CN108026432B - 具有改善的稳定性和改善的抛光特性的选择性氮化物淤浆 - Google Patents

具有改善的稳定性和改善的抛光特性的选择性氮化物淤浆 Download PDF

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Publication number
CN108026432B
CN108026432B CN201680052336.XA CN201680052336A CN108026432B CN 108026432 B CN108026432 B CN 108026432B CN 201680052336 A CN201680052336 A CN 201680052336A CN 108026432 B CN108026432 B CN 108026432B
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polishing composition
mol
polishing
substrate
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Chinese (zh)
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CN108026432A (zh
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P.潘戴伊
张柱然
B.瑞斯
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CMC Materials LLC
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CMC Materials LLC
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
    • C08K2003/2213—Oxides; Hydroxides of metals of rare earth metal of cerium

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201680052336.XA 2015-09-09 2016-08-29 具有改善的稳定性和改善的抛光特性的选择性氮化物淤浆 Active CN108026432B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/849,066 2015-09-06
US14/849,066 US9597768B1 (en) 2015-09-09 2015-09-09 Selective nitride slurries with improved stability and improved polishing characteristics
PCT/US2016/049299 WO2017044340A1 (en) 2015-09-09 2016-08-29 Selective nitride slurries with improved stability and improved polishing characteristics

Publications (2)

Publication Number Publication Date
CN108026432A CN108026432A (zh) 2018-05-11
CN108026432B true CN108026432B (zh) 2022-06-14

Family

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CN201680052336.XA Active CN108026432B (zh) 2015-09-09 2016-08-29 具有改善的稳定性和改善的抛光特性的选择性氮化物淤浆

Country Status (7)

Country Link
US (1) US9597768B1 (enExample)
EP (1) EP3347428B1 (enExample)
JP (1) JP7021073B2 (enExample)
KR (1) KR102650526B1 (enExample)
CN (1) CN108026432B (enExample)
TW (1) TWI646184B (enExample)
WO (1) WO2017044340A1 (enExample)

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US10584266B2 (en) * 2018-03-14 2020-03-10 Cabot Microelectronics Corporation CMP compositions containing polymer complexes and agents for STI applications
US12227673B2 (en) 2018-12-04 2025-02-18 Cmc Materials Llc Composition and method for silicon nitride CMP
KR20220090534A (ko) * 2019-10-22 2022-06-29 씨엠씨 머티리얼즈, 인코포레이티드 유전체 cmp를 위한 조성물 및 방법
KR20220087492A (ko) * 2019-10-22 2022-06-24 씨엠씨 머티리얼즈, 인코포레이티드 실리콘 산화물보다 실리콘 질화물 및 폴리실리콘에 대해 높은 선택성을 갖는 연마 조성물 및 방법
KR102290191B1 (ko) * 2019-12-06 2021-08-19 주식회사 케이씨텍 Sti cmp 공정용 연마 슬러리 조성물 및 이의 제조방법
US20230094224A1 (en) * 2020-01-16 2023-03-30 Showa Denko Materials Co., Ltd. Polishing agent, stock solution for polishing agent, and polishing method
JP7716857B2 (ja) * 2020-03-23 2025-08-01 株式会社フジミインコーポレーテッド 研磨用組成物
JP7569717B2 (ja) * 2021-03-09 2024-10-18 花王株式会社 酸化珪素膜用研磨液組成物
US20230242790A1 (en) * 2022-02-03 2023-08-03 Cmc Materials, Inc. Ceria-based slurry compositions for selective and nonselective cmp of silicon oxide, silicon nitride, and polysilicon
KR20250066152A (ko) * 2023-11-06 2025-05-13 에스케이엔펄스 주식회사 반도체 공정용 연마 조성물 및 이를 이용한 기판의 제조방법
CN119592231B (zh) * 2024-12-25 2025-09-30 河北工业大学 一种基于氧化铈磨料的氧化硅/氮化硅酸性抛光液及其制备方法

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Publication number Publication date
US20170066102A1 (en) 2017-03-09
TWI646184B (zh) 2019-01-01
WO2017044340A1 (en) 2017-03-16
EP3347428A4 (en) 2019-05-08
JP2018534379A (ja) 2018-11-22
US9597768B1 (en) 2017-03-21
EP3347428A1 (en) 2018-07-18
EP3347428B1 (en) 2023-04-19
TW201718816A (zh) 2017-06-01
KR102650526B1 (ko) 2024-03-25
CN108026432A (zh) 2018-05-11
JP7021073B2 (ja) 2022-02-16
KR20180039176A (ko) 2018-04-17

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