CN108014414A - A kind of preparation method of implanted degradable medicaments sustained release electronics patch - Google Patents
A kind of preparation method of implanted degradable medicaments sustained release electronics patch Download PDFInfo
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- CN108014414A CN108014414A CN201810009706.2A CN201810009706A CN108014414A CN 108014414 A CN108014414 A CN 108014414A CN 201810009706 A CN201810009706 A CN 201810009706A CN 108014414 A CN108014414 A CN 108014414A
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- Prior art keywords
- preparation
- insulating layer
- degradable
- patch
- energy acceptance
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Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M37/00—Other apparatus for introducing media into the body; Percutany, i.e. introducing medicines into the body by diffusion through the skin
- A61M37/0069—Devices for implanting pellets, e.g. markers or solid medicaments
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K31/00—Medicinal preparations containing organic active ingredients
- A61K31/16—Amides, e.g. hydroxamic acids
- A61K31/17—Amides, e.g. hydroxamic acids having the group >N—C(O)—N< or >N—C(S)—N<, e.g. urea, thiourea, carmustine
- A61K31/175—Amides, e.g. hydroxamic acids having the group >N—C(O)—N< or >N—C(S)—N<, e.g. urea, thiourea, carmustine having the group, >N—C(O)—N=N— or, e.g. carbonohydrazides, carbazones, semicarbazides, semicarbazones; Thioanalogues thereof
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/0002—Galenical forms characterised by the drug release technique; Application systems commanded by energy
- A61K9/0009—Galenical forms characterised by the drug release technique; Application systems commanded by energy involving or responsive to electricity, magnetism or acoustic waves; Galenical aspects of sonophoresis, iontophoresis, electroporation or electroosmosis
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K9/00—Medicinal preparations characterised by special physical form
- A61K9/48—Preparations in capsules, e.g. of gelatin, of chocolate
- A61K9/50—Microcapsules having a gas, liquid or semi-solid filling; Solid microparticles or pellets surrounded by a distinct coating layer, e.g. coated microspheres, coated drug crystals
- A61K9/5005—Wall or coating material
- A61K9/5021—Organic macromolecular compounds
- A61K9/5031—Organic macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds, e.g. polyethylene glycol, poly(lactide-co-glycolide)
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/02—General characteristics of the apparatus characterised by a particular materials
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/04—General characteristics of the apparatus implanted
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2205/00—General characteristics of the apparatus
- A61M2205/36—General characteristics of the apparatus related to heating or cooling
- A61M2205/3653—General characteristics of the apparatus related to heating or cooling by Joule effect, i.e. electric resistance
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
- A61M2207/00—Methods of manufacture, assembly or production
Abstract
The invention discloses a kind of preparation method of implanted degradable medicaments sustained release electronics patch.Preparation method of the present invention, which proposes, a kind of prepares the degradable blanket method of medicament slow release electronics patch, this method patterns each layer using acetone, while pattern integrity is ensured, it effectively prevent conventional wet etching such as interlayer and etch a series of uncontrollable defects；Drug bearing microsphere prepared by this method, scale span is larger, can be very good the characteristic for meeting stage drug release；Medicament slow release electronics patch prepared by the present invention, not only ensure that the degradable property of patch, while also as transfer process PI substrates presence, a degree of protection is carried out to patch, enhances the success rate of patch transfer；Manufacturing process of the present invention is simple, and method has the repeatability of height, and success rate is higher；The present invention has general applicability, and the medicine for treating different malignant tumours is wrapped in drug bearing microsphere, so as to fulfill the patch of the different malignant tumour effects for the treatment of is prepared.
Description
Technical field
The present invention relates to medical instrument technology of preparing, and in particular to a kind of implanted degradable medicaments sustained release electronics patch
Preparation method.
Background technology
Malignant tumour is already known to threaten the number one killer of human health, according to statistics cities and counties of 2013-2015 Guangdong Province
The network report of level above medical institutions dies of the number of malignant tumour up to 3632.And FDA (Food and Drug Adminstration) in 1996
(FDA) a kind of medicament slow release patch of Gliadel wafer is just have approved for glioma, but in this medicament slow release patch
Drug diffusion be often unable to control, and range of scatter is smaller, action effect unobvious.And carrying with flexible electronic technology
Go out, possibility is provided to this controlled drug sustained release electronics patch for being used to treat malignant tumour.
The it is proposed of flexible electronic device concept can trace back to the research of organic electronics at first.But due to organic flexible electricity
Sub- technology is limited be subject to organic semiconducting materials performance, significantly limit its use scope and development process.And in recent years
The inorganic flexible electronic to grow up then sufficiently make use of the advantage of inorganic micro-nano electronic device, with reference to organic flexible liner
Bottom, realizes flexible inorganic electronic device, this flexible inorganic electronic device is not only inherited by mechanics optimization structure design
The high performance advantage of the inorganic micro-nano electronic device of tradition, has also given full play to the advantage of organic flexible substrate, instead of traditional
Silicon substrate, greatly reduces the cost of electronic device.Simultaneously because its have it is good attach characteristic, with human body integrated level height etc.
Characteristic and the intellectual monitoring and therapy field for being widely used in health physiological parameter, Feng Xue seminars of Tsinghua University are respectively
A series of flexible electronic devices are developed, such as flexible electronic temperature patch, flexible cardioelectric monitor patch and flexible oxygen saturation monitor patch.
But these flexible electronic devices are mostly external flexible device, and mostly non-degradable material, it is not used to the monitoring of inside of human body
And treatment.
The content of the invention
For drug diffusion scope present in above prior art problem is small, uncontrollable and electronic device can not be internal
The problem of degraded, the present invention propose a kind of preparation method of the degradable medicament slow release electronics patch of implanted.
The preparation method of the degradable medicament slow release electronics patch of implanted of the invention, comprises the following steps：
1) drug bearing microsphere is prepared：
Drug bearing microsphere is prepared using solvent evaporation method, the material of medicine and carrier material clad is dissolved in solvent, and
Stirred
Mix, form the drug bearing microsphere of carrier material clad packaging medicine, drug bearing microsphere forms in the solution, formed and carry medicine
Microballoon
Solution；
2) drug bearing microsphere is embedded in the first degradable flexible substrate：
The solution of degradation material is provided, and is mixed with drug bearing microsphere solution, mixed solution has been placed in solid shape
Mould
In, cured, so as to form the first degradable flexible substrate, and to be embedded in first degradable soft for drug bearing microsphere
Property base
In bottom；
3) transfer substrate is provided：
Transfer substrate includes hard substrate, sacrifice layer and transfer carrier successively from bottom to up；
4) energy acceptance coil, insulating layer and heating resistor are sequentially formed on transfer substrate：
A) the first photoresist of spin coating on transfer substrate, is lithographically formed the photoetching agent pattern with the complementation of energy acceptance coil,
Adhesion layer is plated, the metal of energy acceptance coil is plated on adhesion layer, the first photoresist is removed, so that unwanted metal be gone
Fall, form energy acceptance coil；
B) the second photoresist of spin coating on energy acceptance coil, is lithographically formed the photoetching agent pattern with insulating layer complementation, plating
Adhesion layer, plates the material of insulating layer on adhesion layer, removes the second photoresist, so that unwanted material be removed, is formed exhausted
Edge layer；
C) the 3rd photoresist of spin coating on the insulating layer, is lithographically formed the photoetching agent pattern with heating resistor complementation, plating adhesion
Layer, plates the metal of heating resistor on adhesion layer, removes the 3rd photoresist, so that unwanted metal be removed, forms fever
Resistance；
5) transfer：
The energy acceptance coil, insulating layer and the heating resistor that prepare on transfer substrate are transferred to the first degradable flexible
Substrate；
6) transfer carrier is removed：
Transfer carrier is removed using reactive ion etching RIE, so as to sequentially form hair in the first degradable flexible substrate
Thermal resistance, insulating layer and energy acceptance coil；
7) cast mixed solution is provided：
Drug bearing microsphere solution is mixed into the solution of degradation material, forms cast mixed solution；
8) the second degradable flexible substrate is formed：
Heating resistor, insulating layer and the energy acceptance coil that will be formed in the first degradable flexible substrate are put into mould
In, Xiang Mo
Cast mixed solution in tool, forms the second degradable flexible substrate for having embedded drug bearing microsphere after curing, at the same time will
Heating electric
Including resistance, insulating layer and energy acceptance coil encapsulation.
Wherein, in step 1), the material of carrier material clad uses polymer acid anhydrides, such as poly lactic-co-glycolic acid
Copolymer (polylactic-co-glycolic acid, PLGA) or polylactic acid (polylactic acid, PLA), solvent is adopted
With one kind in dichloromethane, acetone, chloroform, vinyl chloride and ethyl acetate.
In step 2), the degradation material that the first degradable flexible substrate uses is common for polylactic acid-carbonate
One kind in polymers P (LA-TMC), polylactic acid (PLA) or Poly(D,L-lactide-co-glycolide (PLGA).
In step 3), hard substrate uses silicon or glass；Sacrifice layer uses polymetylmethacrylate；Transfer carries
Body uses one kind in polyimides (PI), polyethyleneimine (PEI) and acrylic resin (PAA).
In step 4), using acetone by the metal of first, second, and third photoresist and corresponding part, insulating layer,
Metal removal, so as to form energy acceptance coil, insulating layer and heating resistor respectively.Energy acceptance coil uses zinc, magnesium and molybdenum
In one kind, thickness can be adjusted accordingly according to actual needs, common between 1 μm~3 μm；Insulating layer uses magnesia
It is common between 500nm~1.5 μm or silica, thickness can be adjusted accordingly according to actual needs；Heating resistor is adopted
With one kind in zinc, magnesium and molybdenum, thickness can be adjusted accordingly according to actual needs, common between 500nm~2 μm.
In step 6), the power of reactive ion etching is 100w~150w；Oxygen partial pressure is 25~35torr, its is specific
Power can influence etch rate and device surface quality, can be adjusted accordingly according to actual needs.
In step 7), the degradation material that the second degradable flexible substrate uses is common for polylactic acid-carbonate
One kind in polymers P (LA-TMC), polylactic acid (PLA) and Poly(D,L-lactide-co-glycolide (PLGA).
Advantages of the present invention：
Preparation method of the present invention propose it is a kind of prepare the degradable blanket method of medicament slow release electronics patch, should
Method patterns each layer using acetone, while pattern integrity is ensured, effectively prevent conventional wet etching such as
Interlayer etches a series of defects such as uncontrollable；Drug bearing microsphere prepared by this method, scale span is larger, can be very good to meet rank
The characteristic of section drug release；Medicament slow release electronics patch prepared by the present invention, not only ensure that the degradable property of patch, at the same also because
In the presence of transfer process PI substrates, to carry out a degree of protection to patch, enhancing the success rate of patch transfer；This hair
Bright degradable medicament slow release electronics patch manufacturing process is simple, and method has the repeatability of height, and success rate is higher；This
Invention has general applicability, the medicine for treating different malignant tumours can be wrapped in drug bearing microsphere, is treated so as to fulfill preparing
The patch of different malignant tumour effects.
Brief description of the drawings
Fig. 1 is the stream of one embodiment of the preparation method of the degradable medicament slow release electronics patch of the implanted of the present invention
Cheng Tu；
Fig. 2 is the load of one embodiment of the preparation method of the degradable medicament slow release electronics patch of the implanted of the present invention
The preparation process schematic diagram of medicine microballoon；
Fig. 3 is the of one embodiment of the preparation method of the degradable medicament slow release electronics patch of implanted of the present invention
The preparation process schematic diagram of one degradable flexible substrate；
Fig. 4 is turning for one embodiment of the preparation method of the degradable medicament slow release electronics patch of the implanted of the present invention
Print the preparation process schematic diagram of substrate；
Fig. 5 is the energy of one embodiment of the preparation method of the degradable medicament slow release electronics patch of the implanted of the present invention
Measure the preparation process schematic diagram of receiving coil, insulating layer and heating resistor；
Fig. 6 is turning for one embodiment of the preparation method of the degradable medicament slow release electronics patch of the implanted of the present invention
The preparation process schematic diagram of print extremely encapsulation.
Embodiment
Below in conjunction with the accompanying drawings, by specific embodiment, the present invention is further explained.
The degradable base material of the present embodiment uses polylactic acid-carbonate copolymer (P (LA-TMC)), and medicine is adopted
With Carmustine (BCNU), carrier material clad uses l-lactic acid (PLLA), and transfer substrate is using silicon chip as hard
Substrate.
As shown in Figure 1, the preparation method of the degradable medicament slow release electronics patch of the implanted of the present embodiment, including it is following
Step：
1) drug bearing microsphere is prepared：
The PLLA particles of 100mg are taken to be added in the dichloromethane solution of 25ml, magnetic stirrer 2 is using 850r/min's
Mixing speed dissolves 7min, is completely dissolved PLLA particles, forms PLLA solution 1；200mg bovine serum albumin(BSA)s (BSA) are taken again
It is added in the deionized water in 50ml, 5min is stirred using the speed of 1000r/min, perfect solution is allowed to, forms emulsifying agent
3, then the BCNU drug solns 4 of 50mg and PLLA solution 1 are slowly added into the emulsifying agent 3 quickly stirred, 5h is persistently stirred, is treated
Organic solvent volatilizees completely, forms drug bearing microsphere solution 5, as shown in Figure 2.
2) drug bearing microsphere is embedded in the first degradable flexible substrate：
Take P (LA-TMC) material of 2g to be dissolved in the dichloromethane solution of 20ml, carried out using the mixing speed of 1000r/min
2h is stirred, after P (LA-TMC) is completely dissolved, P (LA-TMC) solution 11 is formed, adds degradable drug bearing microsphere solution 5, and adopt
5min is stirred with the mixing speed of 300r/min, it is sufficiently mixed uniformly.Uniformly mixed mixed liquor 12 is poured into advance system
In the mould 13 of work, 2 days are stood in the environment of dustless, sterile, room temperature, makes its spontaneous curing, forms the first degradable flexible
Substrate, as shown in Figure 3.
3) transfer substrate is provided：
First required size is cleaved into using silicon chip 6 as hard substrate (such as：2cm*2cm), by the good silicon chip of cleavage
7 times progress surface-active-treatment 5min of ultraviolet lamp are put into after cleaning, by the hard substrate handled well using low in sol evenning machine 8
Fast (600r/min, 6s), high speed (3000r/min, 30s) carry out spin coating polymethyl methacrylate (PMMA) and are used as sacrifice layer,
Afterwards using 180 DEG C of baking 20min in heating plate 9；Hard substrate after baking is used into identical parameter (low speed (600r/
Min, 6s), at a high speed (3000r/min, 30s)) spin-on polyimide (PI) solution is carried out, and the hard substrate that spin coating has PI is put
Using the ginseng of 80 DEG C of (20min) → 120 DEG C (20min) → 150 DEG C (30min) → 180 DEG C (120min) in vacuum drying oven 10
Number is cured, and the PI films after curing are as transfer carrier, easily transfer relatively weak with the interface of hard substrate, process
As shown in Figure 4.
4) energy acceptance coil, insulating layer and heating resistor are sequentially formed on transfer substrate, as shown in Figure 5：
A) energy acceptance coil is prepared：Transfer substrate is placed on sol evenning machine 8, using low speed (600r/min, 6s), high speed
The parameter of (1500r/min, 30s) carries out the first negative photoresist of spin coating (ENPI202), by the substrate of spin coating photoetching as heating plate
110 DEG C are used on 9, the parameter of 5min is toasted, then the substrate toasted after completing is carried out uv-exposure with litho machine 14
34s, the substrate after exposure is placed in heating plate 9 and uses 110 DEG C, the parameter of 5min carries out post bake, and the substrate after post bake is put
Developed about 1min in developer for negative photoresist (FHD-5) 15, and development is completed substrate is placed in Electron beam evaporation machine 16
The molybdenum film for carrying out deposition 2nm respectively deposits certain thickness zinc film (such as tack coat, then on molybdenum film：1.5 μm,
Actual conditions can be adjusted corresponding coating film thickness according to resistance demand), the transfer substrate for having plated zinc film is placed in third
Unnecessary metallic film is removed in ketone 17, forms energy acceptance coil.
B) insulating layer is prepared：Will prepare the transfer substrate containing energy acceptance coil with a) in similar the second negative photoetching of spin coating
Glue (ENPI202), and the flows such as post bake, exposure, development are carried out using identical technique.And the substrate for completion of developing is placed in electricity
In beamlet vacuum coating equipment 16, the cavity temperature of Electron beam evaporation machine is increased to 80 DEG C, starts to deposit certain thickness oxygen
Change magnesium film (such as 1 μm, actual film thickness can adjust accordingly according to demand)., can be with when cavity temperature is increased to 80 DEG C
Ensure the insulating properties of magnesia film.Transfer substrate after deposited oxide magnesium film is removed to the magnesia of redundance, is formed
Insulating layer.
C) heating resistor is prepared：Prepared by heating resistor to the transfer substrate after completing b) using with a) identical method,
So as to be formed in the energy acceptance coil transferred on substrate, insulating layer and the device 18 of heating resistor patch 22.
5) transfer：
Polydimethylsiloxane film is prepared first, and preparation method uses body：Curing agent=10:1 parameter into
Row prepares PDMS, and the two-phase mixed is being vacuumized, and the bubble produced in mixed process is removed, by mixed PDMS
Using 70 DEG C, 40min carries out being formed by curing PDMS film.PDMS film 20 after curing is attached on sheet glass 19, at the same time will
The device 18 of energy acceptance coil, insulating layer and heating resistor patch 22 on transfer substrate is transferred, so that by energy
It is transferred to 21 in the first degradable flexible substrate and (reversely attaches, it is ensured that bottom on receiving coil, insulating layer and heating resistor patch 22
Layer PI is removed completely during follow-up RIE), and the first degradable flexible substrate is attached on PDMS film 20.
6) transfer carrier is removed：Insert and power 100w, oxygen partial pressure 30torr used in reactive ion etching machine 23,
The parameter of 50min removes the PI films of bottom.
7) cast mixed solution is provided：
Drug bearing microsphere solution is mixed into the solution of the second degradable flexible base material, forms cast mixed solution
24；
8) the second degradable flexible substrate is formed：
The heating resistor, insulating layer and the energy acceptance coil that will be formed in the first degradable flexible substrate are put into patch
Mould 13 in, pour the cast mixed solution 24 for being mixed with drug bearing microsphere, treat its spontaneous curing, complete the encapsulation to patch, shape
Into complete medicament slow release electronics patch 25, as shown in Figure 6.
It is finally noted that the purpose for publicizing and implementing example is that help further understands the present invention, but this area
Technical staff be appreciated that：Without departing from the spirit and scope of the invention and the appended claims, it is various to replace and repair
It is all possible for changing.Therefore, the present invention should not be limited to embodiment disclosure of that, and the scope of protection of present invention is to weigh
Subject to the scope that sharp claim defines.
Claims (9)
- A kind of 1. preparation method of the degradable medicament slow release electronics patch of implanted, it is characterised in that the preparation method bag Include following steps：1) drug bearing microsphere is prepared：Drug bearing microsphere is prepared using solvent evaporation method, the material of medicine and carrier material clad is dissolved in solvent, and carries out Stirring, forms the drug bearing microsphere of carrier material clad packaging medicine, and drug bearing microsphere is formed in the solution, and it is molten to form drug bearing microsphere Liquid；2) drug bearing microsphere is embedded in the first degradable flexible substrate：The solution of degradation material is provided, and is mixed with drug bearing microsphere solution, mixed solution is placed in figurate mould In tool, cured, so that the first degradable flexible substrate is formed, and drug bearing microsphere is embedded in the first degradable flexible substrate It is interior；3) transfer substrate is provided：Transfer substrate includes hard substrate, sacrifice layer and transfer carrier successively from bottom to up；4) energy acceptance coil, insulating layer and heating resistor are sequentially formed on transfer substrate：A) the first photoresist of spin coating on transfer substrate, is lithographically formed the photoetching agent pattern with the complementation of energy acceptance coil, and plating is viscous Attached layer, plates the metal of energy acceptance coil on adhesion layer, the first photoresist is removed, so as to unwanted metal be removed, shape Into energy acceptance coil；B) the second photoresist of spin coating on energy acceptance coil, is lithographically formed the photoetching agent pattern with insulating layer complementation, plating adhesion Layer, plates the material of insulating layer on adhesion layer, removes the second photoresist, so that unwanted material be removed, forms insulating layer；C) the 3rd photoresist of spin coating on the insulating layer, is lithographically formed the photoetching agent pattern with heating resistor complementation, plates adhesion layer, The metal of heating resistor is plated on adhesion layer, removes the 3rd photoresist, so that unwanted metal be removed, forms heating resistor；5) transfer：The energy acceptance coil, insulating layer and the heating resistor that prepare on transfer substrate are transferred to the first degradable flexible base Bottom；6) transfer carrier is removed：Transfer carrier is removed using reactive ion etching RIE, so as to sequentially form heating electric in the first degradable flexible substrate Resistance, insulating layer and energy acceptance coil；7) cast mixed solution is provided：Drug bearing microsphere solution is mixed into the solution of degradation material, forms cast mixed solution；8) the second degradable flexible substrate is formed：Heating resistor, insulating layer and the energy acceptance coil that will be formed in the first degradable flexible substrate are put into mould, to Cast mixed solution in mould, forms the second degradable flexible substrate for having embedded drug bearing microsphere after curing, while by heating electric Including resistance, insulating layer and energy acceptance coil encapsulation.
- 2. preparation method as claimed in claim 1, it is characterised in that in step 1), the material of carrier material clad is adopted With polymer acid anhydrides；Solvent uses one kind in dichloromethane, acetone, chloroform, vinyl chloride and ethyl acetate.
- 3. preparation method as claimed in claim 1, it is characterised in that in step 2), the first degradable flexible substrate uses Degradation material be polylactic acid-carbonate copolymer, polylactic acid and Poly(D,L-lactide-co-glycolide in one Kind.
- 4. preparation method as claimed in claim 1, it is characterised in that in step 3), hard substrate uses silicon or glass；It is sacrificial Domestic animal layer uses polymethyl methacrylate；Carrier is transferred using one kind in polyimides, polyethyleneimine and acrylic resin.
- 5. preparation method as claimed in claim 1, it is characterised in that in step 4), using acetone by first, second and The metal of three photoresists and corresponding part, insulating layer, metal removal, thus formed respectively energy acceptance coil, insulating layer and Heating resistor.
- 6. preparation method as claimed in claim 1, it is characterised in that in step 4), energy acceptance coil using zinc, magnesium and One kind in molybdenum, thickness is between 1 μm~3 μm.
- 7. preparation method as claimed in claim 1, it is characterised in that in step 4), insulating layer uses magnesia or dioxy SiClx, thickness is between 500nm~1.5 μm.
- 8. preparation method as claimed in claim 1, it is characterised in that in step 4), heating resistor is used in zinc, magnesium and molybdenum One kind, thickness is between 500nm~2 μm.
- 9. preparation method as claimed in claim 1, it is characterised in that in step 7), the second degradable flexible substrate uses Degradation material be polylactic acid-carbonate copolymer, polylactic acid and Poly(D,L-lactide-co-glycolide in one Kind.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110051364A (en) * | 2019-04-23 | 2019-07-26 | 重庆大学 | A kind of implanted electrode with drug release function |
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| CN110051364A (en) * | 2019-04-23 | 2019-07-26 | 重庆大学 | A kind of implanted electrode with drug release function |
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