CN108057581B - Gluing equipment, spray head assembly thereof and gluing method - Google Patents
Gluing equipment, spray head assembly thereof and gluing method Download PDFInfo
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- CN108057581B CN108057581B CN201810093747.4A CN201810093747A CN108057581B CN 108057581 B CN108057581 B CN 108057581B CN 201810093747 A CN201810093747 A CN 201810093747A CN 108057581 B CN108057581 B CN 108057581B
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- gluing
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- gluing nozzle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0291—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work the material being discharged on the work through discrete orifices as discrete droplets, beads or strips that coalesce on the work or are spread on the work so as to form a continuous coating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/023—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/04—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface with blades
- B05C11/048—Scrapers, i.e. metering blades having their edge oriented in the upstream direction in order to provide a reverse angle of attack
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
- B05C5/0275—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve
- B05C5/0279—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated flow controlled, e.g. by a valve independently, e.g. individually, flow controlled
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- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses gluing equipment and a spray head assembly thereof, wherein the spray head assembly comprises a support bracket, a first gluing spray head, a second gluing spray head and a leveling element, wherein the first gluing spray head, the second gluing spray head and the leveling element are assembled on the support bracket; in the gluing advancing direction, the first gluing nozzle is positioned in front of the second gluing nozzle, the leveling element is positioned behind the second gluing nozzle, and the leveling element is used for leveling glue solution sprayed out of the first gluing nozzle and the second gluing nozzle. The invention also discloses a gluing method, which is used for gluing the connecting position between the first object and the second object which are connected in an overlapped way by applying the gluing equipment. The invention can improve the flatness of gluing, ensure that the gluing thickness is more uniform and improve the quality of products.
Description
Technical Field
The invention relates to the technical field of display manufacturing, in particular to gluing equipment and a spray head assembly thereof, and further relates to a gluing method using the gluing equipment.
Background
Chip On Film (COF), a die attach film (COF) for mounting an IC on a flexible circuit board, is used in a Chip packaging technology for a plurality of display devices, such as LCD, OLED, etc. Such a chip is used as a Source Driver (Source Driver) and a Gate Driver (Gate Driver) for display driving in many cases. Referring to fig. 1, in the driving circuit, one end of a chip on film 1 is connected to a Printed Circuit Board (PCB)2 for receiving data signals transmitted from the PCB, and the other end is connected to a display Panel (Panel)3 for transmitting data signals output by an IC to the display Panel 3 to drive the display Panel 3 to display. The connection between the printed circuit board 2 and the display panel 3 through the chip on Film 1 is completed through a Bonding process, specifically, through a hot pressing process, the printed circuit board 2 and the display panel 3 are respectively connected to two ends of the chip on Film 3 through Anisotropic Conductive Film (ACF), so as to form a circuit loop for driving the display panel 3.
After the bonding process between the chip on film 1 and the printed circuit board 2 and the display panel 3 is completed, UV glue or Tuffy glue is usually coated on the lap joint step area 4 between the chip on film 1 and the printed circuit board 2 and the display panel 3, so that the final display product can avoid the bad circuit of the part caused by the corrosion of the routing and the aging of the conductive glue under the environment of high temperature and high humidity, and the connection strength between the chip on film 1 and the printed circuit board 2 and the display panel 3 can be improved.
Referring to fig. 2a-2c and fig. 3, taking the application of UV glue or non-glue to the step zone 4 between the flip chip 1 and the display panel 3 as an example, the glue coating process in the prior art is to apply glue solution 6 by using a spray gun 5 to move back and forth along the step zone 4 (as shown in the direction X1 in fig. 2a-2 c), and then to cure the glue solution 6 to form cured glue 7. In the gluing process of the prior art, the flatness of the finally formed glue body 7 cannot be guaranteed, and the thickness uniformity is poor, particularly in the edge area 8 where the spray gun 5 is folded back, the glue body 6 is coated in an overlapping way, and as shown in fig. 3, the finally cured glue body 7 forms a convex angle 9 in the edge area. The convex angle 9 not only affects the appearance of the product, but also easily scratches the convex angle 9 in the subsequent production process to damage the colloid 7, thereby reducing the protective performance of the colloid 7. Further, the thickness of the convex angle 9 may be larger than that of the flip chip package 1 and may protrude from the surface of the flip chip package 1, so that the convex angle 9 interferes with other structural members in the subsequent assembly process, thereby causing poor product.
Disclosure of Invention
In view of the defects of the prior art, the invention provides a gluing device and a nozzle assembly thereof, which are used for solving the problems of poor gluing flatness and uneven thickness of a connection area of a chip on film.
In order to achieve the purpose, the invention adopts the following technical scheme:
a spray head assembly of a gluing device comprises a support bracket, a first gluing spray head, a second gluing spray head and a leveling element, wherein the first gluing spray head, the second gluing spray head and the leveling element are assembled on the support bracket; in the gluing advancing direction, the first gluing nozzle is positioned in front of the second gluing nozzle, the leveling element is positioned behind the second gluing nozzle, and the leveling element is used for leveling glue solution sprayed out of the first gluing nozzle and the second gluing nozzle.
The nozzle assembly further comprises a guide unit connected to the support bracket, and the guide unit drives the support bracket to move so as to control the first gluing nozzle and the second gluing nozzle to glue along a predetermined path.
Wherein the leveling element is a troweling brush.
Wherein the leveling element is a doctor blade.
The invention provides a gluing device, which comprises:
the working base is used for bearing an object to be coated with glue;
the spray head assembly is arranged above the working base station and used for coating the object to be coated with glue;
a glue solution storage unit which is respectively connected with the first gluing nozzle and the second gluing nozzle and is used for supplying glue solution to the first gluing nozzle and the second gluing nozzle;
and the glue coating amount control unit is respectively connected with the first glue coating spray head and the second glue coating spray head and is used for controlling the glue output amount of the first glue coating spray head and the second glue coating spray head.
The working base platform is a vacuum adsorption platform to adsorb and fix the object to be coated with glue.
The present invention also provides a glue application method for applying glue to a lap step region between a first object and a second object lap-joined to each other, wherein the glue application method comprises:
providing a gluing device as described above;
fixing the first object and the second object which are connected with each other in a lap joint mode on the working base platform;
setting a gluing path in the lap joint step area;
controlling the first gluing nozzle and the second gluing nozzle to move back and forth along the gluing path to spray glue solution, and leveling the sprayed glue solution by the leveling element;
and curing the glue solution after finishing spraying and leveling.
The first object is a chip on film, and the second object is a display panel or a flexible circuit board or a printed circuit board.
Wherein the glue solution is UV glue or graph non-glue.
The technical process of spraying the glue solution on the gluing path specifically comprises the following steps:
s100, controlling the first gluing nozzle and the second gluing nozzle to move from the first end to the second end of the gluing path and spraying glue solution;
s200, when the first gluing nozzle is about to reach the edge of the second end of the gluing path, controlling the glue output of the first gluing nozzle to gradually decrease and controlling the glue output of the second gluing nozzle to correspondingly increase so as to keep the total glue output of the first gluing nozzle and the second gluing nozzle unchanged;
s300, when the first gluing nozzle reaches the second end edge of the gluing path, controlling the first gluing nozzle to stop spraying glue solution, and when the second gluing nozzle reaches the second end edge of the gluing path, controlling the second gluing nozzle to stop spraying glue solution;
s400, reversing the direction of a spray head assembly, controlling the first gluing spray head and the second gluing spray head to move from the second end of the gluing path to the first end, and spraying glue solution;
s500, when the first gluing nozzle is about to reach the edge of the first end of the gluing path, controlling the glue output of the first gluing nozzle to gradually decrease and controlling the glue output of the second gluing nozzle to correspondingly increase so as to keep the total glue output of the first gluing nozzle and the second gluing nozzle unchanged;
s600, when the first gluing nozzle reaches the first end edge of the gluing path, controlling the first gluing nozzle to stop spraying glue solution, and when the second gluing nozzle reaches the first end edge of the gluing path, controlling the second gluing nozzle to stop spraying glue solution;
and S700, repeating the steps S100-S600, and reciprocating for many times between the first end and the second end of the gluing path to finish the technological process of spraying glue solution.
According to the gluing equipment and the spray head assembly thereof provided by the embodiment of the invention, the spray head assembly is provided with the first gluing spray head, the second gluing spray head and the leveling element, gluing is sequentially carried out in the gluing area through the first gluing spray head and the second gluing spray head, so that the glue solution is more uniformly distributed, and further, the leveling element is used for leveling the coated glue solution, so that the gluing flatness is improved, the gluing thickness is more uniform, and the product quality is improved.
Drawings
FIG. 1 is a schematic structural diagram of the interconnection of a conventional COF with a printed circuit board and a display panel;
FIGS. 2a-2c are schematic diagrams of a prior art bonding process for bonding the bonding area of the COF;
FIG. 3 is a schematic diagram of a prior art structure for forming a cured adhesive on the connection region of a COF;
FIG. 4 is a schematic structural diagram of a gluing device provided by an embodiment of the invention;
FIG. 5 is a schematic structural diagram of a nozzle assembly of the glue spreading apparatus according to the embodiment of the invention;
FIG. 6 is a top view of a nozzle assembly of the glue spreading apparatus provided by the embodiment of the invention;
FIGS. 7a-7e are diagrams illustrating the structure of the connection region of the COF on the chip package according to the embodiment of the present invention;
fig. 8 is a schematic structural diagram illustrating a structure of forming a cured encapsulant on the connection region of the chip on film according to the embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. Examples of these preferred embodiments are illustrated in the accompanying drawings. The embodiments of the invention shown in the drawings and described in accordance with the drawings are exemplary only, and the invention is not limited to these embodiments.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the scheme according to the present invention are shown in the drawings, and other details not so relevant to the present invention are omitted.
The present embodiment provides a gluing apparatus, as shown in fig. 4, the gluing apparatus includes a work base 100, a nozzle assembly 200, a glue solution storage unit 300, and a glue application amount control unit 400.
The working base 100 is used for carrying an object 500 to be glued. Specifically, the working base 100 is a vacuum adsorption platform, and the object 500 to be coated is adsorbed and fixed by the action of vacuum adsorption force.
The nozzle assembly 200 is disposed above the working base 100, and is configured to apply glue to the object 500 to be glued.
The glue solution storage unit 300 is connected to the nozzle assembly 200, and is configured to store a glue solution and supply the glue solution to the nozzle assembly 200.
The glue amount control unit 400 is connected to the nozzle assembly 200 and is configured to control a glue amount of the nozzle assembly 200 during gluing.
In order to improve the smoothness of the glue application, the present embodiment provides a nozzle assembly 200, and referring to fig. 5 and 6, the nozzle assembly 200 includes a support bracket 10, and a first glue nozzle 20, a second glue nozzle 30 and a leveling member 40 mounted on the support bracket 10. Wherein, in the direction of glue travel (direction X2 in fig. 5), the first glue nozzle 20 is located in front of the second glue nozzle 30 and the smoothing element 40 is located behind the second glue nozzle 30. The first gluing nozzle 20 and the second gluing nozzle 30 are used for applying glue, and the leveling element 40 is used for leveling the glue sprayed from the first gluing nozzle 20 and the second gluing nozzle 30.
In particular, the smoothing element 40 can be chosen as a smoothing brush or a scraper.
Further, the head assembly 200 further comprises a guide unit 50, the guide unit 50 being connected to the support bracket 10, the guide unit 50 moving the support bracket 10 to control the first and second glue nozzles 20 and 30 to apply glue along a predetermined path. Moreover, the guide unit 50 also serves to turn the head assembly 200 towards to ensure that, in the direction of glue travel, the first glue head 20 is located in front of the second glue head 30, while the leveling element 40 remains behind the second glue head 30.
As shown in fig. 4, in the gluing device, the glue solution storage unit 300 is respectively connected to the first gluing nozzle 20 and the second gluing nozzle 30, for example, by a rubber tube. The glue solution storage unit 300 supplies glue solution to the first and second gluing nozzles 20 and 30. The glue amount control unit 400 is connected to the first glue nozzle 20 and the second glue nozzle 30, respectively, and the glue amount control unit 400 controls the glue amount of the first glue nozzle 20 and the second glue nozzle 30 during glue solution coating, for example, by controlling the pressure of the spray to control the glue amount, or by controlling a valve.
As in the gluing device and the nozzle assembly thereof provided in the above embodiments, the nozzle assembly 200 is provided with the first gluing nozzle 20, the second gluing nozzle 30 and the leveling element 40, and gluing is performed in the gluing area sequentially through the first gluing nozzle 20 and the second gluing nozzle 30, so that the glue solution is distributed more uniformly. Further, the leveling element 40 is arranged behind the first gluing nozzle 20 and the second gluing nozzle 30, and the leveling element 40 is used for leveling the coated glue solution, so that the gluing flatness is improved, the gluing thickness is more uniform, and the product quality is improved.
Based on the same conception and thought, the invention also provides a gluing method, and gluing is carried out by applying the gluing equipment provided in the embodiment of the invention. Referring to fig. 7a-7e, the glue application method is used to apply glue to a lap step region 503 between a first object 501 and a second object 502 that are lap-joined to each other. In the manufacturing process of the display device, after a Chip On Film (COF) bonding process is completed, the adhesive coating method may be applied to coat adhesive on a connection region of the COF, where the first object 501 is the COF, and the second object 502 is a display Panel (Panel) or a flexible printed circuit board (FPC) or a Printed Circuit Board (PCB).
In this embodiment, referring to fig. 7a to 7e and combining fig. 4 and fig. 5, a description is given by taking the adhesive coating of the lap step region 503 between the flip chip film and the display panel as an example, that is, the first object 501 is the flip chip film, the second object 502 is the display panel, and the adhesive coating method includes the steps of:
s1, providing the gluing device according to the above embodiment of the present invention, as shown in fig. 4, the gluing device includes a working base 100, a nozzle assembly 200, a glue solution storage unit 300, and a glue application amount control unit 400.
S2, the first object 501 and the second object 502 are fixed to the work base 100.
S3, setting the glue application path 504 in the lap step area 503.
S4, controlling the nozzle assembly 200 to perform the glue application in the glue application path 504. The method specifically comprises the following steps: the first glue application nozzle 20 and the second glue application nozzle 30 of the nozzle assembly 200 are controlled to reciprocate along the glue application path 504 (X2 in fig. 7a-7e indicates the glue application direction) to apply the glue 60, and the applied glue 60 is leveled by the leveling member 40 during the glue application process. In this embodiment, the glue solution 60 is a UV glue or a patterned non-glue.
Specifically, the process of step S4 specifically includes the steps of:
s100, referring to fig. 7a, the first and second glue nozzles 20 and 30 of the control nozzle assembly 200 move from the first end a toward the second end B of the glue application path 504 and spray the glue 60.
S200, as shown in fig. 7a and 7B, when the first glue nozzle 20 is about to reach the edge of the second end B of the glue spreading path 504, controlling the glue discharging amount of the first glue nozzle 20 to gradually decrease and controlling the glue discharging amount of the second glue nozzle 30 to correspondingly increase, so that the total glue discharging amounts of the first glue nozzle 20 and the second glue nozzle 30 are not changed.
S300, as shown in fig. 7B, when the first glue nozzle 20 reaches the edge of the second end B of the glue applying path 504, controlling the first glue nozzle 20 to stop spraying the glue solution 60, and when the second glue nozzle 30 reaches the edge of the second end B of the glue applying path 504, controlling the second glue nozzle 30 to stop spraying the glue solution 60.
S400, referring to fig. 7c, the orientation of the nozzle assembly 200 is reversed, and the first glue nozzle 20 and the second glue nozzle 30 are controlled to move from the second end B of the glue application path 504 to the first end a and to spray the glue 60.
S500, as shown in fig. 7c and 7d, when the first glue nozzle 20 is about to reach the edge of the first end a of the glue applying path 504, controlling the glue discharging amount of the first glue nozzle 20 to gradually decrease and controlling the glue discharging amount of the second glue nozzle 30 to correspondingly increase, so that the total glue discharging amounts of the first glue nozzle 20 and the second glue nozzle 30 are not changed.
S600, as shown in fig. 7d, when the first glue nozzle 20 reaches the edge of the first end a of the glue applying path 504, the first glue nozzle 20 is controlled to stop spraying the glue solution 60, and when the second glue nozzle 30 reaches the edge of the first end a of the glue applying path, the second glue nozzle 30 is controlled to stop spraying the glue solution 60.
S700, referring to fig. 7e, turning the direction of the nozzle assembly 200, and controlling the first glue nozzle 20 and the second glue nozzle 30 to move from the first end a to the second end B of the glue applying path 504 again and spray the glue solution 60, that is, repeating the steps S100 to S600, and repeating the steps between the first end a and the second end B of the glue applying path 504 for multiple times to complete the process of spraying the glue solution.
S5, referring to fig. 8, the glue solution 60 after the spraying and leveling is cured to form a cured glue 70 in the step area between the first object 501 and the second object 502. The cured encapsulant 70 is used to protect the circuitry of the bond pads of the flip chip from moisture and oxygen, and also to improve bond strength.
As shown in fig. 8, in the gluing method of the above embodiment, gluing is performed sequentially by the first gluing nozzle and the second gluing nozzle, so that the glue solution is distributed more uniformly; further, in the gluing process, the glue solution coated is flattened through a flattening element, so that the finally obtained solidified glue body 70 has good flatness, the thickness of the solidified glue body is more uniform, and the quality of a product is improved.
In summary, the glue spreading apparatus, the nozzle assembly thereof and the corresponding glue spreading method provided in the embodiments of the present invention can improve the problems of poor glue spreading flatness and uneven thickness in the connection region of the flip chip.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is directed to embodiments of the present application and it is noted that numerous modifications and adaptations may be made by those skilled in the art without departing from the principles of the present application and are intended to be within the scope of the present application.
Claims (10)
1. Spray head assembly of a gluing device, characterized in that it comprises a support bracket and a first gluing head, a second gluing head and a flattening element assembled on the support bracket; in the gluing advancing direction, the first gluing nozzle is positioned in front of the second gluing nozzle, the leveling element is positioned behind the second gluing nozzle, and the leveling element is used for leveling glue solution sprayed out of the first gluing nozzle and the second gluing nozzle; the first gluing nozzle and the second gluing nozzle are used for moving from the first end to the second end of the gluing path and spraying glue, wherein when the first gluing nozzle is about to reach the second end edge of the gluing path, the glue output amount is gradually reduced, meanwhile, the glue output amount of the second gluing nozzle is correspondingly increased, when the first gluing nozzle is about to reach the second end edge of the gluing path, the glue spraying is stopped, when the second gluing nozzle is about to reach the second end edge of the gluing path, the glue spraying is stopped, after the first gluing nozzle and the second gluing nozzle are rotated, the first gluing nozzle and the second gluing nozzle move from the second end to the first end of the gluing path and spray glue, wherein when the first gluing nozzle is about to reach the first end edge of the gluing path, the glue output amount is gradually reduced, and meanwhile, the glue output amount of the second gluing nozzle is correspondingly increased, and stopping spraying the glue solution when the first gluing nozzle reaches the first end edge of the gluing path, and stopping spraying the glue solution when the second gluing nozzle reaches the first end edge of the gluing path.
2. Spray head assembly according to claim 1, further comprising a guide unit connected to said support carriage, said guide unit moving said support carriage to control said first and second glue spray heads to apply glue along a predetermined path.
3. Spray head assembly according to claim 1 or 2, wherein the levelling element is a smoothing brush.
4. Spray head assembly according to claim 1 or 2, wherein the leveling element is a doctor blade.
5. A gluing device, characterized in that it comprises:
the working base is used for bearing an object to be coated with glue;
the nozzle assembly according to any one of claims 1 to 4, disposed opposite and above the working base, for applying glue to the object to be glued;
a glue solution storage unit which is respectively connected with the first gluing nozzle and the second gluing nozzle and is used for supplying glue solution to the first gluing nozzle and the second gluing nozzle;
and the glue coating amount control unit is respectively connected with the first glue coating spray head and the second glue coating spray head and is used for controlling the glue output amount of the first glue coating spray head and the second glue coating spray head.
6. The gluing apparatus according to claim 5, wherein the working base is a vacuum suction platform for suction fixing the object to be glued.
7. A glue application method for applying glue to a lap step region between a first object and a second object lap-joined to each other, the glue application method comprising:
-providing a gluing device according to claim 5 or 6;
fixing the first object and the second object which are connected with each other in a lap joint mode on the working base platform;
setting a gluing path in the lap joint step area;
controlling the first gluing nozzle and the second gluing nozzle to move back and forth along the gluing path to spray glue solution, and leveling the sprayed glue solution by the leveling element;
and curing the glue solution after finishing spraying and leveling.
8. The method for pasting glue of claim 7, wherein the first object is a chip on film and the second object is a display panel or a flexible circuit board or a printed circuit board.
9. Gluing method according to claim 8, characterised in that the glue solution is a UV glue or a graphic non-glue.
10. Gluing method according to any one of claims 7 to 9, wherein the process of spraying glue on the gluing path comprises in particular the steps of:
s100, controlling the first gluing nozzle and the second gluing nozzle to move from the first end to the second end of the gluing path and spraying glue solution;
s200, when the first gluing nozzle is about to reach the edge of the second end of the gluing path, controlling the glue output of the first gluing nozzle to gradually decrease and controlling the glue output of the second gluing nozzle to correspondingly increase so as to keep the total glue output of the first gluing nozzle and the second gluing nozzle unchanged;
s300, when the first gluing nozzle reaches the second end edge of the gluing path, controlling the first gluing nozzle to stop spraying glue solution, and when the second gluing nozzle reaches the second end edge of the gluing path, controlling the second gluing nozzle to stop spraying glue solution;
s400, reversing the direction of a spray head assembly, controlling the first gluing spray head and the second gluing spray head to move from the second end of the gluing path to the first end, and spraying glue solution;
s500, when the first gluing nozzle is about to reach the edge of the first end of the gluing path, controlling the glue output of the first gluing nozzle to gradually decrease and controlling the glue output of the second gluing nozzle to correspondingly increase so as to keep the total glue output of the first gluing nozzle and the second gluing nozzle unchanged;
s600, when the first gluing nozzle reaches the first end edge of the gluing path, controlling the first gluing nozzle to stop spraying glue solution, and when the second gluing nozzle reaches the first end edge of the gluing path, controlling the second gluing nozzle to stop spraying glue solution;
and S700, repeating the steps S100-S600, and reciprocating for many times between the first end and the second end of the gluing path to finish the technological process of spraying glue solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810093747.4A CN108057581B (en) | 2018-01-31 | 2018-01-31 | Gluing equipment, spray head assembly thereof and gluing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810093747.4A CN108057581B (en) | 2018-01-31 | 2018-01-31 | Gluing equipment, spray head assembly thereof and gluing method |
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| Publication Number | Publication Date |
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| CN108057581A CN108057581A (en) | 2018-05-22 |
| CN108057581B true CN108057581B (en) | 2020-04-10 |
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| CN116618241B (en) * | 2023-07-24 | 2023-09-12 | 江苏泽润新能科技股份有限公司 | Car battery package glue filling device |
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| CN201410449Y (en) * | 2009-04-13 | 2010-02-24 | 宜兴市长宜汽车密封配件厂 | CNC coating machine |
| CN202877038U (en) * | 2012-09-06 | 2013-04-17 | 良奕工业有限公司 | Attaching equipment for panel and glue dispensing mechanism of attaching equipment |
| CN204412571U (en) * | 2015-01-05 | 2015-06-24 | 上海广为焊接设备有限公司 | Automatic glue spreading device |
| CN204503456U (en) * | 2015-01-26 | 2015-07-29 | 深圳市瓯迅达电子有限公司 | A kind of backlight module sizer |
| CN205270037U (en) * | 2016-01-04 | 2016-06-01 | 京东方（河北）移动显示技术有限公司 | Rubber coating head, Coating unit and coating system |
| CN205762048U (en) * | 2016-07-04 | 2016-12-07 | 京东方（河北）移动显示技术有限公司 | A kind of glue spreading of base plate device |
-
2018
- 2018-01-31 CN CN201810093747.4A patent/CN108057581B/en active Active
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