CN107992174A - The method for improving main frame radiating efficiency - Google Patents
The method for improving main frame radiating efficiency Download PDFInfo
- Publication number
- CN107992174A CN107992174A CN201711260527.8A CN201711260527A CN107992174A CN 107992174 A CN107992174 A CN 107992174A CN 201711260527 A CN201711260527 A CN 201711260527A CN 107992174 A CN107992174 A CN 107992174A
- Authority
- CN
- China
- Prior art keywords
- heat sink
- heat
- main frame
- conduction bar
- baffle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the method for improving main frame radiating efficiency, include the following steps：Step A：Main frame is placed on the upper surface of bottom plate, and between baffle；Step B：By in one end insertion mounting hole away from heat sink in the installation axle of radiator, and make the end thereof contacts away from support plate on the bottom and contact block of heat sink；Step C：Mobile computing machine host, makes the fan outlet of main frame close to heat sink.Heat sink can be conducted by moisture absorption that fan is taken out of and to one end away from fan, the temperature at host then be reduced, beneficial to the radiating and cooling of CPU.
Description
Technical field
The present invention relates to computer realm, and in particular to the method for improving main frame radiating efficiency.
Background technology
Computer is commonly called as computer, is a kind of electronic computer device for supercomputing, can carry out numerical computations, and can
To carry out logical calculated, also there is store-memory.It is that can be run according to program, it is automatic, high speed processing mass data
Modernize intelligent electronic device.It is made of hardware system and software systems, the computer for being fitted without any software is referred to as naked
Machine.Supercomputer, industrial control computer, network computer, personal computer, five class of embedded computer can be divided into, compared with
Advanced computer has biocomputer, photonic computer, quantum computer etc..
Heat can be produced in the CPU of computer and other parts at high speeds operation process, heat dissipation is exactly a heat transfer in fact
Process, it is therefore an objective to by CPU produce heat take in other media, by cpu temperature control within a stability range.Root
The environment lived according to us, the heat of CPU is finally among air to be diffused to.
The performance of CPU and the environment temperature height residing for it have substantial connection., it is necessary to will when CPU, which is run, produces heat
Its heat derives produced, the temperature of CPU will be got off.
In present office space, each employee matches a station, and the host of computer is placed on, and is located at
The lower section of station；And taken a seat for the ease of employee, host can be disposed close to the side of station support plate, this causes host apoplexy
Fanning distributing for the hot gas of blowout can be stopped by support plate, it is impossible to smoothly export.
The content of the invention
Present invention aims at the method for providing raising main frame radiating efficiency, solve to take a seat for the ease of employee,
Host is disposed close to the side of station support plate, this causes distributing for the hot gas that fan is blown out in host to be stopped by support plate,
The problem of cannot smoothly exporting.
The present invention is achieved through the following technical solutions：
The method for improving main frame radiating efficiency, includes the following steps：
Step A：Main frame is placed on the upper surface of bottom plate, and between baffle；
Step B：One end away from heat sink in the installation axle of radiator is inserted into mounting hole, and makes the bottom of heat sink
End and the end thereof contacts away from support plate on contact block；
Step C：Mobile computing machine host, makes the fan outlet of main frame close to heat sink.
Heat sink can be conducted by moisture absorption that fan is taken out of and to one end away from fan, then reduce the temperature at host
Degree, beneficial to the radiating and cooling of CPU.
Further, the baffle has two, and is respectively connected respectively with one end of bottom plate, and heat dissipation is both provided with baffle
Device, the radiator include the heat sink that contacts successively and support component, the heat sink perpendicular to ground, its bottom
One end is provided with installation axle, and mounting hole is both provided with the top of the baffle, and the installation axle is inserted into mounting hole；
The support component includes support plate and contact block, and one end of the support plate and the outer wall of baffle connect, described
One end of contact block and the upper surface of support plate connect, and the other end of contact block is contacted with the bottom of heat sink.
Heat sink uses metallic plate, such as iron plate, copper coin and aluminium sheet.
In use, host is located on the upper surface of bottom plate, and between baffle.Preferably simultaneously, radiator is installed
Close to the air outlet of host fan on baffle, the hot wind that fan is blown out is set to pass through heat sink.
One end that the setting of support component makes heat sink hanging at the same time receives the support from support component, reduces installation
The received stress of axis, protects the quality of connecting portion between installation axle and heat sink, avoids the interruption of installation axle and heat sink
Situation about splitting occurs.
Further, each radiator has 6 heat sinks, and one end of the bottom of heat sink is both provided with peace
Fill axis；
The quantity of the mounting hole and contact block is consistent with the quantity of heat sink, and the equal edge of mounting hole on each baffle
Long side sideline at the top of baffle is distributed evenly and at intervals successively, and installation axle respectively coordinates with a mounting hole respectively, remote on contact block
Bottom of the one end respectively respectively with a heat sink from support plate contacts.
Further, heat conduction bar is provided with the one end of the bottom of the heat sink away from baffle, the heat conduction bar is U
Shape, the bottom of heat sink is inserted into the inner concave of corresponding heat conduction bar, and is contacted with heat conduction bar；The end and position of heat conduction bar
Heat sink in radiator end connects.
In heat sink, the heat absorbed close to the heat sink of fan outlet is more than the heat sink positioned at radiator end
Heat, for the ease of the heat dissipation of heat sink, therefore heat conduction bar is set, by the heat conduction of heat conduction bar, by the heat sink of high temperature
Temperature leads the temperature to the heat sink of low temperature.
Further, connecting hole, the axis of the connecting hole are both provided with the heat sink positioned at radiator end
Perpendicular to heat sink；Connecting shaft, the connecting shaft difference one connecting hole of each insertion are both provided with the end of the heat conduction bar
In.
Heat conduction bar is releasably installed on heat sink by connecting shaft, easy to the cleaning and maintenance of the present invention.
Further, sequentially connected fixed plate and bullet are both provided between the end of the connecting shaft and heat conduction bar
Spring, is connected close to one end of heat conduction bar with fixed plate in the connecting shaft, and the fixed plate passes through the end of spring and heat conduction bar
Connection, when the bottom of heat sink is contacted with heat conduction bar and connecting shaft coordinates with connecting hole, spring is in extended state.
The setting of spring is in close contact the inner concave of heat conduction bar and the bottom of heat sink, and heat sink is led easy to heat conduction bar
Heat.
Further, the cross section of the mounting hole is square, the cross sectional dimensions of the installation axle and the horizontal stroke of mounting hole
Sectional dimension is consistent.
Compared with prior art, the present invention have the following advantages and advantages：
1st, the method that the present invention improves main frame radiating efficiency, heat sink can by moisture absorption that fan is taken out of and to
One end away from fan is conducted, and the temperature at host is then reduced, beneficial to the radiating and cooling of CPU；
2nd, the method that the present invention improves main frame radiating efficiency, in heat sink, close to the heat sink of fan outlet
The heat of absorption is more than the heat of the heat sink positioned at radiator end, for the ease of the heat dissipation of heat sink, therefore sets and leads
Hot bar, by the heat conduction of heat conduction bar, the temperature to the heat sink of low temperature is led by the temperature of the heat sink of high temperature；
3rd, the method that the present invention improves main frame radiating efficiency, the setting of spring make inner concave and the heat dissipation of heat conduction bar
The bottom of plate is in close contact, easy to heat conduction bar to heat sink heat conduction.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the structure diagram of the present invention；
Fig. 2 is the structure diagram of present invention when looking up；
Fig. 3 is the structure diagram of support component；
Fig. 4 is the structure diagram of heat sink；
Fig. 5 is the structure diagram of heat conduction bar.
Mark and corresponding parts title in attached drawing：
1- bottom plates, 2- baffles, 3- mounting holes, 4- heat sinks, 5- installation axles, 6- support plates, 7- contact blocks, 8- heat conduction bars,
9- connecting holes, 10- connecting shafts, 11- fixed plates, 12- springs.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment 1
As Figure 1-Figure 5, the method that the present invention improves main frame radiating efficiency, includes the following steps：
Step A：Main frame is placed on the upper surface of bottom plate 1, and between baffle 2；
Step B：One end away from heat sink 4 in the installation axle 5 of radiator is inserted into mounting hole 3, and makes heat sink 4
Bottom and contact block 7 on the end thereof contacts away from support plate 6；
Step C：Mobile computing machine host, makes the fan outlet of main frame close to heat sink 4.
Heat sink 4 can be conducted by moisture absorption that fan is taken out of and to one end away from fan, then be reduced at host
Temperature, beneficial to the radiating and cooling of CPU.
Further, the baffle 2 has two, and one end respectively with bottom plate 1 is connected respectively, is both provided with baffle 2
Radiator, the radiator include the heat sink 4 that contacts successively and support component, the heat sink 4 perpendicular to ground, its
One end of bottom is provided with installation axle 5, and mounting hole 3, the insertion of installation axle 5 installation are both provided with the top of the baffle 2
In hole 3；
The support component includes support plate 6 and contact block 7, and one end of the support plate 6 is connected with the outer wall of baffle 2,
One end of the contact block 7 is connected with the upper surface of support plate 6, and the other end of contact block 7 is contacted with the bottom of heat sink 4.
Heat sink uses metallic plate, such as iron plate, copper coin and aluminium sheet.
In use, host is located on the upper surface of bottom plate 1, and between baffle 2.Preferably simultaneously, radiator is pacified
Close to the air outlet of host fan on baffle 2, the hot wind that fan is blown out is set to pass through heat sink.
One end that the setting of support component makes heat sink 4 hanging at the same time receives the support from support component, reduces peace
5 received stress of axis is filled, the quality of connecting portion between installation axle 5 and heat sink 4 is protected, avoids installation axle 5 and heat sink 4
Between situation about being broken occur.
Further, each radiator has 6 heat sinks 4, and one end of the bottom of heat sink 4 is both provided with
Installation axle 5；
The quantity of the mounting hole 3 and contact block 7 is consistent with the quantity of heat sink 4, and the mounting hole on each baffle 2
3 are distributed evenly and at intervals successively along the long side sideline at the top of baffle 2, and installation axle 5 respectively coordinates with a mounting hole 3 respectively, connects
Bottom of the one end away from support plate 6 respectively respectively with a heat sink 4 contacts on contact block 7.
Further, the described one end of the bottom of heat sink 4 away from baffle 2 is provided with heat conduction bar 8, the heat conduction bar 8
For U-shaped, the bottom of heat sink 4 is inserted into the inner concave of corresponding heat conduction bar 8, and is contacted with heat conduction bar 8；Heat conduction bar 8
End is connected with the heat sink 4 positioned at radiator end.
In heat sink 4, the heat absorbed close to the heat sink 4 of fan outlet is more than the heat dissipation positioned at radiator end
The heat of plate 4, for the ease of the heat dissipation of heat sink 4, therefore sets heat conduction bar 8, by the heat conduction of heat conduction bar 8, by dissipating for high temperature
The temperature of hot plate 4 leads the temperature to the heat sink 4 of low temperature.
Further, connecting hole 9, the axis of the connecting hole 9 are both provided with the heat sink 4 positioned at radiator end
Line is perpendicular to heat sink 4；Connecting shaft 10 is both provided with the end of the heat conduction bar 8, the connecting shaft 10 distinguishes each insertion one
In a connecting hole 9.
Heat conduction bar 8 is releasably installed on heat sink 4 by connecting shaft 10, easy to the cleaning and maintenance of the present invention.
Further, sequentially connected fixed plate 11 is both provided between the connecting shaft 10 and the end of heat conduction bar 8
With spring 12, it is connected close to one end of heat conduction bar 8 with fixed plate 11 in the connecting shaft 10, the fixed plate 11 passes through spring 12
It is connected with the end of heat conduction bar 8, when the bottom of heat sink 4 is contacted with heat conduction bar 8 and connecting shaft 10 coordinates with connecting hole 9, bullet
Spring 12 is in extended state.
The setting of spring 12 makes the inner concave of heat conduction bar 8 be in close contact with the bottom of heat sink 4, easy to heat conduction bar 8 to dissipating
4 heat conduction of hot plate.
Further, the cross section of the mounting hole 3 is square, the cross sectional dimensions of the installation axle 5 and mounting hole 3
Cross sectional dimensions is consistent.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further
Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include
Within protection scope of the present invention.
Claims (7)
1. improve the method for main frame radiating efficiency, it is characterised in that：Include the following steps：
Step A：Main frame is placed on the upper surface of bottom plate (1), and between baffle (2)；
Step B：One end away from heat sink (4) in the installation axle (5) of radiator is inserted into mounting hole (3), and makes heat dissipation
The bottom of plate (4) and the end thereof contacts away from support plate (6) on contact block (7)；
Step C：Mobile computing machine host, makes the fan outlet of main frame close to heat sink (4).
2. the method according to claim 1 for improving main frame radiating efficiency, it is characterised in that：The baffle (2)
There are two, and one end respectively with bottom plate (1) is connected respectively, and radiator, the radiator bag are both provided with baffle (2)
The heat sink (4) contacted successively and support component are included, the heat sink (4) is provided with peace perpendicular to ground, one end of its bottom
Axis (5) is filled, mounting hole (3) is both provided with the top of the baffle (2), the installation axle (5) is inserted into mounting hole (3)；
The support component includes support plate (6) and contact block (7), and one end of the support plate (6) connects with the outer wall of baffle (2)
Connect, one end of the contact block (7) is connected with the upper surface of support plate (6), the other end and the heat sink (4) of contact block (7)
Bottom contacts.
3. the method according to claim 2 for improving main frame radiating efficiency, it is characterised in that：Each heat dissipation
Device has 6 heat sinks (4), and one end of the bottom of heat sink (4) is both provided with installation axle (5)；
The quantity of the mounting hole (3) and contact block (7) is consistent with the quantity of heat sink (4), and the peace on each baffle (2)
Dress hole (3) is distributed evenly and at intervals successively along the long side sideline at the top of baffle (2), and installation axle (5) is respectively installed with one respectively
Hole (3) coordinates, and bottom of the one end away from support plate (6) respectively respectively with a heat sink (4) contacts on contact block (7).
4. the method according to claim 3 for improving main frame radiating efficiency, it is characterised in that：In the heat sink
(4) one end of bottom away from baffle (2) is provided with heat conduction bar (8), and the heat conduction bar (8) is U-shaped, the bottom of heat sink (4)
It is inserted into the inner concave of corresponding heat conduction bar (8), and is contacted with heat conduction bar (8)；The end of heat conduction bar (8) is with being located at heat dissipation
Heat sink (4) connection of device end.
5. the method according to claim 4 for improving main frame radiating efficiency, it is characterised in that：Filled positioned at heat dissipation
Put and connecting hole (9) is both provided with the heat sink (4) of end, the axis of the connecting hole (9) is perpendicular to heat sink (4)；Institute
The end for stating heat conduction bar (8) is both provided with connecting shaft (10), and the connecting shaft (10) is respectively in one connecting hole (9) of each insertion.
6. the method according to claim 5 for improving main frame radiating efficiency, it is characterised in that：In the connecting shaft
(10) sequentially connected fixed plate (11) and spring (12), the connecting shaft are both provided between the end of heat conduction bar (8)
(10) one end on close to heat conduction bar (8) is connected with fixed plate (11), and the fixed plate (11) passes through spring (12) and heat conduction bar
(8) end connection, when the bottom of heat sink (4) is contacted with heat conduction bar (8) and connecting shaft (10) coordinates with connecting hole (9),
Spring (12) is in extended state.
7. the method according to claim 2 for improving main frame radiating efficiency, it is characterised in that：The mounting hole
(3) cross section is square, and the cross sectional dimensions of the installation axle (5) is consistent with the cross sectional dimensions of mounting hole (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711260527.8A CN107992174A (en) | 2017-12-04 | 2017-12-04 | The method for improving main frame radiating efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711260527.8A CN107992174A (en) | 2017-12-04 | 2017-12-04 | The method for improving main frame radiating efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107992174A true CN107992174A (en) | 2018-05-04 |
Family
ID=62035452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711260527.8A Withdrawn CN107992174A (en) | 2017-12-04 | 2017-12-04 | The method for improving main frame radiating efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107992174A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115202448A (en) * | 2022-07-19 | 2022-10-18 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation assembly arranged outside |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205910648U (en) * | 2016-06-23 | 2017-01-25 | 四川海铭电子信息科技有限公司 | Industrial computer that radiating efficiency is high |
| CN206147470U (en) * | 2016-09-14 | 2017-05-03 | 石鹤松 | Convenient computer mainframe who removes of shock attenuation heat dissipation |
| CN206178623U (en) * | 2016-09-22 | 2017-05-17 | 黑龙江大学 | Computer machine case refrigeration plant |
| CN107357375A (en) * | 2017-07-18 | 2017-11-17 | 北京东土科技股份有限公司 | The efficient radiating apparatus and closed type cabinet of a kind of closed type cabinet |
-
2017
- 2017-12-04 CN CN201711260527.8A patent/CN107992174A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205910648U (en) * | 2016-06-23 | 2017-01-25 | 四川海铭电子信息科技有限公司 | Industrial computer that radiating efficiency is high |
| CN206147470U (en) * | 2016-09-14 | 2017-05-03 | 石鹤松 | Convenient computer mainframe who removes of shock attenuation heat dissipation |
| CN206178623U (en) * | 2016-09-22 | 2017-05-17 | 黑龙江大学 | Computer machine case refrigeration plant |
| CN107357375A (en) * | 2017-07-18 | 2017-11-17 | 北京东土科技股份有限公司 | The efficient radiating apparatus and closed type cabinet of a kind of closed type cabinet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115202448A (en) * | 2022-07-19 | 2022-10-18 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation assembly arranged outside |
| CN115202448B (en) * | 2022-07-19 | 2023-12-12 | 武汉松泽源科技发展有限公司 | Calculator host with additional heat dissipation component externally mounted |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180504 |
|
| WW01 | Invention patent application withdrawn after publication |