CN107958846A - A kind of synchronous localization method in IC devices faultage image detection - Google Patents
A kind of synchronous localization method in IC devices faultage image detection Download PDFInfo
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- CN107958846A CN107958846A CN201610904204.7A CN201610904204A CN107958846A CN 107958846 A CN107958846 A CN 107958846A CN 201610904204 A CN201610904204 A CN 201610904204A CN 107958846 A CN107958846 A CN 107958846A
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- height
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- range finder
- laser range
- photomoduel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
A kind of synchronous localization method in IC devices faultage image detection, including：Laser range finder measures the height of substrate, and height tolerance is sent to the height of lifting platform component, lifting platform component corrected X Y vacuum translation stage and IC devices；Photomoduel catches the image of alignment mark point, calculates the physical location of IC devices, send position deviation to XY vacuum translation stages, XY vacuum translation stage corrects the position of alignment mark point；Laser range finder measures the height of alignment mark point, send height tolerance to camera lifting assembly, the operating distance of camera lifting assembly correcting camera component, the height of photomoduel is height of foundation at this time；Photomoduel is sequentially completed the shooting of height of foundation epigraph；After photomoduel completes the shooting of height of foundation epigraph, it is elevated to next tomography height, the front and rear variation in altitude value of laser range finder measure lifting, determines that photomoduel lifts situation in place and gives camera lifting assembly, realizes the closed-loop control of photomoduel lifting.
Description
Technical field
The precise positioning technology of high-definition picture treatment technology and laser based on CCD industrial cameras, utilizes IC devices
Inside defines the height of multilayer drop, the faultage image of multiple short transverse is combined, so as to make up high magnification condition figure below
As the physical depth deficiency in detection, wherein the space high-precise synchronization localization method of faultage image, in order to acquisition device
The picture rich in detail of part, its key technology point are：The combination of the correct focusing method and spatial synchronization localization method of image.
Background technology
Improved with the application of the progress of semiconductor packaging, the micromation of chip and multi-chip, the thickness of chip
Degree is continuously increased, chip can package type be also continuously increased, for reduce IC device sizes, the packaging technology of product is in height
Degree direction is continually developed, and challenges 2.5D and 3D encapsulation technologies increasingly, while also challenges high magnification, high accuracy, high-end IC detection skills
Art.
In a material strip, usually there are hundreds of or even thousands of IC devices encapsulates together, each IC devices can be
Single-chip or multi-chip, it is also possible to include other passive devices.In single IC devices, the difference in height of each chip
And multilayer interconnection, high-low-position difference is up to the space drop of 20um to 1000um, each drop quilt of this height position between them
Referred to as single tomography spacing.The image definition depth of field of usual high power detection camera is in 30um ~ 50um, for 1000um's
Space drop, it is necessary to which multiple space orientation, repeatedly shoot to achieve the purpose that shooting clear image.
Each IC device isolation with independent electrical performance is come out, image deflects detection is carried out as single object, leads to
The formula of Chang Yizhao settings and the pattern of Fault position, can first be clapped with low range and take verification film, then positioned by laser ranging
Function and camera judge image center location, and to complete the tomography of local high power, which is called in fault detection technology
Synchronous localization method.
Traditional IC devices package detection once focuses method detection using front, either machinery focus or it is electronic focus,
It can only all accomplish the image detection of plane 2D.Under high magnification testing requirements, the physical depth of camera is very limited, with 200
Exemplified by times optical magnification, Depth of field only has 30um ~ 50um, is encapsulated for the 2.5D in Advanced Packaging instantly and 3D,
The picture rich in detail of detection multilayer different height is needed, such as：Solder ball surface on the defects of to package substrate and substrate, chip list
Soldered ball quality in face quality and chip, and the detail detection such as each layer line arc locus, the figure that traditional single focuses
As detection technique, cannot just meet the requirements completely.
A kind of synchronous localization method in IC devices faultage image detection, can effectively solve the above problems.Laser is as one
The new industrial processes of kind and e measurement technology, under the control of the computer can measure a variety of materials surface into the accurate of row distance, can
High accuracy positioning for detection device.This patent catches the product pattern on IC devices using industrial camera, makees horizontal level
Positioning, recycle laser ranging function, complete vertical direction camera focusing, camera complete basic plane image shooting
Afterwards, then camera is moved to another target point, which can be the different parts of same IC devices or same
IC device different heights position, such as：Chip upper surface, at the top of the soldered ball on chip, first height on bank top, bank top
Second height etc.；Other altitude locations either in same IC devices, complete the Image Acquisition of multiple different height, are formed same
The faultage image collection of one IC devices, realizes the synchronous positioning in fault detection technology.
For this reason, the premise for correctly realizing the technology is to be properly positioned image and synchronously complete focusing positioning, complete high-precision
The collecting work of the multilayer faultage image of degree.Since IC device chips need the camera of face collection image, laser range finder is only
It can be installed on on the relatively-stationary locus of the camera, making Relatively orientation.How IC device upper fronts bat
According to position, accomplish that accurate Fault position just becomes problem.
1., can be in IC devices to reach the design requirement of IC devices encapsulation to complete the accurate superposition of the multi-chip of IC devices
Multiple alignment mark points are set on part, which has ensured the high accuracy contraposition patch and routing of chip, ensured product closed assembly
Technique is correctly completed.Single exposure formation, there is inevitable position between each chip when alignment mark point is substrate manufacture
Relation is put, its relative positional accuracy is very high, is the base reference point for detecting each chip plane position of IC devices, equally may be used
To make the laser range finder base water prosposition of tomography altitude location.
2. the benchmark that alignment mark point separates for single IC device area of image detection, and single IC device of division
High magnification Image Acquisition region benchmark.
Refer to the attached drawing two：A kind of IC device schematic diagrames in synchronous localization method in IC devices faultage image detection.
3. by laser range finder precise positioning camera shooting focal length, after image capturing system completes shooting, second is moved to
A tomography height, by second of shooting focal length of laser range finder precise positioning, starts image capturing system and shoots the second tomography
Product image, is sequentially completed the faultage image collection of more height positions.
4. the position command of height position movement instruction and the image capturing system movement of laser range finder coordinates, calculating
Under machine control, servomotor adjustment positioning height position and base bits compensation.CCD industrial cameras can catch micrometer resolution
Image, the actual position value in compensation product movement, completes the center centering of image taking, laser range finder ensures correct
Product focus position, it is ensured that the product corresponding to image taking, correctness and uniqueness in space length and position.
The content of the invention
The purpose of the present invention is the industrial camera and laser range finder under making full use of computer to control, IC devices are realized
Synchronous positioning in faultage image detection.
The purpose of the present invention can be achieved through the following technical solutions：
The present invention includes：XY vacuum translation stage, IC devices, photomoduel, light source assembly, left laser range finder, camera lifting group
Part, lifting platform component, right laser range finder.
1. the height of left laser range finder and right laser range finder measurement IC device substrates, height tolerance average value is sent flat
The height of platform lifting assembly, lifting platform component preliminary corrections XY vacuum translation stage and IC devices；
2. photomoduel catches the image of IC devices front alignment mark point, each chip and other elements on IC devices are calculated
Physical location, send position deviation value to XY vacuum translation stages, XY vacuum translation stage correction IC devices front alignment mark point phase
For the position of photomoduel, ensure that the central point of shooting meets the sets requirement of image taking；
3. the height of left laser range finder and right laser range finder synchro measure IC devices front alignment mark point, by height tolerance
Average value send camera lifting assembly, the operating distance of the accurate correcting camera component of camera lifting assembly, left laser range finder and the right side
The position of laser range finder and photomoduel is relatively fixed, at this time photomoduel relative to IC devices front alignment mark point height
Degree is height of foundation；
4. photomoduel is sequentially completed the shooting of each subregion height of foundation epigraph of IC devices, during this left laser range finder and
The height of right laser range finder measurement each subregion shooting point of IC devices, send deviation average to camera lifting assembly, ensures IC devices
The height of each subregion shooting point of part is consistent with height of foundation；
After 5. photomoduel completes the shooting of each subregion height of foundation epigraph of IC devices, camera lifting assembly is raised or lowered to
To next tomography height（Such as：H0 ~ H6, is shown in figure two, figure three）, left laser range finder and right laser range finder and phase unit
The position of part is relatively fixed, left laser range finder and right laser range finder measure at the same time respective corresponding points on IC devices rise, under
The front and rear variation in altitude value of drop, determines that photomoduel rises or falls situation in place and gives camera lifting assembly, realizes camera
The closed-loop control of component process of rising or falling；
6. camera lifting assembly and the difference of platform lifting assembly effect：Camera lifting assembly stroke is smaller, precision is higher, is used for
The accurate adjustment of photomoduel and laser range finder height；Lifting platform component stroke is larger, precision is slightly worse, is put down for XY vacuum
The first successive step of moving stage and IC element heights, be additionally operable to because IC devices deform it is larger, during beyond camera lifting assembly adjusting range
Adjustment.
Brief description of the drawings
Fig. 1：A kind of structure diagram of synchronous localization method in IC devices faultage image detection.
1.XY vacuum translation stages；
2. IC devices；
3. photomoduel；
4. light source assembly；
5. left laser range finder；
6. camera lifting assembly；
7. lifting platform component；
8. right laser range finder.
Fig. 2：A kind of IC device schematic diagrames in synchronous localization method in IC devices faultage image detection.
9. substrate；
10. chip one；
11. chip two；
12. other elements；
13. alignment mark point.
Fig. 3：A kind of IC element heights position schematic diagram in synchronous localization method in IC devices faultage image detection.
H0, product substrate height position.
H1, one height position of chip.
H2, other element heights positions.
H3, one overhead height position of bank.
H4, two overhead height position of bank.
H5, two height position of chip.
H6, three overhead height position of bank.
Specific implementation method
The present invention is described in detail with specific implementation step below in conjunction with the accompanying drawings.
As shown in Figure 1, the present invention includes：XY vacuum translation stage 1, IC devices 2, photomoduel 3, light source assembly 4, left laser
Rangefinder 5, camera lifting assembly 6, lifting platform component 7, right laser range finder 8.
1. left laser range finder 5 and right laser range finder 8 measure the height of 2 substrate 9 of IC devices, by height tolerance average value
Send the height of lifting platform component 7,7 preliminary corrections XY vacuum translation stage 1 of lifting platform component and IC devices 2；
2. photomoduel 3 catches the image of the positive alignment mark point 13 of IC devices 2, each chip and other is calculated on IC devices 2
The physical location of element, send position deviation value to XY vacuum translation stage 1, XY vacuum translation stage 1 corrects the contraposition of the front of IC devices 2
Index point 13 ensures that the central point of shooting meets the sets requirement of image taking relative to the position of photomoduel 3；
3. the height of left laser range finder 5 and the positive alignment mark point 13 of 8 synchro measure IC devices of right laser range finder 2, by height
Degree deviation average send camera lifting assembly 6, the operating distance of the accurate correcting camera component 3 of camera lifting assembly 6, left Laser Measuring
Distance meter 5 and right laser range finder 8 and the position of photomoduel 3 are relatively fixed, and photomoduel 4 is relative to the front of IC devices 2 at this time
The height of alignment mark point 13 is height of foundation；
4. photomoduel 3 is sequentially completed the shooting of each subregion height of foundation epigraph of IC devices 2, left laser range finder during this
The height of the 5 and measurement IC of right laser range finder 8 devices, 2 each subregion shooting point, send deviation average to camera lifting assembly 6, protects
The height of 2 each subregion shooting point of card IC devices is consistent with height of foundation；
After 5. photomoduel 3 completes the shooting of 2 each subregion height of foundation epigraph of IC devices, camera lifting assembly 6 rise or under
Drop to next tomography height（Such as：H0 ~ H6, is shown in Fig. 2, Fig. 3）, left laser range finder 5 and right laser range finder 8 and phase
The position of thermomechanical components 3 is relatively fixed, and left laser range finder 5 and right laser range finder 8 measure respective corresponding points on IC devices 2 at the same time
Rise, decline front and rear variation in altitude value, determine that photomoduel 3 rises or falls situation in place and gives camera lifting assembly 6,
Realize the closed-loop control of 3 process of rising or falling of photomoduel；
6. the difference that camera lifting assembly 6 and platform lifting assembly 7 act on：6 stroke of camera lifting assembly is smaller, precision is higher,
Accurate adjustment for photomoduel 3 and left laser range finder 5 and 8 height of right laser range finder；7 stroke of lifting platform component compared with
Greatly, precision is slightly worse, for the first successive step of 2 height of XY vacuum translation stage 1 and IC devices, be additionally operable to because IC devices 2 deform it is larger,
Adjustment during beyond camera 6 adjusting range of lifting assembly.
Claims (1)
- A kind of 1. synchronous localization method in IC devices faultage image detection, it is characterized in that the invention includes：The height of left laser range finder and right laser range finder measurement IC device substrates, send height tolerance average value to lifting platform The height of component, lifting platform component preliminary corrections XY vacuum translation stage and IC devices；Photomoduel catches the image of IC devices front alignment mark point, calculates the reality of each chip and other elements on IC devices Border position, send position deviation value to XY vacuum translation stages, XY vacuum translation stage correct IC devices front alignment mark point relative to The position of photomoduel, ensures that the central point of shooting meets the sets requirement of image taking；The height of left laser range finder and right laser range finder synchro measure IC devices front alignment mark point, height tolerance is put down Average send camera lifting assembly, and the operating distance of the accurate correcting camera component of camera lifting assembly, left laser range finder and the right side are swashed The position of optar and photomoduel is relatively fixed, at this time photomoduel relative to IC devices front alignment mark point height As height of foundation；Photomoduel is sequentially completed the shooting of each subregion height of foundation epigraph of IC devices, left laser range finder and the right side during this Laser range finder measures the height of each subregion shooting point of IC devices, send deviation average to camera lifting assembly, ensures IC devices The height of each subregion shooting point is consistent with height of foundation；After photomoduel completes the shooting of each subregion height of foundation epigraph of IC devices, camera lifting assembly is raised or lowered to Next tomography height（Such as：H0 ~ H6, is shown in figure two, figure three）, left laser range finder and right laser range finder and photomoduel Position be relatively fixed, left laser range finder and right laser range finder measure respective corresponding points on IC devices and rise, decline at the same time Front and rear variation in altitude value, determines that photomoduel rises or falls situation in place and gives camera lifting assembly, realizes phase unit The closed-loop control of part process of rising or falling；Camera lifting assembly and the difference of platform lifting assembly effect：Camera lifting assembly stroke is smaller, precision is higher, for phase The accurate adjustment of thermomechanical components and laser range finder height；Lifting platform component stroke is larger, precision is slightly worse, is translated for XY vacuum The first successive step of platform and IC element heights, be additionally operable to because IC devices deform it is larger, during beyond camera lifting assembly adjusting range Adjustment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610904204.7A CN107958846A (en) | 2016-10-18 | 2016-10-18 | A kind of synchronous localization method in IC devices faultage image detection |
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|---|---|---|---|
| CN201610904204.7A CN107958846A (en) | 2016-10-18 | 2016-10-18 | A kind of synchronous localization method in IC devices faultage image detection |
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| CN107958846A true CN107958846A (en) | 2018-04-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763449A (en) * | 2022-11-21 | 2023-03-07 | 中山芯承半导体有限公司 | Packaging structure with small chips with different thicknesses and manufacturing method thereof |
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- 2016-10-18 CN CN201610904204.7A patent/CN107958846A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763449A (en) * | 2022-11-21 | 2023-03-07 | 中山芯承半导体有限公司 | Packaging structure with small chips with different thicknesses and manufacturing method thereof |
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Application publication date: 20180424 |