CN108063016B - 一种集成电路导电胶膜用复合导电粒子及其制备方法 - Google Patents
一种集成电路导电胶膜用复合导电粒子及其制备方法 Download PDFInfo
- Publication number
- CN108063016B CN108063016B CN201711429148.7A CN201711429148A CN108063016B CN 108063016 B CN108063016 B CN 108063016B CN 201711429148 A CN201711429148 A CN 201711429148A CN 108063016 B CN108063016 B CN 108063016B
- Authority
- CN
- China
- Prior art keywords
- conducting particles
- integrated circuit
- adhesive film
- composite conducting
- conductive adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2325/02—Homopolymers or copolymers of hydrocarbons
- C08J2325/04—Homopolymers or copolymers of styrene
- C08J2325/06—Polystyrene
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- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711429148.7A CN108063016B (zh) | 2017-12-26 | 2017-12-26 | 一种集成电路导电胶膜用复合导电粒子及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711429148.7A CN108063016B (zh) | 2017-12-26 | 2017-12-26 | 一种集成电路导电胶膜用复合导电粒子及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108063016A CN108063016A (zh) | 2018-05-22 |
CN108063016B true CN108063016B (zh) | 2019-12-03 |
Family
ID=62140248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711429148.7A Active CN108063016B (zh) | 2017-12-26 | 2017-12-26 | 一种集成电路导电胶膜用复合导电粒子及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN108063016B (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104334327A (zh) * | 2012-04-19 | 2015-02-04 | 氰特科技股份有限公司 | 复合材料 |
CN105139920A (zh) * | 2015-09-25 | 2015-12-09 | 京东方科技集团股份有限公司 | 一种导电颗粒及其制备方法、导电胶、显示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7083859B2 (en) * | 2003-07-08 | 2006-08-01 | Hitachi Chemical Co., Ltd. | Conductive powder and method for preparing the same |
JP3879749B2 (ja) * | 2003-07-08 | 2007-02-14 | 日立化成工業株式会社 | 導電粉及びその製造方法 |
-
2017
- 2017-12-26 CN CN201711429148.7A patent/CN108063016B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104334327A (zh) * | 2012-04-19 | 2015-02-04 | 氰特科技股份有限公司 | 复合材料 |
CN105139920A (zh) * | 2015-09-25 | 2015-12-09 | 京东方科技集团股份有限公司 | 一种导电颗粒及其制备方法、导电胶、显示装置 |
Also Published As
Publication number | Publication date |
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CN108063016A (zh) | 2018-05-22 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191111 Address after: Wenling RuoHeng town Taizhou city Zhejiang province 317500 Peng Lin Cun school No. 68 East Applicant after: ZHEJIANG DOUDOUBAO TRADITIONAL CHINESE MEDICINE RESEARCH Co.,Ltd. Address before: Qingyang District of Chengdu City, Sichuan province 610091 Dragon Industrial Port East Road 4 Applicant before: CHENDU NEW KELI CHEMICAL SCIENCE Co.,Ltd. CHINA |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A composite conductive particle for conductive adhesive film of integrated circuits and its preparation method Effective date of registration: 20230925 Granted publication date: 20191203 Pledgee: Bank of Taizhou Wenling RuoHeng sub branch Pledgor: ZHEJIANG DOUDOUBAO TRADITIONAL CHINESE MEDICINE RESEARCH Co.,Ltd. Registration number: Y2023980058737 |