CN108046786A - 一种相变储热轻质多孔陶瓷砖 - Google Patents
一种相变储热轻质多孔陶瓷砖 Download PDFInfo
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Abstract
本发明提供了一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料50‑80份、硅藻土14‑20份、木质素10‑30份、三聚磷酸钠2‑4份、碳酸钙7‑13份、膨胀珍珠岩6‑10份、石蜡14‑20份、玻化微珠粉6‑10份。采用本发明的原料配比和制备方法制备出的陶瓷砖高气孔率和抗压强度、质量轻、保温效果好,抗压强度可达10Mpa以上。
Description
技术领域
本发明涉及建筑保温领域,具体涉及一种相变储热轻质多孔陶瓷砖。
背景技术
我国各种建筑的总面积已经超过400亿平方米以上,并且每年新竣工房屋面积为18-22亿平方米,其中绝大多数建筑的外墙都没有进行隔热保温处理,因此隔热保温陶瓷砖因其具有导热系数低、强度高、防火、抗雨水渗透、经久耐用而受到人们的欢迎,而目前生产的隔热陶瓷砖的气孔率低、质量重、保温效果差,并不能真正的实现保温节能的目的。
发明内容
本发明的目的在于克服现有技术的不足,提供相变储热轻质多孔陶瓷砖。
为了实现上述目的,本发明采用的技术方案如下:
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料50-80份、硅藻土14-20份、木质素10-30份、三聚磷酸钠2-4份、碳酸钙7-13份、膨胀珍珠岩6-10份、石蜡14-20份、玻化微珠粉6-10份。
上述的相变储热轻质多孔陶瓷砖,其中,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份。
上述的相变储热轻质多孔陶瓷砖,其中,所述陶瓷砖生料的重量份组分为:SiO2 63-73份、Al2O3 8-16份、CaO1.0-2.0份、MgO 2-4份、Na2O 5-6份。
上述的相变储热轻质多孔陶瓷砖,其中,所述膨胀珍珠岩的粒径为5-8mm。
上述的相变储热轻质多孔陶瓷砖的制备方法,包括如下步骤:
(1)将上述重量份的膨胀珍珠岩与熔融后的石蜡混合均匀后,在60-70℃水浴加热下真空搅拌吸附1-2h,冷却,即得相变材料;
(2)将步骤(1)中制得的相变材料与陶瓷砖生料、硅藻土、木质素、三聚磷酸钠、碳酸钙、玻化微珠粉搅拌均匀后加入适量的水,烘干过筛造粒,干压成形、干燥、烧成,即得。
上述的相变储热轻质多孔陶瓷砖的制备方法,其中,所述烧成温度为980-1020℃。
本发明的有益之处在于:
1、本发明提供的相变储热轻质多孔陶瓷砖的配方成分设计合理,采用石蜡作为相变材料,以膨胀珍珠岩作为载体,吸附相变材料,能够极大的提高陶瓷砖相变储热的性能,再添加适量的玻化微珠粉,能够实现更好的保温效果。
2、本发明提供的相变储热轻质多孔陶瓷砖以硅藻土和木质素的混合物作为起泡剂,其中木质素的元素组成为:C 59-65%、H 4.8-5.8%、N29.8-34.8%、S 0.4%,具有可燃性,在230-560℃燃烧时,重量损失高达95%,能够有效的提高气孔率,但是机械强度差,硅藻土属于强烈碳化后的粉状原料,具有良好的塑性,能够使泥料具有很好的成型性能,是一种多孔的疏松矿物,由细小的二氧化硅颗粒组成,但是在燃烧的过程中重量损失的少,而将硅藻土和木质素的混合物作为起泡剂,无需额外加入增塑剂便能够制得气孔率和抗压强度高的轻质多孔陶瓷砖。
3、本发明提供的相变储热轻质多孔陶瓷砖以陶瓷砖生料为主要原料、硅藻土和木质素为起泡剂、膨胀珍珠岩和石蜡的复合物作为相变材料、玻化微珠粉作为保温材料、三聚磷酸钠作为分散剂、碳酸钙作为抗菌剂制备出的陶瓷砖高气孔率和抗压强度、质量轻、保温效果好。
具体实施方式
实施例1
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料50-80份、硅藻土14-20份、木质素10-30份、三聚磷酸钠2-4份、碳酸钙7-13份、膨胀珍珠岩6-10份、石蜡14-20份、玻化微珠粉6-10份;
其中,陶瓷砖生料的重量份组分为:SiO2 63-73份、Al2O3 8-16份、CaO1.0-2.0份、MgO2-4份、Na2O 5-6份,膨胀珍珠岩的粒径为5-8mm。
上述的相变储热轻质多孔陶瓷砖的制备方法,包括如下步骤:
(1)将上述重量份的膨胀珍珠岩与熔融后的石蜡混合均匀后,在60-70℃水浴加热下真空搅拌吸附1-2h,冷却,即得相变材料;
(2)将步骤(1)中制得的相变材料与陶瓷砖生料、硅藻土、木质素、三聚磷酸钠、碳酸钙、玻化微珠粉搅拌均匀后加入适量的水,烘干过筛造粒,干压成形、干燥、在980-1020℃下烧成,即得。
采用上述原料配比和制备方法制备出的陶瓷砖高气孔率和抗压强度、质量轻、保温效果好,抗压强度可达10Mpa以上。
实施例2
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份;
其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O5.5份,膨胀珍珠岩的粒径为6.5mm。
上述的相变储热轻质多孔陶瓷砖的制备方法,包括如下步骤:
(1)将上述重量份的膨胀珍珠岩与熔融后的石蜡混合均匀后,在65℃水浴加热下真空搅拌吸附1.5h,冷却,即得相变材料;
(2)将步骤(1)中制得的相变材料与陶瓷砖生料、硅藻土、木质素、三聚磷酸钠、碳酸钙、玻化微珠粉搅拌均匀后加入适量的水,烘干过筛造粒,干压成形、干燥、在100℃下烧成,即得。
采用上述原料配比和制备方法制备出的陶瓷砖高气孔率和抗压强度、质量轻、保温效果好,抗压强度可达15Mpa。
对比例1
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份;其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O 5.5份,膨胀珍珠岩的粒径为6.5mm。具体制备方法同实施例2,同实施例2相比,未添加木质素,制备出的陶瓷砖与实施例2相比,气孔率明显降低,重量较重。
对比例2
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份;其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O 5.5份,膨胀珍珠岩的粒径为6.5mm。具体制备方法同实施例2,同实施例2相比,未添加硅藻土,制备出的陶瓷砖与实施例2相比,气孔率减少,抗压程度明显降低,为2Mpa。
对比例3
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、玻化微珠粉8份;其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O 5.5份,膨胀珍珠岩的粒径为6.5mm。具体制备方法同实施例2,同实施例2相比,未添加石蜡,制备出的陶瓷砖与实施例2相比,储热性能和保温效果变差,抗压强度12Mpa。
对比例4
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、石蜡17份、玻化微珠粉8份;其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O 5.5份,膨胀珍珠岩的粒径为6.5mm。具体制备方法同实施例2,同实施例2相比,未添加膨胀珍珠岩,制备出的陶瓷砖与实施例2相比,储热性能和保温效果严重变差,抗压强度11Mpa。
对比例5
一种相变储热轻质多孔陶瓷砖,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份;其中,陶瓷砖生料的重量份组分为:SiO2 68份、Al2O3 12份、CaO1.5份、MgO 3份、Na2O 5.5份,膨胀珍珠岩的粒径为6.5mm。具体制备方法同实施例2,同实施例2相比,未添加玻化微珠粉,制备出的陶瓷砖与实施例2相比,储热性能和保温效果变差,抗压强度10Mpa。
本发明实施例3-25提供的相变储热轻质多孔陶瓷砖的配方见表1-3。
Claims (6)
1.一种相变储热轻质多孔陶瓷砖,其特征在于,由以下重量份的原料制备而成:陶瓷砖生料50-80份、硅藻土14-20份、木质素10-30份、三聚磷酸钠2-4份、碳酸钙7-13份、膨胀珍珠岩6-10份、石蜡14-20份、玻化微珠粉6-10份。
2.如权利要求1所述的相变储热轻质多孔陶瓷砖,其特征在于,由以下重量份的原料制备而成:陶瓷砖生料65份、硅藻土17份、木质素20份、三聚磷酸钠3份、碳酸钙10份、膨胀珍珠岩8份、石蜡17份、玻化微珠粉8份。
3.如权利要求1-2任一所述的相变储热轻质多孔陶瓷砖,其特征在于,所述陶瓷砖生料的重量份组分为:SiO2 63-73份、Al2O3 8-16份、CaO1.0-2.0份、MgO 2-4份、Na2O 5-6份。
4.如权利要求1-2任一所述的相变储热轻质多孔陶瓷砖,其特征在于,所述膨胀珍珠岩的粒径为5-8mm。
5.如权利要求1-4任一所述的相变储热轻质多孔陶瓷砖的制备方法,其特征在于,包括如下步骤:
(1)将上述重量份的膨胀珍珠岩与熔融后的石蜡混合均匀后,在60-70℃水浴加热下真空搅拌吸附1-2h,冷却,即得相变材料;
(2)将步骤(1)中制得的相变材料与陶瓷砖生料、硅藻土、木质素、三聚磷酸钠、碳酸钙、玻化微珠粉搅拌均匀后加入适量的水,烘干过筛造粒,干压成形、干燥、烧成,即得。
6.如权利要求5所述的相变储热轻质多孔陶瓷砖的制备方法,其特征在于,所述烧成温度为980-1020℃。
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CN115536425A (zh) * | 2022-10-17 | 2022-12-30 | 淄博锦昊陶瓷有限公司 | 保温陶瓷砖及其制备方法 |
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CN114015418B (zh) * | 2021-11-15 | 2023-11-03 | 南京金合能源材料有限公司 | 一种高效传质传热的热化学吸附储热材料及其制备方法 |
CN115536425A (zh) * | 2022-10-17 | 2022-12-30 | 淄博锦昊陶瓷有限公司 | 保温陶瓷砖及其制备方法 |
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