CN107962796A - A kind of processing method of the intelligent bus casing clamping body of high intensity - Google Patents
A kind of processing method of the intelligent bus casing clamping body of high intensity Download PDFInfo
- Publication number
- CN107962796A CN107962796A CN201711081308.3A CN201711081308A CN107962796A CN 107962796 A CN107962796 A CN 107962796A CN 201711081308 A CN201711081308 A CN 201711081308A CN 107962796 A CN107962796 A CN 107962796A
- Authority
- CN
- China
- Prior art keywords
- lower housing
- housing shell
- shell
- upper shell
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D99/00—Subject matter not provided for in other groups of this subclass
- B29D99/006—Producing casings, e.g. accumulator cases
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
Abstract
The invention discloses a kind of processing method of the intelligent bus casing clamping body of high intensity, comprise the following steps：(A) being capable of intermeshing upper shell and lower housing shell by being molded formation in mould；(B) filler is installed in lower housing shell, and chip is placed at the center of lower housing shell；(C) upper shell is connected with lower housing shell by cooperation by rubber block, then by adhesive by upper shell and lower housing shell adhesive seal.When IC card is subject to the external force vertical or angled with card face and will deform upon, being respectively arranged with two elastic connecting portions and can produce deformation with external force direction on upper shell and lower housing shell outer wall, distorted with slowing down external force caused by the entirety of card face, rubber block forced compression between upper shell and lower housing shell at the same time, external force is distorted dynamics caused by card face and is reduced to minimum by the connecting portion of assistant spring in deformation process is replied, and then is prevented IC card excessive distortion and caused chip to be damaged.
Description
Technical field
The present invention relates to the processing method of moving communicating field, in particular to a kind of intelligent bus casing clamping body of high intensity.
Background technology
IC card refers to integrated circuit card, our general bus cards are exactly one kind of IC card, general common IC card
Communicated using the card reader of radio-frequency technique and IC card, IC card is distinguishing with magnetic card, and IC card is by integrated in card
Circuit stores information, and magnetic card is generally higher than magnetic card by the magnetic force record information in card, the cost of IC card, but confidentiality is more
It is good.Bus IC card is a kind of non-contact data card, it is to pass through the inductance coil on card by the chip being integrated in card
Effect (coil that inductance coil is namely coiled into by copper wire) makes sensing electric current at the both ends of coil by the effect of various circuits
It is changed into direct current, then a relatively large capacitance is incorporated to from direct current both ends, both end voltage can be made to keep stablizing, at coil both ends
Two lines are drawn again to chip, as signal transmssion line；When close to the POS, coil produces induced voltage, can to card and
The data of external data base are transmitted.
Most passengers are usually carried with when using bus IC card, and be placed in trouser pocket or wallet is made with facilitating
With；But since bus IC card is small and thickness is thin, song is easily lost or is bent over when carrying, and then cause
Chip in the fracture of bus IC card housing, card is damaged.
The content of the invention
It is an object of the invention to provide a kind of processing method of the intelligent bus casing clamping body of high intensity, improves bus IC
The bend resistance ability of card, prevents that chip is damaged in bus IC card.
The purpose of the present invention is achieved through the following technical solutions：
A kind of processing method of the intelligent bus casing clamping body of high intensity, comprises the following steps：
(A) being capable of intermeshing upper shell and lower housing shell by being molded formation in mould；
(B) filler is installed in lower housing shell, and chip is placed at the center of lower housing shell；
(C) upper shell is connected with lower housing shell by cooperation by rubber block, then is glued upper shell and lower housing shell by adhesive
Close sealing；
In above-mentioned steps, the upper shell and lower housing shell are interconnected to constitute closed cavity by rubber block, in cavity
Chip is inside fixed with, and filler is equipped between chip and cavity, the setting respectively on the upper shell and lower housing shell outer wall
There are two elastic connecting portions, the width of the connecting portion is a quarter of upper shell overall width.The present invention is to existing
The improvement of bus IC card shell, encloses a cavity by upper shell, lower housing shell together with rubber block, filling is equipped with cavity
Thing, bus chip are placed in the center of cavity, and when IC card is impacted or is dropped from eminence, filler can play chip
Certain buffer protection function, avoids chip from being damaged；When IC card is subject to the external force vertical or angled with card face and will
When deforming upon, being respectively arranged with two elastic connecting portions and can be produced with external force direction on upper shell and lower housing shell outer wall
Raw deformation, is distorted with slowing down external force caused by the entirety of card face, while the rubber block stress between upper shell and lower housing shell
Compression, external force is distorted dynamics caused by card face and is reduced to minimum by the connecting portion of assistant spring in deformation process is replied, into
And prevent IC card excessive distortion and cause chip to be damaged.
In the step (C), the shape of the rubber block is T-shaped, fluted in the end set of upper shell, in lower housing shell
End be provided with blind hole, the vertical end and engagement of rubber block, horizontal ends and the blind hole of rubber block coordinate.The rubber block of T-shaped
By with the groove on upper and lower casing end and the cooperation of blind hole, between upper-lower casing is ensured while closing sealing, protect
Certain deformation quantity can occur for card IC card rubber block when by external impacts, to slow down the trend of IC card face distortion.
Four connecting portions are symmetricly set on centered on cavity on upper shell and lower housing shell outer wall.Four elastic companies
Socket part is symmetrically distributed on upper shell and lower housing shell two-by-two, when being subject to external impacts in IC card face, may be such that the elasticity of connecting portion
Reply volume is added to maximum, and direction acts on card face and makes on the contrary, offsetting external force to the full extent with external force direction
Into distortion consequence.
The section of the connecting portion is waveform.Preferably, section can be in unit area for corrugated connecting portion
It is interior to produce relatively large number of deformation quantity, it can further improve the buffer protection of upper shell and lower housing shell.
Compared with prior art, the present invention have the following advantages and advantages：
1st, the present invention is when IC card is subject to the external force vertical or angled with card face and will deform upon, upper shell
With being respectively arranged with two elastic connecting portions and can produce deformation with external force direction on lower housing shell outer wall, to slow down external force
The distortion caused by the entirety of card face, while the rubber block forced compression between upper shell and lower housing shell, are replying deformation
External force is distorted dynamics caused by card face and is reduced to minimum by the connecting portion of assistant spring in journey, and then prevents IC card excessive distortion
And chip is caused to be damaged；
2nd, the rubber block of T-shaped of the invention by with the groove on upper and lower casing end and the cooperation of blind hole, in guarantee
Between lower housing shell while closing sealing, ensure IC card rubber block when by external impacts certain deformation quantity can occur, with
Slow down the trend of IC card face distortion；
3rd, section of the invention can produce relatively large number of deformation quantity for corrugated connecting portion in unit area, can
Further improve the buffer protection of upper shell and lower housing shell.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the structure diagram of the present embodiment 1；
Mark and corresponding parts title in attached drawing：
1- upper shells, 2- lower housing shells, 3- chips, 4- rubber blocks, 5- fillers, 6- connecting portions.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment 1
As shown in Figure 1, the present embodiment comprises the following steps：
(A) being capable of intermeshing upper shell 1 and lower housing shell 2 by being molded formation in mould；
(B) the installation filler 5 in lower housing shell 2, and chip 3 is placed at the center of lower housing shell 2；
(C) upper shell 1 and lower housing shell 2 are connected by cooperation by rubber block 4, then by adhesive by upper shell 1 and lower casing
2 adhesive seal of body.
In above-mentioned steps, the upper shell 1 and lower housing shell 2 are interconnected to constitute closed cavity by rubber block 4, in chamber
Chip 3 is fixed with vivo, and filler 5 is equipped between chip 3 and cavity, point on 2 outer wall of the upper shell 1 and lower housing shell
Two elastic connecting portions 6 are not provided with, and the width of the connecting portion 6 is a quarter of 1 overall width of upper shell.Work of the present invention
As the improvement to existing bus IC card shell, upper shell 1, lower housing shell 2 are enclosed into a chamber together with rubber block 4
Body, cavity is interior to be equipped with filler 5, and bus chip 3 is placed in the center of cavity, when IC card is impacted or is dropped from eminence
Filler 5 can play chip 3 certain buffer protection function, avoid chip 3 impaired；When IC card be subject to it is vertical with card face or into
The external force of certain angle and when will deform upon, be respectively arranged with two elastic companies on 2 outer wall of upper shell 1 and lower housing shell
Socket part 6 can produce deformation with external force direction, be distorted with slowing down external force caused by the entirety of card face, while be located at upper shell 1
4 forced compression of rubber block between lower housing shell 2, in deformation process is replied the connecting portion 6 of assistant spring by external force to card face
Caused by distortion dynamics be reduced to minimum, and then prevent IC card excessive distortion and cause chip 3 impaired.
Wherein, the shape of the rubber block 4 is T-shaped, fluted in the end set of upper shell 1, in the end of lower housing shell 2
Blind hole, the vertical end and engagement of rubber block 4 are provided with, horizontal ends and the blind hole of rubber block 4 coordinate.The rubber block 4 of T-shaped passes through
With the groove on 2 end of upper and lower casing and the cooperation of blind hole, between upper-lower casing 2 is ensured while closing sealing, ensure
Certain deformation quantity can occur for IC card rubber block 4 when by external impacts, to slow down the trend of IC card face distortion.
Embodiment 2
As shown in Figure 1, the present embodiment, on the basis of embodiment 1, four connecting portions 6 are symmetrically set centered on cavity
Put on 2 outer wall of upper shell 1 and lower housing shell.Four elastic connecting portions 6 are symmetrically distributed on upper shell 1 and lower housing shell 2 two-by-two,
When being subject to external impacts in IC card face, it may be such that the elastic recovery amount of connecting portion 6 is added to maximum, and direction and external force direction
On the contrary, offset to the full extent external force act on card face and caused by distort consequence.
Preferably, the section of the connecting portion 6 is waveform.Section can be in unit plane for corrugated connecting portion 6
Relatively large number of deformation quantity is produced in product, can further improve the buffer protection of upper shell 1 and lower housing shell 2.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further
Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include
Within protection scope of the present invention.
Claims (4)
1. the processing method of the intelligent bus casing clamping body of a kind of high intensity, it is characterised in that comprise the following steps：
(A) being capable of intermeshing upper shell (1) and lower housing shell (2) by being molded formation in mould；
(B) the installation filler (5) in lower housing shell (2), and chip (3) is placed at the center of lower housing shell (2)；
(C) upper shell (1) and lower housing shell (2) connection are coordinated by rubber block (4), then by adhesive by upper shell (1) and
Lower housing shell (2) adhesive seal；
In above-mentioned steps, the upper shell (1) and lower housing shell (2) are interconnected to constitute closed cavity by rubber block (4),
Chip (3) is fixed with cavity, and filler (5), the upper shell (1) and lower housing shell are equipped between cavity in chip (3)
(2) two elastic connecting portions (6) are respectively arranged with outer wall, the width of the connecting portion (6) is upper shell (1) overall width
A quarter.
A kind of 2. processing method of the intelligent bus casing clamping body of high intensity according to claim 1, it is characterised in that：It is described
In step (C), the shape of rubber block (4) is T-shaped, fluted in the end set of upper shell (1), in the end of lower housing shell (2)
Blind hole, the vertical end and engagement of rubber block (4) are provided with, horizontal ends and the blind hole of rubber block (4) coordinate.
A kind of 3. processing method of the intelligent bus casing clamping body of high intensity according to claim 1, it is characterised in that：Four
The connecting portion (6) is symmetricly set on centered on cavity on upper shell (1) and lower housing shell (2) outer wall.
4. a kind of processing method of the intelligent bus casing clamping body of high intensity according to claims 1 to 3 any one, it is special
Sign is：The section of the connecting portion (6) is waveform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711081308.3A CN107962796A (en) | 2017-11-07 | 2017-11-07 | A kind of processing method of the intelligent bus casing clamping body of high intensity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711081308.3A CN107962796A (en) | 2017-11-07 | 2017-11-07 | A kind of processing method of the intelligent bus casing clamping body of high intensity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107962796A true CN107962796A (en) | 2018-04-27 |
Family
ID=61999893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711081308.3A Withdrawn CN107962796A (en) | 2017-11-07 | 2017-11-07 | A kind of processing method of the intelligent bus casing clamping body of high intensity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107962796A (en) |
-
2017
- 2017-11-07 CN CN201711081308.3A patent/CN107962796A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180427 |