CN108021850B - Fingerprint sensing device and electronic equipment - Google Patents
Fingerprint sensing device and electronic equipment Download PDFInfo
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- CN108021850B CN108021850B CN201610959240.3A CN201610959240A CN108021850B CN 108021850 B CN108021850 B CN 108021850B CN 201610959240 A CN201610959240 A CN 201610959240A CN 108021850 B CN108021850 B CN 108021850B
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- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Physics & Mathematics (AREA)
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Abstract
The invention discloses a fingerprint sensing device and electronic equipment. The fingerprint sensing device comprises a printed circuit board and a TFT sensor. The TFT sensor is arranged on the printed circuit board and is electrically connected with the printed circuit board through a first connecting wire formed by a wire bonding process, wherein the TFT sensor is used for executing fingerprint sensing. In the fingerprint sensing device, the cost of the TFT sensor is low, and the TFT sensor is electrically connected with the printed circuit board through the connecting wire formed by the wire bonding process, so that the process is mature and stable, the cost of the fingerprint sensing device can be reduced, and the fingerprint sensing device is beneficial to application.
Description
Technical Field
The present invention relates to the field of fingerprint technologies, and in particular, to a fingerprint sensing device and an electronic device.
Background
In the related art, a fingerprint sensing device generally adopts a manner of forming a MOS transistor on a semiconductor substrate to implement a related sensor circuit. However, the fingerprint sensing device formed in this way is relatively costly and disadvantageous for the application of the fingerprint sensing device.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the invention needs to provide a fingerprint sensing device and an electronic device.
The fingerprint sensing device comprises a printed circuit board and a TFT sensor, wherein the TFT sensor is arranged on the printed circuit board and is electrically connected with the printed circuit board through a first connecting wire formed by a wire bonding process, and the TFT sensor is used for performing fingerprint sensing.
In the fingerprint sensing device, the cost of the TFT sensor is low, and the TFT sensor is electrically connected with the printed circuit board through the connecting wire formed by the wire bonding process, so that the process is mature and stable, the cost of the fingerprint sensing device can be reduced, and the fingerprint sensing device is beneficial to application.
In some embodiments, the printed circuit board is a hard board.
In some embodiments, the TFT sensor includes an insulating substrate and a TFT sensing array formed on the insulating substrate, the insulating substrate being attached to the printed circuit board.
In some embodiments, the first connection line is connected from a side of the insulating substrate where the TFT sensing array is disposed to a side of the printed circuit board where the TFT sensor is carried.
In certain embodiments, the insulating substrate is a glass substrate, a plastic substrate, or a ceramic substrate.
In some embodiments, the fingerprint sensing device further comprises a control chip, a power chip and a memory chip, wherein one or more of the control chip, the power chip and the memory chip are arranged on the printed circuit board at intervals, and are electrically connected with the printed circuit board through a second connecting wire formed by a wire bonding process.
In some embodiments, the fingerprint sensing device further comprises a chipset disposed on the printed circuit board and electrically connected to the printed circuit board through a second connection wire formed by a wire bonding process, wherein the chipset comprises one or more of a control chip, a power chip and a memory chip.
In some embodiments, the fingerprint sensing device further comprises a package, and the side of the printed circuit board provided with the TFT sensor and the first connection line is packaged by the package. .
In some embodiments, the fingerprint sensing device further comprises a coating layer formed on the package by coating; or the fingerprint sensing device further comprises a cover plate, and the cover plate is attached to the packaging body.
In some embodiments, the TFT sensing array includes a TFT and a sensing electrode connected to the TFT, wherein the TFT is more adjacent to the insulating substrate than the sensing electrode.
In another embodiment of the present invention, a fingerprint sensing device includes a TFT sensor including an insulating substrate and a TFT sensing array formed on the insulating substrate, and a cover plate attached to the TFT sensing array, wherein the TFT sensor is used for performing fingerprint sensing.
In the fingerprint sensing device, the cost of the TFT sensor is low, and the insulating substrate of the TFT sensor can be used as the substrate of the fingerprint sensing device, so that an additional hard plate is not needed, the cost of the fingerprint sensing device can be reduced, and the application of the fingerprint sensing device is facilitated.
In certain embodiments, the insulating substrate is a glass substrate, a plastic substrate, or a ceramic substrate.
In some embodiments, the fingerprint sensing device further comprises a shielding layer disposed between the TFT sensing array and the cover plate.
In some embodiments, the shielding layer is disposed on a surface of the cover plate.
In some embodiments, the fingerprint sensing device further comprises a flexible circuit board electrically connected to the TFT sensing array.
In some embodiments, the insulating substrate includes an edge region surrounding the TFT sensing array, the edge region is not covered by the cover plate, an edge trace connected to the TFT sensing array is formed on the edge region, and the flexible circuit board is electrically connected to the edge trace.
In some embodiments, the fingerprint sensing device further comprises a control chip, a power chip and a memory chip, wherein one or more of the control chip, the power chip and the memory chip are arranged on the flexible circuit board at intervals.
In some embodiments, the fingerprint sensing device further comprises a chipset disposed on the flexible circuit board, wherein the chipset comprises one or more of a control chip, a power chip, and a memory chip.
In some embodiments, the TFT sensing array includes a plurality of TFTs and a sensing electrode connected to each TFT, wherein the plurality of TFTs are fabricated on the insulating substrate, the sensing electrode is located closer to the cover plate than the TFTs, and a side of the cover plate facing away from the sensing electrode is configured to receive fingerprint input of a user.
In certain embodiments, the fingerprint sensing device is a capacitive fingerprint sensing device.
An electronic device according to an embodiment of the present invention includes the fingerprint sensing device according to any of the above embodiments.
In the electronic equipment, the cost of the TFT sensor is low, so that the cost of the fingerprint sensing device can be reduced, and the application of the fingerprint sensing device on the electronic equipment is facilitated.
Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of a fingerprint sensing device according to an embodiment of the invention;
fig. 2 is a schematic structural view of a TFT sensor according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a TFT sensing array according to an embodiment of the invention;
FIG. 4 is a schematic diagram of a fingerprint sensor device according to another embodiment of the present invention;
FIG. 5 is a schematic diagram of a fingerprint sensor device according to another embodiment of the present invention;
FIG. 6 is a schematic diagram of a fingerprint sensor device according to another embodiment of the present invention;
fig. 7 is a schematic plan view of a TFT sensor according to an embodiment of the present invention;
fig. 8 is a schematic back view of an electronic device according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be mechanically connected, may be electrically connected, or may be in communication with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of embodiments of the invention. It will be appreciated, however, by one skilled in the art that the inventive aspects may be practiced without one or more of the specific details, or with other structures, components, etc. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring the invention.
Referring to fig. 1, a fingerprint sensing device 100 according to an embodiment of the invention includes a Printed Circuit Board (PCB) 102 and a TFT sensor (thin film transistor sensor) 104, wherein the TFT sensor 104 is disposed on the PCB 102 and electrically connected to the PCB 102 through a first connection line 106 formed by a wire bonding process, and the TFT sensor 104 is used for performing fingerprint sensing.
In this way, in the fingerprint sensing device 100, the cost of the TFT sensor 104 is low, and the TFT sensor 104 is electrically connected to the printed circuit board 102 through the connection wire 106 formed by the wire bonding process, so that the process is mature and stable, and the cost of the fingerprint sensing device 100 can be reduced, which is beneficial to the application of the fingerprint sensing device 100.
In this embodiment, the TFT sensor 104 is preferably a Die (Die), and the transistors on the TFT sensor are all TFTs, and accordingly, such a sensor is referred to as a TFT sensor.
In some embodiments, some of the TFTs in the TFT sensor 104 are used as switching elements, some are used as switching elements, TFTs defined as switching elements are first TFTs, and TFTs defined as switching elements are second TFTs. The fingerprint sensing device 100 supplies a driving signal to the sensing electrode 111 (see later and fig. 3), for example, through a first TFT, and receives a sensing signal from the output of a second TFT to acquire fingerprint information. The second TFT is configured to convert a voltage signal output from the sensing electrode 111 into a current signal, where the current signal is the sensing signal. However, the present invention is not limited thereto, and the TFT sensor 104 may include, for example, TFTs with other functions, and in different embodiments, the TFT sensor 104 may omit the first TFT, the second TFT, or the like, according to the sensing mode.
In one example, a first connection pad (not shown) may be formed on a top surface of the TFT sensor 104 (i.e., a side facing away from the printed circuit board 102), and a second connection pad (not shown) may be formed on a top surface of the printed circuit board 102 (i.e., a side facing the TFT sensor 104), and one end of the first connection line 106 may be bonded to the first connection pad and the other end of the first connection line 106 may be bonded to the second connection pad during wire Bonding (Bonding) to electrically connect the TFT sensor 104 to the printed circuit board 102.
In some embodiments, the printed circuit board 102 is a hard board.
In this way, the fingerprint sensing device 100 can be made to meet the strength requirements.
Specifically, the printed circuit board 102 of the hard board has higher strength than the flexible circuit board, and when the TFT sensor 104 is attached to the printed circuit board 102, the printed circuit board 102 is less deformed, and the TFT sensor 104 can be accurately attached to the set position of the printed circuit board 102.
In some embodiments, referring to fig. 2, the TFT sensor 104 includes an insulating substrate 108 and a TFT sensing array 110 formed on the insulating substrate 108, and the insulating substrate 108 is attached to the printed circuit board 102.
In this manner, the TFT sensor 104 may be fabricated at a low cost using a process of forming an integrated circuit including the TFT sensing array 110 on the insulating substrate 108.
In particular, the TFTs of the TFT sense array 110 are preferably low temperature polysilicon thin film transistors. However, amorphous silicon thin film transistors, metal oxide (e.g., IGZO) thin film transistors, graphene thin film transistors are suitable.
In some embodiments, referring to fig. 3, the TFT sensing array 110 includes a plurality of TFTs and a sensing electrode 111 connected to each TFT, wherein the TFTs are closer to the insulating substrate 108 than the sensing electrode 111.
As such, the sensing electrode 111 can be capacitively coupled to the finger to gather fingerprint information of the finger. However, in other embodiments, the TFT sensor 104 is not limited to a capacitive fingerprint sensor, but may be any other suitable type of sensor, such as an ultrasonic type, an optical type, an infrared type fingerprint sensor, and so on.
Specifically, the sensing electrode 111 may be made of any one of a metal material, a metal oxide conductive material, a conductive composite material, a graphene material, and a carbon nanotube material.
In the illustrated example of the invention, the TFT is a bottom gate thin film transistor. The TFT sensing array 110 includes a first insulating layer 41 formed on an insulating substrate 108, a gate electrode 47 formed on the first insulating layer 41, and a lead L connected to the gate electrode 47, a second insulating layer 46 formed on the gate electrode 47 and the first insulating layer 41, an active layer 49 formed on the second insulating layer 46, source and drain electrodes 44 and 45 formed on both sides of the active layer 49, and a third insulating layer 48 formed on the source and drain electrodes 44 and 45 and the second insulating layer 46, and a contact hole penetrating the third insulating layer 48 and the second insulating layer 46. The sensing electrode 111 is formed over the third insulating layer 48. Wherein the lead L extends from one side of the gate electrode 47 to a position of a contact hole through which the sensing electrode 111 is connected to the gate electrode 47. The TFT includes a gate electrode 47, a second insulating layer 46, an active layer 49, a source electrode 44, and a drain electrode 45. The active layer 49 is, for example, a silicon island layer or a metal oxide layer (IGZO). The lead L is the same material as the gate 47, and is integrally formed with the gate 47.
It should be noted that in other embodiments, the TFT may be another type of thin film transistor, such as a dual top gate low temperature polysilicon thin film transistor, an inverted bottom gate thin film transistor, or a low temperature polysilicon thin film transistor.
The TFT sensing array 110 correspondingly outputs a sensing signal according to a change in a driving signal caused by the approach or touch of a finger on the sensing electrode 111.
In some embodiments, the first connection lines 106 connect from the side of the insulating substrate 108 where the TFT sensing array 110 is disposed to the side of the printed circuit board 102 carrying the TFT sensors 104.
In this manner, the first connection line 106 is facilitated to connect the TFT sensor 104 and the printed circuit board 102 during wire bonding.
Specifically, in one example, the first connection line 106 may be a connection line made of metal, which has good conductivity and low cost. The metal is copper, silver, gold, or an alloy thereof.
In certain embodiments, the insulating substrate 108 is a glass substrate, a plastic substrate, or a ceramic substrate.
Thus, the material of the insulating substrate 108 is easy to obtain, the cost is low, the application range is wide, and meanwhile, the insulating substrate 108 made of the material is easy to cut the fingerprint sensing device 100 into different sizes.
Specifically, if the insulating substrate 108 is a glass substrate or a ceramic substrate, the TFT sensing array 110 may be directly formed on the glass substrate or the ceramic substrate by using a TFT process; if the insulating substrate 108 is a plastic substrate, the TFT sensor array 110 may be fabricated on the plastic substrate using a roll-to-roll (roll-to-roll) process.
In some embodiments, referring to fig. 1, the fingerprint sensing device 100 further includes a control chip 112, a power chip 114 and a memory chip 116, wherein one or more of the control chip 112, the power chip 114 and the memory chip 116 are disposed on the printed circuit board 102 at intervals, and are electrically connected to the printed circuit board 102 through a second connection wire 118 formed by a wire bonding process.
Thus, the fingerprint sensing device 100 is integrated with related functional chips through the wire bonding process, so that the integration level of the fingerprint sensing device 100 is higher, and the cost is reduced.
Further, signal transmission between various chips disposed on the same printed circuit board 102 and the TFT sensor 104 is faster, improving the efficiency of the fingerprint sensing device 100.
Preferably, the control chip 112, the power chip 114 and the memory chip 116 are disposed at intervals on the printed circuit board 102. The control chip 112 may control the TFT sensor 104 to perform fingerprint data acquisition. The power chip 114 may be used to manage the power to the fingerprint sensing device 100 to stabilize the power to the fingerprint sensing device 100. The memory chip 116 is used to store various control instructions and to buffer fingerprint data collected by the TFT sensor 104.
When the related chip is mounted on the printed circuit board 102, for example, the chip is fixed at a set position of the printed circuit board 102 by using an adhesive, and then the second connection wires 118 are electrically connected to the chip and the printed circuit board 102 by using a wire bonding process. Alternatively, the manner of mounting the relevant chip on the printed circuit board 102 is not limited to the adhesive manner, but may be other suitable manners, such as embossing, etc.
In some embodiments, referring to fig. 4, the fingerprint sensing device 100 further includes a chipset 120, the chipset 120 is disposed on the printed circuit board 102 and electrically connected to the printed circuit board 102 through a second connection wire 118 formed by a wire bonding process, wherein the chipset 120 includes one or more of a control chip, a power chip and a memory chip.
Thus, the related chips are integrated into a chip set (chip) and then arranged on the printed circuit board 102, so that the integration level of the fingerprint sensing device 100 is further improved, and the cost is reduced.
Further, the data transmission speed between the relevant chips integrated in the chip set is faster, improving the efficiency of the fingerprint sensing device 100.
Preferably, the chipset 120 includes a control chip, a power chip, and a memory chip. The function and mounting manner of the relevant chip can be referred to the description of the above embodiments, and will not be explained in detail here.
In some embodiments, referring to fig. 1, 4 and 5, the fingerprint sensing device 100 further comprises a package 122, and the side of the printed circuit board 102 provided with the TFT sensor 104 and the first connection line 106 is encapsulated by the package 122.
Thus, the components on the printed circuit board 102 are protected from moisture attack and damage by external forces.
Further, the package 122 is packaged with the printed circuit board 102, which has the advantages that the packaging form is mature and stable, the size of the packaged fingerprint sensing device 100 can be cut into different sizes according to practical conditions, and the packaging structure has strong adaptability, and can be used as a coating scheme, a molding capping plate scheme and the like.
Specifically, the components packaged on the printed circuit board 102 include, but are not limited to, control chips, power chips, memory chips, connection lines formed by wire bonding processes, TFT sensors, chipsets, traces on the surface of the printed circuit board, resistors, capacitors, and the like.
In some embodiments, referring to fig. 1 and 5, the fingerprint sensing device 100 further comprises a Coating layer 124, wherein the Coating layer 124 is formed on the package 122 by Coating (Coating); alternatively, the fingerprint sensing device 100 further comprises a cover 126, and the cover 126 is attached to the package 120. For the TFT sensor 104 of the fingerprint sensing device 100 of fig. 1, 4, 5, a Coating 124 is either applied (corresponding to the Coating chip design) or a cover 126 is provided (corresponding to the cover chip design).
In this way, the fingerprint sensing device 100 can be directly applied to various electronic apparatuses.
Specifically, in one example, when the fingerprint sensing device 100 with the coating layer 124 is applied to an electronic apparatus, the fingerprint sensing device 100 may be disposed at the back of the electronic apparatus, for example, the fingerprint sensing device 100 is mounted inside a rear case of the electronic apparatus, and then an opening is made in the rear case of the electronic apparatus to expose the coating layer 124, and a user places a finger at the coating layer 124 to cause the fingerprint sensing device 100 to collect a fingerprint when performing fingerprint input. In one example, the coating layer 124 may be formed on the encapsulation 122 using an ink layer coating (coating).
When the fingerprint sensing device 100 with the cover 126 is applied to an electronic apparatus, the fingerprint sensing device 10 may be arranged on the front side of the electronic apparatus, for example, the fingerprint sensing device 100 is mounted inside the front case of the electronic apparatus, and then the front case of the electronic apparatus is perforated to expose the cover 126, and a user places a finger at the cover 126 to cause the fingerprint sensing device 100 to collect a finger fingerprint when performing fingerprint input. In one example, the cover plate 126 may be made of sapphire or glass or ceramic, etc.
Of course, the fingerprint sensing device 100 may be located in other locations of the electronic device, such as the side. Alternatively, the coating layer 124 or the cover 126 may not be disposed on the package 122, and the fingerprint sensing device 100 may be disposed below a protective cover (i.e., the front case) of an electronic device, i.e., an Underglass solution.
In the embodiment of the invention, the electronic equipment is a portable electronic product or a household electronic product or a vehicle-mounted electronic product. The portable electronic products are various suitable electronic products such as mobile terminals, for example, mobile phones, tablet computers, notebook computers, wearable products, and the like; household electronic products such as intelligent door locks, televisions, refrigerators, desktop computers and other suitable electronic products; the vehicle-mounted electronic products are, for example, vehicle-mounted DVD, vehicle-mounted navigator and the like.
Further, for the fingerprint sensor device 100 of fig. 1, 4 and 5, the printed circuit board 102 is electrically connected to an external circuit through a flexible circuit board, so as to realize signal transmission.
Referring to fig. 6, a fingerprint sensing device 200 according to an embodiment of the invention includes a TFT sensor 202 and a cover plate 204, wherein the TFT sensor 202 includes an insulating substrate 206 and a TFT sensing array 208 formed on the insulating substrate 206, and the cover plate 204 is attached to the TFT sensing array 208, and the TFT sensor 202 is used for performing fingerprint sensing.
In this way, in the fingerprint sensing device 200, the cost of the TFT sensor 202 is low, and the insulating substrate 206 of the TFT sensor 202 can be used as the substrate of the fingerprint sensing device 200, so that no additional hard board is required, thereby reducing the cost of the fingerprint sensing device 200 and being beneficial to the application of the fingerprint sensing device 200.
Specifically, the TFT sensor 202 uses TFTs (thin film transistors) in the TFT sensing array 208 as switching transistors of the sensing circuit of the fingerprint sensing device 200, through which the relevant detection signals from the sensing electrodes of the TFT sensor 202 are received. For example, a sensing circuit formed of a TFT may convert a variation of a reference signal caused by a sensing electrode due to the proximity of a target object (e.g., a finger) or touching the fingerprint sensing device 200 into an alternating current signal (e.g., a current or voltage signal).
Wherein the sensing electrode is closer to the cover plate 204 than the TFT. As such, a sensing electrode (not shown) can be capacitively coupled to the finger, for example, to gather fingerprint information of the finger.
Specifically, the sensing electrode may be made of any one of a metal material, a metal oxide conductive material, a conductive composite material, a graphene material, and a carbon nanotube material.
The TFT sensing array 208 correspondingly outputs a sensing signal according to a change of a reference signal caused by the approach or touch of a finger on the sensing electrode.
In one example, the cover plate 204 may be glued to the TFT sensing array 208. The cover plate 204 may be made of sapphire, glass, ceramic, or the like.
In some embodiments, the insulating substrate 206 is a glass substrate, a plastic substrate, or a ceramic substrate.
Thus, the material of the insulating substrate 206 is easy to obtain, the cost is low, the application range is wide, and meanwhile, the insulating substrate 206 made of the material is easy to cut the fingerprint sensing device 200 into different sizes.
Specifically, if the insulating substrate 206 is a glass substrate or a ceramic substrate, the TFT sensing array 208 may be directly formed on the glass substrate or the ceramic substrate by using a TFT process; if the insulating substrate 206 is a plastic substrate, the TFT sensing array 208 may be fabricated on the plastic substrate using a roll-to-roll (roll-to-roll) process.
In some embodiments, the fingerprint sensing device 200 further comprises a shielding layer 210, the shielding layer 210 being arranged between the TFT sensing array 208 and the cover plate 204.
In this manner, when the fingerprint sensing device 200 is disposed on the front side of an electronic device, the shielding layer 210 may shield the TFT sensing array 208 underneath, thereby functioning to visually conceal the TFT sensing array 208.
Specifically, the fingerprint sensing device 200 may be mounted inside a front case of an electronic apparatus, and then an opening is made in the front case of the electronic apparatus to expose the cover 204, and a user places a finger at the cover 204 to cause the fingerprint sensing device 200 to collect a finger fingerprint when performing fingerprint input.
In some embodiments, the barrier layer 210 is disposed on a surface of the cover plate 204.
Since the shielding layer 210 is more easily formed on the surface of the cover plate 204, the cost of the fingerprint sensing device 200 may be reduced.
Specifically, the shielding layer 210 may be formed by coating a surface of the cover plate 204 facing the TFT sensing array 208 with a white ink layer, for example. After the shielding layer 210 is formed on the cover plate 204, the cover plate 204 with the shielding layer 210 may be attached to the TFT sensing array 208 by using an adhesive.
In some embodiments, the fingerprint sensing device 200 further comprises a flexible circuit board 212, wherein the flexible circuit board 212 is electrically connected to the TFT sensing array 208.
In this way, the flexible circuit board 212 is electrically connected with an external circuit, so that signal transmission is realized, and meanwhile, the installation space of the flexible circuit board 212 in the electronic equipment can be flexibly configured.
Specifically, in one example, the TFT sensor 202 may be electrically connected to the flexible circuit board 212 by means of a COF (chip-on-flex).
In some embodiments, referring to fig. 7, the insulating substrate 206 includes an edge region 214 surrounding the TFT sensor array 208, the edge region 214 is not covered by the cover 204, an edge trace 216 connected to the TFT sensor array 208 is formed on the edge region 214, and the flexible circuit board 212 is electrically connected to the edge trace 216.
Thus, the flexible circuit board 212 can be partially carried on the insulating substrate 206, which is beneficial for reliable connection of the flexible circuit board 212 and the TFT sensing array 208.
In particular, in fabricating the TFT sensor 202, the edge trace 216 may be simultaneously formed on the edge region 214 through a process of an integrated circuit of a Thin Film Transistor (TFT), and the edge trace 216 may include a scan line and a signal line.
Fig. 7 is only schematically provided with edge traces 216 on one side (right side as shown) of the TFT sense array 208, and those skilled in the art will appreciate that there are edge traces on other sides of the TFT sense array 208 that may extend to the location of the edge regions connected to the flexible circuit board 212.
In some embodiments, the fingerprint sensing device 200 further comprises a control chip, a power chip, and a memory chip, one or more of which are disposed on the flexible circuit board 212 at intervals.
Thus, the fingerprint sensing device 200 is integrated with related functional chips, so that the integration level of the fingerprint sensing device 200 is higher, and the cost is reduced.
Further, signal transmission between various chips disposed on the same flexible circuit board 212 and the TFT sensor 202 is faster, improving the efficiency of the fingerprint sensing device 200.
Preferably, the control chip, the power chip and the memory chip are disposed on the flexible circuit board 212 at intervals. The control chip may control the TFT sensor 202 to perform fingerprint data acquisition. The power chip may be used to manage the power to the fingerprint sensing device 200, stabilizing the power to the fingerprint sensing device 200. The memory chip is used to store various control instructions and to buffer fingerprint data collected by the TFT sensor 202.
In one example, the associated chips may be disposed on the flexible circuit board 212 by Surface Mount Technology (SMT).
In some embodiments, the fingerprint sensing device 200 further comprises a chipset disposed on the flexible circuit board 212, wherein the chipset comprises one or more of a control chip, a power chip, and a memory chip.
Thus, the related chips are integrated into a chip set (chipset) and then arranged on the flexible circuit board 212, so that the integration level of the fingerprint sensing device 200 is further improved, and the cost is reduced.
Further, the data transmission speed between the relevant chips integrated in the chip set is faster, and the efficiency of the fingerprint sensing device 200 is improved.
Preferably, the chipset includes a control chip, a power chip, and a memory chip. The function and mounting manner of the relevant chip can be referred to the description of the above embodiments, and will not be explained in detail here.
In some embodiments, the fingerprint sensing device 200 is a capacitive fingerprint sensing device.
Thus, the capacitive fingerprint sensing device has mature technology and wide application range.
Specifically, in one example, when a finger touches the capacitive fingerprint sensing device 200, the sensing electrode of the TFT sensor 202 may form capacitive coupling with the finger, thereby forming capacitive sensing, and fingerprint sensing is achieved by collecting a sensing signal output by the capacitive sensing.
Referring to fig. 8, an electronic device 300 according to an embodiment of the present invention includes a fingerprint sensing device 302. The fingerprint sensing device 302 may be a fingerprint sensing device according to any of the embodiments above.
In this way, in the electronic device 300, the cost of the fingerprint sensing device 302 can be reduced due to the low cost of the TFT sensor, which is beneficial to the application of the fingerprint sensing device 302 to the electronic device 300.
Specifically, as previously described, the fingerprint sensing device 302 may be disposed at a suitable location on the front, back, and/or side of the electronic device 300. In one example of the invention, the fingerprint sensing device 302 is provided on the back of the electronic device 300. Specifically, the rear housing 304 of the electronic device 300 is provided with an opening 306 for the fingerprint sensing device 302 to capture a fingerprint of a finger.
In the embodiment of the invention, the electronic device 300 is, for example, a portable electronic product or a home electronic product. The portable electronic products are various suitable electronic products such as mobile terminals, for example, mobile phones, tablet computers, notebook computers, wearable products, and the like; household electronic products are suitable electronic products such as intelligent door locks, televisions, refrigerators, desktop computers and the like.
In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.
Claims (9)
1. The fingerprint sensing device is characterized by comprising a printed circuit board and a TFT sensor, wherein the TFT sensor is arranged on the printed circuit board and is electrically connected with the printed circuit board through a first connecting wire formed by a wire bonding process, and the TFT sensor is used for performing fingerprint sensing;
the TFT sensor comprises an insulating substrate and a TFT sensing array formed on the insulating substrate, wherein the insulating substrate is attached to the printed circuit board;
the fingerprint sensing device further comprises a control chip, a power chip and a storage chip, wherein one or more of the control chip, the power chip and the storage chip are arranged on the printed circuit board at intervals and are electrically connected with the printed circuit board through a second connecting wire formed by a wire bonding process.
2. The fingerprint sensing device according to claim 1, wherein said printed circuit board is a hard board.
3. The fingerprint sensing device according to claim 1, wherein said first connection lines are connected from a side of said insulating substrate where said TFT sensing array is provided to a side of said printed circuit board carrying said TFT sensor.
4. The fingerprint sensing device according to claim 1, wherein said insulating substrate is a glass substrate, a plastic substrate or a ceramic substrate.
5. The fingerprint sensing device according to claim 1, further comprising a chipset disposed on the printed circuit board and electrically connected to the printed circuit board via a second connection line formed by a wire bonding process, wherein the chipset comprises one or more of a control chip, a power chip and a memory chip.
6. The fingerprint sensing device according to any one of claims 1-5, further comprising a package, wherein a side of said printed circuit board provided with said TFT sensor and said first connection line is encapsulated by said package.
7. The fingerprint sensing device according to claim 6, further comprising a coating layer formed on the package by coating; or (b)
The fingerprint sensing device further comprises a cover plate, and the cover plate is attached to the packaging body.
8. The fingerprint sensing device according to claim 1, wherein said TFT sensing array comprises TFTs and sensing electrodes connected to said TFTs, wherein said TFTs are more adjacent to said insulating substrate than said sensing electrodes.
9. An electronic device comprising a fingerprint sensing device according to any one of claims 1-8.
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