CN108064420B - 异质结及由其衍生的电子器件 - Google Patents
异质结及由其衍生的电子器件 Download PDFInfo
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- CN108064420B CN108064420B CN201580081002.0A CN201580081002A CN108064420B CN 108064420 B CN108064420 B CN 108064420B CN 201580081002 A CN201580081002 A CN 201580081002A CN 108064420 B CN108064420 B CN 108064420B
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- graphene
- heterojunction
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- quantum well
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- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/GB2015/051784 WO2016203184A1 (en) | 2015-06-18 | 2015-06-18 | Heterostructures and electronic devices derived therefrom |
Publications (2)
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CN108064420A CN108064420A (zh) | 2018-05-22 |
CN108064420B true CN108064420B (zh) | 2020-06-30 |
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CN201580081002.0A Expired - Fee Related CN108064420B (zh) | 2015-06-18 | 2015-06-18 | 异质结及由其衍生的电子器件 |
Country Status (6)
Country | Link |
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US (1) | US10692977B2 (ko) |
EP (1) | EP3311410A1 (ko) |
JP (1) | JP6637526B2 (ko) |
KR (2) | KR20190108199A (ko) |
CN (1) | CN108064420B (ko) |
WO (1) | WO2016203184A1 (ko) |
Families Citing this family (28)
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EA201890167A1 (ru) * | 2015-07-13 | 2018-07-31 | Крайонано Ас | Светодиоды и фотодетекторы, сформированные из нанопроводников/нанопирамид |
EP3329509A1 (en) | 2015-07-31 | 2018-06-06 | Crayonano AS | Process for growing nanowires or nanopyramids on graphitic substrates |
US10714648B2 (en) * | 2016-01-25 | 2020-07-14 | University-Industry Cooperation Group Of Kyung Hee University | Solar cell with graphene-silicon quantum dot hybrid structure and method of manufacturing the same |
WO2018009931A1 (en) * | 2016-07-08 | 2018-01-11 | Cornell University | Transition metal chalcogenide van der waals films, methods of making same, and apparatuses and devices comprising same |
US9991122B2 (en) * | 2016-08-31 | 2018-06-05 | Micron Technology, Inc. | Methods of forming semiconductor device structures including two-dimensional material structures |
US10121932B1 (en) * | 2016-11-30 | 2018-11-06 | The United States Of America As Represented By The Secretary Of The Navy | Tunable graphene light-emitting device |
CN107634089B (zh) * | 2017-09-27 | 2019-11-19 | 中国科学院上海微系统与信息技术研究所 | 一种石墨烯-硒化铌超导异质结器件及其制备方法 |
CN109004016B (zh) * | 2018-06-04 | 2021-08-17 | 国家纳米科学中心 | 非对称范德华异质结器件、其制备方法及用途 |
US11355393B2 (en) | 2018-08-23 | 2022-06-07 | Massachusetts Institute Of Technology | Atomic precision control of wafer-scale two-dimensional materials |
US11136666B2 (en) | 2018-08-30 | 2021-10-05 | University Of Kentucky Research Foundation | Ordered nanotubes on a two-dimensional substrate consisting of different material properties |
JP2021536700A (ja) * | 2018-09-07 | 2021-12-27 | グラフオーディオ・インコーポレイテッド | 透明な静電式変換器 |
KR102250011B1 (ko) * | 2018-10-18 | 2021-05-10 | 한양대학교 산학협력단 | 막 구조체, 소자 및 멀티레벨 소자 |
JP7196547B2 (ja) | 2018-11-08 | 2022-12-27 | 富士通株式会社 | 光検出素子、光センサ、及び光検出素子の製造方法 |
CN109473522B (zh) * | 2018-11-28 | 2020-07-07 | 华灿光电(浙江)有限公司 | 一种氮化镓基发光二极管外延片及其制备方法 |
US11152542B2 (en) * | 2018-12-19 | 2021-10-19 | Purdue Research Foundation | Semiconductor device and method of making the same |
KR102140775B1 (ko) * | 2019-02-22 | 2020-08-04 | 재단법인 나노기반소프트일렉트로닉스연구단 | 그래핀 적층체, 그의 제조방법 및 그를 포함하는 유기전자소자 |
KR102239885B1 (ko) * | 2019-03-29 | 2021-04-12 | 연세대학교 산학협력단 | 헤테로 구조의 적층 박막, 헤테로 구조의 적층 박막의 제조 방법 및 헤테로 구조의 적층 박막을 포함하는 반도체 소자 |
US10505063B1 (en) * | 2019-05-24 | 2019-12-10 | Mathew M. Zuckerman | Graphene and hexagonal boron nitride van der waals heterostructured solar energy processing unit (SPU) |
US20200373451A1 (en) * | 2019-05-24 | 2020-11-26 | Seven Z's Trust | Graphene and hexagonal boron nitride van der waals heterostructured solar energy processing unit (SPU) |
CN110429174B (zh) * | 2019-08-14 | 2021-11-05 | 孙旭阳 | 石墨烯/掺杂二维层状材料范德瓦尔斯异质结超导复合结构、超导器件及其制备方法 |
CN113036043B (zh) * | 2019-12-24 | 2022-05-27 | Tcl科技集团股份有限公司 | 量子点发光二极管及其制备方法 |
US11908894B2 (en) | 2020-04-10 | 2024-02-20 | The Board Of Trustees Of The University Of Illinois | Deformable electronic device and method of making a deformable electronic device |
US11705200B2 (en) | 2020-06-10 | 2023-07-18 | National University of Singapore and | Van der Waals heterostructure memory device and switching method |
KR102319613B1 (ko) * | 2020-09-04 | 2021-10-29 | 서울대학교산학협력단 | 2차원 물질을 이용한 페로브스카이트 유연 투명 태양전지 |
KR20220040536A (ko) * | 2020-09-23 | 2022-03-31 | 삼성전자주식회사 | 부성 미분 저항 소자 |
US20230066449A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor, manufacturing method of semiconductor device, and manufacturing method of hbnc layer |
PL442275A1 (pl) * | 2022-09-14 | 2024-03-18 | Politechnika Warszawska | Sposób selektywnego wzrostu heterostruktur van der Waalsa na podłożu grafenowym metodą chemicznego osadzania z fazy gazowej z wykorzystaniem naświetlania wiązką elektronową oraz heterostruktura wytworzona tym sposobem |
CN115683440B (zh) * | 2022-11-18 | 2023-11-03 | 哈尔滨工业大学 | 一种高分辨力石墨烯异质结气压传感器 |
Citations (1)
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US20150083206A1 (en) * | 2012-03-22 | 2015-03-26 | The University Of Manchester | Photovoltaic cells |
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Non-Patent Citations (2)
Title |
---|
Light-emitting diodes by band-structure engineering in van der Waals heterostructures;F. WITHERS等;《NATURE MATERIALS》;20150202;第14卷(第3期);第301-306页 * |
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