CN108070887A - Electroplating method and system thereof - Google Patents
Electroplating method and system thereof Download PDFInfo
- Publication number
- CN108070887A CN108070887A CN201611114218.5A CN201611114218A CN108070887A CN 108070887 A CN108070887 A CN 108070887A CN 201611114218 A CN201611114218 A CN 201611114218A CN 108070887 A CN108070887 A CN 108070887A
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- Prior art keywords
- electroplate liquid
- electro
- anode
- plating method
- cathode
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- 238000009713 electroplating Methods 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 70
- 239000002904 solvent Substances 0.000 claims abstract description 28
- 230000005496 eutectics Effects 0.000 claims abstract description 23
- 239000007788 liquid Substances 0.000 claims description 142
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 42
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 33
- 238000005246 galvanizing Methods 0.000 claims description 30
- 229910021645 metal ion Inorganic materials 0.000 claims description 26
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 25
- SGMZJAMFUVOLNK-UHFFFAOYSA-M choline chloride Chemical group [Cl-].C[N+](C)(C)CCO SGMZJAMFUVOLNK-UHFFFAOYSA-M 0.000 claims description 23
- 229910052742 iron Inorganic materials 0.000 claims description 23
- 239000001763 2-hydroxyethyl(trimethyl)azanium Substances 0.000 claims description 22
- 235000019743 Choline chloride Nutrition 0.000 claims description 22
- 229960003178 choline chloride Drugs 0.000 claims description 22
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 17
- 239000007787 solid Substances 0.000 claims description 17
- 229910052725 zinc Inorganic materials 0.000 claims description 17
- 239000011701 zinc Substances 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000013049 sediment Substances 0.000 claims description 11
- 238000000926 separation method Methods 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 9
- 150000002500 ions Chemical class 0.000 claims description 7
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 6
- 238000005119 centrifugation Methods 0.000 claims description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 239000001257 hydrogen Chemical group 0.000 claims description 6
- 229910052739 hydrogen Chemical group 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000011084 recovery Methods 0.000 claims description 6
- 229910000975 Carbon steel Inorganic materials 0.000 claims description 5
- 239000010962 carbon steel Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004202 carbamide Substances 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 239000011133 lead Substances 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims 1
- 238000007747 plating Methods 0.000 abstract description 29
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 27
- 238000000576 coating method Methods 0.000 description 27
- 239000007769 metal material Substances 0.000 description 13
- 150000003839 salts Chemical class 0.000 description 13
- 238000004064 recycling Methods 0.000 description 9
- 239000006227 byproduct Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- PTFCDOFLOPIGGS-UHFFFAOYSA-N Zinc dication Chemical compound [Zn+2] PTFCDOFLOPIGGS-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 230000005611 electricity Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 229910000806 Latten Inorganic materials 0.000 description 4
- 241000209094 Oryza Species 0.000 description 4
- 235000007164 Oryza sativa Nutrition 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 235000009566 rice Nutrition 0.000 description 4
- 239000010802 sludge Substances 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 238000002354 inductively-coupled plasma atomic emission spectroscopy Methods 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005352 clarification Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000011592 zinc chloride Substances 0.000 description 2
- 235000005074 zinc chloride Nutrition 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 235000006708 antioxidants Nutrition 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- -1 brightener Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229960001231 choline Drugs 0.000 description 1
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000002608 ionic liquid Substances 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001453 nickel ion Inorganic materials 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 238000007248 oxidative elimination reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
- C25D3/665—Electroplating: Baths therefor from melts from ionic liquids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The electroplating method comprises the steps of carrying out pre-electrolysis procedure by using electroplating solution provided with an anode and a cathode, wherein the electroplating solution consists of eutectic solvent; and replacing the cathode with the object to be plated to perform an electroplating process. The electroplating system comprises a tank body; the electroplating solution consists of a eutectic solvent and is arranged in the tank body; an anode and a cathode respectively placed in the plating solution; and a power supply unit electrically connected to the anode and the cathode.
Description
Technical field
The disclosure is on a kind of electro-plating method and system using eutectic solvent as electroplate liquid.
Background technology
Taiwan 3C industries are prosperous, and plate surface treatment technology is then various electronic product and component progress corrosion protection, beautification
The important technology of appearance etc., whether the shells such as mobile phone, computer, various metals and many plastic cement converted products all need to be via appropriate
Surface treatment program to extend its service life.Since most electroplate liquid is mostly aqueous solution, in order to increase electric conductivity, coating light
Damp degree and stability and be commonly incorporated into strong acid, highly basic or the high toxic material containing cyanide, cause follow-up waste liquid and Treatment of Sludge journey
Sequence is complicated and with high costs, therefore environmental type electroplate liquid rises with Green Electroplating process requirement day.
Eutectic solvent (Deep Eutectic Solvent) belongs to a kind of pattern of ionic liquid, utilizes two kinds of chemical combination
Object is mixed to form liquid in the case of eutectic point, it has, and electric conductivity is high, thermal stability is high, is in a liquid state at room temperature, to many
Metal has many advantages, such as high-dissolvability and small to environmental hazard with ceramics.When eutectic solvent as electroplate liquid in use, it is still necessary to
Metal salt or other compounds (such as metal oxide) containing metal or other additives for adding metal to be plated again are (such as anti-
Oxidant, adjuvant, brightener, wetting agent, surfactant etc.), cause electroplating bath components complicated, be unfavorable for recycling use and
It handles complicated.
Therefore, it is current urgent problem to be solved to develop a kind of environment amenable electro-plating method and system.
The content of the invention
The disclosure uses the eutectic solvent of nontoxic, environment amenable choline chloride series, and as electroplate liquid, substitution passes
The electroplate liquid for aqueous solution of uniting, and using the addition of metallic salt in the general electroplate liquid of preelectrolysis program substitution, make electroplating quality steady
It is fixed；Since electroplate liquid composition is simple, without any additive, if electroplating process generates extra sediment, simple separation can be passed through
Technology by separation, electroplate liquid and sediment can recycle use.Therefore, the electro-plating method of the disclosure and its system be hardly
Processing procedure waste liquid is generated, in addition electroplate liquid, without harmful substances such as cyanides, very friendly to environment, the processing routine of waste liquid also may be used
Significantly reduce.
In an embodiment of the disclosure, a kind of electro-plating method is provided, includes the electroplate liquid that anode and cathode are equipped with one
Preelectrolysis program is carried out, wherein, which is made of eutectic solvent；And the cathode is replaced with object to be plated, to carry out
Galvanizing process.
In an embodiment of the disclosure, a kind of electroplating system is provided, includes groove body；Electroplate liquid, by eutectic solvent institute
It forms and the electroplate liquid is placed in the groove body；Anode and cathode are respectively placed in the electroplate liquid；And power-supply unit, electricity
Property connects the anode and the cathode.
Description of the drawings
Fig. 1 is the schematic diagram of the electroplating system of one embodiment of the disclosure.
Fig. 2 is the flow chart of the electro-plating method of one embodiment of the disclosure.
Fig. 3 is the flow chart of the electro-plating method of another embodiment of the disclosure.
Fig. 4 is the flow chart of the electro-plating method of disclosure another embodiment.
Fig. 5 is embodiment 7 through being centrifuged out the XRD diagram of solid by-product.
Fig. 6 is that embodiment 7 is schemed through being centrifuged out the SEM of solid by-product.
Fig. 7 is embodiment 8 through being centrifuged out the XRD diagram of solid by-product.
Fig. 8 is that embodiment 8 is schemed through being centrifuged out the SEM of solid by-product.
Wherein, reference numeral：
1 electroplating system
11 groove bodies
12 electroplate liquids
13 anodes
14 cathodes
14 ' objects to be plated
15 power-supply units
16 recovery units
161 entrances
162 outlets.
Specific embodiment
Below sincerely in conjunction with the accompanying drawings and embodiments, the specific embodiment of the disclosure is further described.Following embodiment
The technical solution for clearly illustrating the disclosure is only used for, and the protection domain of the disclosure cannot be limited with this.
In one embodiment, please refer to Fig.1, the disclosure provides a kind of electroplating system 1, will be as sun by the use of electrochemical principle
The metal material oxidative cleavage of pole into metal ion into electroplate liquid, then using in electroplate liquid metal ion reduction deposition to as
On the object surface to be plated of cathode.The electroplating system 1 includes groove body 11, electroplate liquid 12, anode 13, cathode 14 and power-supply unit
15, the wherein electroplate liquid 12 is placed in the groove body 11, and the anode 13, cathode 14 are respectively placed in the electroplate liquid 12, which supplies
The electric connection anode 13 of unit 15 and the cathode 14, the wherein groove body 11 is answered to be mainly used for housing the electroplate liquid 12, be not limited to
Any shape or material, such as container of glass or Teflon liner can be used, and as the groove body 11, the electroplate liquid 12 is by low common
Molten solvent is formed, which is one kind of ion solvent, mutual by intermolecular hydrogen bonding by two or three of substance
The solvent that association is melted and formed, fusing point are low compared with single substance.
In one embodiment, which includes choline chloride (Choline chloride) and hydrogen bonds chemical combination
Object has highly polar and metal ion dissolubility；In addition, choline chloride base eutectic solvent also possess it is cheap, biological
Degradable, the advantages of environment is friendly.In one embodiment, the hydrogeneous key compound is mainly providing hydrogen bond and the choline chloride
The eutectic solvent is formed, urea, ethylene glycol or glycerine, the wherein choline chloride and the hydrogeneous key compound can be exemplified as
Molar ratio can be 2：1 to 1：4, such as 1：1、2：3、2：5 or 1：2, make the eutectic solvent that there is relatively low fusing point.
In one embodiment, the electroplate liquid 12 do not include metal salt or other additives, not comprising metal salt or other add
Agent is added to refer in electroplate liquid 12 in addition to choline chloride and hydrogeneous key compound, not comprising other metal salts or additive,
Except electroplate liquid inevitable impurity in itself.Sludge can be reduced after long-time is using electroplate liquid 12 to generate, even if generating
Sediment since the ingredient of electroplate liquid is more simple, is conducive to recycling, effectively simplifies the work of electroplate liquid subsequent processing recycling
Sequence.
In one embodiment, the anode 13 and the cathode 14 are respectively arranged in the electroplate liquid 12, are arranged at the electroplate liquid
It refers to partly or entirely being impregnated in the electroplate liquid 12 in 12, it can be with the electroplate liquid 12 and the power-supply unit 15
Formed electrochemical circuit, wherein the material of the anode 13 can be exemplified as include selected from zinc, nickel, copper, gold, silver, platinum, chromium, magnesium,
At least one metal that lead, cobalt, aluminium and titanium are grouped, that is, any one or more of metal material to be electroplated may be selected and make
For the anode 13, such as single metal or alloy material, it is not limited thereto；In preelectrolysis program, the material of the cathode 14
It can be exemplified as platinum or comprising platinum, the shape of the cathode 14 can illustrate using wire electrode or the smaller electrode of other areas
Kenel makes the metal ion from the anode 13 be not easy to be deposited on the cathode 14, allows in electroplate liquid 12 from the anode 13
Concentration of metal ions is promoted, and is used for follow-up galvanizing process；In galvanizing process, which is substituted for object 14 ' to be plated,
In the material of the object 14 ' to be plated can be a conductive metal object, such as iron, carbon steel, allumen or copper.In an embodiment
In, which can also select, such as iron, carbon steel, allumen identical with the material of the object 14 ' to be plated in preelectrolysis program
Or copper, it is not limited thereto.
In one embodiment, the anode (+) of the power-supply unit 15 and cathode (-) are electrically connected in the anode 13
And the cathode 14.After the power-supply unit 15 passes to the power supply of direct current, which can be released electronics (solution by oxidation
Separate out metal ion), a part of metal ion then reduces (obtaining electronics) on the cathode 14 and forms gold in the electroplate liquid 12
Belong to atom and accumulate in 14 surface layer of cathode, wherein the power-supply unit 15 can be exemplified as DC power supply, to provide
One curtage carries out preelectrolysis or galvanizing process, operation electric current or voltage can according to different metal materials, preelectrolysis or
Galvanizing process is adjusted, such as the electric current of preelectrolysis program can be 0.1 ampere to 5 amperes；The electric current of galvanizing process can be 0.1
Ampere is to 5 amperes, since preelectrolysis program is mainly that the metal of anode 13 is allowed to dissociate into electroplate liquid 12 accumulation from anode 13
Concentration of metal ions, so operation electric current can set relatively it is higher, to shorten the time of preelectrolysis program.
In one embodiment, it is precipitated when the concentration of metal ions from anode 13 in electroplate liquid 12 is excessive and generates sediment
When, which can also include recovery unit 16, which includes entrance 161 and outlet 162, pass through one respectively
Pipeline is connected to the groove body 11.The electroplate liquid 12 from the groove body 11 is received by the entrance 161, is removed by separable programming
After sediment, the electroplate liquid 12 after separation is back to the groove body 11 by outlet 162 again, continues to reuse the electroplate liquid
12, the wherein recovery unit 16 can be the device of a separation of solid and liquid, such as filter device or centrifuge, be not limited thereto.It is logical
Cross the solid (sediment) that the recovery unit 16 is separated, metal or its oxide mainly comprising the anode 13, as long as through
Crossing can recycling after drying.
In one embodiment, the electroplating system 1 is also comprising sensing unit (not shown), to measure the electroplate liquid 12
From the concentration of metal ions of the anode 13, the wherein sensing unit can be exemplified as inductively coupled plasma optical emission spectroscopy
(Inductively coupled plasma optical emission spectroscopy, ICP-OES) or Atomic absorption
Spectrometer (Atomic absorption spectroscopy, AA).In one embodiment, in galvanizing process, the electroplate liquid
The control range of concentration of metal ions from the anode 13 in 12 can be 600ppm to 30000ppm, such as 5000ppm is extremely
25000ppm, 10000ppm are to 23000ppm or 10000ppm to 20000ppm, and the control range of concentration of metal ions can be because
Different metal species and it is different, such as during electrogalvanizing, the control range of concentration of metal ions is 5000ppm to 25000ppm.When
When ion concentration is too low, it is likely to result in that crystal grain hole is more and uneven coating；When ion concentration is excessively high, big is likely to result in
Crystal grain be precipitated and it is uneven be attached to coating surface, by control electroplate liquid in concentration of metal ions can effectively ensure to electroplate
Quality.
In one embodiment, the electroplating system 1 is also comprising temperature control unit (not shown), to control the electroplate liquid 12
Temperature, the wherein temperature control unit can include heater, temperature-sensitive sticker and temperature setting unit.In one embodiment,
The control range of the temperature of the electroplate liquid 12 can be 25 DEG C to 130 DEG C, according to different metal materials, preelectrolysis or plating conditions
It is adjusted.
It please refers to Fig.2, is the flow chart of the electro-plating method of one embodiment of the disclosure, the plating system for utilizing Fig. 1 is presented
Electro-plating method performed by system 1.In the present embodiment, as indicated in step sloo, the plating for being equipped with anode 13 and cathode 14 with one
Liquid 12 carries out preelectrolysis program, wherein, which is made of eutectic solvent.The eutectic solvent is ion solvent
One kind mutually associates melting and the solvent formed by two or three of substance by intermolecular hydrogen bonding.
In one embodiment, which includes choline chloride and hydrogeneous key compound, the hydrogeneous key compound
Mainly the eutectic solvent, such as urea, ethylene glycol or glycerine, the wherein chlorine are formed with the choline chloride to provide hydrogen bond
The molar ratio for changing choline and the hydrogeneous key compound can be 2：1 to 1：4, such as 1：1、2：3、2：5 or 1：2.
In one embodiment, which does not add metal salt or other additives, does not add metal salt or other add
Agent is added to refer in electroplate liquid 12 in addition to choline chloride and hydrogeneous key compound, in addition other metal salts is not added again or adds
Add agent, such as zinc chloride is not added during electrogalvanizing, either, in electroplate liquid 12 in addition to choline chloride and hydrogeneous key compound,
Not comprising other metal salts or additive, except solvent drug inevitable impurity in itself.When 12 system of electroplate liquid is by eutectic
When solvent forms, long-time use electroplate liquid 12 when can reduce sludge generate, even if generate sediment, due to ingredient compared with
Merely, be conducive to recycling, effectively simplify the process of 12 subsequent processing of electroplate liquid recycling.
In one embodiment, it is placed in the electroplate liquid 12 and refers to that the anode 13 and the cathode 14 can partly or entirely contain
It is dipped in the electroplate liquid 12, electrochemical circuit, the wherein anode can be formed with the electroplate liquid 12 and the power-supply unit 15
13 material can be exemplified as including and is grouped at least selected from zinc, nickel, copper, gold, silver, platinum, chromium, magnesium, lead, cobalt, aluminium and titanium
A kind of metal, that is, any one or more of metal material to be electroplated may be selected as the anode 13, for example, single metal or
Alloy material is not limited thereto；The material of the cathode 14 can be exemplified as platinum or comprising platinum, and the shape of the cathode 14 can lift
Example makes the metal ion from the anode 13 be not easy to be deposited on this using wire electrode or the smaller electrode kenel of other areas
On cathode 14, electroplate liquid 12 is allowed easily to promote the concentration of metal ions from anode 13, is used as follow-up galvanizing process.One
In embodiment, the cathode 14 is also optional identical with the material of the object 14 ' to be plated, such as iron, carbon steel, allumen or copper, and
It is not limited.
In one embodiment, the anode (+) of the power-supply unit 15 and cathode (-) are electrically connected in the anode 13
And the cathode 14.After the power-supply unit 15 passes to the power supply of direct current, which can be released electronics (solution by oxidation
Separate out metal ion), the concentration of metal ions from anode 13 in electroplate liquid 12 is made to continue to build up to a preset value, such as
600ppm to 30000ppm, for example, 5000ppm to 25000ppm, 10000ppm to 23000ppm or 10000ppm extremely
20000ppm, to complete the preelectrolysis program, and the preset value can be different due to different metal species, such as during electrogalvanizing, it should
Preset value can be 5000ppm to 25000ppm.In one embodiment, the operating parameter of the preelectrolysis program can be according to demand (example
Such as different metal material) it adjusts, such as the electric current of the preelectrolysis program can be 0.1 ampere to 5 amperes, temperature can be for 25 DEG C extremely
130℃。
Then, as shown in step S200, cathode 14 is replaced with object 14 ' to be plated and carries out a galvanizing process.It is taken with object 14 ' to be plated
For cathode 14, anode 13 and object 14 ' to be plated are placed in the electroplate liquid 12 respectively, is placed in the electroplate liquid 12 and refers to the sun
Pole 13 and the object 14 ' to be plated can be partly or entirely impregnated in the electroplate liquid 12, can be supplied with the electroplate liquid 12 and the power supply
Unit 15 formed electrochemical circuit, wherein the material of the anode 13 can be exemplified as include selected from zinc, nickel, copper, gold, silver, platinum,
Any one or more of metal material to be electroplated may be selected at least one metal that chromium, magnesium, lead, cobalt, aluminium and titanium are grouped
It as the anode 13, such as single metal or alloy material, is not limited thereto, wherein due to the preelectrolysis program and the plating
The anode material of program is identical, can be continuing in this step or anode 13 is substituted for the new of same metal material
Anode 13；The material of the object 14 ' to be plated can be conductive metal object, such as iron, carbon steel, allumen or copper, not with
This is limited.In one embodiment, the object 14 ' to be plated can with the material identical of the cathode 14, due to the phase in the preelectrolysis program
Between, concentration of metal ions from the anode 13 in electroplate liquid 12 and not up to plating standard, so the electroplate of the cathode 14
Matter is bad, and the object 14 ' to be plated that cathode 14 can be directly substituted for same metal material in the present embodiment carries out the galvanizing process.
In one embodiment, the anode (+) of the power-supply unit 15 and cathode (-) are electrically connected in the anode 13
And the object 14 ' to be plated.After the power-supply unit 15 passes to the power supply of direct current, which can release electronics by oxidation
(dissociateing metal ion), continues to supplement the concentration of metal ions of 12 Anodic 13 of electroplate liquid, and the electroplate liquid in this step
12 itself have had the concentration of metal ions for the anode 13 for being suitble to plating, such as 600ppm to 30000ppm, such as 5000ppm is extremely
25000ppm, 10000ppm to 23000ppm or 10000ppm to 20000ppm, therefore in the electroplate liquid 12 a part of metal from
It is sub then (obtaining electronics) is reduced on the object 14 ' to be plated as cathode formed and metallic atom and accumulate in cathode surface layer, with complete
Into the galvanizing process.In one embodiment, the operating parameter of the galvanizing process can be done according to demand (such as different metal material)
Adjustment, such as the electric current of the galvanizing process can be 0.1 ampere to 5 amperes, temperature can be 25 DEG C to 130 DEG C.
It please refers to Fig.3, is the flow chart of the electro-plating method of another embodiment of the disclosure, the plating for utilizing Fig. 1 is presented
Electro-plating method performed by system 1.In the present embodiment, in addition to comprising abovementioned steps S100 to step S200, also comprising step
Rapid S300, wherein step S100 are identical with foregoing description to step S200, and details are not described herein.
It is carrying out among step S200, as shown in step S300, when the concentration of metal ions of the anode 13 in electroplate liquid 12
During less than preset value, then carry out preelectrolysis program as indicated in step sloo.In this step, original object 14 ' to be plated can directly be made
The cathode 14 of inert metal is used or replaced with for the cathode 14, is not limited thereto.In one embodiment, which can
For 600ppm to 30000ppm, for example, 5000ppm to 25000ppm, 10000ppm to 23000ppm or 10000ppm extremely
20000ppm, and the preset value can be different due to different metal species, such as during electrogalvanizing, which can be for 5000ppm extremely
25000ppm.When the concentration of metal ions from the anode 13 in electroplate liquid 12 reaches preset value again by preelectrolysis program,
It is carried out again such as the galvanizing process of step S200, such as when the preelectrolysis program carried out again is using original object 14 ' to be plated, carried out again
Galvanizing process then using new object 14 ' to be plated, if the preelectrolysis program carried out again replaces with inert metal, carry out again
Galvanizing process can be then using original object 14 ' to be plated.By control and maintain the concentration of metal ion in electroplate liquid can effectively really
Protect electroplating quality.
It please refers to Fig.4, is the flow chart of the electro-plating method of disclosure another embodiment, the plating for utilizing Fig. 1 is presented
Electro-plating method performed by system 1.In the present embodiment, in addition to comprising abovementioned steps S100 to step S200, also comprising step
Rapid S400 to step S420, wherein step S100 is identical with foregoing description to step S200, and details are not described herein.
In step S200 is carried out, as shown in step S400 and step S410, contain the anode when being generated in the electroplate liquid 12
During 13 sediment, which carries out a separation of solid and liquid program.In S400 steps, since the electroplate liquid 12 is by eutectic
Solvent is formed, so the sediment mostlys come from the anode 13 of dissociation, therefore ingredient is simple and can be easily separated.In S410
In step, which includes filtering or centrifugation carries out, as long as can be by the solid (precipitation in electroplate liquid 12
Object) it is removed, it is not limited thereto；Due to 12 main component of electroplate liquid or eutectic solvent after separation, so can
It is used with continuing recycling, returns in the preelectrolysis program of step S100 or the galvanizing process of step S200 and be continuing with once again.
Then, as shown in step S420, the sediment containing anode 13 is obtained.In this step, by the removed precipitation
Object can form the powder comprising the anode 13 or its oxide through over cleaning, drying program, such as with deionized water and second
Alcohol cleans, and recycles 100 DEG C to 120 DEG C oven drying, vacuum drying or with hot blast drying.
The electro-plating method and its system of the disclosure, as electroplate liquid, do not add other any metal salts using eutectic solvent
Or additive, hardly have processing procedure waste liquid or sludge and generate, and it is mostly all recyclable reuse, at electroplate liquid
Program relative simplicity is managed, it is very friendly to environment.
The plating test (electrogalvanizing) of 1 program containing preelectrolysis of embodiment (Pt)
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by electroplate liquid
Temperature control is 100 DEG C, then, using zinc metal as anode, using platinum wire as cathode, is partly impregnated in electroplate liquid, is passed through
Outside line is connected to current supply (BK Precision DS15010), passes to 2 Ampere currents and maintains 50 minutes, makes electricity
Contain the zinc ion of about 14300ppm in plating solution.
After preelectrolysis program, cathode is hyperphoric for iron plate, and the spacing in electroplate liquid between two electrodes is set to 5 lis
Rice proceeds by galvanizing process, and plating conditions are set as imposing 2 amperes of electric current at 100 DEG C, electroplated after five minutes with regard to energy shape
Into coating.
Glossiness (Gloss Unit, GU) using each region on Grossmeters (A＆B GU62) test coating is averagely more than
60GU, the average thickness range of coating is 2.45 microns.
Plating test (electrogalvanizing) of the comparative example 1 without preelectrolysis program
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by electroplate liquid
Temperature control is 100 DEG C, then, using zinc metal as anode, using iron plate as cathode, is partly impregnated in electroplate liquid, in electricity
Spacing in plating solution between two electrodes is set to 5 centimetres, and current supply (BK Precision are connected to through outside line
DS15010), 2 Ampere currents are passed to, proceed by galvanizing process.
By electroplating after ten minutes, and have not seen apparent coating；Coating is generated when plating reaches 20 minutes, uses gloss
The glossiness in each region averagely only has 2GU to 3GU on degree meter (A＆B GU62) test coating, and the average thickness of coating is micro- for 1.3
Rice.It follows that preelectrolysis program can actually effectively promote electroplating velocity and glossiness.
Comparative example 2 adds the plating test (electrogalvanizing) of metal salt
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol is placed in electroplating bath, in addition adds again as electroplate liquid
The zinc chloride of 0.3M is 100 DEG C into electroplate liquid, and by the temperature control of electroplate liquid, then, using zinc metal as anode, with iron
Piece is partly impregnated in electroplate liquid, the spacing in electroplate liquid between two electrodes is set to 5 centimetres, through outside line as cathode
Current supply (BK Precision DS15010) is connected to, 2 Ampere currents is passed to, proceeds by galvanizing process.
It is electroplated to form coating after five minutes, use the gloss in each region on Grossmeters (A＆B GU62) test coating
Degree is averagely more than 60GU, and the average thickness range of coating is 2.2 microns.
It follows that using the galvanizing process of preelectrolysis according to embodiment 1, electroplating velocity and glossiness can actually
It is close with the electroplating quality for adding metallic salt, and electroplate liquid does not add any metal salt in embodiment 1, so follow-up electricity
The processing routine of plating solution can significantly reduce.
The plating test (electrogalvanizing) of 2 program containing preelectrolysis of embodiment (Pt)
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by electroplate liquid
Temperature control is 100 DEG C, then, using zinc metal as anode, using platinum wire as cathode, is partly impregnated in electroplate liquid, is passed through
Outside line is connected to current supply (BK Precision DS15010), passes to 2 Ampere currents and maintains 70 minutes, makes electricity
Contain the zinc ion of about 20010ppm in plating solution.
After preelectrolysis program, cathode is hyperphoric for iron plate, and the spacing in electroplate liquid between two electrodes is set to 5 lis
Rice, proceeds by galvanizing process, plating conditions are set as imposing 0.5 ampere of electric current at 100 DEG C, electroplated after twenty minutes with regard to energy
Form coating.Glossiness (Gloss Unit, GU) using each region on Grossmeters (A＆B GU62) test coating is average big
In 20GU, the average thickness range of coating is 4.5 microns.
The plating test (electrogalvanizing) of 3 program containing preelectrolysis of embodiment (Pt)
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by electroplate liquid
Temperature control is 100 DEG C, then, using zinc metal as anode, using platinum wire as cathode, is partly impregnated in electroplate liquid, is passed through
Outside line is connected to current supply (BK Precision DS15010), passes to 2 Ampere currents and maintains 30 minutes, makes electricity
Contain the zinc ion of about 8580ppm in plating solution.
After preelectrolysis program, cathode is hyperphoric for iron plate, and the spacing in electroplate liquid between two electrodes is set to 5 lis
Rice proceeds by galvanizing process, and plating conditions are set as imposing 2 amperes of electric current at 100 DEG C, electroplated after five minutes with regard to energy shape
Into coating.Glossiness (Gloss Unit, GU) using each region on Grossmeters (A＆B GU62) test coating is averagely more than
20GU, the average thickness range of coating is 1.2 microns.
The plating test (electrogalvanizing) of 4 program containing preelectrolysis of embodiment (Fe)
It is 1 to configure molar ratio:2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by electroplate liquid
Temperature control is 100 DEG C, then, using zinc metal as anode, using iron plate as cathode, is partly impregnated in electroplate liquid, through outer
Portion's connection passes to 2 Ampere currents and maintains 30 minutes, wherein iron to current supply (BK Precision DS15010)
On piece can generate coating, but coating surface is coarse, and the glossiness through measurement is less than 1GU.
Then, when containing the zinc ion of about 8500ppm in electroplate liquid, using new iron plate as cathode, it is continuing with original
Electroplate liquid, with (100 DEG C/2 amperes) progress galvanizing processes of the same terms, by glossiness after five minutes, can be generated more than 50GU's
Coating.It follows that first iron plate is equivalent to preelectrolysis program, although using ferrous metal as cathode so that part zinc from
Son is deposited on iron plate, but remaining zinc ion still can be accumulated in electroplate liquid, therefore after the completion of preelectrolysis program, second
The electroplating velocity of iron plate can be promoted effectively with glossiness.
The plating test (electronickelling) of 5 program containing preelectrolysis of embodiment (Cu)
With molar ratio 1：2 choline chloride and urea are placed in electroplating bath as electroplate liquid, and by the temperature control of electroplate liquid
90 DEG C are made as, then, using nickel metal as anode, using latten(-tin) as cathode, is partly impregnated in electroplate liquid, through outside line
Current supply is connected to, with 15 volts of voltage preelectrolysis after twenty minutes, when the nickel ion for containing about 2300ppm in electroplate liquid
When, it replaces cathode and is electroplated 10 minutes with 15 volts of voltages to be intended to brass plating piece, nickel coating can be generated on latten(-tin).
The plating test (electro-coppering) of 6 program containing preelectrolysis of embodiment (Fe)
With molar ratio 1：2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by the temperature of electroplate liquid
It controls as 30 DEG C, then, using copper metal as anode, using iron plate as cathode, is partly impregnated in electroplate liquid, through outside line
Current supply is connected to, after 0.1 Ampere currents preelectrolysis 30 minutes, when the copper ion for containing about 710ppm in electroplate liquid
When, cathode iron plate is replaced, is electroplated 5 minutes with 0.1 Ampere currents, copper coating can be generated on iron plate.
7 electroplate liquid separation of solid and liquid program of embodiment
With molar ratio 1：2 choline chloride and glycerine are placed in electroplating bath as electroplate liquid, and by the temperature of electroplate liquid
It controls as 60 DEG C, then, using zinc metal as anode, using latten(-tin) as cathode, is partly impregnated in electroplate liquid, through outer lines
Road is connected to current supply, passes to 7 volts of electric currents and maintains 80 minutes, coating can be generated on the results show latten(-tin), and electroplates
When electroplate liquid in can generate zinc particles (solid by-product) and be suspended in electroplate liquid.Then, using centrifuge (Eppendorf
Separation of solid and liquid 5810R) is carried out, centrifugation 10 minutes is carried out under 10000rpm, solid by-product is cleaned with ethyl alcohol and centrifuges 15 points
Clock, be finally evacuated it is drying for one day after, can obtain white powder.
It can determine that the mixing for zinc and zinc oxide after being analyzed with X-ray diffractometer (X-ray diffractometer, XRD)
Object, the results are shown in Figure 5；It is understood with scanning electron microscope (Scanning electron microscope, SEM) shooting
Interlock powder for sheet, the results are shown in Figure 6.Clarification electroplate liquid after centrifugation, can re-use in galvanizing process, together
Sample has electroplating effect.It, can be again through a preelectrolysis program, to increase the ion of plating metal if being intended to promote electroplating velocity
Concentration.
8 electroplate liquid separation of solid and liquid program of embodiment is used with electroplate liquid recycling
With molar ratio 1：2 choline chloride and ethylene glycol are placed in electroplating bath as electroplate liquid, and by the temperature of electroplate liquid
It controls as 100 DEG C, then, using zinc metal as anode, using platinum wire as cathode, is partly impregnated in electroplate liquid, through outside
Connection is to current supply, with (zinc ion concentration is about in electroplate liquid at this time after 2 Ampere currents preelectrolysis 70 minutes
21000ppm), replace cathode to electroplate 30 minutes for iron plate, when can generate coating on the results show iron plate, and electroplate in electroplate liquid
Zinc particles (solid by-product) can be generated to be suspended in electroplate liquid.Then, consolidated using centrifuge (Eppendorf 5810R)
Liquid separates, and centrifugation 10 minutes is carried out under 10000rpm, and solid by-product is cleaned with ethyl alcohol and centrifuged 15 minutes, and finally pumping is dry
Dry one day, it can obtain white powder.
It can determine that after being analyzed with X-ray diffractometer (X-ray diffractometer, XRD) as zinc oxide, as a result such as Fig. 7
It is shown；Understand that it is less than 100 nanometers with scanning electron microscope (Scanning electron micscope, SEM) shooting
Zinc oxide particles, the results are shown in Figure 8.
Clarification electroplate liquid after centrifugation, at 100 DEG C of temperature, then, using zinc metal as anode, using iron plate as the moon
Pole is partly impregnated in electroplate liquid, and current supply is connected to through outside line, with the plating of 2 Ampere currents after five minutes, iron plate
On can generate coating, glossiness is more than 60GU, about 2.15 microns of average thickness, it was demonstrated that this recycling electroplate liquid can re-use in
In galvanizing process.
Although the present invention is disclosed above with several preferred embodiments, however, it is not to limit the invention, any ability
Field technique personnel, without departing from the spirit and scope of the present invention, when can arbitrarily change and retouch, therefore the guarantor of the present invention
Scope is protected when subject to those as defined in claim.
Claims (19)
1. a kind of electro-plating method, which is characterized in that include：
The electroplate liquid that anode and cathode are equipped with one carries out preelectrolysis program, wherein, which is made of eutectic solvent；
And
The cathode is replaced with object to be plated, to carry out galvanizing process.
2. electro-plating method as described in claim 1, which is characterized in that the eutectic solvent includes choline chloride and hydrogen bonds
Compound.
3. electro-plating method as claimed in claim 2, which is characterized in that the hydrogeneous key compound includes urea, ethylene glycol or third
Triol.
4. electro-plating method as claimed in claim 2, which is characterized in that the molar ratio of the choline chloride and the hydrogeneous key compound
For 2：1 to 1：4.
5. electro-plating method as described in claim 1, which is characterized in that the material of the object to be plated for iron, carbon steel, allumen or
Copper.
6. electro-plating method as claimed in claim 5, which is characterized in that the cathode is identical with the material of the object to be plated.
7. electro-plating method as described in claim 1, which is characterized in that the material of the anode include selected from zinc, nickel, copper, gold,
At least one metal that silver, platinum, chromium, magnesium, lead, cobalt, aluminium and titanium are grouped.
8. electro-plating method as described in claim 1, which is characterized in that the material of the cathode includes platinum.
9. electro-plating method as described in claim 1, which is characterized in that the electric current for carrying out the preelectrolysis program is 0.1 ampere to 5
Ampere, temperature are 25 DEG C to 130 DEG C.
10. electro-plating method as described in claim 1, which is characterized in that the electric current for carrying out the galvanizing process is 0.1 ampere to 5
Ampere, temperature are 25 DEG C to 130 DEG C.
11. electro-plating method as described in claim 1, which is characterized in that when the metal ion from the anode in the electroplate liquid
When concentration is higher than a preset value, then carry out the galvanizing process, which is characterized in that the preset value is 600ppm to 30000ppm.
12. electro-plating method as described in claim 1, which is characterized in that also include when the gold from the anode in the electroplate liquid
When belonging to ion concentration and being less than a preset value, then carry out the preelectrolysis program, which is characterized in that the preset value for 600ppm extremely
30000ppm。
13. electro-plating method as described in claim 1, which is characterized in that also include and generate containing the anode in the electroplate liquid
During sediment, separation of solid and liquid program is carried out to the electroplate liquid.
14. electro-plating method as claimed in claim 13, which is characterized in that also include and be somebody's turn to do again with the separated electroplate liquid
Preelectrolysis program or the galvanizing process.
15. electro-plating method as claimed in claim 13, which is characterized in that the separation of solid and liquid program includes filtering or centrifugation.
16. a kind of electroplating system, which is characterized in that include：
Groove body；
Electroplate liquid is made of eutectic solvent and the electroplate liquid is placed in the groove body；
Anode and cathode are respectively placed in the electroplate liquid；And
Power-supply unit is electrically connected the anode and the cathode.
17. electroplating system as claimed in claim 16, which is characterized in that also comprising recovery unit, go out comprising an entrance and one
Mouthful, it is connected to the groove body.
18. electroplating system as claimed in claim 17, which is characterized in that the recovery unit includes filter device or centrifuge.
19. electroplating system as claimed in claim 16, which is characterized in that also comprising sensing unit, to measure the electroplate liquid
In the concentration of metal ions from the anode.
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| TWI662162B (en) | 2019-06-11 |
| TW201819689A (en) | 2018-06-01 |
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