CN108040448B - Mounting and fixing structure of independently packaged radio frequency power amplification chip - Google Patents
Mounting and fixing structure of independently packaged radio frequency power amplification chip Download PDFInfo
- Publication number
- CN108040448B CN108040448B CN201711262054.5A CN201711262054A CN108040448B CN 108040448 B CN108040448 B CN 108040448B CN 201711262054 A CN201711262054 A CN 201711262054A CN 108040448 B CN108040448 B CN 108040448B
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- chip
- power amplifier
- adjusting
- mounting
- power amplification
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Amplifiers (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an independent packaging type power amplification chip mounting and fixing structure, which mainly comprises: the device comprises a supporting seat, an adjusting sheet, a large flat head adjusting jackscrew and a small flat head adjusting jackscrew; the supporting seat is of an inverted concave structure, and the power amplification chip, the adjusting sheet, the adjusting jackscrew and the fastening screw are contained in the supporting seat after being installed; the adjusting sheet is clamped between the adjusting seat and the chip through the limiting table, the large flat head adjusting jackscrew and the small flat head adjusting jackscrew are combined for use, and the adjusting sheet is screwed up alternately in the installation process. The mounting and fixing structure has strong applicability, can be applied to mounting and fixing of a flange type power amplification chip, and can also be applied to mounting and fixing of a non-flange type power amplification chip; the grounding performance, the heat dissipation performance and the shock and vibration resistance of the flange type power amplifier chip can be improved; the assembly difficulty of the power amplifier chip can be reduced and the maintainability of the amplifier can be improved while the grounding performance, the heat dissipation performance and the shock and vibration resistance performance of the non-flange type power amplifier chip are ensured.
Description
Technical Field
The invention relates to the field of power amplifiers, in particular to an installation and fixing structure of an independently packaged radio frequency power amplification chip.
Background
A conventional independently packaged rf power amplifier chip (hereinafter referred to as a power amplifier chip or chip) is shown in fig. 1 and 2. The printed board is slotted, the chip penetrates through the slotted hole, the chip pin is welded to a welding pad of the printed board, and the printed board is fixed on the cavity plate through a screw. The back of the power amplifier chip is a grounding end and needs to be in good contact with the cavity. The flange type power amplifier chip is usually fixed on the cavity plate through screws; and the non-flange type power amplifier chip is generally welded or adhered to the cavity plate.
The radio frequency power amplification chip is a core device in a high-power amplifier and can be divided into an independent packaging type and a bare chip type according to whether packaging is performed or not. The independently packaged power amplifier chip is widely used in engineering due to high reliability and convenient use. The independent packaging type power amplifier chip is divided into two structural forms, namely a flanged structure and a non-flanged structure, as shown in fig. 3a and fig. 3 b.
In fact, for the flange type power amplifier chip, it is usually fixed on the cavity plate by screws; and for the non-flange type power amplifier chip, the power amplifier chip is generally welded or adhered to the cavity plate.
For the flange type power amplifier chip, a screw fixing installation mode is adopted, and the pressing force of the screw is only applied to the flange of the chip. This results in poor grounding at the center of the bottom of the chip, which is likely to generate parasitic resistance, capacitance, and reactance, thereby affecting the performance of the chip. Meanwhile, poor contact causes thermal contact resistance between the chip and the cavity to be increased, so that heat dissipation of the chip is affected, and performance of the chip is further affected. In addition, because only the flanges on the two sides of the chip are fixed, in an impact vibration test, the amplitude of the middle position is large, so that the chip pin and the printed board are easy to crack, even the chip pin is broken, and the power amplifier module is caused to lose efficacy.
For the non-flange type power amplifier chip, a welding or bonding fixing mode is adopted, the chip assembly process is complex, the disassembly and the assembly are inconvenient, and the maintainability is low.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides an installation and fixing structure of an independent packaging type radio frequency power amplification chip.
The technical scheme of the invention is realized as follows:
the utility model provides an independent encapsulation type power amplification chip installation fixed knot constructs, power amplification chip passes the printing board fluting, and its pin welds to the printing board on the pad, and the printing board passes through the fix with screw on the cavity board, still includes: the power amplification chip, the adjusting sheet, the adjusting jackscrew and the fastening screw are all contained in the supporting seat after being installed;
the supporting seats are of an inverted concave structure, the supporting seats on the two sides are provided with stepped unthreaded holes from top to bottom, the unthreaded holes correspond to fastening screws, the middle supporting beam is provided with threaded holes from top to bottom, and the threaded holes correspond to adjusting jackscrews;
the adjusting sheet is of a rectangular sheet structure, the size of the adjusting sheet is similar to that of the upper surface of the power amplification chip, the four corners of the sheet are respectively provided with a limiting table, and the adjusting sheet is clamped in the concave structure in the middle of the supporting seat through the limiting tables at the four corners;
the supporting seat stretches across the power amplification chip, and the fastening screw penetrates through the unthreaded hole of the supporting seat to fix the supporting seat on the cavity plate; the adjusting sheet is clamped between the supporting seat and the power amplification chip through the limiting table; and screwing down the adjusting jackscrew pressing adjusting sheet to complete the installation and fixation of the power amplification chip.
Optionally, the power amplification chip is of a non-normal blue type.
Optionally, the power amplifier chip is of a flange type, the supporting seat is pressed above the flange of the power amplifier chip, and the fastening screw penetrates through the unthreaded hole of the supporting seat and the flange of the power amplifier chip to fix the supporting seat and the power amplifier chip on the cavity plate.
Optionally, a threaded hole from top to bottom is formed in the middle of the middle supporting beam, a large threaded hole is formed in the middle of the beam, two small threaded holes are symmetrically distributed in two sides of the beam, the large threaded hole corresponds to the large adjusting jackscrew, and the small threaded hole corresponds to the small adjusting jackscrew.
Optionally, the large adjustment jackscrew and the small adjustment jackscrew are both flat-head jackscrews.
Optionally, the supporting seat is made of a metal material.
Optionally, the supporting seat is made of aluminum material, copper material or steel material.
Optionally, the supporting seat is made of aluminum.
Optionally, the adjusting sheet is made of a metal material with high rigidity and strength.
Optionally, the adjusting sheet is made of stainless steel.
The invention has the beneficial effects that:
(1) for the flange type power amplifier chip which is independently packaged, the middle position of the chip is fixed while the flange is fixed, so that the grounding performance, the heat dissipation performance and the shock and vibration resistance of the chip can be improved;
(2) for the illegal blue-type power amplifier chip which is independently packaged, the one-time fixing mode of bonding or welding the bottom of the chip is changed into the mode of fixing the top of the chip, so that the assembly difficulty of the power amplifier chip can be reduced and the maintainability of the amplifier can be improved while the grounding performance, the heat dissipation performance and the shock and vibration resistance performance are ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a view showing a conventional power amplification chip mounting structure;
fig. 2 is an exploded view of a conventional power amplifying chip mounting structure;
FIG. 3a is a schematic diagram of a flange-type independently packaged power amplifier chip;
FIG. 3b is a schematic diagram of a non-flange type independently packaged power amplifier chip;
FIG. 4 is a schematic view of a mounting and fixing structure of an independently packaged power amplifier chip according to the present invention;
fig. 5 is an exploded view of the mounting and fixing structure of the independently packaged power amplifier chip according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
By adopting the mounting and fixing structure of the independent packaging type power amplification chip, the grounding performance, the heat dissipation performance and the shock and vibration resistance of the flange type power amplification chip can be improved; the assembly difficulty of the power amplifier chip can be reduced and the maintainability of the amplifier can be improved while the grounding performance, the heat dissipation performance and the shock and vibration resistance performance of the non-flange type power amplifier chip are ensured.
As shown in fig. 4 and 5, the mounting and fixing structure of the independent package type power amplification chip of the present invention includes: the power amplifier comprises a supporting seat 1, an adjusting sheet 2 and an adjusting jackscrew, wherein the supporting seat 1 is of an inverted concave structure, and a power amplifying chip, the adjusting sheet 2, the adjusting jackscrew and a fastening screw are contained in the supporting seat after being installed.
The supporting seat is of a 1-reverse concave structure, the supporting seats on two sides are provided with step unthreaded holes from top to bottom, the unthreaded holes correspond to fastening screws, the middle supporting beam is provided with threaded holes from top to bottom, the middle of the beam is provided with a large threaded hole, two small threaded holes are symmetrically distributed on two sides, the large threaded hole corresponds to the large adjusting jackscrew 3, the small threaded hole corresponds to the small adjusting jackscrew 4, and preferably, the large adjusting jackscrew 3 and the small adjusting jackscrew 4 are flat-headed jackscrews.
The supporting seat 1 can be made of metal materials such as aluminum materials, copper materials and steel materials, and preferably, the aluminum material with lighter weight is adopted in the invention, because the aluminum material has low density and small weight in the materials, the aluminum material is particularly suitable for the installation occasions with the requirement of weight.
The adjusting sheet 2 is a rectangular sheet structure, and the size of the adjusting sheet is similar to that of the upper surface of the power amplification chip. The four corners of the slice are respectively provided with a limit platform, and the adjusting sheet is clamped in the concave structure in the middle of the supporting seat through the limit platforms at the four corners.
The adjusting sheet 2 is made of a metal material with high rigidity, and preferably, the adjusting sheet is made of stainless steel.
Fig. 4 and 5 show the mounting structure of the flange type power amplifier chip on the left side, where the power amplifier chip 6 is slotted through the printed board 8, its pins are soldered to the pads of the printed board 8, and the printed board 8 is fixed to the cavity plate 9 by screws 10; the supporting seat 1 is pressed above the flange of the power amplification chip 6 in a spanning mode, the fastening screw 5 penetrates through the unthreaded hole of the supporting seat 1 and the flange of the power amplification chip 6 to be fixed on the cavity plate 9, and the supporting seat 1 and the power amplification chip 6 are fixed on the cavity plate 9; the adjusting sheet 2 is clamped between the adjusting seat 1 and the chip 6 through the limiting table, so that the adjusting sheet can be prevented from rotating and dislocating in the process of screwing the jackscrew; and a torque wrench is adopted to gradually screw the large adjusting jackscrew 3 and the left and right small adjusting jackscrews 4 to tightly press the adjusting sheet 2, so that the power amplification chip 6 is installed and fixed.
The flange type power amplification chip which is independently packaged is fixed at the middle position of the power amplification chip while the flange is fixed, so that the grounding performance, the heat dissipation performance and the shock and vibration resistance of the power amplification chip can be improved.
Fig. 4 and fig. 5 show the non-normal blue type power amplifier chip mounting structure on the right side, where the power amplifier chip 7 is slotted through the printed board 8, its pins are soldered to the pads of the printed board 8, and the printed board 8 is fixed on the cavity plate 9 by screws 10; the supporting seat 1 stretches across the power amplification chip 7, and the fastening screw 5 penetrates through the unthreaded hole of the supporting seat 1 to fix the supporting seat 1 on the cavity plate 9; the adjusting sheet 2 is clamped between the support base 1 and the power amplification chip 7 through a limiting table, so that the adjusting sheet can be prevented from rotating and dislocating in the process of screwing the jackscrew; and a torque wrench is adopted to gradually screw the large adjusting jackscrew 3 and the left and right small adjusting jackscrews 4 to tightly press the adjusting sheet 2, so that the power amplification chip 7 is installed and fixed.
The invention improves the one-time fixing mode of bonding or welding the bottom of the chip into the top of the chip for the illegal blue-type power amplifier chip which is independently packaged, thereby ensuring the grounding performance, the heat radiation performance and the shock and vibration resistance performance, reducing the assembly difficulty of the power amplifier chip and improving the maintainability of the amplifier.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (9)
1. The utility model provides an independent encapsulation type power amplification chip installation fixed knot constructs, its characterized in that, the power amplification chip passes the printing board fluting, and its pin welds to the printing board on the pad, and the printing board passes through the fix with screw on the cavity board, still includes: the power amplification chip, the adjusting sheet, the adjusting jackscrew and the fastening screw are all contained in the supporting seat after being installed;
the supporting seats are of an inverted concave structure, the supporting seats on the two sides are provided with stepped unthreaded holes from top to bottom, the unthreaded holes correspond to fastening screws, the middle supporting beam is provided with threaded holes from top to bottom, and the threaded holes correspond to adjusting jackscrews;
the adjusting sheet is of a rectangular sheet structure, the size of the adjusting sheet is similar to that of the upper surface of the power amplification chip, the four corners of the sheet are respectively provided with a limiting table, and the adjusting sheet is clamped in a concave structure in the middle of the supporting seat through the limiting tables at the four corners;
the supporting seat stretches across the power amplification chip, and the fastening screw penetrates through the unthreaded hole of the supporting seat to fix the supporting seat on the cavity plate; the adjusting sheet is clamped between the supporting seat and the power amplification chip through the limiting table; and screwing down the adjusting jackscrew pressing adjusting sheet to complete the installation and fixation of the power amplification chip.
2. The mounting and fixing structure of a self-contained power amplifier chip as claimed in claim 1, wherein the power amplifier chip is of a non-normal blue type.
3. The mounting and fixing structure of claim 1, wherein the power amplifier chip is of a flange type, the supporting base is pressed over the flange of the power amplifier chip, the fastening screw penetrates through the aperture of the supporting base, the flange of the power amplifier chip is fixed to the cavity plate, and the supporting base and the power amplifier chip are fixed to the cavity plate.
4. The mounting and fixing structure of an independently packaged power amplifier chip as claimed in claim 1, wherein the middle supporting beam has a top-down threaded hole, and wherein the beam has a middle large threaded hole and two symmetrically distributed small threaded holes, the large threaded hole corresponding to the large adjusting screw, and the small threaded hole corresponding to the small adjusting screw.
5. The mounting and fixing structure of an independently packaged power amplifier chip as claimed in claim 4, wherein the large adjustment screw and the small adjustment screw are flat-head screws.
6. The mounting and fixing structure of an independently packaged power amplifier chip as claimed in claim 1, wherein the supporting base is made of a metal material.
7. The mounting and fixing structure of an independently packaged power amplifier chip as claimed in claim 6, wherein the supporting base is made of aluminum, copper, or steel.
8. The mounting and fixing structure of an independently packaged power amplifier chip as claimed in claim 7, wherein said supporting base is made of aluminum.
9. The mounting and fixing structure of a self-contained power amplifier chip as claimed in claim 1, wherein said adjustment plate is made of stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711262054.5A CN108040448B (en) | 2017-12-04 | 2017-12-04 | Mounting and fixing structure of independently packaged radio frequency power amplification chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711262054.5A CN108040448B (en) | 2017-12-04 | 2017-12-04 | Mounting and fixing structure of independently packaged radio frequency power amplification chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108040448A CN108040448A (en) | 2018-05-15 |
| CN108040448B true CN108040448B (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711262054.5A Active CN108040448B (en) | 2017-12-04 | 2017-12-04 | Mounting and fixing structure of independently packaged radio frequency power amplification chip |
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| CN (1) | CN108040448B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111633589A (en) * | 2020-06-16 | 2020-09-08 | 南京沃天科技有限公司 | Sensor chip centre gripping fixed knot constructs |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201467622U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Manual centering positioning system for chip |
| JP2010232636A (en) * | 2009-03-27 | 2010-10-14 | Ibiden Co Ltd | Multilayer printed wiring board |
| CN204243034U (en) * | 2014-07-23 | 2015-04-01 | 无锡来德电子有限公司 | A kind of LED module |
| CN205142680U (en) * | 2015-10-23 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Adjustable attached device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009135398A (en) * | 2007-11-29 | 2009-06-18 | Ibiden Co Ltd | Combination substrate |
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2017
- 2017-12-04 CN CN201711262054.5A patent/CN108040448B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201467622U (en) * | 2009-03-26 | 2010-05-12 | 赵永先 | Manual centering positioning system for chip |
| JP2010232636A (en) * | 2009-03-27 | 2010-10-14 | Ibiden Co Ltd | Multilayer printed wiring board |
| CN204243034U (en) * | 2014-07-23 | 2015-04-01 | 无锡来德电子有限公司 | A kind of LED module |
| CN205142680U (en) * | 2015-10-23 | 2016-04-06 | 宁波舜宇光电信息有限公司 | Adjustable attached device |
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| Publication number | Publication date |
|---|---|
| CN108040448A (en) | 2018-05-15 |
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