CN108060341B - A kind of high tenacity Ni50Mn25Ga25Memorial alloy and preparation method thereof - Google Patents
A kind of high tenacity Ni50Mn25Ga25Memorial alloy and preparation method thereof Download PDFInfo
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- CN108060341B CN108060341B CN201711422646.9A CN201711422646A CN108060341B CN 108060341 B CN108060341 B CN 108060341B CN 201711422646 A CN201711422646 A CN 201711422646A CN 108060341 B CN108060341 B CN 108060341B
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 44
- 239000000956 alloy Substances 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000000843 powder Substances 0.000 claims abstract description 36
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000000498 ball milling Methods 0.000 claims abstract description 6
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 6
- 239000010439 graphite Substances 0.000 claims abstract description 6
- 238000010907 mechanical stirring Methods 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 7
- 239000002994 raw material Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 38
- 239000011572 manganese Substances 0.000 description 37
- 239000000463 material Substances 0.000 description 9
- 238000002156 mixing Methods 0.000 description 6
- 230000005291 magnetic effect Effects 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000000280 densification Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 229910000807 Ga alloy Inorganic materials 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005294 ferromagnetic effect Effects 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910000734 martensite Inorganic materials 0.000 description 2
- 230000003446 memory effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 239000012781 shape memory material Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
Abstract
The present invention relates to a kind of memorial alloy and preparation method thereof, especially a kind of high tenacity Ni50Mn25Ga25Memorial alloy and preparation method thereof, high tenacity Ni of the invention50Mn25Ga25Memorial alloy is prepared as follows: according to atomic percent feeding, being uniformly mixed by mechanical stirring, is then carried out ball milling, finally the powder of acquisition is put into graphite jig and is sintered, high tenacity Ni is made50Mn25Ga25Memorial alloy.Ni prepared by the present invention50Mn25Ga25Alloy has higher breaking strength, breaking strain, and good toughness, intensity is big.
Description
Technical field
The invention belongs to field of memory alloy, and in particular to a kind of high tenacity Ni50Mn25Ga25Memorial alloy and its preparation side
Method.
Background technique
Ni-Mn-Ga marmem is a kind of novel intelligent ferromagnetic shape memory material, has thermo elastic martensite concurrently
Phase transformation and ferromagnetic transition not only have conventional shape-memory alloy shape memory effect temperature controlled, but also can be
Shape memory effect is generated under magnetic fields.The response frequency of its magneto-shape-memory effect is strained close to piezoelectric ceramics, output
It is a kind of intellectual material of great future in engineering applications close to traditional temperature control marmem.Because its unique feature makes
It is also widely applied in terms of driver and sensor.But Ni-Mn-Ga block materials still have that brittleness is big, intensity
The disadvantages of low and restoring force is small, significantly limits engineer application and its development of the material.These become Magnetic driving memory and close
The main bottleneck of gold application and development.Therefore so how to improve the intensity of alloy, brittleness is reduced, improves alloy mechanical performance,
Obtain big magnetic entropy change and giant magnetoresistance effect, it has also become the main direction of studying of memorial alloy application and development.
Summary of the invention
In order to overcome existing Ni-Mn-Ga alloy system brittleness big, the defects such as intensity is low, the present invention provides one kind and passes through powder
The method preparation Ni that last metallurgy and hot pressed sintering combine50Mn25Ga25The method of Magnetic Memory alloy, it is strong that the method achieve fine grains
Change, significantly changes alloy transformation temperature and improve its mechanical performance and physical property.
The technical solution adopted by the present invention to solve the technical problems is: a kind of high tenacity Ni50Mn25Ga25Memorial alloy
Preparation method, according to atomic percent take 50 parts of Ni powder, 25 parts of Mn powder, 25 parts of Ga powder pass through mechanical stirring mix
Uniformly, the powder of acquisition, is finally put into graphite jig and is sintered by the ball milling for then carrying out 12-20 hours, is made
Ni50Mn25Ga25Memorial alloy；The grain size of powder is within 100 microns.
Further, the placement order of raw material is as follows: placing the Ga powder of low melting point first, then places the Mn of high volatile
Powder finally places Ni powder.
Further, the process conditions of sintering are as follows: pressure is 200 kilograms, vacuum degree 10-3-10-4Pa, temperature are
1300 DEG C or 1400 DEG C or 1500 DEG C, the time is 10 minutes.
Further, the sintering method is vacuum heating-press sintering.
Another object of the present invention is a kind of high tenacity Ni that above method preparation is claimed50Mn25Ga25Memory is closed
Gold.
The process of hot-pressed material densification includes Plastic Flow, VISCOUS FLOW and diffusion and creep, when with plasticity and viscosity
When leading densification mechanism based on flowing into, body of powder is able to quick densifying, and obtains controllable microstructure.The advantage of pressure sintering
Although be equipment investment is small, pressure compared with etc. the low an order of magnitude of static pressure but due in hot press pressure-bearing material can attenuate, from
And longitudinal heat flux is limited, the material for improving the uniformity of workpiece temperature field, greatly reducing energy consumption, major diameter being prepared
Material can effectively control the densification process and quality of material with IT technology observing and controlling hot press.Hot pressed sintering is to utilize thermal energy
The process for densifying product with mechanical energy.The characteristic of this process is that sintering temperature can be burnt according to the size of impressed pressure than normal pressure
Low about 200 DEG C -400 DEG C are tied, while the speed that additional energy densifies product is accelerated, therefore completely fine and close and crystal grain
Careful product can be completed in lower temperature and in the shorter time；And vacuum heating-press sintering is used, due in hot pressing
Higher vacuum degree is maintained, the sintering temperature of product can be effectively further reduced and efficiently excludes the gas in Minute pores
Body, to further promote the densification process of hot-pressed material.
The polycrystal that Ni-Mn-Ga alloy is made of many crystal grain, experiment show that fine grain metal is than thick at normal temperature
Grained metals have higher intensity, hardness, plasticity and toughness.In addition, crystal grain is thinner, grain boundary area is bigger, and crystal boundary is more tortuous, more
It is unfavorable for the extension of crackle.In general, not only intensity is high for fine grain sample, and toughness, refined crystalline strengthening can significantly change
Become alloy transformation temperature and improves its mechanical performance and physical property.
The marmem Ni that the method for the present invention is prepared50Mn25Ga25Different from existing magnetic shape memory alloy
Ni50Mn25Ga25, and Ni prepared by the present invention is had the advantage that by comparison50Mn25Ga25Alloy fracture intensity is in 1600-
Between 1960MPa, than existing Ni50Mn25Ga25Alloy improves about 1000-1300Mpa；Ni prepared by the present invention50Mn25Ga25It closes
Jin Jing's particle size is tiny, about at 20-50 microns, and as the crystallite dimension of the increase alloy of sintering temperature is increased slightly；This
The alloy fracture strain of invention preparation compares existing Ni50Mn25Ga25Alloy fracture strain improves 300-500%, that is to say, that
Bright Ni prepared by the present invention50Mn25Ga25Alloy ductility is big.
Detailed description of the invention
Fig. 1 (a) is the high tenacity Ni that alloy sintering temperature prepared by embodiment 1 is 1300 DEG C50Mn25Ga25Scanning electricity
Sub- micrograph；
Fig. 1 (b) is the high tenacity Ni that alloy sintering temperature prepared by embodiment 2 is 1400 DEG C50Mn25Ga25Scanning electricity
Sub- micrograph；
Fig. 1 (c) is the high tenacity Ni that alloy sintering temperature prepared by embodiment 3 is 1500 DEG C50Mn25Ga25Scanning electron
Micrograph；
Fig. 2 is Ni50Mn25Ga25The XRD spectrum of alloy, wherein 1,2 and 3 respectively represent sintering temperature be 1300 DEG C, 1400
DEG C and the Ni for preparing of 1500 DEG C of whens50Mn25Ga25The XRD curve of alloy；
Fig. 3 is Ni50Mn25Ga25The DSC map of alloy, wherein 1,2 and 3 respectively represent sintering temperature be 1300 DEG C, 1400
DEG C and the Ni for preparing of 1500 DEG C of whens50Mn25Ga25The heating curves of the DSC of alloy；4,5 and 6 respectively represent sintering temperature be 1300
DEG C, Ni prepared by 1400 DEG C and 1500 DEG C whens50Mn25Ga25The cooling curve of the DSC of alloy；
Fig. 4 is Ni under different sintering temperatures50Mn25Ga25The room temperature compression strain curve of alloy.
Specific embodiment
Embodiment 1
High tenacity Ni50Mn25Ga25Memorial alloy is prepared as follows: 50 parts of Ni is taken according to atomic percent
Powder, 25 parts of Mn powder, 25 parts of Ga powder are put into ball mill, are placed the Ga powder of low melting point first, are subsequently placed with high volatile
Mn powder is finally placed Ni powder, is carried out again after mixing ball milling 12-20 hours by mechanical stirring.Then by the mixing of acquisition
Uniformly and powder of the grain size control within 100 microns is put into graphite jig and is sintered.The technique of sintering is: applying pressure is
200 kilograms, vacuum degree 10-4Pa, sintering temperature are 1300 DEG C, and sintering time is 10 minutes；Obtain high tenacity
Ni50Mn25Ga25Memorial alloy.
Embodiment 2
High tenacity Ni50Mn25Ga25Memorial alloy is prepared as follows: 50 parts of Ni is taken according to atomic percent
Powder, 25 parts of Mn powder, 25 parts of Ga powder are put into ball mill, are placed the gallium powder of low melting point first, are subsequently placed with high volatile
Manganese powder finally places nickel powder, carries out again after mixing ball milling 12-20 hours by mechanical stirring.Then by the mixing of acquisition
Uniformly and powder of the grain size control within 100 microns is put into graphite jig and is sintered.The technique of sintering is: applying pressure is
200 kilograms, vacuum degree 10-3Pa, sintering temperature are 1400 DEG C, and sintering time is 10 minutes；Obtain high tenacity
Ni50Mn25Ga25Memorial alloy.
Embodiment 3
High tenacity Ni50Mn25Ga25Memorial alloy is prepared as follows: 50 parts of Ni is taken according to atomic percent
Powder, 25 parts of Mn powder, 25 parts of Ga powder are put into ball mill, are placed the gallium powder of low melting point first, are subsequently placed with high volatile
Manganese powder finally places nickel powder, carries out again after mixing ball milling 12-20 hours by mechanical stirring.Then by the mixing of acquisition
Uniformly and powder of the grain size control within 100 microns is put into graphite jig and is sintered.The technique of sintering is: applying pressure is
200 kilograms, vacuum degree 10-3Pa, sintering temperature are 1500 DEG C, and sintering time is 10 minutes；Obtain high tenacity
Ni50Mn25Ga25Memorial alloy.
Ni prepared by the present invention50Mn25Ga25Memorial alloy crystallite dimension is smaller, at 50 microns hereinafter, martensitic traoformation
Temperature is more than room temperature, and Ni prepared by the present invention50Mn25Ga25The existing Ni of alloy ratio50Mn25Ga25The breaking strength of alloy mentions
High about 1000-1300Mpa, breaking strain compare existing Ni50Mn25Ga25Alloy improves 300-500%.
Claims (3)
1. a kind of high tenacity Ni50Mn25Ga25The preparation method of memorial alloy, which is characterized in that take 50 parts according to atomic percent
Ni powder, 25 parts of Mn powder, 25 parts of Ga powder be uniformly mixed by mechanical stirring, then carry out 12-20 hours ball millings, finally
The powder of acquisition is put into graphite jig and is sintered, Ni is made50Mn25Ga25Memorial alloy；The grain size of the powder exists
Within 100 microns；The placement order of raw material is as follows: then placement Ga powder first places Mn powder, finally places Ni powder；The burning
The process conditions of knot are as follows: pressure is 200 kilograms, vacuum degree 10-3-10-4Pa, temperature be 1300 DEG C or 1400 DEG C or 1500 DEG C,
Time is 10 minutes.
2. a kind of high tenacity Ni according to claim 150Mn25Ga25The preparation method of memorial alloy, which is characterized in that institute
The sintering method stated is vacuum heating-press sintering.
3. a kind of high tenacity Ni50Mn25Ga25Memorial alloy, which is characterized in that be prepared according to method of claim 1
's.
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| CN108950277A (en) * | 2018-08-02 | 2018-12-07 | 大连大学 | A kind of method of combustion reaction high―temperature nuclei NiMnGa Magnetic Memory alloy |
| CN109371473A (en) * | 2018-11-20 | 2019-02-22 | 北京航空航天大学 | A kind of method that twin in NiMnGa monocrystalline is eliminated in power thermal coupling |
| CN110923510B (en) * | 2019-12-16 | 2021-08-31 | 大连大学 | Preparation method of high preferred orientation NiMnGa magnetic memory alloy wire |
| CN111041259A (en) * | 2019-12-18 | 2020-04-21 | 大连大学 | Preparation method of high-strength Mn-Ni-Ga magnetic memory alloy |
| CN110983134A (en) * | 2019-12-18 | 2020-04-10 | 大连大学 | Preparation method of Mn-Ni-Ga magnetic memory alloy with high saturation magnetization |
| CN110994516A (en) * | 2019-12-27 | 2020-04-10 | 广东电网有限责任公司电力科学研究院 | Drainage plate |
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| CN102952982A (en) * | 2012-11-20 | 2013-03-06 | 无锡常安通用金属制品有限公司 | Low-temperature memory alloy and preparation method of low-temperature memory alloy |
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Application publication date: 20180522 Assignee: ZYBODY CO.,LTD. Assignor: DALIAN University Contract record no.: X2023210000200 Denomination of invention: A high toughness Ni50Mn25Ga25memory alloy and its preparation method Granted publication date: 20190927 License type: Common License Record date: 20231127 |
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