CN205039144U

CN205039144U - Heat radiator of chip

Info

Publication number: CN205039144U
Application number: CN201520694973.XU
Authority: CN
Inventors: 钱文彪
Original assignee: KUNSHAN YICHENG ALUMINUM MANUFACTURING Co Ltd
Current assignee: KUNSHAN YICHENG ALUMINUM MANUFACTURING Co Ltd
Priority date: 2015-09-09
Filing date: 2015-09-09
Publication date: 2016-02-17
Anticipated expiration: 2025-09-09

Abstract

The utility model relates to a radiator trade especially relates to a heat radiator of chip, and it includes the base plate, on the top surface of base plate the equidistance be provided with with base plate vertically heat radiation fins, heat radiation fins's tapering is 1, the side of base plate is provided with several air guide hole, heat radiation fins's a side is from last to having offered a plurality of first recesses with a determining deviation down, and a plurality of second recesses have been offered with a determining deviation extremely down from last in the another side. When each heat radiation fins was flowed through to the hot gas flow, the first recess and the second recess that lie in each heat radiation fins both sides face divided into a plurality of minor fins again with each heat radiation fins in other words, have just so increased the heat transfer area of hot gas flow, consequently, under same heat radiation fins quantity, can improve the heat dispersion of radiator.

Description

A kind of chip radiator

Technical field

The utility model relates to radiator industry, particularly relates to a kind of chip radiator.

Background technology

In recent years, along with the development of science and technology, it is the era of knowledge-driven economy contrasted that the mankind have entered with computer network.Since coming out from First electronic computer, the operating system of computer is in continuous upgrading, and the integrated level of chip is more and more higher.In server, the heat that chip produces in running is also multiplied, and the heat that chip produces is that the radiator installed above by it is dissipated, and is so also improving constantly the requirement of the heat-sinking capability of supporting radiator.

At present, be that the radiator adopting aluminium alloy to make dispels the heat to chip mostly.Multiple radiating fins be parallel to each other that the radiator of existing aluminium alloy comprises a base plate and upwards extends bottom base plate, the thermal current coming from server chips enters from one end of radiator, and the other end that the surface along radiating fin flows to radiator flows out.In the process of heat radiation, normally improve heat transfer effect by increasing heat radiation area.But with the radiator that aluminium alloy is made, because the thickness of radiating fin is limited to processing technology, so will heat exchange area be increased, can only by increasing the number of radiating fin.But increase radiating fin quantity, the vent flow path width between radiating fin then can be caused to reduce, increase the pressure loss of cooling airflow, also increase the thickness of the thermal boundary layer of cooling air fluid on radiating fin surface simultaneously, increase heat transfer resistance, reduce whole heat exchange coefficient.Such result can be cost increase, and heat exchange property but may not improve.

In view of this, how designing a kind of novel radiator, for dispelling the heat to server chips, is that those skilled in the art need a problem of solution badly.

Utility model content

For the deficiencies in the prior art, the technical problem that the present invention solves is to provide a kind of chip radiator of excellent heat dissipation performance.

For achieving the above object, the technical solution of the utility model is as follows:

A kind of chip radiator, comprise substrate, the end face of substrate is equidistantly provided with the radiating fin vertical with described substrate, the tapering of described radiating fin is 1 °; The side of described substrate is provided with several air conducting hole; One side of described radiating fin is provided with multiple first groove with necessarily spaced from top to bottom, and another side is provided with multiple second groove with necessarily spaced from top to bottom.

Preferably, described first groove and the second groove equal and opposite in direction.

Preferably, described first groove is mutually corresponding staggered with described second groove.

Preferably, the groove depth of described first groove and the groove depth sum of adjacent described second groove are less than or equal to the thickness of described radiating fin.

Preferably, described first groove and the second groove are arranged parallel to each other.

Preferably, the zone line of described substrate bottom surface convexes to form boss downwards.

Preferably, described air conducting hole is arranged in described boss.

Preferably, the bottom surface of described boss is provided with three groups of locating convex blocks, and each described locating convex block has a draw-in groove.

Compared with prior art, the beneficial effects of the utility model are: when thermal current flows through each radiating fin, the first groove and the second groove that are positioned at each radiating fin two sides are equivalent to each radiating fin is divided into again multiple small fin, which adds the heat exchange area of thermal current, therefore, under same radiating fin quantity, the heat dispersion of radiator can be improved.

Accompanying drawing explanation

In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described.

The front view of a kind of chip radiator that Fig. 1 provides for embodiment one;

The front view of the radiating fin that Fig. 2 provides for embodiment one;

The front view of the radiating fin that Fig. 3 provides for embodiment two;

The front view of a kind of chip radiator that Fig. 4 provides for embodiment three;

The upward view of a kind of chip radiator that Fig. 5 provides for embodiment three.

Embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described.

Embodiment one

See Fig. 1 and 2, a kind of chip radiator, comprises substrate 1, the end face of substrate 1 is equidistantly provided with the radiating fin 2 vertical with substrate 1, and the tapering of radiating fin 2 is 1 °; The side of substrate 1 is provided with several air conducting hole 3; One side of radiating fin 2 is provided with multiple first groove 4 with necessarily spaced from top to bottom, and another side is provided with multiple second groove 5 with necessarily spaced from top to bottom.

First groove and the second groove equal and opposite in direction.

First groove is mutually corresponding staggered with the second groove.

The groove depth of the first groove and the groove depth sum of adjacent second groove are less than or equal to the thickness of radiating fin.

Embodiment two

See Fig. 3, with embodiment one unlike, the first groove and the second groove are arranged parallel to each other.

Embodiment three

See Figure 4 and 5, with embodiment one and two unlike, the zone line of substrate bottom surface convexes to form boss 8 downwards, and air conducting hole is arranged in boss.

The bottom surface of boss 8 is provided with three groups of locating convex blocks 6, and each locating convex block has a draw-in groove 7.Draw-in groove, for fin is stuck in chip, improves positioning precision after being provided with draw-in groove, makes the contact of radiator and chip more excellent, greatly improves the performance of heat radiation.

The heat that chip produces upwards rises through substrate, and in the process, heat to be left part by air conducting hole.When thermal current flows through each radiating fin, the first groove and the second groove that are positioned at each radiating fin two sides are equivalent to each radiating fin is divided into again multiple small fin, which adds the heat exchange area of thermal current, therefore, under same radiating fin quantity, the heat dispersion of radiator can be improved.

To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.

Claims

1. a chip radiator, is characterized in that, comprises substrate, and the end face of substrate is equidistantly provided with the radiating fin vertical with described substrate, and the tapering of described radiating fin is 1 °; The side of described substrate is provided with several air conducting hole; One side of described radiating fin is provided with multiple first groove with necessarily spaced from top to bottom, and another side is provided with multiple second groove with necessarily spaced from top to bottom.

2. a kind of chip radiator according to claim 1, is characterized in that, described first groove and the second groove equal and opposite in direction.

3. a kind of chip radiator according to claim 1 and 2, is characterized in that, described first groove is mutually corresponding staggered with described second groove.

4. a kind of chip radiator according to claim 3, is characterized in that, the groove depth of described first groove and the groove depth sum of adjacent described second groove are less than or equal to the thickness of described radiating fin.

5. a kind of chip radiator according to claim 1 and 2, is characterized in that, described first groove and the second groove are arranged parallel to each other.

6. a kind of chip radiator according to claim 1, is characterized in that, the zone line of described substrate bottom surface convexes to form boss downwards.

7. a kind of chip radiator according to claim 6, is characterized in that, described air conducting hole is arranged in described boss.

8. a kind of chip radiator according to claim 6 or 7, is characterized in that, the bottom surface of described boss is provided with three groups of locating convex blocks, and each described locating convex block has a draw-in groove.