CN107971381A - The ultrasonic vibration of thin-wall complicated curved surface micro-structure components aids in micro- bulging device and method - Google Patents
The ultrasonic vibration of thin-wall complicated curved surface micro-structure components aids in micro- bulging device and method Download PDFInfo
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Abstract
薄壁复杂曲面微结构构件超声振动辅助微胀形装置及方法,它涉及一种薄壁复杂曲面微结构成形装置及方法,以解决薄壁复杂曲面微结构构件现有工艺无法制造的问题,它包括上连接座、下连接座、超声波振动源、凸模、凹模和压料板;超声波振动源安装在上连接座上,上连接座竖向滑动安装在下连接座上,凹模安装在下连接座上,凸模滑动设置在压料板的内孔中,凸模下表面带有阵列的凸起微结构,凹模上表面带有阵列的凹陷微结构,凸起微结构与凹陷微结构匹配设置。微成形方法如下:一、装置组装,二、坯料板微胀形,得到薄壁复杂曲面微结构阵列构件。
Ultrasonic vibration-assisted micro-bulging device and method for thin-walled complex curved surface microstructure components, which relate to a thin-walled complex curved surface microstructure forming device and method to solve the problem that the existing technology cannot manufacture thin-walled complex curved surface microstructure components. Including upper connecting seat, lower connecting seat, ultrasonic vibration source, punch, die and binder plate; On the seat, the punch is slidably set in the inner hole of the binder plate. The lower surface of the punch has an array of raised microstructures, and the upper surface of the die has an array of concave microstructures. The raised microstructures match the concave microstructures. set up. The micro-forming method is as follows: 1. device assembly, and 2. micro-bulging of the blank plate to obtain a thin-walled complex curved surface micro-structure array member.
Description
技术领域technical field
本发明涉及一种薄壁复杂曲面微结构成形装置及方法,具体涉及一种薄壁复杂曲面微结构阵列超声振动辅助微胀形装置及方法,属于材料成形领域。The invention relates to a thin-wall complex curved surface microstructure forming device and method, in particular to a thin-wall complex curved surface microstructure array ultrasonic vibration-assisted micro-bulging device and method, belonging to the field of material forming.
背景技术Background technique
薄壁复杂曲面微结构构件,其特殊的曲面结构,使得该类结构具有光学、热控等多个方面的功能,在微电子等行业有着广泛的应用潜力。然而,该类型构件壁厚很小,通常在100μm以内,结构最大外轮廓尺寸小于10mm,结构为复杂曲面如球冠、正弦曲线等。目前,该类结构由于壁厚非常小无法采用传统的机械加工方法制造,而常规塑性成形方法容易导致壁厚严重减薄,甚至破裂等瓶颈问题,还不能实现高精度的薄壁复杂曲面微结构构件的精密成形。Thin-walled complex curved surface microstructure components, with their special curved surface structure, make this type of structure have multiple functions such as optics and thermal control, and have a wide range of application potentials in microelectronics and other industries. However, the wall thickness of this type of component is very small, usually within 100 μm, the maximum outer contour size of the structure is less than 10 mm, and the structure is a complex curved surface such as a spherical crown, a sinusoidal curve, etc. At present, this type of structure cannot be manufactured by traditional mechanical processing methods due to its very small wall thickness, and conventional plastic forming methods are likely to cause bottlenecks such as severe wall thickness reduction and even cracking, and cannot achieve high-precision thin-walled complex curved surface microstructures. Precision forming of components.
发明内容Contents of the invention
本发明提供一种薄壁复杂曲面微结构构件超声振动辅助微胀形装置及方法,为解决薄壁复杂曲面微结构构件现有工艺无法制造的问题。The invention provides an ultrasonic vibration-assisted micro-bulging device and method for a thin-walled complex curved surface microstructure component, which aims to solve the problem that the thin-walled complex curved surface microstructure component cannot be manufactured by the existing technology.
本发明的技术方案是:Technical scheme of the present invention is:
方案一:薄壁复杂曲面微结构构件超声振动辅助微胀形装置包括上连接座、下连接座、超声波振动源、凸模、凹模和压料板;Option 1: Ultrasonic vibration-assisted micro-bulging device for thin-walled complex curved surface microstructure components includes upper connecting seat, lower connecting seat, ultrasonic vibration source, punch, die and binder plate;
超声波振动源安装在上连接座上,上连接座竖向滑动安装在下连接座上,凹模安装在下连接座上,压料板与凹模连接且二者之间用于放置待成形的坯料板,凸模由凸模机驱动,凸模滑动设置在压料板的内孔中,凸模下表面带有阵列的凸起微结构,凹模上表面带有阵列的凹陷微结构,凸起微结构与凹陷微结构匹配设置。The ultrasonic vibration source is installed on the upper connecting seat, the upper connecting seat is vertically slidably installed on the lower connecting seat, the die is installed on the lower connecting seat, the pressing plate is connected with the die and the blank plate to be formed is placed between them , the punch is driven by a punch machine, the punch is slidably set in the inner hole of the binder plate, the lower surface of the punch has an array of raised microstructures, the upper surface of the die has an array of concave microstructures, and the raised microstructures The structure matches the recessed microstructure setting.
方案二:薄壁复杂曲面微结构构件超声振动辅助微胀形方法是这样实现的:Scheme 2: Ultrasonic vibration-assisted micro-bulging method of thin-walled complex curved surface micro-structural components is realized in this way:
一、装置组装,将凸模和凹模分别加工出曲面形的凸起微结构和凹陷微结构,将凹模安装在下模座上,将坯料板放置在凹模的带有凹陷微结构上,压料板安装在凹模上并压紧坯料板,将凸模置于压料板的内孔中,将超声波振动源安装在上连接座上,超声振动冲头及变幅杆穿过支撑板的中心孔,然后,将上连接器和下连接器连接在固定设备上;1. Assembling the device, processing the convex mold and the concave mold into curved convex microstructures and concave microstructures respectively, installing the concave mold on the lower mold base, placing the blank plate on the concave microstructure of the concave mold, The pressing plate is installed on the die and presses the blank plate, the punch is placed in the inner hole of the pressing plate, the ultrasonic vibration source is installed on the upper connecting seat, the ultrasonic vibration punch and the horn pass through the support plate center hole, then connect the upper and lower connectors to the fixture;
二、坯料板微胀形,上连接器连接在试验机上,上连接座连接在上连接器上,在试验机作用下向下运动,其运动方向由导向柱导向,超声波振动源由上连接器经上模座、上支撑柱和固定板带动向下运动,启动超声波振动源,超声振动冲头作用到凸模上,随着凸模运动而向下运动,凸模向下运动作用到坯料板上,同时,超声波振动源提供超声振动并经变幅杆、凸模作用到坯料板上,超声振动频率为20-40KHz,振幅为1-10微米;2. The blank plate is slightly bulging, the upper connector is connected to the testing machine, the upper connecting seat is connected to the upper connector, and it moves downward under the action of the testing machine. The direction of movement is guided by the guide column, and the ultrasonic vibration source is controlled by the upper connector. Driven by the upper die base, upper support column and fixed plate to move downward, start the ultrasonic vibration source, the ultrasonic vibration punch acts on the punch, moves downward with the movement of the punch, and the downward movement of the punch acts on the blank plate At the same time, the ultrasonic vibration source provides ultrasonic vibration and acts on the blank plate through the horn and punch. The ultrasonic vibration frequency is 20-40KHz and the amplitude is 1-10 microns;
凸起微结构和凹陷微结构阵列相互配合,坯料板在凸模和凹模共同作用下,并有超声振动的辅助,产生胀形变形,当凸模下降到与凹模的间隙是坯料板的厚度时,试验机停止上连接座向下运动,并保持所在位置一定时间后返程,取出凸模后即可取出成形的薄壁复杂曲面微结构阵列构件。The convex microstructure and the concave microstructure array cooperate with each other, and the blank plate is bulging and deformed under the joint action of the punch and the concave mold with the assistance of ultrasonic vibration. When the punch drops to the gap between the punch and the concave mold When the thickness is measured, the testing machine stops the downward movement of the upper connecting seat, and keeps the position for a certain period of time before returning. After taking out the punch, the formed thin-walled complex curved surface microstructure array member can be taken out.
本发明相比现有技术的有益效果是:薄壁复杂曲面微结构阵列构件超声振动辅助微胀形装置及方法,是采用薄板成形该构件,利用超声振动辅助成形的优点,对薄板复杂曲面微结构阵列成形具有重要的积极效果,主要以下几个方面:Compared with the prior art, the present invention has the beneficial effects that: the ultrasonic vibration-assisted micro-bulging device and method for thin-wall complex curved surface microstructure array components adopt thin plates to form the components, and utilize the advantages of ultrasonic vibration-assisted forming to micro-bulge complex curved surfaces of thin plates. Structural array forming has important positive effects, mainly in the following aspects:
(1)利用超声振动改善薄板塑性变形性能,提高其延伸率,壁厚更均匀,如最大壁厚减薄量从27%显著降低至19%,能够提高胀形成形极限,非常适合薄壁复杂曲面结构阵列成形;(1) Utilize ultrasonic vibration to improve the plastic deformation performance of the thin plate, increase its elongation, and make the wall thickness more uniform. For example, the maximum wall thickness reduction is significantly reduced from 27% to 19%, which can improve the bulging forming limit, and is very suitable for thin-wall complex Surface structure array forming;
(2)当凸模移动到位置后保持一定施加超声振动的时间,使得成形的薄板能够更好的贴膜,成形的复杂曲面微结构阵列精度更高,贴膜精度提高了12%。(2) After the punch moves to the position, keep applying ultrasonic vibration for a certain time, so that the formed thin plate can be better attached to the film, and the precision of the formed complex surface microstructure array is higher, and the accuracy of the film is increased by 12%.
(3)使用带有阵列微结构的凸模和凹模,可以成形出具有较大面积的阵列微结构件,成形效率高、成本低,并且成形的薄壁复杂曲面微结构一致性好。(3) By using the punch and die with array microstructures, array microstructure parts with large area can be formed, the forming efficiency is high, the cost is low, and the formed thin-walled complex curved surface microstructure has good consistency.
附图说明Description of drawings
图1为本发明整体结构示意图;Fig. 1 is a schematic diagram of the overall structure of the present invention;
图2成形原理示意图。Figure 2 Schematic diagram of forming principle.
具体实施方式Detailed ways
下面结合附图和实施例对本发明作进一步地说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
参见图1说明,薄壁复杂曲面微结构构件超声振动辅助微胀形装置包括上连接座1、下连接座2、超声波振动源3、凸模4、凹模5和压料板6;Referring to Fig. 1, the ultrasonic vibration-assisted micro-bulging device for thin-walled complex curved surface microstructure components includes an upper connecting seat 1, a lower connecting seat 2, an ultrasonic vibration source 3, a punch 4, a die 5 and a pressure plate 6;
超声波振动源3安装在上连接座1上,上连接座1竖向滑动安装在下连接座2上,凹模5安装在下连接座2上,压料板6与凹模5连接且二者之间用于放置待成形的坯料板,凸模4由凸模机驱动,凸模4滑动设置在压料板6的内孔中,凸模4下表面带有阵列的凸起微结构4-1,凹模5上表面带有阵列的凹陷微结构5-1,凸起微结构4-1与凹陷微结构5-1匹配设置。The ultrasonic vibration source 3 is installed on the upper connecting seat 1, the upper connecting seat 1 is vertically slidably installed on the lower connecting seat 2, the die 5 is installed on the lower connecting seat 2, and the binder plate 6 is connected with the die 5 and between them Used to place the blank plate to be formed, the punch 4 is driven by the punch machine, the punch 4 is slidably set in the inner hole of the pressing plate 6, and the lower surface of the punch 4 has an array of raised microstructures 4-1, The upper surface of the concave mold 5 is provided with an array of concave microstructures 5-1, and the convex microstructures 4-1 are matched with the concave microstructures 5-1.
使用带有阵列微结构的凸模和凹模,可以成形出具有较大面积的阵列微结构件。By using the convex mold and the concave mold with the array microstructure, the array microstructure component with a larger area can be formed.
参见图1,为了保证成形过程运行稳定可靠,上连接座1包括上模座1-1、上支撑柱1-2、固定板1-3和导向柱1-4;固定板1-3通过上支撑柱1-2与上模座1-1连接,超声波振动源3和导向柱1-4安装在固定板1-3上,导向柱1-4能在下连接座2上上下滑动。在上述基础上,作为另一个可实施方式,下连接座2包括下模座2-1、垫板2-2、下支撑柱2-3和支撑板2-4;垫板2-2安装在下模座2-1上,凸模4、凹模5、压料板6和垫板2-2连接在一起,垫板2-2上加工导向槽,支撑板2-4上加工有穿过导向柱1-4的导向孔,支撑板2-4通过下支撑柱2-3与垫板2-2连接。Referring to Fig. 1, in order to ensure the stable and reliable operation of the forming process, the upper connection base 1 includes an upper mold base 1-1, an upper support column 1-2, a fixed plate 1-3 and a guide column 1-4; the fixed plate 1-3 passes through the upper The support column 1-2 is connected with the upper mold base 1-1, the ultrasonic vibration source 3 and the guide column 1-4 are installed on the fixed plate 1-3, and the guide column 1-4 can slide up and down on the lower connecting seat 2. On the basis of the above, as another possible implementation, the lower connecting seat 2 includes a lower mold base 2-1, a backing plate 2-2, a lower supporting column 2-3 and a supporting plate 2-4; the backing plate 2-2 is installed on the lower On the mold base 2-1, the punch 4, the die 5, the binder plate 6 and the backing plate 2-2 are connected together, the backing plate 2-2 is processed with guide grooves, and the support plate 2-4 is processed with passing guides The guide hole of the column 1-4, the supporting plate 2-4 is connected with the backing plate 2-2 through the lower supporting column 2-3.
为了保证得到成形的构件强度满足要求,凸模4和凹模5的材质为SKD11。SKD11为强度、韧性及耐热平衡性的冷模具钢。具有使模具寿命更长,性能更稳定,且易于加工,热处理变形小的特点。为了保证成形的稳定性,超声波振动工况条件为:超声振动频率为20-40KHz,振幅为1-10微米。In order to ensure that the strength of the formed component meets the requirements, the material of the punch 4 and the die 5 is SKD11. SKD11 is a cold die steel with balanced strength, toughness and heat resistance. It has the characteristics of longer mold life, more stable performance, easy processing, and small heat treatment deformation. In order to ensure the stability of forming, the ultrasonic vibration working conditions are: the ultrasonic vibration frequency is 20-40KHz, and the amplitude is 1-10 microns.
参见图1和图2说明,本发明还提供薄壁复杂曲面微结构构件超声振动辅助微胀形方法,该方法是这样实现的:Referring to Fig. 1 and Fig. 2, the present invention also provides a micro-bulging method assisted by ultrasonic vibration of a thin-walled complex curved surface microstructure member, which is realized in the following way:
一、装置组装,将凸模4和凹模5分别加工出曲面形的凸起微结构和凹陷微结构,将凹模5安装在下模座2-1上,将坯料板7放置在凹模5的带有凹陷微结构上,压料板6安装在凹模5上并压紧坯料板7,将凸模4置于压料板6的内孔中,将超声波振动源3安装在上连接座1上,超声振动冲头3-1及变幅杆3-2穿过支撑板2-4的中心孔,然后,将上连接器8和下连接器9连接在固定设备上;1. Assembling the device, the convex mold 4 and the concave mold 5 are respectively processed into curved convex microstructures and concave microstructures, the concave mold 5 is installed on the lower mold base 2-1, and the blank plate 7 is placed on the concave mold 5 On the concave microstructure, the pressing plate 6 is installed on the die 5 and presses the blank plate 7, the punch 4 is placed in the inner hole of the pressing plate 6, and the ultrasonic vibration source 3 is installed on the upper connecting seat 1, the ultrasonic vibration punch 3-1 and the horn 3-2 pass through the center hole of the support plate 2-4, and then connect the upper connector 8 and the lower connector 9 to the fixed device;
二、坯料板微胀形,上连接器8连接在试验机上,上连接座1连接在上连接器8上,在试验机作用下向下运动,其运动方向由导向柱1-4导向,超声波振动源3由上连接器8经上模座1-1、上支撑柱1-2和固定板1-3带动向下运动,启动超声波振动源3,超声振动冲头3-1作用到凸模4上,随着凸模4运动而向下运动,凸模4向下运动作用到坯料板7上,同时,超声波振动源3提供超声振动并经变幅杆3-2、凸模4作用到坯料板7上,超声振动频率为20-40KHz,振幅为1-10微米;2. The blank plate is slightly bulging, the upper connector 8 is connected to the testing machine, the upper connecting seat 1 is connected to the upper connector 8, and moves downward under the action of the testing machine. The direction of movement is guided by the guide column 1-4, and the ultrasonic The vibration source 3 is driven downward by the upper connector 8 through the upper die base 1-1, the upper support column 1-2 and the fixed plate 1-3, and the ultrasonic vibration source 3 is started, and the ultrasonic vibration punch 3-1 acts on the punch 4, moves downward with the movement of the punch 4, and the downward movement of the punch 4 acts on the blank plate 7. At the same time, the ultrasonic vibration source 3 provides ultrasonic vibration and acts on it through the horn 3-2 and the punch 4. On the blank plate 7, the ultrasonic vibration frequency is 20-40KHz, and the amplitude is 1-10 microns;
凸起微结构和凹陷微结构阵列相互配合,坯料板7在凸模4和凹模5共同作用下,并有超声振动的辅助,产生胀形变形,当凸模4下降到与凹模5的间隙是坯料板7的厚度时,试验机停止上连接座1向下运动,并保持所在位置一定时间后返程,取出凸模4后即可取出成形的薄壁复杂曲面微结构阵列构件。为了更好的给导向柱1-4导向,装置的中间部位设计了支撑板2-4,支撑板2-4在导向孔相应位置安装了导套。The convex microstructure and the concave microstructure array cooperate with each other, and the blank plate 7 produces bulging deformation under the joint action of the punch 4 and the concave mold 5 with the assistance of ultrasonic vibration. When the gap is the thickness of the blank plate 7, the testing machine stops the downward movement of the upper connecting seat 1, and returns after keeping the position for a certain period of time. After taking out the punch 4, the formed thin-walled complex curved surface microstructure array member can be taken out. In order to better guide the guide column 1-4, a support plate 2-4 is designed in the middle of the device, and a guide sleeve is installed on the support plate 2-4 at the corresponding position of the guide hole.
本方法可成形得到球冠、正弦曲线等复杂曲面的微结构构件。成形过程中超声波振动源满足:超声振动频率为30KHz,振幅为5微米。超声波振动源3由压电陶瓷提供振动。成形过程中凸模机施加的时间-力关系呈正弦曲线分布。The method can form microstructure components with complex curved surfaces such as spherical caps and sinusoidal curves. The ultrasonic vibration source in the forming process satisfies: the ultrasonic vibration frequency is 30KHz, and the amplitude is 5 microns. The ultrasonic vibration source 3 is provided with vibration by piezoelectric ceramics. During the forming process, the time-force relationship exerted by the punch machine is sinusoidally distributed.
实施例,凸起微结构4-1为球冠结构,凹陷微结构5-1为与球冠结构相匹配的球冠槽,通过薄壁复杂曲面微结构构件超声振动辅助微胀形方法可成形出壁厚为30-100μm薄壁复杂曲面微结构构件,以球冠为例,球冠曲面结构:球径2.44mm、高0.3mm,阵列宽30mm、长50mm。本方法实验在三思拉伸试验机上,成形工艺参数:最大输出力为10kN,输出速度为1-10mm/min;超声振动频率20-40kHz,振幅为1-10μm。振动源采用压电陶瓷提供振动。凸模4、凹模5采用精密数控加工出曲面结构,凸模4和凹模5材料采用SKD11,性能更稳定,热处理变形小。Embodiment, the convex microstructure 4-1 is a spherical cap structure, and the concave microstructure 5-1 is a spherical cap groove matching the spherical cap structure, which can be formed by ultrasonic vibration-assisted micro-bulging method of thin-walled complex curved surface microstructure members Thin-walled and complex curved microstructure components with a wall thickness of 30-100 μm. Taking spherical caps as an example, the spherical cap surface structure: spherical diameter 2.44mm, height 0.3mm, array width 30mm, length 50mm. This method is tested on a Sansi tensile testing machine, and the forming process parameters are: the maximum output force is 10kN, the output speed is 1-10mm/min; the ultrasonic vibration frequency is 20-40kHz, and the amplitude is 1-10μm. The vibration source adopts piezoelectric ceramics to provide vibration. The convex mold 4 and the concave mold 5 are processed by precision numerical control to produce a curved surface structure. The material of the convex mold 4 and the concave mold 5 is SKD11, which has more stable performance and small heat treatment deformation.
本发明已以较佳实施例揭示如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,依据本发明的技术实质对以上实施案例所做的任何简单修改、等同变化与修饰,均仍属本发明技术方案范围。The present invention has been disclosed above with preferred embodiments, but it is not intended to limit the present invention. Any skilled person who is familiar with the profession, without departing from the scope of the technical solution of the present invention, according to the technical essence of the present invention to the above implementation cases Any simple modifications, equivalent changes and modifications still belong to the scope of the technical solution of the present invention.
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