CN108024851A - 植入装置及其制造方法 - Google Patents
植入装置及其制造方法 Download PDFInfo
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- CN108024851A CN108024851A CN201680049872.4A CN201680049872A CN108024851A CN 108024851 A CN108024851 A CN 108024851A CN 201680049872 A CN201680049872 A CN 201680049872A CN 108024851 A CN108024851 A CN 108024851A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Biomedical Technology (AREA)
- Manufacturing & Machinery (AREA)
- Radiology & Medical Imaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Ophthalmology & Optometry (AREA)
- Cardiology (AREA)
- Heart & Thoracic Surgery (AREA)
- Micromachines (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/838,788 US10008443B2 (en) | 2012-04-30 | 2015-08-28 | Implant device |
US14/838,788 | 2015-08-28 | ||
PCT/US2016/049034 WO2017040302A1 (fr) | 2015-08-28 | 2016-08-26 | Dispositif d'implant et son procédé de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108024851A true CN108024851A (zh) | 2018-05-11 |
Family
ID=58188115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201680049872.4A Pending CN108024851A (zh) | 2015-08-28 | 2016-08-26 | 植入装置及其制造方法 |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP3340929A4 (fr) |
CN (1) | CN108024851A (fr) |
WO (1) | WO2017040302A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112869747A (zh) * | 2019-11-29 | 2021-06-01 | 清华大学 | 微电极及其制作和使用方法、塞类装置和微电极系统 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111588985B (zh) * | 2020-05-27 | 2021-02-19 | 微智医疗器械有限公司 | 植入装置及其组装方法 |
Citations (5)
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CN1461227A (zh) * | 2000-11-16 | 2003-12-10 | 波利瓦洛尔公司 | 人体电子植入体及其人工视觉系统 |
CN1961850A (zh) * | 2006-12-07 | 2007-05-16 | 上海交通大学 | 可植入的视觉假体 |
US20140039588A1 (en) * | 2006-08-18 | 2014-02-06 | Second Sight Medical Products, Inc. | Package for an Implantable Neural Stimulation Device |
CN104271165A (zh) * | 2012-04-30 | 2015-01-07 | 加州理工学院 | 高引脚数植入物器件及其制造方法 |
US20150036302A1 (en) * | 2013-08-05 | 2015-02-05 | California Institute Of Technology | Long-term packaging for the protection of implant electronics |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178957A (en) * | 1989-05-02 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
US7211884B1 (en) * | 2002-01-28 | 2007-05-01 | Pacesetter, Inc. | Implantable medical device construction using a flexible substrate |
US7142909B2 (en) * | 2002-04-11 | 2006-11-28 | Second Sight Medical Products, Inc. | Biocompatible bonding method and electronics package suitable for implantation |
US6667215B2 (en) * | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
US9592377B2 (en) * | 2007-07-27 | 2017-03-14 | Second Sight Medical Products, Inc. | Implantable device for the brain |
-
2016
- 2016-08-26 CN CN201680049872.4A patent/CN108024851A/zh active Pending
- 2016-08-26 EP EP16842692.2A patent/EP3340929A4/fr not_active Withdrawn
- 2016-08-26 WO PCT/US2016/049034 patent/WO2017040302A1/fr unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1461227A (zh) * | 2000-11-16 | 2003-12-10 | 波利瓦洛尔公司 | 人体电子植入体及其人工视觉系统 |
US20140039588A1 (en) * | 2006-08-18 | 2014-02-06 | Second Sight Medical Products, Inc. | Package for an Implantable Neural Stimulation Device |
CN1961850A (zh) * | 2006-12-07 | 2007-05-16 | 上海交通大学 | 可植入的视觉假体 |
CN104271165A (zh) * | 2012-04-30 | 2015-01-07 | 加州理工学院 | 高引脚数植入物器件及其制造方法 |
US20150036302A1 (en) * | 2013-08-05 | 2015-02-05 | California Institute Of Technology | Long-term packaging for the protection of implant electronics |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112869747A (zh) * | 2019-11-29 | 2021-06-01 | 清华大学 | 微电极及其制作和使用方法、塞类装置和微电极系统 |
Also Published As
Publication number | Publication date |
---|---|
WO2017040302A1 (fr) | 2017-03-09 |
EP3340929A1 (fr) | 2018-07-04 |
EP3340929A4 (fr) | 2019-04-10 |
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Application publication date: 20180511 Assignee: Weizhi medical apparatus Co., Ltd.|Golden Eye intelligent biomedical Co., Ltd. Assignor: California Institute of Technology Contract record no.: 2018990000276 Denomination of invention: IMPLANT DEVICE AND METHOD OF MAKING THE SAME License type: Common License Record date: 20181019 |
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