CN107992930A - The manufacture method of Intelligent bus card - Google Patents

The manufacture method of Intelligent bus card Download PDF

Info

Publication number
CN107992930A
CN107992930A CN201711081357.7A CN201711081357A CN107992930A CN 107992930 A CN107992930 A CN 107992930A CN 201711081357 A CN201711081357 A CN 201711081357A CN 107992930 A CN107992930 A CN 107992930A
Authority
CN
China
Prior art keywords
lower housing
supporter
housing shell
card
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201711081357.7A
Other languages
Chinese (zh)
Inventor
范亦能
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201711081357.7A priority Critical patent/CN107992930A/en
Publication of CN107992930A publication Critical patent/CN107992930A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00—Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Abstract

The invention discloses the manufacture method of Intelligent bus card, comprise the following steps：(A) being capable of intermeshing upper shell and lower housing shell by being molded formation in mould；(B) supporter is installed with lower housing shell, chip is laid in supporter, and filler is set in supporter surrounding, and chip is placed at the center of lower housing shell；(C) V-arrangement metal frame has been hingedly connected in supporter upper and lower ends, the movable end of V-arrangement metal frame leaves gap between upper shell and lower housing shell respectively；(D) upper shell is connected with lower housing shell by cooperation by rubber block, then by adhesive by upper shell and lower housing shell adhesive seal；Two movable ends of V-arrangement metal frame are deformed upon around with the hinge joint on supporter along Impact direction, are distorted with slowing down external force caused by the entirety of card face, and then prevent IC card excessive distortion and cause chip to be damaged.

Description

The manufacture method of Intelligent bus card
Technical field
The present invention relates to the manufacture method of moving communicating field, in particular to Intelligent bus card.
Background technology
IC card refers to integrated circuit card, our general bus cards are exactly one kind of IC card, general common IC card Communicated using the card reader of radio-frequency technique and IC card, IC card is distinguishing with magnetic card, and IC card is by integrated in card Circuit stores information, and magnetic card is generally higher than magnetic card by the magnetic force record information in card, the cost of IC card, but confidentiality is more It is good.Bus IC card is a kind of non-contact data card, it is to pass through the inductance coil on card by the chip being integrated in card Effect (coil that inductance coil is namely coiled into by copper wire) makes sensing electric current at the both ends of coil by the effect of various circuits It is changed into direct current, then a relatively large capacitance is incorporated to from direct current both ends, both end voltage can be made to keep stablizing, at coil both ends Two lines are drawn again to chip, as signal transmssion line；When close to the POS, coil produces induced voltage, can to card and The data of external data base are transmitted.
Most passengers are usually carried with when using bus IC card, and be placed in trouser pocket or wallet is made with facilitating With；But since bus IC card is small and thickness is thin, song is easily lost or is bent over when carrying, and then cause Chip in the fracture of bus IC card housing, card is damaged.
The content of the invention
It is an object of the invention to provide the manufacture method of Intelligent bus card, the bend resistance ability of bus IC card is improved, Prevent that chip is damaged in bus IC card.
The purpose of the present invention is achieved through the following technical solutions：
The manufacture method of Intelligent bus card, comprises the following steps：
(A) being capable of intermeshing upper shell and lower housing shell by being molded formation in mould；
(B) supporter is installed with lower housing shell, chip is laid in supporter, and set and fill out in supporter surrounding Thing is filled, and chip is placed at the center of lower housing shell；
(C) be hingedly connected V-arrangement metal frame in supporter upper and lower ends, the movable end of V-arrangement metal frame respectively with it is upper Gap is left between housing and lower housing shell；
(D) upper shell is connected with lower housing shell by cooperation by rubber block, then is glued upper shell and lower housing shell by adhesive Close sealing；
Present invention work is the improvement to existing bus IC card shell, by upper shell, lower housing shell together with rubber block A cavity is enclosed, supporter is equipped with cavity, filler is housed, bus chip is placed between supporter and upper-lower casing In supporter, when IC card is impacted or is dropped from eminence, filler can play chip certain buffer protection function, Chip is avoided to be damaged；When IC card is subject to the external force vertical or angled with card face and will deform upon, upper shell and Deformation is produced with external force direction on lower housing shell outer wall, the V-arrangement metal frame on supporter serves as keel in filler Stent, and two of V-arrangement metal frame also leave gap between movable end and upper-lower casing, so that between upper-lower casing Part can be bent in the range of certain angle, at this time the two of V-arrangement metal frame movable end around with supporter hinge joint along by Force direction deforms upon, and is distorted with slowing down external force caused by the entirety of card face, while the rubber between upper shell and lower housing shell Blob of viscose forced compression, and then prevent IC card excessive distortion and cause chip to be damaged.
In the step (D), the shape of rubber block is T-shaped, fluted in the end set of upper shell, at the end of lower housing shell Portion is provided with blind hole, the vertical end and engagement of rubber block, and horizontal ends and the blind hole of rubber block coordinate.The rubber block of T-shaped passes through With the groove on upper and lower casing end and the cooperation of blind hole, between upper-lower casing is ensured while closing sealing, ensure IC Being stuck in, certain deformation quantity can be occurred by rubber block during external impacts, to slow down the trend of IC card face distortion.
In the step (C), two V-arrangement metal frames are symmetricly set on top surface and the bottom of supporter centered on cavity On face.Two V-arrangement metal frames are symmetricly set on supporter centered on cavity so that no matter IC card front or reverse side or It is left end or when right end is subject to external force, V-arrangement metal frame can make the deformation reaction of equidirectional, to reduce the distortion in card face Degree, avoids the chip in supporter from being damaged.
The filler is foamed plastics.Foamed plastics light weight, compactness is good, filled together with V-arrangement metal frame to When in cavity, it can guarantee that while provide certain support for V-arrangement metal frame, moreover it is possible to V-shaped rest is freely deformed upon, is kept away Exempt from it metal fatigue occurs and shortens service life.
Compared with prior art, the present invention have the following advantages and advantages：
1st, the present invention is when IC card is subject to the external force vertical or angled with card face and will deform upon, upper shell Deformation is produced with external force direction with lower housing shell outer wall, the V-arrangement metal frame on supporter serves as dragon in filler Bone stent, and two of V-arrangement metal frame also leave gap between movable end and upper-lower casing, so that between upper-lower casing Part can be bent in the range of certain angle, at this time the two of V-arrangement metal frame movable end around with the hinge joint edge on supporter Impact direction deforms upon, and is distorted with slowing down external force caused by the entirety of card face, while between upper shell and lower housing shell Rubber block forced compression, external force is distorted dynamics reduction by the connecting portion of assistant spring caused by card face in deformation process is replied To minimum, and then prevent IC card excessive distortion and cause chip to be damaged；
2nd, two V-arrangement metal frames of the invention are symmetricly set on supporter centered on cavity so that no matter IC card When front or reverse side left end or right end are subject to external force, V-arrangement metal frame can make the deformation reaction of equidirectional, with Reduce the degreeof tortuosity in card face, avoid the chip in supporter from being damaged；
3rd, foamed plastics light weight of the invention, compactness is good, when being filled together with V-arrangement metal frame to cavity, energy While ensureing to provide certain support for V-arrangement metal frame, moreover it is possible to V-shaped rest is freely deformed upon, avoids it that gold occurs Belong to fatigue and shorten service life.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the structure diagram of embodiment 1；
Mark and corresponding parts title in attached drawing：
1- upper shells, 2- lower housing shells, 3- chips, 4- rubber blocks, 5- fillers, 6- supporters, 7-V shape metal frames.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make For limitation of the invention.
Embodiment 1
As shown in Figure 1, the present embodiment comprises the following steps：
(A) being capable of intermeshing upper shell 1 and lower housing shell 2 by being molded formation in mould；
(B) supporter 6 is installed with lower housing shell 2, chip 3 is laid in supporter 6, and in 6 surrounding of supporter Filler 5 is set, and chip 3 is placed at the center of lower housing shell 2；
(C) be hingedly connected V-arrangement metal frame 7 in 6 upper and lower ends of supporter, the movable end of V-arrangement metal frame 7 respectively with Gap is left between upper shell 1 and lower housing shell 2；
(D) upper shell 1 and lower housing shell 2 are connected by cooperation by rubber block 4, then by adhesive by upper shell 1 and lower casing 2 adhesive seal of body.
Present invention work is the improvement to existing bus IC card shell, by upper shell 1, lower housing shell 2 and rubber block 4 one Rise and enclose a cavity, be equipped with supporter 6 in cavity, filler 5, bus core are housed between supporter 6 and upper-lower casing 2 Piece 3 is placed in supporter 6, and when IC card is impacted or is dropped from eminence, filler 5 can play chip 3 certain buffering Protective effect, avoids chip 3 impaired；It will be deformed upon when IC card is subject to the external force vertical or angled with card face When, deformation is produced with external force direction on 2 outer wall of upper shell 1 and lower housing shell, and the V-arrangement metal frame 7 on supporter 6 is being filled out Fill in thing 5 and serve as keel bracket, and gap is also left between two movable ends and upper-lower casing 2 of V-arrangement metal frame 7, and then So that the part between upper-lower casing 2 can be bent in the range of certain angle, at this time the two of V-arrangement metal frame 7 movable end around with Hinge joint on supporter 6 is deformed upon along Impact direction, is distorted with slowing down external force caused by the entirety of card face, while positioned at upper 4 forced compression of rubber block between housing 1 and lower housing shell 2, the connecting portion of assistant spring is by external force pair in deformation process is replied Dynamics is distorted caused by card face and is reduced to minimum, and then prevents IC card excessive distortion and causes chip 3 impaired.
Wherein, in step (D), the shape of the rubber block 4 is T-shaped, fluted in the end set of upper shell 1, The end of lower housing shell 2 is provided with blind hole, the vertical end and engagement of rubber block 4, and horizontal ends and the blind hole of rubber block 4 coordinate.T-shaped Rubber block 4 by the way that with the groove on 2 end of upper and lower casing and the cooperation of blind hole, closing between upper-lower casing 2 is ensured is close While envelope, ensure that certain deformation quantity can occur for IC card rubber block 4 when by external impacts, to slow down becoming for IC card face distortion Gesture.
Embodiment 2
As shown in Figure 1, the present embodiment is on the basis of embodiment 1, in step (C), two V-arrangement metal frames 7 with It is symmetricly set on centered on cavity on the top and bottom of supporter 6.Two V-arrangement metal frames 7 are symmetrical arranged centered on cavity On supporter 6 so that no matter IC card front or reverse side left end or right end when being subject to external force, V-arrangement metal frame 7 is equal The deformation reaction of equidirectional can be made, to reduce the degreeof tortuosity in card face, avoids the chip 3 in supporter 6 impaired.
Preferably, the filler 5 is foamed plastics.Foamed plastics light weight, compactness is good, with V-arrangement metal frame 7 When filling together to cavity, it can guarantee that while provide certain support for V-arrangement metal frame 7, moreover it is possible to enable V-shaped rest freely Deform upon, avoid it that metal fatigue occurs and shortens service life.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include Within protection scope of the present invention.

Claims (4)

1. the manufacture method of Intelligent bus card, it is characterised in that：Comprise the following steps：
(A) being capable of intermeshing upper shell (1) and lower housing shell (2) by being molded formation in mould；
(B) supporter (6) is installed with lower housing shell (2), chip (3) is laid in supporter (6), and in supporter (6) surrounding sets filler (5), and chip (3) is placed at the center of lower housing shell (2)；
(C) V-arrangement metal frame (7), the movable end difference of V-arrangement metal frame (7) have been hingedly connected in supporter (6) upper and lower ends Gap is left between upper shell (1) and lower housing shell (2)；
(D) upper shell (1) and lower housing shell (2) connection are coordinated by rubber block (4), then by adhesive by upper shell (1) and Lower housing shell (2) adhesive seal.
2. the manufacture method of Intelligent bus card according to claim 1, it is characterised in that：In the step (D), rubber block (4) shape is T-shaped, fluted in the end set of upper shell (1), and blind hole, rubber block are provided with the end of lower housing shell (2) (4) vertical end and engagement, horizontal ends and the blind hole of rubber block (4) coordinate.
3. the manufacture method of Intelligent bus card according to claim 1, it is characterised in that：In the step (C), two institutes V-arrangement metal frame (7) is stated to be symmetricly set on centered on cavity on the top and bottom of supporter (6).
4. the manufacture method of the Intelligent bus card according to claims 1 to 3 any one, it is characterised in that：The filling Thing (5) is foamed plastics.
CN201711081357.7A 2017-11-07 2017-11-07 The manufacture method of Intelligent bus card Withdrawn CN107992930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711081357.7A CN107992930A (en) 2017-11-07 2017-11-07 The manufacture method of Intelligent bus card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711081357.7A CN107992930A (en) 2017-11-07 2017-11-07 The manufacture method of Intelligent bus card

Publications (1)

Publication Number Publication Date
CN107992930A true CN107992930A (en) 2018-05-04

Family

ID=62030637

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711081357.7A Withdrawn CN107992930A (en) 2017-11-07 2017-11-07 The manufacture method of Intelligent bus card

Country Status (1)

Country Link
CN (1) CN107992930A (en)

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PB01 Publication
PB01 Publication
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20180504