CN107962827B

CN107962827B - Composite plate, preparation method thereof and printing head

Info

Publication number: CN107962827B
Application number: CN201711065280.4A
Authority: CN
Inventors: 杨潮平
Original assignee: Individual
Current assignee: Individual
Priority date: 2017-11-02
Filing date: 2017-11-02
Publication date: 2020-01-17
Anticipated expiration: 2037-11-02
Also published as: CN107962827A

Abstract

The invention relates to a composite plate, a preparation method thereof and a printing head. This composite sheet includes the base plate and stacks up the heat accumulation layer on the base plate, and the heat accumulation layer includes frit and clean shot, and the frit sets up on the base plate, and the clean shot distributes in the frit and forms the hollow ball layer, and the distance that one side of base plate was kept away from to the heat accumulation layer to the one side of keeping away from the base plate on the hollow ball layer is 10% of the maximum thickness of heat accumulation layer at least. The composite plate can ensure that the printing head containing the composite plate has high thermal efficiency and good thermal response performance.

Description

Composite plate, preparation method thereof and printing head

Technical Field

The invention relates to the field of printers, in particular to a composite plate, a preparation method thereof and a printing head.

Background

In order to be able to extend the useful life of the printer, it is a very effective way to reduce the power consumption of the printer. In the case of a printer, in order to achieve low power consumption, it is necessary that the print head has high thermal efficiency, i.e., the heat generated by the print head needs to be transferred to the print medium as much as possible.

Of course, the thermal efficiency of the printhead is improved mainly by changing the material of the glaze layer or increasing the thickness of the glaze layer. Wherein, the multilayer glaze layers are made of materials with different heat conductivity coefficients to improve the heat efficiency, the different glaze layers are easy to peel and damage, in the process of development, the technical difficulty is high, glaze slip of various materials is required to be prepared, the process is complex, and the cost is high. The increase of the thickness of the glaze layer can increase the heat capacity of the glaze layer, further increase the heat dissipation time of the heat accumulated by the glaze layer in a non-working state, finally reduce the thermal response performance of the printing head, and is not beneficial to high-speed printing. The existing printing head is generally difficult to give consideration to both the heat efficiency and the thermal response performance.

Disclosure of Invention

Accordingly, it is necessary to provide a composite plate capable of making a printing head including the composite plate high in thermal efficiency and good in thermal responsiveness, and a method of manufacturing the same.

Further, a printhead is provided.

The composite plate comprises a substrate and a heat storage layer stacked on the substrate, wherein the heat storage layer comprises a glaze and hollow spheres, the glaze is arranged on the substrate, the hollow spheres are distributed in the glaze and form hollow sphere layers, and the distance from one side, far away from the substrate, of each hollow sphere layer to one side, far away from the substrate, of each heat storage layer is at least 10% of the maximum thickness of the heat storage layer.

Above-mentioned composite sheet includes the base plate and stacks up the heat accumulation layer on the base plate, the heat accumulation layer includes frit and clean shot, the frit sets up on the base plate, the clean shot distributes in the frit and forms hollow ball layer, through add the clean shot in the frit, the coefficient of heat conductivity of frit has been reduced, make the heat accumulate in hollow ball layer more, can not transmit for the base plate and scatter and disappear excessively, and make the heat transmit the printing medium more, and then make the printer head that contains this composite sheet have higher thermal efficiency, simultaneously, the thickness that need not through increasing the heat accumulation layer improves the thermal efficiency that the printer head that contains this composite sheet, and then can guarantee the high hot response property who beats printer head that contains this composite sheet. Because the heat storage layer of the composite board is of a single-layer glaze structure, the problem that multiple layers of glaze are easy to peel off and damage is avoided, the service life of the composite board is prolonged, the service life of a printing head containing the composite board is prolonged, multiple glaze slip does not need to be prepared, the process is simple, and the cost is low. And because the distance from the side of the hollow ball layer far away from the substrate to the side of the heat storage layer far away from the substrate is at least 10% of the maximum thickness of the heat storage layer, the smoothness of the surface of the heat storage layer and the mechanical strength of the heat storage layer can be ensured, the heat storage performance of the heat storage layer can be improved, excessive heat can be prevented from being accumulated near the resistance layer of the printing head containing the composite plate, and the thermal response performance of the printing head containing the composite plate can be improved. The composite plate can ensure that the printing head containing the composite plate has high thermal efficiency and good thermal response performance.

In one embodiment, the maximum thickness of the heat storage layer is 30 μm to 150 μm; and/or the presence of a catalyst in the reaction mixture,

the ratio of the thickness of the hollow sphere layer to the maximum thickness of the heat storage layer is 0.01: 1-0.9: 1; and/or the presence of a catalyst in the reaction mixture,

the outer diameter of the hollow sphere is 0.25-12 μm; and/or the presence of a catalyst in the reaction mixture,

the ratio of the inner diameter to the outer diameter of the hollow sphere is 0.1: 1-0.9: 1.

in one embodiment, the hollow sphere comprises a core sphere and a coating layer covering the core sphere, wherein the core sphere is hollow.

In one embodiment, the material of the core sphere is selected from at least one of magnesium oxide, aluminum oxide, silicon dioxide, calcium oxide and titanium dioxide; and/or the presence of a catalyst in the reaction mixture,

the material of the coating layer is the same as that of the glaze; and/or the presence of a catalyst in the reaction mixture,

the outer diameter of the core ball is 0.1-10 μm; and/or the presence of a catalyst in the reaction mixture,

the ratio of the inner diameter to the outer diameter of the core sphere is 0.1: 1-0.9: 1; and/or the presence of a catalyst in the reaction mixture,

the ratio of the outer diameter of the core sphere to the outer diameter of the hollow sphere is 0.4: 1-1: 1.

in one embodiment, the outer diameter of the core sphere is 0.5 μm to 6 μm; and/or the presence of a catalyst in the reaction mixture,

the ratio of the inner diameter to the outer diameter of the core sphere is 0.3: 1-0.9: 1.

in one embodiment, the side of the heat storage layer away from the substrate is provided with a bulge, and the hollow sphere layer corresponds to the bulge; or the like, or, alternatively,

and one side of the heat storage layer, which is far away from the substrate, is a plane.

In one embodiment, the hollow sphere layer is arranged on one side of the heat storage layer close to the substrate, and the hollow sphere layer is laminated on the substrate; or the like, or, alternatively,

the hollow ball layer is arranged in the middle of the heat storage layer, and the distance from one side of the hollow ball layer close to the substrate is 0-90% of the maximum thickness of the heat storage layer.

The method for preparing the composite board in any one of the above embodiments comprises the following steps:

alternately arranging organic films and the hollow spheres on one side of the substrate to form a composite layer;

arranging the glaze on one side of the composite layer far away from the substrate, coating the composite layer with the glaze, covering the substrate, and

and heating the composite board at 1000-1500 ℃ for 0.75-1.5 hours to obtain the composite board.

In one embodiment, before the step of alternately arranging the organic films and the hollow spheres on one side of the substrate to form the composite layer, a step of alternately arranging the organic films and the hollow spheres on one side of the glass glaze to form the composite layer is further included, in which a glass glaze is arranged on one side of the substrate to connect the substrate and the composite layer through the glass glaze, the glass glaze is made of the same material as the glaze, and the organic films and the hollow spheres are alternately arranged on one side of the glass glaze away from the substrate to form the composite layer.

A printhead comprising a composite plate as claimed in any one of the preceding embodiments.

Drawings

FIG. 1 is a schematic diagram of a printhead according to one embodiment;

FIG. 2 is an enlarged schematic view at II of the printhead shown in FIG. 1;

FIG. 3 is a partial schematic view of another angle of the printhead of FIG. 1 with the protective layer omitted;

FIG. 4 is a schematic structural diagram of a printhead according to another embodiment;

FIG. 5 is an enlarged schematic view at IV of the printhead shown in FIG. 4;

fig. 6 is a schematic structural view of another embodiment of a composite plate.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1, a printhead 10 according to an embodiment includes a composite plate 100, a conductive layer 200, a resistive layer 300, and a protective layer 400. The print head 10 can be applied to a printer.

The composite plate 100 includes a substrate 110 and a heat storage layer 120 stacked on the substrate 110.

The substrate 110 is a main body of the composite plate 100, and supports the heat storage layer 120. The substrate 110 has a substantially bar shape with a support surface 112 for disposing the heat storage layer 120.

In one embodiment, the substrate 110 is made of ceramic or glass.

Preferably, the substrate 110 is made of alumina ceramic.

In one embodiment, the substrate 110 has a thickness of 0.7mm to 1.5 mm.

The heat storage layer 120 is stacked on the substrate 110. Specifically, the heat storage layer 120 is laminated on the support surface 112. Further, the heat storage layer 120 has a first surface 122 and a second surface 124 disposed opposite to each other. In the illustrated embodiment, the first surface 122 is sized to substantially correspond to the size of the support surface 112 such that the heat storage layer 120 covers the entire support surface 112.

Further, the second surface 124 is curved so that the heat storage layer 120 has protrusions 125, the protrusions 125 have a substantially semi-cylindrical shape, the cross section of each protrusion 125 is substantially semicircular, and the distance from the vertex of each protrusion 125 to the substrate 110 is the maximum thickness of the heat storage layer 120. By providing the protrusions 125 on the heat storage layer 120, the print head 10 can be better brought into contact with the printing medium through the protrusions 125, so that heat can be more efficiently transferred to the printing medium, thereby enabling the print head 10 to be applied to high-speed printing.

In one embodiment, the maximum thickness of the heat storage layer 120 is 30 μm to 150 μm.

In one embodiment, the heat storage layer 120 has a minimum thickness of 18 μm to 90 μm.

Further, the heat storage layer 120 includes a frit 126 and hollow spheres 128. The frit 126 is disposed on the substrate 110. Specifically, the frit 126 is disposed on the support surface 112.

In one embodiment, the glaze 126 is glass glaze slip.

In one embodiment, the glass glaze slurry comprises the following components in percentage by mass: 40 to 75 percent of SiO₂0 to 15 percent of BaO, 0 to 20 percent of SrO and 0 to 10 percent of Na₂O, 0 to 10 percent of K₂O, 1-15% of Al₂O₃1 to 25 percent of B₂O₃And 0 to 10 percent of ZnO.

Preferably, the glass glaze slurry comprises the following components in percentage by mass: 58% SiO₂10% of BaO, 4% of SrO and 5% of Na₂O, 5% of K₂O, 10% of Al₂O₃5% of B₂O₃And 3% ZnO.

In one embodiment, the softening temperature of the glaze 126 is 680 ℃ to 750 ℃.

The hollow spheres 128 serve to reduce the thermal conductivity of the heat storage layer 120. In the illustrated embodiment, the hollow sphere 128 is a hollow sphere. Since the thermal conductivity of air is lower than that of the frit 126, the addition of the hollow spheres 128 can reduce the thermal conductivity of the heat storage layer 120, thereby improving the heat storage performance of the heat storage layer 120.

Referring to fig. 2, the hollow sphere 128 further includes a core sphere 1282 and a cladding 1284. The core ball 1282 is a hollow sphere, which is the main body of the hollow ball 128. Coating 1284 covers the outer surface of core ball 1282. By arranging the coating layer 1284 on the surface of the core ball 1282, the core ball 1282 can be attached to the glaze 126 more closely, and the reduction of the mechanical strength of the heat storage layer 120 due to the existence of a gap between the core ball 1282 and the glaze 126 is avoided.

In one embodiment, the core sphere 1282 has an outer diameter of 0.1 μm to 10 μm.

Preferably, the core sphere 1282 has an outer diameter of 0.5 μm to 6 μm.

In one embodiment, the ratio of the inner diameter to the outer diameter of core ball 1282 is 0.1: 1-0.9: 1.

preferably, the ratio of the inner diameter to the outer diameter of the core ball 1282 is 0.3: 1-0.9: 1.

in one embodiment, the material of core ball 1282 is selected from at least one of magnesium oxide, aluminum oxide, silicon dioxide, calcium oxide, and titanium dioxide. These materials allow core ball 1282 to have a higher melting point, which prevents core ball 1282 from being softened and collapsed during the manufacturing process of composite plate 100, thereby affecting the thermal efficiency of printhead 10.

In the illustrated embodiment, the material of the cladding layer 1284 is the same as that of the glaze 126, so that the single-layer glaze structure of the heat storage layer 120 is ensured, the problem that multiple layers of glaze are easily stripped and damaged is solved, the service life of the composite plate 100 is prolonged, the service life of the printing head 10 is prolonged, various glaze slips do not need to be prepared, the process is simple, and the cost is low.

In one embodiment, the hollow spheres 128 have an outer diameter of 0.25 to 12 μm.

In one embodiment, the ratio of the inner diameter to the outer diameter of the hollow sphere 128 is 0.1: 1-0.9: 1.

in one embodiment, the ratio of the outer diameter of the core sphere 1282 to the outer diameter of the hollow sphere 128 is 0.4: 1-1: 1.

further, hollow spheres 128 are distributed in the frit 126, and a hollow sphere layer 129 is formed in the heat storage layer 120. Specifically, the hollow spheres 128 are multiple, and the hollow spheres 128 are distributed in the glaze 126 at intervals, so as to form a hollow sphere layer 129. In the illustrated embodiment, the hollow spheres 128 are uniformly distributed in the frit 126, such that the hollow sphere layer 129 is a multi-layer structure. When there are a plurality of hollow spheres 128, the coating layer 1284 can fill gaps between the hollow spheres 128 arranged at intervals, so as to prevent the glaze 126 from infiltrating into the gaps between the hollow spheres 128 in the process of preparing the composite plate 100, especially, the glaze 126 cannot infiltrate into the gaps between the hollow spheres 128 close to one side of the substrate 110 when the thickness of the hollow sphere layer 129 is large, thereby affecting the mechanical strength of the heat storage layer 120.

Further, the hollow sphere layer 129 corresponds to the protrusion 125. Due to the arrangement of the hollow sphere layer 129, the thermal conductivity of the protrusion 125 is low, and excessive heat is prevented from being dissipated by being transmitted to the substrate 110 through the heat storage layer 120, so that the heat storage performance of the heat storage layer 120 and the thermal efficiency of the print head 10 are improved.

Further, the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is the distance from the plane formed by the apexes of the hollow spheres 128 on the side of the hollow sphere layer 129 close to the protrusion 125 to the apex of the protrusion 125. Of course, when the hollow sphere 128 is composed of the core sphere 1282 and the coating layer 1284, the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is the distance from the plane formed by the apexes of the core spheres 1282 on the side of the hollow sphere layer 129 close to the protrusions 125 to the apexes of the protrusions 125.

In the illustrated embodiment, the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is H.

In one embodiment, the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is at least 10% of the maximum thickness of the heat storage layer 120.

By setting the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 to be at least 10% of the maximum thickness of the heat storage layer 120, it is possible to ensure the smoothness of the surface of the heat storage layer 120 and the mechanical strength of the heat storage layer 120, to improve the heat storage performance of the heat storage layer 120, to prevent excessive heat from being accumulated near the resistive layer 300 of the print head 10, and to improve the thermal responsiveness of the print head 10.

Preferably, the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is 35% of the maximum thickness of the heat storage layer 120.

In one embodiment, the ratio of the thickness of the hollow sphere layer 129 to the maximum thickness of the heat storage layer 120 is 0.01: 1-0.9: 1. by setting the ratio of the thickness of the hollow sphere layer 129 to the maximum thickness of the heat storage layer 120 to 0.01: 1-0.9: 1, not only can the thermal conductivity of the heat storage layer 120 be effectively reduced, but also the mechanical strength of the heat storage layer 120 can be ensured.

Preferably, the ratio of the thickness of the hollow sphere layer 129 to the maximum thickness of the heat storage layer 120 is 0.2: 1-0.6: 1.

further, the hollow sphere layer 129 is located in the middle of the heat storage layer 120, such that the hollow sphere layer 129 is spaced apart from the supporting surface 112 by a distance from the side close to the substrate 110. Because the supporting surface 112 of the substrate 110 is rough, the glaze 126 covers the supporting surface 112, so that the rough supporting surface 112 can be well filled, the supporting surface 112 can be smoother, the contact area between the heat storage layer 120 and the substrate 110 can be increased, and further, the phenomenon that the contact interface between the heat storage layer 120 and the substrate 110 is damaged due to concentrated stress generated under the action of external force, and the normal use of the printing head 10 is finally influenced, is avoided.

In one embodiment, the distance from the side of the hollow sphere layer 129 close to the substrate 110 to the supporting surface 112 is 0% to 90% of the maximum thickness of the heat storage layer 120.

Preferably, the distance from the side of the hollow sphere layer 129 close to the substrate 110 to the supporting surface 112 of the substrate 110 is 50% of the maximum thickness of the heat storage layer 120.

Referring also to fig. 3, the conductive layer 200 is used to energize the resistive layer 300. The conductive layer 200 is disposed on a side of the heat storage layer 120 away from the substrate 110. Further, the electrically conductive layer 200 is laminated on the second surface 124 of the heat storage layer 120. Specifically, the conductive layer 200 has a common electrode 210 and a plurality of individual electrodes 220, the common electrode 210 and the individual electrodes 220 are disposed on the second surface 124 of the heat storage layer 120, and the resistive layer 300 is partially energized through the individual electrodes 220.

The common electrode 210 has a plurality of strip portions 211, and the plurality of strip portions 211 are provided at intervals. Further, the individual electrodes 220 are disposed at intervals, the individual electrodes 220 and the strip portions 211 are alternately disposed, and a gap is formed between the adjacent individual electrodes 220 and the strip portions 211.

In one embodiment, the conductive layer has a thickness of 0.5 μm to 7 μm.

The resistive layer 300 generates heat when a portion of the conductive layer 200 is energized, and the heat-generated portion of the resistive layer 300 forms a print dot, thereby allowing a pattern or a character to appear on a printing medium. In the illustrated embodiment, the resistor layer 300 is laminated on the side of the conductive layer 200 away from the heat storage layer 120, and the resistor layer 300 corresponds to each of the protrusion 125 and the hollow sphere layer 129. Due to the arrangement of the hollow sphere layer 129, the thermal conductivity of the protrusion 125 is low, so that excessive heat is prevented from being transferred to the substrate 110 through the heat storage layer 120 and dissipated, and further, more heat of the resistor layer 300 is transferred to the printing medium, thereby improving the thermal efficiency of the printhead 10.

Specifically, the resistive layer 300 has a substantially strip shape, the resistive layer 300 covers the common electrode 210 on the side away from the heat storage layer 120, and the resistive layer 300 covers the individual electrodes 220 on the side away from the heat storage layer 120. Further, the resistive layer 300 has a heat generating portion. Specifically, the portion of the resistive layer 300 covering the gap between the adjacent individual electrode 220 and the strip portion 211 is a heat generating portion, and the heat generating portion is connected to both the adjacent individual electrode 220 and the strip portion 211. The heat generating portion generates heat by being energized through a portion of the conductive layer 200, and a print dot is formed by this heat generation.

The protection layer 400 is used to protect the conductive layer 200 and the resistive layer 300 and prevent the conductive layer 200 and the resistive layer 300 from being affected by moisture and abrasion. The passivation layer 400 covers the conductive layer 200 and the resistive layer 300. In the illustrated embodiment, the protection layer 400 covers the side of the resistive layer 300 away from the conductive layer 200 and covers the entire conductive layer 200, thereby protecting the conductive layer 200 and the resistive layer 300 from moisture and abrasion.

In one embodiment, the protection layer 400 is made of an amorphous glass material.

In one embodiment, the thickness of the protective layer 400 is 5 μm to 15 μm.

The above-described printhead 10 has at least the following advantages:

(1) the printing head 10 has the composite plate 100, the composite plate 100 includes the substrate 110 and the heat accumulation layer 120 stacked on the substrate 110, the heat accumulation layer 120 includes the glaze 126 and the hollow ball 128, the glaze 126 is disposed on the substrate 110, the hollow ball 128 is distributed in the glaze 126 and forms the hollow ball layer 129, through adding the hollow ball 128 into the glaze 126, the heat conductivity coefficient of the glaze 126 is reduced, the heat accumulation performance of the heat accumulation layer 120 is improved, the heat is prevented from being excessively transmitted to the substrate 110 through the heat accumulation layer 120 and being dissipated, further, the heat can be transmitted to a printing medium more, finally, the printing head 10 has higher heat efficiency, meanwhile, the heat efficiency of the printing head 10 is improved without increasing the thickness of the heat accumulation layer 120, and further, the high heat response performance of the printing head 10 can be ensured. Because the heat storage layer 120 of the composite board 100 is of a single-layer glaze structure, the problem that multiple layers of glaze are easy to peel off and damage is avoided, the service life of the composite board 100 is prolonged, the service life of the printing head 10 is prolonged, various glaze slip does not need to be prepared, the process is simple, and the cost is low. Since the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is at least 10% of the maximum thickness of the heat storage layer 120, it is possible to improve the heat storage performance of the heat storage layer 120 while ensuring the smoothness of the surface of the heat storage layer 120 and the mechanical strength of the heat storage layer 120, and it is possible to prevent excessive heat from being accumulated in the vicinity of the resistor layer 300 of the print head 10, which is advantageous in improving the thermal responsiveness of the print head 10. The above-described print head 10 has high thermal efficiency and good thermal responsiveness.

(2) The hollow sphere 128 of the print head 10 is composed of a core sphere 1282 and a coating layer 1284 covering the outer surface of the core sphere 1282, and the coating layer 1284 is arranged on the surface of the core sphere 1282, so that the core sphere 1282 can be more tightly attached to the glaze 126, and the mechanical strength of the heat storage layer 120 is prevented from being reduced due to the gap between the core sphere 1282 and the glaze 126. Meanwhile, the material of the coating layer 1284 and the material of the glaze 126 are set to be the same, so that the single-layer glaze structure of the heat storage layer 120 is guaranteed, the coating layer 1284 can be filled in gaps among the hollow balls 128 arranged at a plurality of intervals, and the mechanical strength of the heat storage layer 120 is increased.

(3) The second surface 124 of the heat storage layer 120 of the print head 10 is a curved surface, and the second surface 124 has the protrusions 125, so that the print head 10 can better contact with a printing medium through the protrusions 125, heat can be more effectively transferred to the printing medium, and the print head 10 can be applied to high-speed printing.

(4) The hollow sphere layer 129 of the print head 10 is located in the middle of the heat storage layer 120, so that the hollow sphere layer 129 is spaced apart from the supporting surface 112 by a distance from the side close to the substrate 110. Because the supporting surface 112 of the substrate 110 is rough, the glaze 126 covers the supporting surface 112, so that the rough supporting surface 112 can be well filled, the supporting surface 112 can be more smooth, the contact area between the heat storage layer 120 and the substrate 110 can be increased, and further, the phenomenon that the contact interface between the heat storage layer 120 and the substrate 110 is damaged due to the concentrated stress generated under the action of external force, and the normal use of the printing head 10 is finally influenced is avoided.

(5) The above-described print head 10 can be applied to a printer. When the print head 10 is applied to a printer, since the print head 10 has a high thermal response capability, high-speed printing of the printer can be realized. Meanwhile, the thermal efficiency of the printing head 10 is high, the consumed power is low, and therefore the power consumption of the printer with the printing head 10 is low, the battery service time of the printer can be maintained, and energy and power are saved.

It is understood that the size of the first surface 122 may be smaller than the size of the supporting surface 112, and may be set as needed as long as the conductive layer 200 and the resistive layer 300 are ensured to be disposed on the heat storage layer 120.

It is understood that the shape of the hollow sphere 128 is not limited to a hollow sphere, but may be a hollow cube, or a hollow cylinder, and may be set according to actual needs as long as the distance from the side of the hollow sphere layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is at least 10% of the maximum thickness of the heat storage layer 120.

It is understood that the shape of the core ball 1282 is not limited to the hollow spherical shape, and may be set according to actual needs as long as the distance from the side of the hollow ball layer 129 away from the substrate 110 to the side of the heat storage layer 120 away from the substrate 110 is at least 10% of the maximum thickness of the heat storage layer 120.

It is understood that cladding 1284 may be omitted. Referring to fig. 4 and 5, when the coating 1284 is omitted, the core balls 1282 are directly distributed in the frit 126, and the hollow ball layer 129 is formed.

It is understood that the second surface 124 is not limited to a curved surface, and in other embodiments, referring to fig. 4 and 5, the second surface 124 may be a plane surface as long as the resistive layer 300 is ensured to correspond to the hollow sphere layer 129.

It is understood that the position of the hollow sphere layer 129 is not limited to the middle of the heat storage layer 120. In another embodiment, referring to fig. 6, the hollow sphere 128 is composed of only core spheres 1282, the core spheres 1282 are distributed in the frit 126, the core spheres 1282 are directly disposed on the supporting surface 112, and the hollow sphere layer 129 is stacked on the supporting surface 112 of the substrate 110. Because the hollow sphere 128 does not have the coating layer 1284, the core sphere 1282 directly abuts against the supporting surface 112, and the supporting surface 112 is rough, so that the contact area between the core sphere 1282 and the supporting surface 112 is small, and further, the contact interface between the heat storage layer 120 and the substrate 110 is easily damaged due to the concentrated stress generated under the action of external force. Of course, it should be noted that, when the outer surface of the core ball 1282 is covered by the covering layer 1284, and the hollow ball layer 129 is directly laminated on the supporting surface 112, although the outer surface of the core ball 1282 has the covering layer 1284, since the thickness of the covering layer 1284 is relatively small, the filling effect of the covering layer 1284 on the rough supporting surface 112 is inferior to the filling effect of the glaze 126 on the rough supporting surface 112, and thus the contact interface between the heat storage layer 120 and the substrate 110 is easily damaged.

It is understood that the resistor layer 300 may be directly laminated on the second surface 124 of the heat storage layer 120, as long as the resistor layer 300 is ensured to correspond to the protrusion 125 and the hollow sphere layer 129, and the conductive layer 200 is ensured to be located near the resistor layer 300, thereby ensuring that the conductive layer 200 can provide electricity to the resistor layer 300.

The method for manufacturing the print head 10 includes the following steps:

step S110: composite panel 100 is prepared.

In this embodiment, the preparation of composite panel 100 includes the steps of:

step S111: a glass frit paste is disposed on one side of the substrate 110.

In the present embodiment, a glass frit paste is provided on the supporting surface 112 of the substrate 110.

The distribution position of the hollow sphere layer 129 in the thickness direction of the heat storage layer 120 can be changed by changing the thickness of the glass glaze slip.

Step S112: hollow spheres 128 are prepared.

Specifically, a core sphere 1282 is provided, and a coating layer 1284 is formed on an outer surface of the core sphere 1282, resulting in the hollow sphere 128.

In one embodiment, the core sphere has an outer diameter of 0.1 μm to 10 μm.

In one embodiment, the ratio of the inner diameter to the outer diameter of the core sphere is 0.1: 1-0.9: 1.

In one embodiment, the cladding layer 1284 is made of glass glaze slip.

Preferably, the material of the coating layer 1284 is the same as that of the glass glaze slip.

of course, it should be noted that the source of the core sphere 1282 is not limited, and the core sphere can be made of corresponding materials, or can be directly purchased, as long as the outer diameter of the core sphere is ensured to be 0.1 μm to 10 μm, and the ratio of the inner diameter to the outer diameter is 0.1: 1-0.9: 1 and the material is selected from at least one of magnesium oxide, aluminum oxide, silicon dioxide, calcium oxide and titanium dioxide.

Of course, if the coating 1284 is not required, the step of forming the coating 1284 on the outer surface of the core ball 1282 may be omitted.

Of course, the order of step S111 and step S112 is not limited to the above order, and step S112 may be performed first and then step S111, or step S111 and step S112 may be performed simultaneously, and may be adjusted according to actual circumstances.

Of course, it should be noted that the hollow sphere 128 may also be obtained by purchasing or other methods, as long as the outer diameter of the hollow sphere 128 is ensured to be 0.25 μm to 2 μm, and the ratio of the inner diameter to the outer diameter of the hollow sphere 128 is 0.1: 1-0.9: 1. the ratio of the outer diameter of the core sphere 1282 to the outer diameter of the hollow sphere 128 is 0.4: 1-1: 1, the product is obtained.

Step S113: the organic film and the hollow spheres 128 are alternately provided on the side of the glass frit paste away from the substrate 110 to form a composite layer.

Specifically, an organic film is disposed on a side of the glass glaze slurry away from the supporting surface 112, and the hollow spheres 128 and the organic film are alternately disposed. By alternately arranging the organic film and the hollow spheres 128, the hollow spheres 128 can be previously fixed in the organic film, facilitating the distribution of the hollow spheres 128 in each layer structure of the hollow sphere layer 129. Meanwhile, the composite layers with different thicknesses can be obtained by repeating step S113, so that the thickness of the finally obtained hollow sphere layer 129 can be changed.

In one embodiment, the organic film is formed by disposing a raw material of the organic film on the substrate 110 and the hollow balls 128 by an electrostatic spraying method or a vacuum spraying method.

In one embodiment, the organic film is made of at least one material selected from ethyl cellulose, ethyl acrylic acid, butyl acrylic acid, ethyl methacrylate, butyl-ethyl methacrylate cellulose, maleic acid resin, and rosin.

In one embodiment, the organic film has a thickness of 0.5 μm to 2 μm. The distribution of the hollow spheres 128 in the thickness direction of the composite layer can be varied by varying the thickness of the organic film.

In one embodiment, the hollow spheres 128 are provided by cold spray or electrostatic spray.

Preferably, the hollow spheres 128 are provided by a cold spray process. Because the cold spraying method can make the hollow spheres 128 more uniformly dispersed on the organic film or glass glaze slip.

Of course, when it is necessary to directly provide the composite layer on the supporting surface 112 of the substrate 110, step S111 is omitted.

Of course, it should be noted that when cladding 1284 is omitted, core ball 1282 may be placed directly on the glass frit to form a composite layer. Of course, if the hollow sphere 128 is directly available, step S112 is omitted.

Step S114: glaze slurry is arranged on one side of the composite layer, which is far away from the substrate 110, and the composite layer is coated by the glaze slurry and covers the substrate 110.

Specifically, glaze slurry is printed on the side of the composite layer away from the substrate 110, and the glaze slurry coats the composite layer and covers the substrate 110, so as to obtain the intermediate plate.

In one embodiment, the material of the glaze slurry is the same as the material of the glass glaze slurry.

Preferably, the material of the glaze slip, the material of the glass glaze slip and the material of the cladding layer 1284 are the same.

Step S115: and heating the intermediate plate at 1000-1500 ℃ for 0.75-1.5 hours to obtain the composite plate 100.

In one embodiment, the farthest distance from the side of the composite plate 100 away from the substrate 110 to the supporting surface 112 is 30 μm to 150 μm.

Step S120: the print head 10 is obtained by forming the conductive layer 200 and the resistive layer 300 on the side of the composite plate 100 away from the substrate 110.

In the present embodiment, the conductive layer 200 is formed on the side of the composite plate 100 away from the substrate 110, and the resistive layer 300 is formed on the side of the conductive layer 200 away from the composite plate 100.

Step S130: a protective layer 400 is formed on the conductive layer 200 and the resistive layer 300 on the side away from the composite board 100.

In one embodiment, the conductive layer has a thickness of 0.5 μm to 7 μm.

Of course, if the water resistance and the wear resistance of the conductive layer 200 and the resistive layer 300 can satisfy the actual requirements, step S130 may be omitted.

The above-described method of manufacturing the printhead 10 has at least the following advantages:

(1) in the preparation method of the printing head 10, the material of the glass glaze slip, the material of the coating layer 1284 and the material of the glaze slip are the same, so that the heat storage layer 120 is of a single-layer structure, the problem that multiple layers of glaze are easy to peel and damage is solved, the service life of the composite board 100 is prolonged, the service life of the printing head 10 is prolonged, various glaze slips do not need to be prepared, the process is simple, and the cost is low.

(2) In the above method for manufacturing the printhead 10, the organic film and the hollow spheres 128 are alternately disposed, and the organic film can fix the hollow spheres 128. The composite layer having different thicknesses can be obtained by repeating step S113, and the thickness of the hollow sphere layer 129 finally obtained can be changed. Meanwhile, the distribution of the hollow spheres 128 in the thickness direction of the composite layer can also be changed by changing the thickness of the organic film. In addition, the hollow spheres 128 are disposed on the organic film by using a cold spray method, so that the hollow spheres 128 can be uniformly distributed on the organic film, thereby ensuring that the hollow spheres 128 are uniformly distributed in each layer structure of the hollow sphere layer 129.

(3) In the manufacturing method of the above-described print head 10, the distribution position of the hollow sphere layer 129 in the thickness direction of the heat storage layer 120 can be changed by providing a glass frit on the support surface 112 of the substrate 110 in advance and changing the thickness of the glass frit paste, and further the distribution position of the hollow sphere layer 129 in the thickness direction of the heat storage layer 120 can be controlled.

(4) The preparation method of the printing head 10 can be used for preparing the printing head 10, the composite plate 100 and the hollow ball 128, and is powerful in function and simple in process. Meanwhile, the obtained printing head 10 has high thermal efficiency and thermal response performance, so that the manufacturing method of the printing head 10 has high economic value.

The following are specific examples:

in the following examples, unless otherwise specified, the components of the glass glaze slip all comprise, in mass percent: 58% SiO₂10% of BaO, 4% of SrO and 5% of Na₂O, 5% of K₂O, 10% of Al₂O₃5% of B₂O₃And 3% ZnO.

Example 1

The preparation method of the composite board of the embodiment comprises the following steps:

(1) magnesium oxide was used to prepare a powder having an outer diameter of 10 μm and a ratio of inner diameter to outer diameter of 0.9: 1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein the outer diameter of the hollow sphere is 12 μm.

(2) And arranging glass glaze slip on one side of the substrate with the thickness of 1.5mm, and alternately arranging organic films and hollow spheres on the glass glaze slip to form a composite layer. Wherein the organic film is made of ethyl cellulose, the thickness of the organic film is 5 μm, the organic film is arranged by an electrostatic spraying method, and the hollow spheres are arranged by a cold spraying method.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1500 ℃ for 1.5 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 150 mu m, the minimum thickness of the heat storage layer is 90 mu m, the thickness of the hollow ball layer is 60 mu m, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 30 mu m.

Example 2

(1) the ratio of the inner diameter to the outer diameter was 0.1 μm: 1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein, the material of core ball is aluminium oxide, and the external diameter of hollow ball is 0.25 μm.

(2) A glass glaze slip is arranged on one side of a substrate with the thickness of 0.7mm, and an organic film and hollow spheres are alternately arranged on the glass glaze slip to form a composite layer. Wherein the organic film is made of ethyl acrylic acid, the thickness of the organic film is 0.2 mu m, the mode of arranging the organic film is a vacuum spraying method, and the mode of arranging the hollow spheres is an electrostatic spraying method.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1000 ℃ for 0.75 hour to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 30 micrometers, the minimum thickness of the heat storage layer is 18 micrometers, the thickness of the hollow ball layer is 3 micrometers, and the distance from the side, away from the substrate, of the hollow ball layer to the side, away from the substrate, of the heat storage layer is 3 micrometers.

Example 3

(1) calcium oxide was used to prepare a mixture having an outer diameter of 3 μm and a ratio of inner diameter to outer diameter of 0.8:1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein, the outer diameter of the hollow ball is 4 μm.

(2) A glass glaze slip is arranged on one side of a substrate with the thickness of 1.0mm, and organic films and hollow spheres are alternately arranged on the glass glaze slip to form a composite layer. Wherein the organic film is made of butyl acrylic acid, the thickness of the organic film is 1 mu m, the mode of arranging the organic film is a vacuum spraying method, and the mode of arranging the hollow spheres is an electrostatic spraying method.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 80 microns, the minimum thickness of the heat storage layer is 48 microns, the thickness of the hollow ball layer is 10 microns, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 20 microns.

Example 4

(1) silica was used to prepare a silica gel having an outer diameter of 3 μm and a ratio of inner diameter to outer diameter of 0.8:1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein, the outer diameter of the hollow ball is 4 μm.

(2) And arranging glass glaze slip on one side of the substrate with the thickness of 1.2mm, and alternately arranging organic films and hollow spheres on the glass glaze slip to form a composite layer. Wherein the organic membrane is made of ethyl methacrylate, the thickness of the organic membrane is 1 mu m, the mode of arranging the organic membrane is an electrostatic spraying method, and the mode of arranging the hollow spheres is the electrostatic spraying method.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 80 microns, the minimum thickness of the heat storage layer is 48 microns, the thickness of the hollow ball layer is 20 microns, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 20 microns.

Example 5

(1) titanium dioxide was used to prepare a titanium dioxide alloy having an outer diameter of 5 μm and a ratio of inner diameter to outer diameter of 0.8:1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein the outer diameter of the hollow sphere is 6.5 μm.

(2) And arranging glass glaze slip on one side of the substrate with the thickness of 0.9mm, and alternately arranging organic films and hollow spheres on the glass glaze slip to form a composite layer. Wherein the organic membrane is made of butyl-ethyl methacrylate-cellulose, the thickness of the organic membrane is 1 mu m, the mode of arranging the organic membrane is an electrostatic spraying method, and the mode of arranging the hollow spheres is a cold spraying method.

Example 6

(1) the mass ratio of 1: 1 silica and titania to prepare a mixture having an outer diameter of 5 μm and a ratio of inner diameter to outer diameter of 0.8:1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein the outer diameter of the hollow sphere is 6.5 μm.

(2) And arranging glass glaze slip on one side of the substrate with the thickness of 1.5mm, and alternately arranging organic films and hollow spheres on the glass glaze slip to form a composite layer. Wherein the organic film is made of materials with the mass ratio of 1: 1 maleic acid resin and rosin, the thickness of the organic film is 1 μm, the manner of disposing the organic film is an electrostatic spraying method, and the manner of disposing the hollow spheres is a cold spraying method.

Example 7

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1500 ℃ for 1.5 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 150 mu m, the minimum thickness of the heat storage layer is 90 mu m, the thickness of the hollow ball layer is 135 mu m, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 15 mu m.

Example 8

(2) Organic films and hollow spheres were alternately disposed on a 1.5mm substrate to form a composite layer. Wherein the organic film is made of ethyl cellulose, the thickness of the organic film is 5 μm, the organic film is arranged by an electrostatic spraying method, and the hollow spheres are arranged by a cold spraying method.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1500 ℃ for 1.5 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 150 mu m, the minimum thickness of the heat storage layer is 90 mu m, the thickness of the hollow ball layer is 60 mu m, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 90 mu m.

Example 9

(1) magnesium oxide was used to prepare a powder having an outer diameter of 10 μm and a ratio of inner diameter to outer diameter of 0.9: 1 and forming a coating layer on the outer surface of the obtained core sphere to obtain the hollow sphere, wherein the coating layer comprises 50% of SiO2, 15% of BaO, 5% of SrO, 15% of PbO, 5% of B2O3 and 10% of ZnO by mass percent, and the outer diameter of the hollow sphere is 12 microns.

Example 10

The method for manufacturing the print head of the embodiment includes the following steps:

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein one side of the heat storage layer, which is far away from the substrate, is a plane, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 80 microns, the minimum thickness of the heat storage layer is 80 microns, the thickness of the hollow ball layer is 10 microns, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 20 microns.

Example 11

(2) And arranging glass glaze slip on one side of the substrate with the thickness of 1.2mm, and alternately arranging organic films and hollow spheres on the glass glaze slip to form a composite layer. Wherein the organic membrane is made of ethyl methacrylate, the thickness of the organic membrane is 1 μm, the organic membrane is arranged by electrostatic spraying, and the hollow spheres are arranged by electrostatic spraying.

(3) And arranging slurry on one side of the composite layer, which is far away from the substrate, and heating the composite layer at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, so that the composite plate is obtained. Wherein the maximum thickness of the heat storage layer is 80 μm, the minimum thickness of the heat storage layer is 48 μm, the thickness of the hollow ball layer is 20 μm, the distance from the side of the hollow ball layer far away from the substrate to the side of the heat storage layer far away from the substrate is 20 μm, and the components of the slurry comprise 50% of SiO in parts by weight₂15% of BaO, 5% of SrO, 15% of PbO and 5% of B₂O₃And 10% ZnO.

Example 12

(1) Titanium dioxide was used to prepare a titanium dioxide alloy having an outer diameter of 5 μm and a ratio of inner diameter to outer diameter of 0.3: 1, and forming a coating layer on the outer surface of the core ball by using glass glaze slip to obtain the hollow ball. Wherein the outer diameter of the hollow sphere is 6.5 μm.

Example 13

(1) a glass glaze slurry was placed on one side of a 1.5mm substrate, and an organic film and a core sphere were alternately placed on the glass glaze slurry to form a composite layer. Wherein the organic film is made of materials with the mass ratio of 1: 1 maleic acid resin and rosin, the thickness of the organic film is 1 μm, the outer diameter of the core sphere is 5 μm, the ratio of the inner diameter to the outer diameter of the core sphere is 0.8:1, and the core sphere is made of materials with the mass ratio of 1: 1, the manner of providing the organic film is an electrostatic spraying method, and the manner of providing the core ball is a cold spraying method.

(2) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 80 microns, the minimum thickness of the heat storage layer is 48 microns, the thickness of the hollow ball layer is 20 microns, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 20 microns.

Example 14

(1) the mass ratio of 1: 1 of silica and titanium dioxide, preparing a core sphere having an outer diameter of 5 μm and a ratio of inner diameter to outer diameter of 0.8:1, and forming a coating layer on the outer surface of the core sphere with a glass glaze slip to obtain a hollow sphere. Wherein the outer diameter of the hollow sphere is 6.5 μm.

(3) And arranging glass glaze slip on one side of the composite layer, which is far away from the substrate, heating the glass glaze slip at 1250 ℃ for 1.2 hours to form a heat storage layer and a hollow sphere layer, wherein the side of the heat storage layer, which is far away from the substrate, is provided with a semi-cylindrical bulge, and thus the composite plate is obtained. The maximum thickness of the heat storage layer is 80 microns, the minimum thickness of the heat storage layer is 48 microns, the thickness of the hollow ball layer is 20 microns, and the distance from the side, far away from the substrate, of the hollow ball layer to the side, far away from the substrate, of the heat storage layer is 5 microns.

Example 15

(1) magnesium oxide was used to prepare a powder having an outer diameter of 10 μm and a ratio of inner diameter to outer diameter of 0.9: 1, core sphere.

(2) Organic films and core balls were alternately disposed on a 1.5mm substrate to form a composite layer. Wherein the organic film is made of ethyl cellulose, the thickness of the organic film is 5 μm, the mode of arranging the organic film is an electrostatic spraying method, and the mode of arranging the core ball is a cold spraying method.

Example 16

and arranging glass glaze slip on one side of the substrate with the thickness of 0.9mm, heating at 1250 ℃ for 1.2 hours to form a heat storage layer, wherein one side of the heat storage layer, which is far away from the substrate, is provided with a bulge, and thus the composite plate without the hollow spheres is obtained. Wherein the maximum thickness of the heat storage layer is 150 μm, and the minimum thickness of the heat storage layer is 90 μm.

Example 17

and arranging glass glaze slip on one side of the substrate with the thickness of 0.9mm, heating at 1250 ℃ for 1.2 hours to form a heat storage layer, wherein one side of the heat storage layer, which is far away from the substrate, is provided with a bulge, and thus the composite plate without the hollow spheres is obtained. Wherein the maximum thickness of the heat storage layer is 80 μm, and the minimum thickness of the heat storage layer is 48 m.

And (3) testing:

(1) the compression strength of the heat storage layer in the composite boards of examples 1 to 17 was measured by applying pressure to the heat storage layer region corresponding to the heating resistance band using a compression roller, the thermal conductivity of the heat storage layer in the composite boards of examples 1 to 17 was measured by a laser flash method, and the roughness of the heat storage layer away from the substrate side in the composite boards of examples 1 to 17 was measured by a surface roughness tester. The thermal conductivity of the heat storage layers in the composite plates of examples 1 to 17 was measured to be the average thermal conductivity of the heat storage layers in the composite plates of examples 1 to 17. The compressive strength and the thermal conductivity of the heat storage layer of the composite plates of examples 1 to 17 and the roughness of the side of the heat storage layer away from the substrate were measured, and the test results are detailed in table 1.

Table 1 shows the compressive strength and thermal conductivity of the heat storage layer of the composite plates of examples 1 to 17, and the roughness of the heat storage layer on the side away from the substrate.

TABLE 1

As can be seen from table 1, the thermal conductivity of the heat storage layer of example 1 and the roughness of the side of the heat storage layer away from the substrate are both equivalent to the thermal conductivity of the heat storage layer of example 8 and the roughness of the side of the heat storage layer away from the substrate, respectively, while the compressive strength of the heat storage layer of example 1 is significantly higher than that of the heat storage layer of example 8, which indicates that the compressive strength of the heat storage layer can be significantly improved by controlling the position of the hollow sphere layer so that the hollow sphere layer does not directly contact with the substrate.

The roughness of the side of the heat storage layer far from the substrate in example 1 is equivalent to the roughness of the side of the heat storage layer far from the substrate in example 9, the thermal conductivity of the heat storage layer in example 1 is slightly lower than the thermal conductivity of the heat storage layer in example 9, the compressive strength of the heat storage layer in example 1 is obviously better than the compressive strength of the heat storage layer in example 9, and it is possible that the material of the coating layer of the hollow spheres in example 9 is different from the material of the glass glaze slurry, and the material of the coating layer in example 1 is the same as the material of the glass glaze slurry, so that the single-layer glaze structure of the heat storage layer is ensured, the coating layer can be filled in the gaps among the hollow spheres arranged at intervals, and the mechanical strength of the heat storage layer is further increased.

The roughness of the side of the heat storage layer far away from the substrate and the thermal conductivity of the heat storage layer in embodiment 4 are respectively equivalent to the roughness of the side of the heat storage layer far away from the substrate and the thermal conductivity of the heat storage layer in embodiment 11, while the compressive strength of the heat storage layer in embodiment 4 is obviously superior to that of the heat storage layer in embodiment 11, probably because the heat storage layer in embodiment 11 is composed of two different materials, the heat storage layer is in a two-layer structure, while the heat storage layer in embodiment 4 is in a single-layer structure, the heat storage layer in the single-layer structure can avoid the problem that different layer structures are easily peeled off and damaged, so that the mechanical strength of the heat storage layer in the single-layer structure is higher. The compressive strength of the heat storage layer and the roughness of the side of the heat storage layer away from the substrate in example 5 are equivalent to those of the heat storage layer in example 12, respectively, whereas the thermal conductivity of the heat storage layer in example 5 is lower than that of the heat storage layer in example 12, which indicates that the heat storage performance of the heat storage layer in example 5 is superior to that of the heat storage layer in example 12, and further indicates that the ratio of the inner diameter to the outer diameter of the core sphere is smaller than 0.3: 1, the hollow sphere layer formed has a reduced ability to reduce the thermal conductivity of the heat storage layer.

The compressive strength of the heat storage layer and the roughness of the side, far away from the substrate, of the heat storage layer in example 5 are respectively equivalent to the compressive strength of the heat storage layer in example 17 and the roughness of the side, far away from the substrate, of the heat storage layer, while the thermal conductivity of the heat storage layer in example 5 is obviously lower than that of the heat storage layer in example 17, which shows that the heat storage performance of the heat storage layer can be obviously improved by arranging the hollow ball layer in the heat storage layer, and further, the heat is effectively prevented from being excessively transferred to the substrate through the heat storage layer and being dissipated.

The thermal conductivity and compressive strength of the heat storage layer of example 6 are equivalent to those of the heat storage layer of example 14, while the roughness of the substrate-away side of the heat storage layer of example 6 is significantly less than that of the substrate-away side of the heat storage layer of example 14, indicating that a distance from the substrate-away side of the hollow sphere layer to the substrate-away side of the heat storage layer of greater than or equal to 10% of the maximum thickness of the heat storage layer is more beneficial to improving the smoothness of the substrate-away side of the heat storage layer.

In conclusion, the hollow sphere layer with controllable position and thickness exists in the heat storage layer, so that the heat conductivity coefficient of the heat storage layer is effectively reduced; the position of the hollow ball layer is controlled, so that the hollow ball layer is not in direct contact with the substrate, and the compression strength of the heat storage layer is ensured to be greater than the maximum compression strength (about 3N/cm) of a conventional printing head; in addition, the heat storage layers in the embodiments 1 to 7 have low roughness (less than or equal to 0.2 μm) on the side away from the substrate, and can meet the preparation requirement of the subsequent conducting layer.

(2) The thermal response properties of the composite sheets of examples 1 to 17 were measured, and the results are shown in table 2. The thermal response performance of the print heads of examples 1 to 17 was determined by measuring the time required for the heat generating portion of the print heads of examples 1 to 17 to rise from 100 ℃ to 300 ℃ and the time required for the heat generating portion of the print heads of examples 1 to 17 to fall from 300 ℃ to 100 ℃. Wherein, the time required for the heating part to rise from 100 ℃ to 300 ℃ is the temperature rise time of the heating part, and the time required for the heating part to fall from 300 ℃ to 100 ℃ is the temperature fall time of the heating part.

Table 2 shows the temperature rise time and temperature fall time of the heat generating portions of the print heads of examples 1 to 17.

TABLE 2

As can be seen from table 2, the temperature rise time and the temperature fall time of the heat generating portion of example 3 are respectively shorter than those of the heat generating portion of example 10, which shows that the heat responsiveness of the heat generating portion of example 3 is better than that of the heat generating portion of example 10, and that providing the projections on the side of the heat storage layer away from the substrate can improve the heat responsiveness of the print head, so that the print head can be applied to high-speed printing.

The temperature rise time and the temperature fall time of the heat generating portion of example 17 were 0.89 msec and 1.03 msec, respectively, the temperature rise time and the temperature fall time of the heat generating portion of example 5 were 0.66 msec and 1.11 msec, respectively, the temperature rise time of the heat generating portion of example 1 was shortened by 25.84% as compared with the temperature rise time of the heat generating portion of example 15, and the temperature fall time of the heat generating portion of example 1 was improved by only 7.77% as compared with the temperature fall time of the heat generating portion of example 15.

The temperature rise time and the temperature fall time of the heat generating portion of example 16 were 0.77 msec and 1.28 msec, respectively, and the temperature rise time of the heat generating portion of example 16 was 13.48% shorter than that of example 17, whereas the temperature fall time of the heat generating portion of example 16 was 24.27% longer than that of example 17, which means that the temperature rise time of the heat generating portion could be shortened by increasing the thickness of the heat storage layer without the hollow sphere layer, but the temperature fall time of the heat generating portion also increased greatly, so that the printhead required much time to dissipate heat in the non-operating state, which is not favorable for quick use of the printhead.

In summary, the hollow ball layer is arranged in the heat storage layer, so that the temperature rise time of the heating part during operation can be reduced without increasing the thickness of the heat storage layer, and the temperature fall time of the heating part during non-operation can not be excessively increased, thereby improving the thermal efficiency of the printing head and ensuring the high thermal response performance of the printing head.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A composite plate, comprising a substrate and a heat storage layer stacked on the substrate, wherein the heat storage layer comprises a glaze and hollow spheres, the glaze is disposed on the substrate, the hollow spheres are distributed in the glaze and form hollow sphere layers, and the distance from one side of the hollow sphere layer away from the substrate to one side of the heat storage layer away from the substrate is at least 10% of the maximum thickness of the heat storage layer, the hollow sphere layers are spaced from the substrate, and the ratio of the thickness of the hollow sphere layers to the maximum thickness of the heat storage layer is 0.01: 1-0.9: 1.

2. a composite board according to claim 1, wherein the maximum thickness of the heat storage layer is 30 μm to 150 μm; and/or the presence of a catalyst in the reaction mixture,

3. the composite plate of claim 1, wherein the hollow sphere comprises a core sphere and a coating layer covering the core sphere, the core sphere being hollow.

4. The composite board according to claim 3, wherein the core sphere is made of at least one material selected from the group consisting of magnesium oxide, aluminum oxide, silicon dioxide, calcium oxide, and titanium dioxide; and/or the presence of a catalyst in the reaction mixture,

5. a composite board according to claim 4, wherein the core sphere has an outer diameter of 0.5 to 6 μm; and/or the presence of a catalyst in the reaction mixture,

6. the composite plate according to claim 1, wherein the heat storage layer has a protrusion on a side away from the substrate, and the hollow sphere layer corresponds to the protrusion; or the like, or, alternatively,

7. A composite board according to claim 1, wherein the hollow sphere layer is disposed in the middle of the heat storage layer, and the distance from the side of the hollow sphere layer close to the substrate is 0% to 90% of the maximum thickness of the heat storage layer.

8. A method of making a composite panel according to any of claims 1 to 7, comprising the steps of:

9. The method for preparing a composite plate according to claim 8, wherein before the step of forming the composite layer by alternately forming the organic films and the hollow spheres on one side of the substrate, a step of forming the composite layer by alternately forming the organic films and the hollow spheres on one side of the substrate is further included in which a glass glaze is formed on one side of the substrate so that the substrate and the composite layer are connected by the glass glaze, the glass glaze is made of the same material as the glaze, and the organic films and the hollow spheres are alternately formed on one side of the substrate to form the composite layer.

10. A printhead comprising a composite panel as claimed in any one of claims 1 to 7.