EP3340929A4 - Dispositif d'implant et son procédé de fabrication - Google Patents
Dispositif d'implant et son procédé de fabrication Download PDFInfo
- Publication number
- EP3340929A4 EP3340929A4 EP16842692.2A EP16842692A EP3340929A4 EP 3340929 A4 EP3340929 A4 EP 3340929A4 EP 16842692 A EP16842692 A EP 16842692A EP 3340929 A4 EP3340929 A4 EP 3340929A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- making
- same
- implant device
- implant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000007943 implant Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
- A61N1/0526—Head electrodes
- A61N1/0543—Retinal electrodes
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- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/18—Applying electric currents by contact electrodes
- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
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- A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
- A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
- A61N1/372—Arrangements in connection with the implantation of stimulators
- A61N1/375—Constructional arrangements, e.g. casings
- A61N1/3758—Packaging of the components within the casing
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H01L24/27—Manufacturing methods
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- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L2924/191—Disposition
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- H01L2924/191—Disposition
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- H01L2924/191—Disposition
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- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
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- Engineering & Computer Science (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/838,788 US10008443B2 (en) | 2012-04-30 | 2015-08-28 | Implant device |
PCT/US2016/049034 WO2017040302A1 (fr) | 2015-08-28 | 2016-08-26 | Dispositif d'implant et son procédé de fabrication |
Publications (2)
Publication Number | Publication Date |
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EP3340929A1 EP3340929A1 (fr) | 2018-07-04 |
EP3340929A4 true EP3340929A4 (fr) | 2019-04-10 |
Family
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Family Applications (1)
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EP16842692.2A Withdrawn EP3340929A4 (fr) | 2015-08-28 | 2016-08-26 | Dispositif d'implant et son procédé de fabrication |
Country Status (3)
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EP (1) | EP3340929A4 (fr) |
CN (1) | CN108024851A (fr) |
WO (1) | WO2017040302A1 (fr) |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN112869747B (zh) * | 2019-11-29 | 2022-11-25 | 清华大学 | 微电极及其制作和使用方法、塞类装置和微电极系统 |
CN111588985B (zh) * | 2020-05-27 | 2021-02-19 | 微智医疗器械有限公司 | 植入装置及其组装方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7211884B1 (en) * | 2002-01-28 | 2007-05-01 | Pacesetter, Inc. | Implantable medical device construction using a flexible substrate |
US20090124965A1 (en) * | 2007-07-27 | 2009-05-14 | Greenberg Robert J | Implantable device for the brain |
US20110118808A1 (en) * | 2002-04-11 | 2011-05-19 | Robert J Greenberg | Biocompatible bonding method and electronics package suitable for implantation |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178957A (en) * | 1989-05-02 | 1993-01-12 | Minnesota Mining And Manufacturing Company | Noble metal-polymer composites and flexible thin-film conductors prepared therefrom |
EP1721633A3 (fr) * | 2000-11-16 | 2006-11-29 | Polyvalor, S.E.C. | Implant électronique de corps et système de vision artificielle pour ce dernier |
US6667215B2 (en) * | 2002-05-02 | 2003-12-23 | 3M Innovative Properties | Method of making transistors |
AU2007284422B2 (en) * | 2006-08-18 | 2011-06-02 | Second Sight Medical Products, Inc. | Package for an implantable neural stimulation device |
CN100490767C (zh) * | 2006-12-07 | 2009-05-27 | 上海交通大学 | 可植入的视觉假体 |
US9144490B2 (en) * | 2012-04-30 | 2015-09-29 | California Institute Of Technology | High-lead count implant device and method of making the same |
US9781842B2 (en) * | 2013-08-05 | 2017-10-03 | California Institute Of Technology | Long-term packaging for the protection of implant electronics |
-
2016
- 2016-08-26 CN CN201680049872.4A patent/CN108024851A/zh active Pending
- 2016-08-26 WO PCT/US2016/049034 patent/WO2017040302A1/fr unknown
- 2016-08-26 EP EP16842692.2A patent/EP3340929A4/fr not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7211884B1 (en) * | 2002-01-28 | 2007-05-01 | Pacesetter, Inc. | Implantable medical device construction using a flexible substrate |
US20110118808A1 (en) * | 2002-04-11 | 2011-05-19 | Robert J Greenberg | Biocompatible bonding method and electronics package suitable for implantation |
US20090124965A1 (en) * | 2007-07-27 | 2009-05-14 | Greenberg Robert J | Implantable device for the brain |
Non-Patent Citations (1)
Title |
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See also references of WO2017040302A1 * |
Also Published As
Publication number | Publication date |
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CN108024851A (zh) | 2018-05-11 |
EP3340929A1 (fr) | 2018-07-04 |
WO2017040302A1 (fr) | 2017-03-09 |
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