directly conveyed to the conveying belt of the feeding end of the blanking machine 2; the inside of the frame 3 is connected with a silicon wafer storage frame 9 in a vertical sliding manner, the number of silicon wafers which can be stored by the silicon wafer storage frame 9 is determined according to actual demands, the silicon wafer storage frames 9 with different types can be replaced, and a driving mechanism for driving the silicon wafer storage frame 9 to slide up and down is arranged on the frame 3 below the silicon wafer storage frame 9; the inner side of the baffle plate 6 provided with the feed inlet 7 is provided with a receiving and feeding mechanism for receiving and feeding out silicon wafers.
The cover plate 4 is divided into a fixed plate 41 and two movable plates 42, the fixed plate 41 is positioned between the two movable plates 42, and the fixed plate 41 is fixedly connected with the frame 3; the two exhaust openings 5 are positioned on the fixed plate 41, and the pipe joints 10 are arranged at the two exhaust openings 5 on the fixed plate 41; the two movable plates 42 are hinged with the fixed plate 41, and the upper end surfaces of the two movable plates 42 are provided with handles 43.
The driving mechanism comprises two first air cylinders 11 and two air flow controllers, and the two air flow controllers are respectively and correspondingly connected with one first air cylinder 11; the silicon wafer storage rack 9 is divided into a left frame 91 and a right frame 92, the left frame 91 and the right frame 92 are in one-to-one correspondence, and the left frame 91 and the right frame 92 are both in sliding connection with the rack 3 through a sliding block 12; the piston rods of the two first cylinders 11 are respectively connected with the corresponding sliding blocks 12 of the left frame 91 and the right frame 92, and synchronously control the up-and-down sliding of the left frame 91 and the right frame 92; in this way, when the number of silicon wafers stored is kept unchanged and silicon wafers of different models are required to be produced, only the left frame 91 and the right frame 92 need to be adjusted by the slider 12 even if model conversion is realized.
The receiving and feeding mechanism comprises a support 13, the support 13 is positioned below the feeding hole 7, one end of the support 13 is connected with the baffle 6 or the frame 3, the other end of the support 13 is folded upwards, the other end of the support 13 is rotatably connected with a rotating shaft 14, wheels 15 for receiving and feeding are arranged at two ends of the rotating shaft 14, and the support 13 is also provided with a power mechanism for driving the rotating shaft 14 to rotate. The rotating shaft 14 is parallel to the feeding hole 7, and the center of the rotating shaft 14 and the center of the feeding hole 7 are on the same vertical line.
One end of the bracket 13 is hinged with the baffle 6 or the frame 3; a second cylinder 16 is hinged on the baffle 6 between the bracket 13 and the feed inlet 7, and a piston rod of the second cylinder 16 is hinged with the bracket 13 and is used for controlling the bracket 13 to rotate around a hinged position at one end.
The buffer layer made of flexible materials is coated on the outer peripheral surface of the wheel 15, so that friction force can be increased, the silicon wafer can be damped, cracking of the silicon wafer can be prevented, and loss in the production process is reduced.
The power mechanism comprises a motor 17, the motor 17 is fixed on the bracket 13, a belt pulley 18 is arranged on the rotating shaft 14, and the motor 17 is in transmission connection with the belt pulley 18 through a belt 19.
The inductor 20 used for inducing the silicon wafer to enter the feeding hole 7 is arranged below the feeding hole 7 on the baffle 6, and the inductor 20 is used for inducing the silicon wafer to enter the feeding hole 7 and also can induce the position condition of the silicon wafer, so that the position of the wheel 15 can be adjusted in real time to better receive materials.
Two parallel sectional materials 21 are arranged below the silicon wafer storage rack 9 on the frame 3, the two sectional materials 21 are in one-to-one correspondence with the two first air cylinders 11, the sectional materials 21 are provided with long-strip-shaped T-shaped fixing grooves 22, the two first air cylinders 11 are respectively fixed on the respective corresponding sectional materials 21 through fixing blocks 23, and the fixing blocks 23 are fixed on the sectional materials 21 through the combination of bolts and the fixing grooves 22.
A baffle plate 24 is arranged below the silicon wafer storage rack 9 on the frame 3, and the baffle plate 24 is fixed on the upper end surfaces of the two parallel sectional materials 21.
The above-mentioned sensor 20, motor 17 and air flow controller are all connected to the general control mechanism of the printing press 1.
Working principle: the exhaust port 5 is communicated with an exhaust mechanism through a pipe joint 10; when the silicon wafer printed in the printer 1 is sent to the feed inlet 7 through the conveying belt, the sensor 20 senses that the second air cylinder 16 acts at the moment, the free end of the bracket 13 is turned upwards, the wheel 15 is positioned below the silicon wafer, meanwhile, the motor 17 acts to enable the wheel 15 to rotate, the silicon wafer slides into the silicon wafer storage rack 9, and if the silicon wafer belongs to a normal production procedure at the moment, the silicon wafer enters the blanking machine 2 through the discharge port 8 directly on the wheel 15; if the machine belongs to a temporary maintenance state of the printing machine at this time, the blanking machine 2 normally works to blank the printed silicon wafers, the unfinished silicon wafers are not sent out when entering the silicon wafer storage rack 9, a piece of silicon wafers enters at this time, the first air cylinder 11 is controlled to enable the silicon wafer storage rack 9 to move upwards by one storage position, so that the semi-finished silicon wafers are stored in the silicon wafer storage rack 9, a control device records the original program of each layer of silicon wafers, and at the same time, an exhaust mechanism exhausts the air from the inside of the baffle 6 through the air exhaust opening 5; after repair is finished, blanking is carried out through a blanking machine 2, and each silicon wafer is prompted to be put back into the original program according to a control device; if the blanking machine 2 needs to be temporarily maintained, the blanking machine 2 is stopped for maintenance, the printer 1 works normally, the silicon wafers printed on the printer 1 enter the silicon wafer storage rack 9 and are not sent out, a piece of silicon wafers enters the silicon wafer storage rack 9 at the moment, the first air cylinder 11 is controlled to enable the silicon wafer storage rack 9 to move upwards to a storage position, after the maintenance of the blanking machine 2 is finished, the control device controls the device to send out the silicon wafers, and at the moment, the silicon wafers printed on the printer 1 are normally sent out, and meanwhile, the silicon wafers in the silicon wafer storage rack 9 are inserted between the silicon wafers printed on the printer 1 and then finished.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A buffer station for unloading a printing machine, characterized in that: the automatic feeding and discharging device comprises a frame (3) positioned at the front end of a feeding and discharging machine (2) of a printing machine (1), wherein a cover plate (4) is arranged at the top of the frame (3), and two exhaust openings (5) are formed in the cover plate (4); four sides of the upper part of the frame (3) are provided with baffle plates (6), wherein the baffle plates (6) positioned on the front side and the rear side are respectively provided with a feed inlet (7) and a discharge outlet (8), the feed inlet (7) corresponds to the discharge end of the printing machine (1), and the discharge outlet (8) corresponds to the feed end of the blanking machine (2); the inside of the frame (3) is connected with a silicon wafer storage frame (9) in an up-down sliding way, and a driving mechanism for driving the silicon wafer storage frame (9) to slide up and down is arranged on the frame (3) below the silicon wafer storage frame (9); a receiving and feeding mechanism for receiving and sending out silicon wafers is arranged on the inner side of the baffle plate (6) provided with the feed inlet (7); the driving mechanism comprises two first air cylinders (11) and two air flow controllers, and the two air flow controllers are respectively and correspondingly connected with one first air cylinder (11); the silicon wafer storage rack (9) is divided into a left frame (91) and a right frame (92), the left frame (91) and the right frame (92) are in one-to-one correspondence, and the left frame (91) and the right frame (92) are both in sliding connection with the rack (3) through a sliding block (12); the piston rods of the two first cylinders (11) are respectively connected with the corresponding sliding blocks (12) of the left frame (91) and the corresponding sliding blocks (12) of the right frame (92), and the left frame (91) and the right frame (92) are synchronously controlled to slide up and down; the receiving and feeding mechanism comprises a support (13), the support (13) is located below the feeding hole (7), one end of the support (13) is connected with the baffle (6) or the rack (3), the other end of the support (13) is folded upwards, the other end of the support (13) is rotatably connected with a rotating shaft (14), wheels (15) for receiving and feeding are arranged at two ends of the rotating shaft (14), and the support (13) is further provided with a power mechanism for driving the rotating shaft (14) to rotate.
2. The buffer station for unloading a printer according to claim 1, wherein: the cover plate (4) is divided into a fixed plate (41) and two movable plates (42), the fixed plate (41) is positioned between the two movable plates (42), and the fixed plate (41) is fixedly connected with the frame (3); the two exhaust openings (5) are positioned on the fixed plate (41), and pipe joints (10) are arranged at the two exhaust openings (5) on the fixed plate (41); the two movable plates (42) are hinged with the fixed plate (41), and handles (43) are arranged on the upper end faces of the two movable plates (42).
3. The buffer station for unloading a printer according to claim 1, wherein: one end of the bracket (13) is hinged with the baffle (6) or the frame (3); a second air cylinder (16) is hinged on the baffle plate (6) between the bracket (13) and the feeding hole (7), and a piston rod of the second air cylinder (16) is hinged with the bracket (13) and used for controlling the bracket (13) to rotate around a hinged position at one end.
4. The buffer station for unloading a printer according to claim 1, wherein: the peripheral surface of the wheel (15) is coated with a buffer layer made of flexible materials.
5. The buffer station for unloading a printer according to claim 1, wherein: the power mechanism comprises a motor (17), the motor (17) is fixed on the bracket (13), a belt pulley (18) is arranged on the rotating shaft (14), and the motor (17) is in transmission connection with the belt pulley (18) through a belt (19).
6. A buffer station for unloading a printing press according to claim 1 or 3, wherein: an inductor (20) for inducing the silicon wafers to enter the feeding hole (7) is arranged below the feeding hole (7) on the baffle (6).
7. The buffer station for unloading a printer according to claim 1, wherein: the silicon wafer storage rack is characterized in that two parallel sectional materials (21) are arranged below the silicon wafer storage rack (9) on the rack (3), the two sectional materials (21) are in one-to-one correspondence with the two first air cylinders (11), the sectional materials (21) are provided with long-strip-shaped T-shaped fixing grooves (22), the two first air cylinders (11) are respectively fixed on the sectional materials (21) corresponding to each other through fixing blocks (23), and the fixing blocks (23) are fixed on the sectional materials (21) through the combination of bolts and the fixing grooves (22).
8. The buffer station for unloading a printer according to claim 7, wherein: a baffle plate (24) is arranged below the silicon wafer storage rack (9) on the frame (3), and the baffle plate (24) is fixed on the upper end surfaces of the two parallel sectional materials (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711307348.5A CN108074852B (en) | 2017-12-11 | 2017-12-11 | Buffer table for unloading printing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711307348.5A CN108074852B (en) | 2017-12-11 | 2017-12-11 | Buffer table for unloading printing machine |
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| Publication Number | Publication Date |
|---|---|
| CN108074852A CN108074852A (en) | 2018-05-25 |
| CN108074852B true CN108074852B (en) | 2023-11-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711307348.5A Active CN108074852B (en) | 2017-12-11 | 2017-12-11 | Buffer table for unloading printing machine |
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| CN (1) | CN108074852B (en) |
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| CN207529915U (en) * | 2017-12-11 | 2018-06-22 | 东方日升新能源股份有限公司 | Printing machine unloading buffer table |
| CN209045517U (en) * | 2018-12-17 | 2019-06-28 | 阿特斯阳光电力集团有限公司 | A kind of silicon wafer storage system |
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| KR102174332B1 (en) * | 2014-07-30 | 2020-11-04 | 삼성전자주식회사 | Stockers of Fabricating Semiconductors and Wafer Transferring Method Using the Same |
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|---|---|---|---|---|
| CN101648454A (en) * | 2008-08-13 | 2010-02-17 | 东远精技工业股份有限公司 | Cartridge device for automatic screen printing production line |
| CN105870261A (en) * | 2016-06-02 | 2016-08-17 | 昆山豪恩特机器人自动化科技有限公司 | Fully-automatic feeding and discharging equipment for printing photovoltaic solar cell silicon wafers |
| CN205855267U (en) * | 2016-06-07 | 2017-01-04 | 江苏爱多能源科技有限公司 | Novel silicon slice unloading frame |
| CN206697459U (en) * | 2017-03-09 | 2017-12-01 | 昆山豪恩特机器人自动化科技有限公司 | Photovoltaic solar etches channel blanking machine |
| CN207529915U (en) * | 2017-12-11 | 2018-06-22 | 东方日升新能源股份有限公司 | Printing machine unloading buffer table |
| CN209045517U (en) * | 2018-12-17 | 2019-06-28 | 阿特斯阳光电力集团有限公司 | A kind of silicon wafer storage system |
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|---|---|
| CN108074852A (en) | 2018-05-25 |
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