CN108012450A - A kind of SMT paster techniques - Google Patents
A kind of SMT paster techniques Download PDFInfo
- Publication number
- CN108012450A CN108012450A CN201711147231.5A CN201711147231A CN108012450A CN 108012450 A CN108012450 A CN 108012450A CN 201711147231 A CN201711147231 A CN 201711147231A CN 108012450 A CN108012450 A CN 108012450A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- pcb
- reflow soldering
- carried out
- smt paster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to SMT fields, disclose a kind of modified SMT paster techniques, include the following steps：A. pickling is carried out to pcb board；B. ultrasonic wave water washing is carried out to pcb board；C. pcb board is dried；D. to pcb board brush tin cream；E. with chip mounter to PCB patches；F. reflow soldering is carried out to the PCB after patch with reflow soldering.This method reduces the fraction defective of the pcb board of welding, ensures the high reliability of pcb board, and then can save manual maintenance's cost, improves SMT processing qualities.
Description
Technical field
The present invention relates to SMT fields, and in particular to a kind of SMT paster techniques.
Background technology
With the miniaturization and micromation of modern electronic product, the selection of electronic component and using more toward surface patch
Dress direction is developed, and is producing and be made aspect, SMT surface mounting technologies are just particularly important.A good electronic product is
No durable, in addition to the quality of material in itself, key is the assembling process of technique.
It is electronic component to be attached to or be inserted on pcb board and then with relevant machine in the assembling process of electronic product
Device is welded, and is SMT techniques.If pcb board is during producer manufactures, surface is unclean, and there are grease, foul
When impurity residue, bad welding influence will be produced on electronic component in rear road SMT patch process of manufacture.How
Remove the foul of plate face, impurity is just particularly important.
The content of the invention
The invention mainly solves the technical problem of providing a kind of SMT paster techniques, there is provided a whole set of optimal technique ginseng
Number and scheme, by controlling chemical concentration, temperature, pressure and other parameters, in the case where not influencing PCB qualities, can effectively locate
PCB surface impurity is managed, reduction is scrapped, and ensures product quality.Brush tin cream process is entered back into after the pcb board desiccation after cleaning,
The quality through subsequently welding obtained pcb board is improved, the fraction defective of the pcb board of welding is reduced, ensures the highly reliable of pcb board
Property, and then manual maintenance's cost can be saved.
In order to solve the above technical problems, the technical solution adopted by the present invention is：
A kind of SMT paster techniques, include the following steps：
A. pickling is carried out to pcb board；
B. ultrasonic wave water washing is carried out to pcb board；
C. pcb board is dried；
D. to pcb board brush tin cream；
E. with chip mounter to PCB patches；
F. reflow soldering is carried out to the PCB after patch with reflow soldering；
Further, sulfuric acid concentration used in the pickling is 2-3%.
Further, the frequency of oscillation of the ultrasonic wave water washing is 81%-85%.
Further, the temperature range of reflow soldering is 240-250 degrees Celsius during the reflow soldering.
Further, the tin cream thickness range of the brush tin cream is 0.11-0.12mm.
Further, the percentage by weight of tin is 90-95% in the tin cream, the percentage by weight of silver is 1-2%, zinc
Percentage by weight is 0.1-0.3%, 3-8% rosin resins.
The present invention has the advantages that：
Present invention process is easy to operate, and device simple, works well.By carrying out the techniques such as pickling, ultrasonic wave water washing into andante
Face is cleaned, and PCB surface dirt is eliminated using the special process parameter, environmental condition and the chemical concentration that are determined through test of many times
Dye, the formation that film is welded to organic guarantor when welding create good conditions, reduce and scrap, reduce quality cost, control product yield
Purpose.
Embodiment
With reference to embodiment, the present invention will be described in detail, and embodiment is only the preferred embodiment of the present invention,
It is not limitation of the invention.
Embodiment 1
A kind of SMT paster techniques, include the following steps：
A. pickling is carried out to pcb board；
B. ultrasonic wave water washing is carried out to pcb board；
C. pcb board is dried；
D. to pcb board brush tin cream；
E. with chip mounter to PCB patches；
F. reflow soldering is carried out to the PCB after patch with reflow soldering；
Wherein, sulfuric acid concentration used in the pickling is 2-3%.
Wherein, the frequency of oscillation of the ultrasonic wave water washing is 81%-85%.
Wherein, the temperature range of reflow soldering is 240-250 degrees Celsius during the reflow soldering.
Wherein, the tin cream thickness range of the brush tin cream is 0.11-0.12mm.
Wherein, the percentage by weight of tin is 90-95% in the tin cream, the percentage by weight of silver is 1-2%, the weight of zinc
Percentage is 0.1-0.3%, 3-8% rosin resins.
Plate face cleaning is carried out by carrying out the techniques such as pickling, ultrasonic wave water washing, so can fully get rid of pcb board residual
In the organic principle such as inorganic composition and some greases such as the sulphur, mercury, cadmium on surface, and will not remaining influence subsequent technique component.
For the pcb board of high request, the unfailing performance shadow of the clean level of pcb board to the subsequently PCB through being produced after Reflow Soldering
Sound is very big.
The present invention carries out SMT paster techniques, after effectively reducing OSP processing by test statistics by the technical program
The bad products of generation, can make PCBA scrappages drop to 0.1% by original 0.8%, thus the production yield greatly improved and
Efficiency.
The foregoing is merely the embodiment of the present invention, is not intended to limit the scope of the invention, every to utilize this hair
The equivalent arrangements that bright specification is made, are directly or indirectly used in other related technical areas, are similarly included in
In the scope of patent protection of the present invention.
Claims (6)
1. a kind of SMT paster techniques, it is characterised in that include the following steps：
A. pickling is carried out to pcb board；
B. ultrasonic wave water washing is carried out to pcb board；
C. pcb board is dried；
D. to pcb board brush tin cream；
E. with chip mounter to PCB patches；
F. reflow soldering is carried out to the PCB after patch with reflow soldering.
2. SMT paster techniques according to claim 1, it is characterised in that：Sulfuric acid concentration used in the pickling is 2-3%.
3. SMT paster techniques according to claim 1, it is characterised in that：The frequency of oscillation of the ultrasonic wave water washing is
81%-85%。
4. SMT paster techniques according to claim 1, it is characterised in that：The temperature of reflow soldering during the reflow soldering
Scope is 240-250 degrees Celsius.
5. SMT paster techniques according to claim 1, it is characterised in that：The tin cream thickness range of the brush tin cream is
0.11-0.12mm。
6. SMT paster techniques according to claim 1, it is characterised in that：The percentage by weight of tin is in the tin cream
90-95%, the percentage by weight of silver are 1-2%, the percentage by weight of zinc is 0.1-0.3%, 3-8% rosin resins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711147231.5A CN108012450A (en) | 2017-11-17 | 2017-11-17 | A kind of SMT paster techniques |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711147231.5A CN108012450A (en) | 2017-11-17 | 2017-11-17 | A kind of SMT paster techniques |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108012450A true CN108012450A (en) | 2018-05-08 |
Family
ID=62052859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711147231.5A Pending CN108012450A (en) | 2017-11-17 | 2017-11-17 | A kind of SMT paster techniques |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108012450A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888188A (en) * | 2019-11-29 | 2021-06-01 | 深圳市普能达电子有限公司 | PCBA (printed circuit board assembly) paster processing technology |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000704A1 (en) * | 2002-07-01 | 2004-01-01 | George Tsao | Process for grid array assembly and electronic device made thereby |
| KR20150081564A (en) * | 2014-01-06 | 2015-07-15 | (주)세웅 | Smt pcb cover and zig unit having the same |
| CN105142354A (en) * | 2015-07-15 | 2015-12-09 | 中山市晔汇电子有限公司 | Improved SMT chip mounting technology |
| CN106658991A (en) * | 2016-11-29 | 2017-05-10 | 芜湖赋兴光电有限公司 | Mounting process for camera chip element |
| CN107278048A (en) * | 2017-06-20 | 2017-10-20 | 苏州市狮威电子有限公司 | A kind of SMT typographies and its printing apparatus |
-
2017
- 2017-11-17 CN CN201711147231.5A patent/CN108012450A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040000704A1 (en) * | 2002-07-01 | 2004-01-01 | George Tsao | Process for grid array assembly and electronic device made thereby |
| KR20150081564A (en) * | 2014-01-06 | 2015-07-15 | (주)세웅 | Smt pcb cover and zig unit having the same |
| CN105142354A (en) * | 2015-07-15 | 2015-12-09 | 中山市晔汇电子有限公司 | Improved SMT chip mounting technology |
| CN106658991A (en) * | 2016-11-29 | 2017-05-10 | 芜湖赋兴光电有限公司 | Mounting process for camera chip element |
| CN107278048A (en) * | 2017-06-20 | 2017-10-20 | 苏州市狮威电子有限公司 | A kind of SMT typographies and its printing apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888188A (en) * | 2019-11-29 | 2021-06-01 | 深圳市普能达电子有限公司 | PCBA (printed circuit board assembly) paster processing technology |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180508 |