CN108054012A - It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor - Google Patents
It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor Download PDFInfo
- Publication number
- CN108054012A CN108054012A CN201711353388.3A CN201711353388A CN108054012A CN 108054012 A CN108054012 A CN 108054012A CN 201711353388 A CN201711353388 A CN 201711353388A CN 108054012 A CN108054012 A CN 108054012A
- Authority
- CN
- China
- Prior art keywords
- tantalum
- molded packages
- surface mount
- shell
- core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/145—Liquid electrolytic capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
Abstract
The invention discloses it is a kind of can Surface Mount installation molded packages liquid tantalum capacitor, including the metal shell and the molded packages layer of housing exterior outside tantalum core, tantalum core, the tantalum core is by tantalum core with the positive wire frame of one end outside molded packages layer is set to be connected, the other end outside the molded packages layer is equipped with negative wire frame, there is gap between the shell and tantalum core, liquid electrolyte is filled in the gap.The solid electrolyte of traditional tantalum capacitor is changed to liquid electrolyte by the present invention, and used can surface-pasted molded packages form, the volume of entire tantalum capacitor can be reduced, so as to reduce its occupied space, and ripple current more higher than other type Surface Mount capacitances is can tolerate, the also tolerable up to backward voltage of 3V.
Description
Technical field
The present invention relates to a kind of capacitor, more particularly to it is a kind of can Surface Mount installation molded packages liquid tantalum capacitor.
Background technology
Solid tantalum capacitor is a kind of using the solid capacitor that electrolyte is free of made of metal tantalum, because it uses metal
Tantalum is medium, it is thus possible to adapt to high-temperature work environment, and tantalum capacitor is during the work time, has auto-mending or isolation
The performance where fault in oxide-film makes oxide film dielectric be reinforced and recovered its due insulating capacity at any time, without
It causes to destroy by continuous cumulative bad, this uniqueness self-healing performance ensure that the advantage of its long-life and reliability, tantalum capacitor
With very high working field strength, and have the characteristics that have excellent performance, compact, therefore, tantalum capacitor obtains
Rapidly development.It is growing with the application range of tantalum capacitor, is not only applied in fields such as military communication, space flight,
And the application of tantalum capacitance is also largely used into fields such as Industry Control, video equipment, communication instrument.
In the place that current mobile wireless product uses, existing solid tantalum capacitor product is because volume is larger, it is difficult to do
To miniaturization, and existing solid electrolyte Ta capacitor is because using solid forms, resistance to ripple it is relatively low and can not bear compared with
High backward voltage is, it is necessary to further improve.
The content of the invention
The technical problem to be solved by the present invention is to overcome the deficiencies in the prior art, provide it is a kind of can Surface Mount installation molding envelope
Fill liquid tantalum capacitor, the solid electrolyte of traditional tantalum capacitor is changed to liquid electrolyte by it, and used can surface patch
The molded packages form of dress can reduce the volume of entire tantalum capacitor, so as to reduce its occupied space, and it is tolerable than it
Its higher ripple current of type Surface Mount capacitance, the also tolerable up to backward voltage of 3V.
In order to solve the above technical problems, technical solution proposed by the present invention is：It is a kind of can Surface Mount installation molded packages liquid
Body tantalum capacitor, including the metal shell and the molded packages layer of housing exterior outside tantalum core, tantalum core, the tantalum core passes through tantalum core
It is connected with the positive wire frame for setting one end outside molded packages layer, the other end outside the molded packages layer is sticked and has cathode
Lead frame has gap between the shell and tantalum core, and liquid electrolyte is filled in the gap.
The present invention can Surface Mount installation molded packages liquid tantalum capacitor profile and existing surface mount tantalum capacitance
Device it is consistent, convenient for its be mounted on existing end product it is enterprising exercise use, ensure that its application range will not reduce.
Further, one end of the tantalum core is fixed inside the shell using fixing bracket isolation.
Further, the fixing bracket is concave structure, i.e., its surface is equipped with groove structure, and opening blocks tantalum core
One end.
Further, the shell is concave structure, and length is more than the length of tantalum core, and the openend of the shell passes through
Gasket is sealed, and the gasket is oppositely arranged on the both ends of tantalum core with fixing bracket.
Further, the shell for metallic silver into.
Further, the positive wire frame and negative wire frame be can surface-pasted lead frame.
Compared with prior art, the advantage of the invention is that：
1st, original complete solid electrolyte is changed to the internal tantalum capacitor for liquid electrolyte by tantalum capacitor of the invention, both
There is tantalum capacitor, and there is liquid capacitor, tantalum capacitor tolerance ripple current and anti-can be greatly enhanced
To the ability of voltage, the backward voltage of up to 3V can tolerate；
2nd, compared with former plug-in type tantalum capacitor, tantalum capacitor of the invention has the characteristics that compact, can reduce its occupancy
Space, beneficial to the development of its miniaturization, beneficial to the miniaturization for promoting its end product.
Description of the drawings
Fig. 1 is the structure diagram of the present invention.
Marginal data：
1st, tantalum core；2nd, shell；3rd, molded packages layer；4th, tantalum core；5th, positive wire frame；6th, negative wire frame；7th, fixing bracket；
8th, gasket.
Specific embodiment
For the ease of understanding the present invention, the present invention is made below in conjunction with Figure of description and preferred embodiment more complete
Face meticulously describes, but protection scope of the present invention is not limited to embodiment in detail below.
As shown in Figure 1, it is a kind of can Surface Mount installation molded packages liquid tantalum capacitor, outside tantalum core 1, tantalum core 1
Molded packages layer 3 outside metal shell 2 and shell 2, tantalum core 1 is by tantalum core 4 with setting 3 outside one end of molded packages layer just
Pole lead frame 5 connects, and the other end outside molded packages layer 3, which is sticked, negative wire frame 6, has sky between shell 2 and tantalum core 1
Gap is filled with liquid electrolyte in the gap.
In the present embodiment, one end of tantalum core 1 is fixed on using the isolation of fixing bracket 7 in shell 2.
In the present embodiment, fixing bracket 7 is concave structure, i.e., its surface is equipped with groove structure, and opening blocks tantalum core 1
One end.
In the present embodiment, shell 2 is concave structure, and length is more than the length of tantalum core 1, and the openend of shell 2 passes through close
Packing 8 is sealed, and gasket 8 is oppositely arranged on the both ends of tantalum core 1 with fixing bracket 7.
In the present embodiment, shell 2 for metallic silver into.
In the present embodiment, positive wire frame 5 and negative wire frame 6 are can surface-pasted lead frame.
Claims (6)
1. it is a kind of can Surface Mount installation molded packages liquid tantalum capacitor, including tantalum core（1）, tantalum core（1）External metal shell
（2）And shell（2）External molded packages layer（3）, the tantalum core（1）Pass through tantalum core（4）With setting molded packages layer（3）It is external
The positive wire frame of one end（5）Connection, the molded packages layer（3）The external other end is equipped with negative wire frame（6）, feature
It is：The shell（2）With tantalum core（1）Between have gap, be filled with liquid electrolyte in the gap.
2. according to claim 1 can Surface Mount installation molded packages liquid tantalum capacitor, it is characterised in that：The tantalum
Core（1）One end use fixing bracket（7）Isolation is fixed on shell（2）It is interior.
3. according to claim 2 can Surface Mount installation molded packages liquid tantalum capacitor, it is characterised in that：It is described solid
Fixed rack（7）For concave structure, opening blocks tantalum core（1）One end.
4. it is according to claim 2 can Surface Mount installation molded packages liquid tantalum capacitor, it is characterised in that：The shell
（2）For concave structure, length is more than tantalum core（1）Length, the shell（2）Openend pass through gasket（8）It carries out close
Envelope, the gasket（8）With fixing bracket（7）It is oppositely arranged on tantalum core（1）Both ends.
5. according to any one of claim 1-4 can Surface Mount installation molded packages liquid tantalum capacitor, feature exists
In：The shell（2）For metallic silver into.
6. according to any one of claim 1-4 can Surface Mount installation molded packages liquid tantalum capacitor, feature exists
In：The positive wire frame（5）With negative wire frame（6）Being can surface-pasted lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711353388.3A CN108054012A (en) | 2017-12-15 | 2017-12-15 | It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711353388.3A CN108054012A (en) | 2017-12-15 | 2017-12-15 | It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108054012A true CN108054012A (en) | 2018-05-18 |
Family
ID=62132622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711353388.3A Pending CN108054012A (en) | 2017-12-15 | 2017-12-15 | It is a kind of can Surface Mount installation molded packages liquid tantalum capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108054012A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817461A (en) * | 2019-03-08 | 2019-05-28 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of non-electrolyte tantalum electrolytic capacitor positive and negative anodes patch welding procedure |
| CN112086288A (en) * | 2020-10-19 | 2020-12-15 | 湖南盛通电子科技有限公司 | Manufacturing method of surface mount type solid plastic package capacitor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0173192A1 (en) * | 1984-08-22 | 1986-03-05 | Union Carbide Corporation | Encapsulated chip capacitor |
| CN201465812U (en) * | 2009-03-02 | 2010-05-12 | 株洲宏达电子有限公司 | Chip omniseal non-solid electrolyte tantalum capacitor |
| CN204130352U (en) * | 2014-09-29 | 2015-01-28 | 中国振华（集团）新云电子元器件有限责任公司 | The non-solid electrolyte tantalum electrolytic capacitor of a kind of composite type |
-
2017
- 2017-12-15 CN CN201711353388.3A patent/CN108054012A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0173192A1 (en) * | 1984-08-22 | 1986-03-05 | Union Carbide Corporation | Encapsulated chip capacitor |
| CN201465812U (en) * | 2009-03-02 | 2010-05-12 | 株洲宏达电子有限公司 | Chip omniseal non-solid electrolyte tantalum capacitor |
| CN204130352U (en) * | 2014-09-29 | 2015-01-28 | 中国振华（集团）新云电子元器件有限责任公司 | The non-solid electrolyte tantalum electrolytic capacitor of a kind of composite type |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817461A (en) * | 2019-03-08 | 2019-05-28 | 中国振华（集团）新云电子元器件有限责任公司 | A kind of non-electrolyte tantalum electrolytic capacitor positive and negative anodes patch welding procedure |
| CN109817461B (en) * | 2019-03-08 | 2021-09-28 | 中国振华（集团）新云电子元器件有限责任公司 | Welding process for positive electrode patch and negative electrode patch of non-electrolyte tantalum electrolytic capacitor |
| CN112086288A (en) * | 2020-10-19 | 2020-12-15 | 湖南盛通电子科技有限公司 | Manufacturing method of surface mount type solid plastic package capacitor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180518 |
|
| RJ01 | Rejection of invention patent application after publication |