CN107995705A - A kind of optical assembly applied to industrial temperature range - Google Patents
A kind of optical assembly applied to industrial temperature range Download PDFInfo
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- CN107995705A CN107995705A CN201711243548.9A CN201711243548A CN107995705A CN 107995705 A CN107995705 A CN 107995705A CN 201711243548 A CN201711243548 A CN 201711243548A CN 107995705 A CN107995705 A CN 107995705A
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- optical assembly
- heating element
- ceramic heating
- ceramic
- temperature range
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- 230000003287 optical effect Effects 0.000 title claims abstract description 73
- 239000000919 ceramic Substances 0.000 claims abstract description 83
- 238000010438 heat treatment Methods 0.000 claims abstract description 50
- 239000000835 fiber Substances 0.000 claims abstract description 15
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 239000003292 glue Substances 0.000 claims description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052573 porcelain Inorganic materials 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 20
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 6
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 6
- 235000011449 Rosa Nutrition 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012913 prioritisation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- GAHOBHHMYUYJDT-UHFFFAOYSA-N desaspidin Chemical compound O=C1C(C(=O)CCC)=C(O)C(C)(C)C(O)=C1CC1=C(O)C(C(=O)CCC)=C(O)C=C1OC GAHOBHHMYUYJDT-UHFFFAOYSA-N 0.000 description 1
- 229960003800 desaspidin Drugs 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001012 protector Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Automation & Control Theory (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The present invention relates to optical communication field, there is provided a kind of optical assembly applied to industrial temperature range, including hardware, for carrying out the ceramic heating element of temperature-compensating to optical assembly inside chip, and for sensing the temperature detection chip of optical assembly temperature；Hardware side is provided with fiber adapter, ceramic heating element is bonded on the TO Can of the opposite side of hardware, and the ceramic heating element is provided with flexible PCB, the flexible PCB and the temperature detection chip and carries the module board of the temperature detection chip and be connected.The present invention carries out temperature-compensating using high-heat conductive efficency and the ceramic heating element of low cost to optical assembly inside chip, traditional temperature-compensating mode is given up, the optical assembly of needs is made without customizing the TO Can with adding thermal resistance or TEC (semiconductor cooler), only need using TO Can general on the market, the difficulty for obtaining raw material is greatly reduced, service life had not only been improved but also had reduced cost.
Description
Technical field
The present invention relates to optical communication field, the specially optical assembly applied to industrial temperature range.
Background technology
As Fibre Optical Communication Technology is in the extensive use of backbone network, Metropolitan Area Network (MAN), data center, the integrated module of optical transceiver is
Increasingly popularize, due to the diminution of integrated module of optical transceiver volume, the increase of density, the increase of power consumption, industry interior focusing transmitting-receiving
The temperature requirement of integrated module is more and more stringenter.
The operating temperature of the integrated module of optical transceiver is mainly determined by the optical assembly (TOSA, ROSA or BIDI) among module
It is fixed, this is because what the material property of manufacture Avalanche Photo Diode (APD) and laser diode (LD) was determined, iii-v
The performance of material can change with temperature change.
Avalanche Photo Diode (APD) is a kind of optical device for having interior gain.With photosensitive made of III-V material
After adding bias voltage on the PN junction of diode, incident light is utilized by PN junction and generates photo-generated carrier.Increase bias voltage meeting
" snowslide " (surge of photoelectric current at double, be called and do enhancement effect) phenomenon is produced, bias voltage more large gain is bigger, and APD is sensitive
Degree is higher.Coefficient between APD bias voltages and temperature is generally 0.15V/ DEG C (- 40 DEG C~25 DEG C) 0.1V/ DEG C (25 DEG C~85
℃)；Gain is constant during in order to ensure temperature change, and conventional way is to increase a compensation circuit, root on a modular circuit board
Bias voltage is adjusted according to temperature change.But because cryogenic temperature scope is larger, compensate too many to the voltage of APD, just have larger
Probability there is the breakdown voltage of bias voltage more than APD in itself, APD will be damaged in this case.
III-V material is similarly for optical gain medium in laser diode (LD), and acts on wavelength selection
Distributed grating also very sensitive to operating ambient temperature (coefficient between the selection of the wavelength of grating and temperature is 0.1nm/
DEG C, the coefficient of gain media peak displacement and temperature is 0.6nm/ DEG C), it is in industrial temperature range (especially low temperature) so working as
When, the SMSR (side mode suppression ratio) of LD changes violent reduction, single mode operation state, therefore seriously affects or even interrupt
Communication.In order to increase the operating temperature range of LD, common way is that the coupling efficiency of chip is improved in design chips.But
The RIN (relative noise intensity) of LD can be increased under this state again and be not suitable for the transmission of high speed signal.In order to meet industrial warm
The requirement of degree, the manufacturer of LD chips can generally carry out the screening of different temperature points in die terminals.
There is stringenter want to the wave-length coverage of LD in WDM (wavelength-division multiplex) system for needing stringent control wavelength
Ask, in order to realize the requirement of WDM wave-length coverages, in present industry more common way be by heat controller, LD chips,
Temperature sensor, the photon detector of monitoring, ESD protectors are integrated in TO-Can to control the temperature of laser diode together
Degree.But this method needs complicated design and cumbersome technique to be realized, therefore can increase the cost of optical assembly.
The content of the invention
It is an object of the invention to provide a kind of optical assembly applied to industrial temperature range, current technical barrier is overcome,
Traditional LD and APD temperature-compensating modes are substituted using existing inexpensive ceramic heating plate, had both solved existing APD
The problem of being easily damaged solves the problems, such as that existing LD costs are higher again.
To achieve the above object, the embodiment of the present invention provides following technical solution：It is a kind of applied to industrial temperature range
Optical assembly, including hardware, for carrying out the ceramic heating element of temperature-compensating to optical assembly inside chip, and are used for
Sense the temperature detection chip of the optical assembly temperature；The hardware side is provided with fiber adapter, the ceramics
Heating component is bonded on the TO-Can of the opposite side of the hardware, and ceramic heating element installation is flexible
Circuit board, the flexible PCB is with the temperature detection chip and carries the module board phase of the temperature detection chip
Even.
Further, the hardware is cylindrical shape, and the fiber adapter and the TO-Can are located at institute respectively
State at two discs of hardware；The ceramic heating element is fixed on the transmitting terminal TO- of the optical assembly by glue
On Can, the ceramic heating element includes the first square ceramic wafer, and first ceramic wafer has to be passed through for optical assembly pin
Some first through hole, and the first film resistance is coated with first ceramic wafer, two electrodes of the first film resistance are equal
Equipped with the first gold-plated circuit, the pin of the optical assembly is connected with two first gold-plated circuits by the flexible PCB
Connect.
Further, two first gold-plated circuits extend along the first ceramic wafer edge；Each first through hole
Two first gold-plated circuits are respectively positioned on to surround in the circle formed.
Further, the hardware is cylindrical shape, and the fiber adapter and the TO-Can are located at institute respectively
State at two discs of hardware；The ceramic heating element is fixed on the receiving terminal TO- of the optical assembly by glue
On Can, the ceramic heating element includes circular second ceramic wafer, and second ceramic wafer has to be passed through for optical assembly pin
Some second through holes, and the second film resistor is coated with second ceramic wafer, two electrodes of second film resistor are equal
Equipped with the second gold-plated circuit, the pin of the optical assembly is connected with two second gold-plated circuits by the flexible PCB
Connect.
Further, two second gold-plated circuits are distributed in the second ceramic wafer edge placement, and each described second
Through hole is respectively positioned on the same side of two second gold-plated circuits.
Further, the hardware is rectangular-shape, and the ceramic heating element has two, the fiber adapter
And two ceramic heating elements are bonded in three sides of the hardware respectively.
Further, the optical assembly has transmitting terminal and receiving terminal, and one of ceramic heating element is bonded in the TO-
Can transmitting terminals, another ceramic heating element are bonded in the TO-Can receiving terminals.
Further, the ceramic heating element is fixed with the flexible PCB by scolding tin
Further, the pin of the optical assembly is fixed with the flexible PCB by scolding tin.
The beneficial effects of the invention are as follows：
1st, temperature-compensating is carried out to optical assembly inside chip using high-heat conductive efficency and the ceramic heating element of low cost,
Traditional APD and LD temperature-compensating modes are given up, had not only improved service life but also reduced cost.
2nd, the optical assembly of needs is made without customizing the TO-Can with adding thermal resistance or TEC (semiconductor cooler), only
Need using general TO-Can on the market, to greatly reduce the difficulty for obtaining raw material, not only improved service life but also
Reduce cost.
3rd, using film resistor, more to be stablized by Chip-R on FPC or external fire-bar mode compared with existing,
And cheap, availability higher.
Brief description of the drawings
Fig. 1 is a kind of ceramics of the specific transmitting terminal of optical assembly applied to industrial temperature range provided in an embodiment of the present invention
The structure diagram of heating component；
Fig. 2 is the structural representation of optical assembly TOSA applied to industrial temperature range provided in an embodiment of the present invention a kind of
Figure；
Fig. 3 is the ceramics that a kind of optical assembly applied to industrial temperature range provided in an embodiment of the present invention has receiving terminal
The structure diagram of heating component；
The structure diagram of Fig. 4 optical assembly ROSA applied to industrial temperature range provided in an embodiment of the present invention a kind of；
Fig. 5 is applied on BIDI products for a kind of optical assembly applied to industrial temperature range provided in an embodiment of the present invention
Structure diagram；
In reference numeral：1- hardwares；2- ceramic heating elements；The first ceramic wafers of 20-；21- first through hole；22-
The first film resistance；The first gold-plated circuits of 23-；The second ceramic wafers of 24-；The second through holes of 25-；The second film resistors of 26-；27-
Two gold-plated circuits；3- fiber adapter；4- flexible PCBs；5-TO-Can.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained all other without making creative work
Embodiment, belongs to the scope of protection of the invention.
- 4 are please referred to Fig.1, the embodiment of the present invention provides a kind of optical assembly applied to industrial temperature range, includes metal
Structural member 1, ceramic heating element 2, and for sensing the temperature detection chip of the optical assembly temperature, wherein ceramic heat group
Part 2 is used as carrying out temperature-compensating to optical assembly inside chip, and by APD to carry out temperature-compensating more steady compared with existing
It is fixed, service life length, compared with existing LD costs again it is cheap very much.The side of metal structure is provided with fiber adapter 3, separately
The light group of needs is made without customizing the TO-Can5 with adding thermal resistance by TO-Can5 packaging ceramics heating component 2 in side
Part, it is only necessary to use TO-Can5 general on the market, substantially increase the availability of raw material.Ceramic heating element 2
Flexible PCB 4, flexible PCB 4 and the temperature detection chip are installed and carry the module electricity of the temperature detection chip
Road plate is connected.Temperature detecting module is existing module, it can perceive the temperature around tube assembly, then passes through FPC (flexible electricals
Road plate 4) to provide electric current to ceramic heating element 2, ceramic heating element 2, which is started to work, produces heat, finally conducts to light group
The function that temperature-compensating is carried out to its chip is realized inside part.
It is specific embodiment below：
Embodiment 1, please refers to Fig.1 and Fig. 2, hardware 1 are cylindric, above-mentioned fiber adapter 3 and ceramics
Heating component 2 is respectively at two discs of the cylindrical metal structural member 1.Optical assembly is TOSA, and ceramic heating element 2 is logical
Cross glue to be fixed on the transmitting terminal TO-Can of this optical assembly, ceramic heating element 2 includes the first ceramic wafer 20, it is square
, some first through hole 21 are penetrated through on the first ceramic wafer 20, preferably 4, can be passed through for 4 pins of TOSA,
The first film resistance 22 is plated on first ceramic wafer 20, which covers the face of whole square ceramic plate, but at first through hole 21
Perforation, coordinates the discrepancy of pin.The first gold-plated circuit 23, the pin of optical assembly are equipped with two electrodes of the first film resistance 22
It is connected with two the first gold-plated circuits 23 by flexible PCB 4.The two poles of the earth of resistance are drawn using the first gold-plated circuit 23,
And the first film resistance 22 used will more be stablized compared with existing by Chip-R on FPC or external fire-bar mode,
And cheap, availability higher.The present embodiment is the embodiment that ceramic heating element 2 is used as TOSA.In the present embodiment
In, the first ceramic wafer 20 can also make circular or other shapes.
Further optimize such scheme, referring to Fig. 1, two first gold-plated circuits 23 are along first ceramic wafer
20 edges extend, and each first through hole 21 is respectively positioned on two first gold-plated circuits 23 in the circle formed.Along shape
The edge of ceramic wafer plates the first gold-plated circuit 23, can be that several first through hole 21 reserve out position, avoid producing with them dry
Relate to.
Embodiment 2, figure, 3 and Fig. 4, hardware 1 are also cylindrical shape, and above-mentioned fiber adapter 3 and ceramics add
Hot component 2 is respectively at two discs of the cylindrical metal structural member 1.The optical assembly is ROSA ends, ceramic heat group
Part 2 is fixed on the receiving terminal TO-Can of the optical assembly by glue, and ceramic heating element 2 includes the second ceramic wafer 24, it
It is circular, some second through holes 25 is penetrated through on the second ceramic wafer 24, preferably 5, can be for 5 of optical assembly ROSA
Pin passes through, and the second film resistor 26 is plated on the second ceramic wafer 24, which covers the face of whole round ceramic plate, but several
Penetrated through at a second through hole 25, coordinate the discrepancy of pin.The second gold-plated circuit is equipped with two electrodes of the second film resistor 26,
The pin of optical assembly is connected with two gold-plated circuits by flexible PCB 4.Using the second gold-plated circuit 27 come by the two of resistance
Pole draw, and use the second film resistor 26 compared with it is existing will be more by Chip-R on FPC or external fire-bar mode
Add stabilization, cheap, availability higher.The present embodiment is the embodiment that ceramic heating element 2 is used as ROSA ends.At this
In embodiment, the second ceramic wafer 24 can also do squarely or other shapes.
Further optimize such scheme, referring to Fig. 3, two second gold-plated circuits 27 are distributed in second pottery
24 edge placement of porcelain plate, each second through hole 25 are respectively positioned on the same side of two second gold-plated circuits 27.With it is above-mentioned
TOSA package is identical, and the purpose so designed herein is also for preventing from interfering.
As the prioritization scheme of the embodiment of the present invention, when above-mentioned hardware 1 is rectangular-shape, ceramic heat group
Part 2 has two, they are exactly the ceramic heating element 2 in two above-mentioned embodiments.At this time, fiber adapter 3 and two
Ceramic heating element 2 is located at three sides of hardware 1 respectively.
Further optimize such scheme, embodiment 3, referring to Fig. 5, optical assembly has transmitting terminal and receiving terminal, wherein one
A ceramic heating element 2 is bonded in the TO-Can transmitting terminals, another ceramic heating element 2 is bonded in the TO-Can and receives
End, by two kinds of above-mentioned ports with identical product, being suitably applied on BIDI products in the present embodiment.
Continue to optimize such scheme, embodiment 4, optical assembly has two transmitting terminals, and two ceramic heating elements 2 glue respectively
It is connected on two transmitting terminals of TO-Can.
Continue to optimize such scheme, embodiment 5, optical assembly has two receiving terminals, and two ceramic heating elements 2 glue respectively
It is connected on two receiving terminals of TO-Can.
As the prioritization scheme of the embodiment of the present invention, ceramic heating element 2 is consolidated with the flexible PCB 4 by scolding tin
Fixed, the pin of optical assembly is fixed with the flexible PCB 4 by scolding tin.Can be fixed using scolding tin fixation.In addition, pottery
Carried out using heat-conducting glue be bonded between porcelain heating component 2 and optical assembly TO-Can5, carry out adhesion using heat-conducting glue, centre is not deposited
In thermal resistance.
The optical assembly at above-mentioned ROSA ends is light-receiving component, and the optical assembly at TOSA ends is light emission component, and TO-Can5 is
A kind of packaged type.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of changes, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (9)
- A kind of 1. optical assembly applied to industrial temperature range, it is characterised in that：Including hardware, in optical assembly Portion's chip carries out the ceramic heating element of temperature-compensating, and for sensing the temperature detection chip of the optical assembly temperature；Institute State hardware side and fiber adapter is installed, the ceramic heating element is bonded in the another of the hardware On the TO-Can of side, and the ceramic heating element is provided with flexible PCB, the flexible PCB and the temperature detection Chip and carry the module board of the temperature detection chip and be connected.
- A kind of 2. optical assembly applied to industrial temperature range as claimed in claim 1, it is characterised in that：The metal structure Part is cylindrical shape, and the fiber adapter and the TO-Can are located at two discs of the hardware respectively；Institute State ceramic heating element to be fixed on the transmitting terminal TO-Can of the optical assembly by glue, the ceramic heating element includes side First ceramic wafer of shape, first ceramic wafer have some first through hole passed through for optical assembly pin, and first pottery The first film resistance is coated with porcelain plate, two electrodes of the first film resistance are equipped with the first gold-plated circuit, the optical assembly Pin be connected with two first gold-plated circuits by the flexible PCB.
- A kind of 3. optical assembly applied to industrial temperature range as claimed in claim 2, it is characterised in that：Two described first Gold-plated circuit extends along the first ceramic wafer edge；Each first through hole is respectively positioned on two first gold-plated circuits and encloses In the circle of formation.
- A kind of 4. optical assembly applied to industrial temperature range as claimed in claim 1, it is characterised in that：The metal structure Part is cylindrical shape, and the fiber adapter and the TO-Can are located at two discs of the hardware respectively；Institute State ceramic heating element to be fixed on the receiving terminal TO-Can of the optical assembly by glue, the ceramic heating element includes circle Second ceramic wafer of shape, second ceramic wafer have some second through holes passed through for optical assembly pin, and second pottery The second film resistor is coated with porcelain plate, two electrodes of second film resistor are equipped with the second gold-plated circuit, the optical assembly Pin be connected with two second gold-plated circuits by the flexible PCB.
- A kind of 5. optical assembly applied to industrial temperature range as claimed in claim 4, it is characterised in that：Two described second Gold-plated circuit is distributed in the second ceramic wafer edge placement, and each second through hole is respectively positioned on two second gold-plated electricity The same side on road.
- A kind of 6. optical assembly applied to industrial temperature range as claimed in claim 1, it is characterised in that：The metal structure Part is rectangular-shape, and the ceramic heating element has two, and the fiber adapter and two ceramic heating elements divide Three sides of the hardware are not bonded in.
- A kind of 7. optical assembly applied to industrial temperature range as claimed in claim 6, it is characterised in that：The optical assembly tool There are transmitting terminal and receiving terminal, one of ceramic heating element is bonded in the TO-Can transmitting terminals, another ceramic heat group Part is bonded in the TO-Can receiving terminals.
- A kind of 8. optical assembly applied to industrial temperature range as claimed in claim 1, it is characterised in that：The ceramic heat Component is fixed with the flexible PCB by scolding tin.
- A kind of 9. optical assembly applied to industrial temperature range as claimed in claim 1, it is characterised in that：The optical assembly Pin is fixed with the flexible PCB by scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243548.9A CN107995705B (en) | 2017-11-30 | 2017-11-30 | Optical assembly applied to industrial temperature range |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711243548.9A CN107995705B (en) | 2017-11-30 | 2017-11-30 | Optical assembly applied to industrial temperature range |
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| CN107995705A true CN107995705A (en) | 2018-05-04 |
| CN107995705B CN107995705B (en) | 2024-03-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109189116A (en) * | 2018-08-14 | 2019-01-11 | 上海华虹宏力半导体制造有限公司 | The temperature holding meanss and method of IC chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109189116A (en) * | 2018-08-14 | 2019-01-11 | 上海华虹宏力半导体制造有限公司 | The temperature holding meanss and method of IC chip |
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