CN211857519U - Bending-resistant non-contact smart card - Google Patents
Bending-resistant non-contact smart card Download PDFInfo
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- CN211857519U CN211857519U CN202020788847.1U CN202020788847U CN211857519U CN 211857519 U CN211857519 U CN 211857519U CN 202020788847 U CN202020788847 U CN 202020788847U CN 211857519 U CN211857519 U CN 211857519U
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- smart card
- card base
- card
- buckle
- upper cover
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Abstract
The utility model relates to a smart card technical field, concretely relates to bending resistance non-contact smart card, including card base, smart card chip, still include upper cover and lower cover, the inside appearance chamber that forms in upper cover and lower cover closed back, the card base sets up in holding the intracavity, presss from both sides between card base and the lower cover and is equipped with down flexible buffer layer, presss from both sides between card base and the upper cover and is equipped with flexible buffer layer, is provided with bending resistance net layer in the card base, card base and bending resistance net layer integrated into one piece, and the mounting groove has been seted up to the card base, and the smart card chip sets up in the mounting groove, it is equipped with the buffering body to press from both sides between the bottom surface of smart card chip and mounting groove, and the surface of upper cover. The card base of this bending resistance non-contact smart card is provided with bending resistance net layer in, and the card base outsourcing has upper cover and lower cover, is provided with flexible buffer layer and flexible buffer layer down between card base and upper cover and the lower cover, and the bottom of smart card chip is provided with the buffering body, has the resistant performance of falling of good bending resistance, and it is good to fall anti-seismic performance.
Description
Technical Field
The utility model relates to a smart card technical field, concretely relates to bending resistance non-contact smart card.
Background
Due to the rapid development of electronic equipment, smart card consumption relates to various fields, such as telephone cards, bank cards, medical insurance cards and the like, and the smart card consumption brings convenience to both parties of users, so that the smart card consumption becomes a consumption mode which is deeply popular. A conventional contactless smart card typically includes a smart chip, a standard PVC card and coils, the smart chip being embedded in the recess.
However, the contactless smart cards currently on the market are easy to bend and damage the internal structure of the smart card, the contactless smart cards are easy to slip off the ground by hand and crash the surface of the smart card, and the possibility of breaking the internal connection structure of the smart card by shock due to dropping is high, for example, patent application No. 201320073290.3 and publication No. CN 203025756U.
Disclosure of Invention
In order to overcome the shortcoming and the not enough that exist among the prior art, the utility model aims to provide a bending resistance non-contact smart card, be provided with the bending resistance net layer in the card base of this bending resistance non-contact smart card, the card base outsourcing has upper cover and lower cover, is provided with flexible buffer layer and lower flexible buffer layer between card base and upper cover and the lower cover, and the bottom of smart card chip is provided with the buffering body, has the resistant performance of falling of good bending resistance, and it is good to fall anti-seismic performance.
The purpose of the utility model is realized through the following technical scheme: the utility model provides an anti-bending non-contact smart card, includes the card base, set up in the coil of card base and set up in the smart card chip of card base, the smart card chip with the coil electricity is connected, still includes upper cover and lower cover, and the inside appearance chamber that forms after upper cover and lower cover are closed, the card base sets up in holding the intracavity, it is equipped with down flexible buffer layer to press from both sides between card base and the lower cover, it is equipped with last flexible buffer layer to press from both sides between card base and the upper cover, be provided with anti-bending net layer in the card base, card base and anti-bending net layer integrated into one piece, the mounting groove has been seted up to the card base, the smart card chip sets up in the mounting groove, it is equipped with the buffering body to press from both sides between the bottom surface of smart card.
The intelligent card chip is a radio frequency card chip and internally comprises an encryption control and communication logic circuit.
And an anti-interference metal sheet is clamped between the card base and the lower flexible buffer layer.
The anti-interference metal sheet is a ferrite anti-interference sheet.
Wherein, the bending-resistant grid layer is a soft metal grid or a tensile silk thread grid.
Wherein, the buffer body is a silica gel pad, a soft colloid or a buffer pressure spring.
Wherein, the connection face of lower cover begins to have a plurality of type of falling T grooves, the connection face of upper cover be provided with a plurality ofly with the connector that the type of falling T groove corresponds, the connector includes base member, two sets up in the L type buckle of base member relatively and sets up the tensioning pressure spring between two L type buckles, the one end and one of them L type buckle butt of tensioning pressure spring, the other end and another L type buckle butt, upper cover and lower cover are closed back, L type buckle card is gone into the both sides of the bottom in type of falling T groove.
The number of the inverted T-shaped grooves and the number of the connectors are twelve, and the twelve inverted T-shaped grooves and the connectors are arranged alternately.
The upper flexible buffer layer and the lower flexible buffer layer are made of silica gel through integral forming.
The beneficial effects of the utility model reside in that: the utility model discloses be provided with bending resistance net layer in this bending resistance non-contact smart card's the card base, can effectively strengthen the toughness of card base, good bending resistance has, and can resume original form fast after receiving certain bending, avoid the coil to be damaged, the card base outsourcing has upper cover and lower cover, be provided with flexible buffer layer and lower flexible buffer layer between card base and upper cover and the lower cover, the bottom of smart card chip is provided with the buffering body, it is resistant falling the performance to have good bending resistance, it is good to fall anti-seismic performance.
Drawings
Fig. 1 is a cross-sectional view of the present invention.
Fig. 2 is a partially enlarged view of the area a in fig. 1 according to the present invention.
Fig. 3 is a schematic structural diagram of the connector and the inverted T-shaped groove of the present invention.
Fig. 4 is a partially enlarged view of the region B in fig. 1 according to the present invention.
The reference signs are: the card base 1, the coil 2, the smart card chip 3, the upper cover 4, the lower cover 5, the upper flexible buffer layer 6, the lower flexible buffer layer 7, the anti-bending grid layer 8, the mounting groove 9, the buffer body 10, the soft rubber layer 11, the anti-interference metal sheet 12, the inverted T-shaped groove 13, the base body 14, the L-shaped buckle 15 and the tensioning pressure spring 16.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and accompanying fig. 1 to 4, which are not intended to limit the present invention.
Referring to fig. 1-4, the bending-resistant non-contact smart card comprises a card base 1, a coil 2 arranged on the card base 1, a smart card chip 3 arranged on the card base 1, an upper cover 4 and a lower cover 5, wherein the smart card chip 3 is electrically connected with the coil 2, the upper cover 4 and the lower cover 5 form a cavity after being closed, the card base 1 is arranged in the containing cavity, a lower flexible buffer layer 7 is clamped between the card base 1 and the lower cover 5, an upper flexible buffer layer 6 is clamped between the card base 1 and the upper cover 4, an anti-bending grid layer 8 is arranged in the card base 1, the card base 1 and the anti-bending grid layer 8 are integrally formed, mounting groove 9 has been seted up to card base 1, smart card chip 3 sets up in mounting groove 9, it is equipped with buffer 10 to press from both sides between the bottom surface of smart card chip 3 and mounting groove 9, the surface of upper cover 4 and lower cover 5 is provided with soft glue layer 11.
The intelligent card chip is a radio frequency card chip and internally comprises an encryption control and communication logic circuit.
An anti-interference metal sheet 12 is clamped between the card base 1 and the lower flexible buffer layer 7.
The anti-interference metal sheet 12 is a ferrite anti-interference sheet. The ferrite anti-interference sheet has excellent anti-interference performance, and can ensure normal identification and transmission of signals.
Wherein, the bending-resistant grid layer 8 is a soft metal grid or a tensile silk thread grid. The bending-resistant grid layer 8 adopts soft metal grids or tensile silk thread grids, and has good toughness and bending resistance.
Wherein, the buffer body 10 is a silica gel pad or a soft colloid.
The buffer body 10 is a buffer compression spring. The buffering pressure springs are four and are arranged alternately, the upper ends of the four buffering pressure springs are abutted to the four corners of the smart card chip 3, and the lower ends of the four buffering pressure springs are abutted to the bottom surface of the mounting groove 9. The buffer body 10 is a silica gel pad or a soft colloid, and can play a good role in buffering and damping the smart card chip 3, and the card can reduce the impact on the smart card chip 3 when falling and colliding.
Wherein, the face of connecting of lower cover 5 begins to have a plurality of T type grooves 13 that fall, the face of connecting of upper cover 4 be provided with a plurality of with the connector that T type groove 13 corresponds falls, the connector includes base member 14, two sets up in the L type buckle 15 of base member 14 relatively and sets up the tensioning pressure spring 16 between two L type buckles 15, the one end and one of them L type buckle 15 butt of tensioning pressure spring 16, the other end and another L type buckle 15 butt, after upper cover 4 and lower cover 5 are closed, L type buckle 15 card is gone into the both sides of the bottom in T type groove 13 that fall. The connector adopts such structural design, can firmly withhold the type of falling T groove 13, ensures that upper cover 4 and lower cover 5 can zonulae occludens, and even the card falls and bumps also be difficult for becoming flexible.
The number of the inverted T-shaped grooves 13 and the number of the connectors are twelve, and the twelve inverted T-shaped grooves 13 and the connectors are arranged alternately.
The upper flexible buffer layer 6 and the lower flexible buffer layer 7 are both made of silica gel through integral forming.
The above-mentioned embodiment is the utility model discloses the implementation of preferred, in addition, the utility model discloses can also realize by other modes, not deviating from the utility model discloses any obvious replacement is all within the protection scope under the prerequisite of design.
Claims (9)
1. The utility model provides a bending resistance non-contact smart card, includes the card base, sets up in the coil of card base and sets up in the smart card chip of card base, the smart card chip with the coil electricity is connected, its characterized in that: still include upper cover and lower cover, inside formation appearance chamber after upper cover and lower cover are closed, the card base sets up in holding the intracavity, it is equipped with down flexible buffer layer to press from both sides between card base and the lower cover, it is equipped with flexible buffer layer to press from both sides between card base and the upper cover, be provided with bending resistance net layer in the card base, card base and bending resistance net layer integrated into one piece, the mounting groove has been seted up to the card base, the smart card chip sets up in the mounting groove, it is equipped with the buffer body to press from both sides between the bottom surface of smart card chip and mounting groove, the surface of upper cover and lower cover is provided with the soft glue layer.
2. A buckle-resistant contactless smart card according to claim 1, characterized in that: the intelligent card chip is a radio frequency card chip and internally comprises an encryption control and communication logic circuit.
3. A buckle-resistant contactless smart card according to claim 1, characterized in that: an anti-interference metal sheet is clamped between the card base and the lower flexible buffer layer.
4. A buckle-resistant contactless smart card according to claim 3, characterized in that: the anti-interference metal sheet is a ferrite anti-interference sheet.
5. A buckle-resistant contactless smart card according to claim 1, characterized in that: the bending-resistant grid layer is a soft metal grid or a tensile silk thread grid.
6. A buckle-resistant contactless smart card according to claim 1, characterized in that: the buffer body is a silica gel pad, a soft colloid or a buffer pressure spring.
7. A buckle-resistant contactless smart card according to claim 1, characterized in that: the connection face of lower cover begins to have a plurality of type grooves of falling T, the connection face of upper cover be provided with a plurality ofly with the connector that the type groove of falling T corresponds, the connector includes base member, two relative settings in the L type buckle of base member and set up the tensioning pressure spring between two L type buckles, the one end and one of them L type buckle butt of tensioning pressure spring, the other end and another L type buckle butt, upper cover and lower cover are closed back, L type buckle card is gone into the both sides of the bottom in the type groove of falling T.
8. A buckle-resistant contactless smart card according to claim 7, characterized in that: the number of the inverted T-shaped grooves and the number of the connectors are twelve, and the twelve inverted T-shaped grooves and the connectors are arranged alternately.
9. A buckle-resistant contactless smart card according to claim 1, characterized in that: the upper flexible buffer layer and the lower flexible buffer layer are both made of silica gel through integral forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020788847.1U CN211857519U (en) | 2020-05-13 | 2020-05-13 | Bending-resistant non-contact smart card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020788847.1U CN211857519U (en) | 2020-05-13 | 2020-05-13 | Bending-resistant non-contact smart card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211857519U true CN211857519U (en) | 2020-11-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020788847.1U Active CN211857519U (en) | 2020-05-13 | 2020-05-13 | Bending-resistant non-contact smart card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211857519U (en) |
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2020
- 2020-05-13 CN CN202020788847.1U patent/CN211857519U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Room 101, 701, 801, Building 24, No. 8, Duluo 6th Road, Shuikou Street, Huicheng District, Huizhou City, Guangdong Province, 516000 Patentee after: Huizhou Zhonghongtong Smart Card Co.,Ltd. Address before: 523000 Factory B, No. 9, High-tech Second Road, Four Villages, Tangxia Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN ZHT SMART CARD CO.,LTD. |
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| CP03 | Change of name, title or address |