CN107944266A - Assembly management method, device and mobile terminal - Google Patents
Assembly management method, device and mobile terminal Download PDFInfo
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- CN107944266A CN107944266A CN201711350440.XA CN201711350440A CN107944266A CN 107944266 A CN107944266 A CN 107944266A CN 201711350440 A CN201711350440 A CN 201711350440A CN 107944266 A CN107944266 A CN 107944266A
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- Prior art keywords
- hole position
- title
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- hole
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/50—Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems
- G06F21/52—Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems during program execution, e.g. stack integrity ; Preventing unwanted data erasure; Buffer overflow
- G06F21/53—Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems during program execution, e.g. stack integrity ; Preventing unwanted data erasure; Buffer overflow by executing in a restricted environment, e.g. sandbox or secure virtual machine
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
- G06F9/445—Program loading or initiating
- G06F9/44505—Configuring for program initiating, e.g. using registry, configuration files
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/44—Arrangements for executing specific programs
- G06F9/445—Program loading or initiating
- G06F9/44594—Unloading
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2149—Restricted operating environment
Abstract
The present invention is on a kind of assembly management method, device and mobile terminal, belongs to Internet technical field.The described method includes：When receiving assembly management request, first assembly title is extracted in assembly management request；Based on first assembly title, search whether there is the corresponding with first assembly title first hole position title；If it is determined that in the presence of the corresponding with first assembly title first hole position title, then the hole position based on the first hole position title instruction manages component to be managed.The present invention is based on first assembly title, search whether there is the corresponding with first assembly title first hole position title, if it is determined that in the presence of the corresponding with first assembly title first hole position title, hole position then based on the first hole position title instruction manages component to be managed, so that the correspondence between component and hole position is fixed, hole position management assembly corresponding with component can be directly based upon, without being performed both by hole bit allocation in assembly management each time, the assignment error of hole position is avoided, it is intelligent preferable.
Description
Technical field
The present invention relates to Internet technical field, more particularly to a kind of assembly management method, device and mobile terminal.
Background technology
With the rapid development of Internet technology, terminal is no longer only used for interpersonal communication, more for various
Amusement and daily life, for example, seeing a film, playing game, shopping etc., therefore, more and more dependence terminal operatings can be
The software that user provides different services comes into being.As software is increasingly popularized in terminal, many criminals can develop
Viruliferous Malware is taken, Malware is entrained in copyrighted software, when user downloads the malice in personal terminal
During software, the virus carried in Malware will be implanted into the terminal of user, and criminal can be based on the virus and obtain user
Personal information.In order to avoid Malware loses caused by user, developer can test suspect software, consider
To that may carry virus in suspect software, causing virus infection, usual developer can be in sandbox for the terminal tested
Component in suspect software is managed, realizes the test to suspect software.Sandbox is a kind of according to security strategy limitation journey
The performing environment of sequence behavior, by redirecting technique, the file that suspect software is generated and changed, is directed to own files folder
In, a quasi-independent system of void is constructed, manages in systems and starts the component of suspect software, make suspect software in system
Middle operation, so as to fulfill the test to suspect software.
In correlation technique, since the component of suspect software is unknown, therefore sandbox can not be in the installation prior sound of configuration file
Bright, the component in suspect software directly can not be managed and started, and therefore, sandbox is used when managing the component of suspect software
Hole mechanism is accounted for, is at random component distribution hole position, replaces the authentic component in suspect software to carry out with the hole position of corresponding component
Management.
In the implementation of the present invention, inventor has found that correlation technique has at least the following problems：
Since the component of suspect software may collapse at any time during operation, so that the hole position being currently located is exited,
And have new suspect software at any time and be added to that sandbox is medium to be managed, and the background service for being used to distribute hole position for component can not
Timely receive the startup event of suspect software or exit event, cause startup event in sandbox and exit event can not be complete
The synchronization of uniformity so that background service has the hole position point that very big probability will be currently running component when carrying out hole bit allocation
The new suspect software of dispensing, causes the assignment error of hole position, and then the corresponding corresponding assembly in hole position is not started normally, intelligence
Property is relatively low.
The content of the invention
To overcome the assignment error for cheating position present in correlation technique, and then make the corresponding corresponding assembly in hole position can not be normal
Start, it is intelligent relatively low the problem of, the present invention provides a kind of assembly management method, device and mobile terminal.
First aspect according to embodiments of the present invention, there is provided a kind of assembly management method, the described method includes：
When receiving assembly management request, first assembly title, the component are extracted in assembly management request
Management request carries the first assembly title of component to be managed and the component to be managed；
Based on the first assembly title, search whether there is the corresponding with the first assembly title first hole position name
Claim；
If it is determined that in the presence of the corresponding with the first assembly title first hole position title, then based on the described first hole position name
The hole position of instruction is claimed to manage the component to be managed.
In another embodiment, the method further includes：
If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that hole position to be allocated；
When determining the hole position success to be allocated, by the second hole position title of the hole position to be allocated and described first group
Part title corresponds to storage；
The component to be managed is managed based on the hole position to be allocated.
In another embodiment, it is described if it is determined that there is no corresponding with the first assembly title first hole position name
Claim, it is determined that hole position to be allocated includes：
If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that at least one not divide
With hole position；
Any unallocated hole position is extracted at least one unallocated hole position, using the unallocated hole position as described in
Hole position to be allocated.
In another embodiment, the method further includes：
When determining the hole position failure to be allocated, at least one recyclable hole position not yet recycled is obtained, it is described to return
It is removed to receive the corresponding component in hole position；
If obtaining at least one recyclable hole position success, at least one recyclable hole position is arranged to not
Distribution hole position；
If obtaining at least one recyclable hole position failure, generate and show recycling failure command.
In another embodiment, the method further includes：
When receiving assembly removal request, the second component Name, the component are extracted in assembly removal request
Remove the second component Name that request carries component to be removed；
Based on second component Name, hole position title to be removed corresponding with second component Name is searched；
The hole to be removed position of the position title instruction in hole to be removed is discharged, the hole position to be removed is arranged to unallocated hole
Position.
Second aspect according to embodiments of the present invention, there is provided a kind of assembly management device, described device include：
Extraction module, for when receiving assembly management request, first assembly to be extracted in assembly management request
Title, the assembly management request carry the first assembly title of component to be managed and the component to be managed；
Searching module, for based on the first assembly title, searching whether to exist corresponding with the first assembly title
First hole position title；
Management module, for if it is determined that in the presence of the corresponding with the first assembly title first hole position title, being then based on
The hole position of the first hole position title instruction manages the component to be managed.
In another embodiment, described device further includes：
Determining module, for if it is determined that there is no corresponding with the first assembly title first to cheat position title, then really
Fixed hole position to be allocated；
Memory module, for when determining the hole position success to be allocated, position name to be cheated by the second of the hole position to be allocated
Claim storage corresponding with the first assembly title；
The management module, is additionally operable to manage the component to be managed based on the hole position to be allocated.
In another embodiment, the determining module includes：
Determination sub-module, for if it is determined that there is no corresponding with the first assembly title first to cheat position title, then
Determine at least one unallocated hole position；
Extracting sub-module, for extracting any unallocated hole position at least one unallocated hole position, by described in not
Distribution hole position is as the hole position to be allocated.
In another embodiment, described device further includes：
Acquisition module, for when determining the hole position failure to be allocated, acquisition not yet to be recycled at least one recyclable
Position is cheated, the corresponding component in the recyclable hole position is removed；
Setup module, if for obtaining at least one recyclable hole position success, at least one is returned described
Receive hole position and be arranged to unallocated hole position；
Generation module, if for obtaining at least one recyclable hole position failure, generates and shows recycling failure
Instruction.
In another embodiment, described device further includes：
The extraction module, is additionally operable to, when receiving assembly removal request, the be extracted in assembly removal request
Two component Names, the assembly removal request carry the second component Name of component to be removed；
The searching module, is additionally operable to be based on second component Name, searches corresponding with second component Name
Hole position title to be removed；
Release module, for discharging the hole to be removed position of the position title instruction in hole to be removed, by the hole position to be removed
It is arranged to unallocated hole position.
The third aspect according to embodiments of the present invention, there is provided a kind of mobile terminal, including the group described in above-mentioned Part II
Part managing device.
Fourth aspect according to embodiments of the present invention, there is provided a kind of mobile terminal, including：Memory, can hold for storing
Row instruction；And processor, for communicating with the memory above-mentioned first party is completed to perform the executable instruction
The operation of assembly management method described in face.
The technical solution that the embodiment of the present invention provides can include the following benefits：
When receiving assembly management request, first assembly title is extracted in assembly management request, based on first assembly
Title, searches whether there is the corresponding with first assembly title first hole position title, if it is determined that exist and first assembly title
Corresponding first hole position title, then the hole position based on the first hole position title instruction manage component to be managed so that component and hole position
Between correspondence be fixed, can be directly based upon it is corresponding with component hole position management assembly, without in each sub-assembly
Hole bit allocation is performed both by during management, avoids the assignment error of hole position, it is intelligent preferable.
It should be appreciated that the general description and following detailed description of the above are only exemplary and explanatory, not
Can the limitation present invention.
Brief description of the drawings
Attached drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the present invention
Example, and for explaining the principle of the present invention together with specification.
Fig. 1 is a kind of flow chart of assembly management method according to an exemplary embodiment；
Fig. 2A is a kind of flow chart of assembly management method according to an exemplary embodiment；
Fig. 2 B are a kind of flow charts of assembly management method according to an exemplary embodiment；
Fig. 2 C are a kind of flow charts of assembly management method according to an exemplary embodiment；
Fig. 3 A are a kind of block diagrams of assembly management device according to an exemplary embodiment；
Fig. 3 B are a kind of block diagrams of assembly management device according to an exemplary embodiment；
Fig. 3 C are a kind of block diagrams of assembly management device according to an exemplary embodiment；
Fig. 3 D are a kind of block diagrams of assembly management device according to an exemplary embodiment；
Fig. 3 E are a kind of block diagrams of assembly management device according to an exemplary embodiment；
Fig. 4 is a kind of block diagram of assembly management device according to an exemplary embodiment.
Embodiment
Here exemplary embodiment will be illustrated in detail, its example is illustrated in the accompanying drawings.Following description is related to
During attached drawing, unless otherwise indicated, the same numbers in different attached drawings represent the same or similar key element.Following exemplary embodiment
Described in embodiment do not represent and the consistent all embodiments of the present invention.On the contrary, they be only with it is such as appended
The example of the consistent apparatus and method of some aspects being described in detail in claims, of the invention.
Fig. 1 is a kind of flow chart of assembly management method according to an exemplary embodiment, as shown in Figure 1, the party
Method comprises the following steps.
In a step 101, when receiving assembly management request, first assembly title is extracted in assembly management request,
Assembly management request carries the first assembly title of component to be managed and component to be managed.
In a step 102, based on first assembly title, search whether there is the corresponding with first assembly title first hole position
Title.
In step 103, if it is determined that there is the first hole corresponding with first assembly title position title, then based on the first hole
The hole position of position title instruction manages component to be managed.
Method provided in an embodiment of the present invention, when receiving assembly management request, the is extracted in assembly management request
One component Name, based on first assembly title, searches whether there is the corresponding with first assembly title first hole position title, if
Determine there is the corresponding with first assembly title first hole position title, then pipe is treated in the hole position management based on the first hole position title instruction
Manage component so that the correspondence between component and hole position is fixed, can be directly based upon hole position corresponding with component management
Component, without being performed both by hole bit allocation in assembly management each time, avoids the assignment error of hole position, intelligent preferable.
In another embodiment, method further includes：
If it is determined that there is no the corresponding with first assembly title first hole position title, it is determined that hole position to be allocated；
When determining hole position success to be allocated, by the second hole of hole position to be allocated, position title is corresponding with first assembly title deposits
Storage；
Component to be managed is managed based on hole position to be allocated.
In another embodiment, if it is determined that there is no corresponding with first assembly title first to cheat position title, then really
Fixed hole position to be allocated includes：
If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that at least one not divide
With hole position；
Any unallocated hole position is extracted at least one unallocated hole position, using the unallocated hole position as described in
Hole position to be allocated.
In another embodiment, the method further includes：
When determining the hole position failure to be allocated, at least one recyclable hole position not yet recycled is obtained, it is described to return
It is removed to receive the corresponding component in hole position；
If obtaining at least one recyclable hole position success, at least one recyclable hole position is arranged to not
Distribution hole position；
If obtaining at least one recyclable hole position failure, generate and show recycling failure command.
In another embodiment, the method further includes：
When receiving assembly removal request, the second component Name, the component are extracted in assembly removal request
Remove the second component Name that request carries component to be removed；
Based on second component Name, hole position title to be removed corresponding with second component Name is searched；
The hole to be removed position of the position title instruction in hole to be removed is discharged, the hole position to be removed is arranged to unallocated hole
Position.
Above-mentioned all optional technical solutions, can use any combination to form the alternative embodiment of the present invention, herein no longer
Repeat one by one.
Fig. 2A is a kind of flow chart of assembly management method according to an exemplary embodiment, as shown in Figure 2 A, should
Method comprises the following steps.
In step 201, when receiving assembly management request, first assembly title is extracted in assembly management request,
Assembly management request carries the first assembly title of component to be managed and component to be managed.
In embodiments of the present invention, component to be managed can be the component in terminal operating system, for example, Activity (is handed over
Mutually) component, Service (service) component, Content Provide (data sharing) components and Receiver (receiver) group
Part.Wherein, terminal operating system can be Android (operation of partly increasing income) system, and the embodiment of the present invention treats management assembly and end
The type of operating system is held to be limited without specific.It was recognized by the inventor that when sandbox receives assembly management request, it is usually
The component to be managed carried in assembly management request is randomly assigned hole position, and the position of the hole based on distribution manages component to be managed.By
The component run in sandbox may be Malware, and the structure and function imperfection of Malware may cause Malware to exist
Collapsed during operation, and then exit sandbox, and sandbox can ceaselessly receive substantial amounts of group during operation
Part management is asked, and causes startup event that sandbox produces parallel in during being managed to component and the thing for exiting event
Part amount is very big so that sandbox is for startup event and exits the record of event and may occur mistake, startup event and exits event
Can not crash consistency synchronization, sandbox may by the hole for having allocated management of component position still be recorded as unallocated hole position, example
Such as, hole position A already is allocated to component 1 to be managed, but mistake occurs for sandbox causes to record hole position A and unassigned, in this way, working as
When cheating position next time for current component to be managed distribution, it is more likely that the hole position sub-distribution again of other assemblies will be already allocated to
To current component to be managed, cause current component to be managed can not normal management.Therefore, in embodiments of the present invention, it is
The fixed hole position of each component distribution to be managed, makes each component to be managed when entering in sandbox, you can enter fixed hole
Position is managed, and avoids that mistake occurs when being randomly assigned hole position for component to be managed, intelligent more excellent.
Due to component to be managed and hole position between correspondence be it is fixed, needing to manage component to be managed
When, the first assembly title of component to be managed can be carried in assembly management request so that sandbox receive assembly management please
When asking, the first assembly title in being asked based on assembly management determines the corresponding hole position of the component to be managed, and then based on hole position
Manage the component to be managed.Wherein, sandbox can work as detection with providing assembly management entrance in its terminal there are connection relation
When triggering the assembly management entrance to user, display module uploads the page.Component upload the page on can provide component upload frame,
Component Name input frame and definite button, can when terminal detects that user uploads the component to be managed uploaded in frame in component
To directly read the first assembly title of component to be managed, and directly first assembly title is included in component Name input frame,
The first assembly title that user is manually entered in component Name input frame can also be received.When detect user to determine button
Triggering when, terminal determines that active user has completed the upload of component to be managed and the first assembly title of component to be managed
Fill in, obtain component to be managed and first assembly title, please based on component to be managed and the management of first assembly title formation component
Ask, and assembly management request is sent to sandbox, so that sandbox determines component to be managed after assembly management request is received
Corresponding hole position, the component to be managed is managed based on hole position.
In step 202, based on first assembly title, search whether there is the corresponding with first assembly title first hole position
Title, if it is determined that there is the first hole corresponding with first assembly title position title, then perform following step 203；If it is determined that
There is no the corresponding with first assembly title first hole position title, then following step 204 is performed.
In embodiments of the present invention, after the first assembly title of component to be managed is determined, first group can be based on
Part title is searched, and searches whether there is the corresponding with first assembly title first hole position title, if it is determined that exist and the
The corresponding first hole position title of one component Name, it is determined that component to be managed is not to first enter sandbox management, in sandbox
Through being assigned with fixed hole position for the component to be managed, component to be managed can be directly entered in sandbox and be managed, namely hold
Row following step 203；If it is determined that there is no the corresponding with first assembly title first hole position title, it is determined that component to be managed
To first enter sandbox management, in this way, just needing the hole position for component to be managed distribution fixation, and pipe is treated based on the management of hole position
Component is managed, namely performs following step 204.
In step 203, if it is determined that there is the first hole corresponding with first assembly title position title, then based on the first hole
The hole position of position title instruction manages component to be managed.
In embodiments of the present invention, if it is determined that there is the first hole corresponding with first assembly title position title, then it represents that
There is hole corresponding with component to be managed position in current sand pit, the hole position management of the first hole position title instruction can be directly based upon
The component to be managed.
In step 204, if it is determined that there is no the corresponding with first assembly title first hole position title, it is determined that treats point
With hole position, when determining hole position success to be allocated, following step 205 is performed；When determining hole position failure to be allocated, perform following
Step 206.
In embodiments of the present invention, if it is determined that there is no corresponding with first assembly title first to cheat position title, then really
Fixed component to be managed is to first enter sandbox management, in this way, just it needs to be determined that still unappropriated hole position to be allocated in sandbox, will treat
Distribution hole bit allocation is managed to component to be managed.Due in sandbox there may be at least one unallocated hole position, in this way, husky
Any hole position that case can be extracted at least one unallocated hole position is used as hole position to be allocated, and subsequently by the hole position to be allocated
Distribute to component to be managed to be managed, namely perform following step 205.
During practical application, the startup event that is generated during management assembly due to sandbox and event is exited
Can not crash consistency it is synchronous so that when a certain component has been completed to test in sandbox, and need not again enter sandbox management
When, sandbox may not recycle the hole position of the component, and still record hole position and be assigned to the component；It is however, husky
Hole position in case is limited, has completed to test there may be some in sandbox and has exited the corresponding hole of management assembly of sandbox
Position, these hole positions may be the allocated hole position in the current record of sandbox, therefore, cause sandbox in definite hole to be allocated
Fail during position, in this way, just needing the hole position (namely corresponding component has completed the hole position of test) to having left unused in sandbox
Recycled, and then regain unallocated hole position, give unallocated hole bit allocation to component to be managed, namely perform following step
206。
In step 205, when determining hole position success to be allocated, by the second hole position title of hole position to be allocated and first group
Part title corresponds to storage, and component to be managed is managed based on hole position to be allocated.
In embodiments of the present invention, can be by the second hole position name of hole position to be allocated when determining hole position success to be allocated
Claim storage corresponding with the first assembly title of component to be managed, for representing that current hole position to be allocated is already allocated to be managed group
Part, component to be managed can be directly entered in the hole position of the second hole position title instruction when entering sandbox management next time, without
It is again component to be managed distribution hole position by sandbox.Wherein, sandbox is when storing the second hole position title and first assembly title, can be with
Component-hole position relation list shown in table 1 is generated, the embodiment of the present invention is to right between sandbox storage assembly title and hole position title
The mode that should be related to is limited without specific.
Table 1
| Component Name | Cheat position title |
| Component A | Cheat position 1 |
| Component B | Cheat position 2 |
| … | … |
In step 206, when determining hole position failure to be allocated, at least one recyclable hole position not yet recycled is obtained,
The recyclable corresponding component in position of cheating is removed, if obtaining at least one recyclable hole position success, performs following step
207；If obtaining at least one recyclable hole position failure, following step 208 is performed.
In embodiments of the present invention, when determining hole position failure to be allocated, can be determined in sandbox at least one recyclable
Cheat position.Wherein, when determining at least one recyclable hole position, the operating status that position is all cheated in sandbox can be detected, will not
The hole position of management assembly is counted as idle hole position, and to the standby time of idle hole position, and being determined according to standby time can
Recycling hole position.Overtime duration can be set in sandbox, when the standby time for determining hole position being more than overtime duration, determine hole position
For recyclable hole position；Preset number can also be set in sandbox, after the display time of each hole position is determined, according to standby time
Duration standby time is ranked up, would sit idle for time longest preset number and cheat position as recyclable hole position.Wherein, it is
The idle duration of each hole position is recorded, sandbox can be that each hole position sets timer, when the component in a certain hole position exits
When, the timer automatic start of hole position, starts timing., can also be according to operation group in the position of hole during practical application
The component states of part determine whether hole position is recyclable hole position, and sandbox can remember the operating status of its corresponding component
Record, when detecting that component completes whole flows of test and when exiting, the corresponding component states in hole position is arranged to test
During completion, in this way, can subsequently determine that hole position is recyclable hole position.The embodiment of the present invention determines sandbox recyclable hole position
Mode limited without specific.
Since recyclable hole position may be not present in sandbox, obtaining at least one recyclable hole position may fail, this
Sample, if sandbox obtains at least one recyclable hole position success, recycles at least one recyclable hole position, will at least one
A recyclable hole position is arranged to unallocated hole position, subsequently to extract any hole position in unallocated hole position as hole to be allocated
Position, and then component to be managed is managed based on hole position to be allocated, namely perform following step 207；If sandbox obtains at least one
Recyclable hole position failure, then it represents that there is no the hole position that can be used, it is necessary to which developer is sandbox increase hole in current sandbox
Position, at this moment, just needs generation recycling failure command, to remind developer, namely performs following step 208.
In step 207, if obtaining at least one recyclable hole position success, at least one recyclable hole position is set
For unallocated hole position, and perform above-mentioned steps 205.
In embodiments of the present invention, if obtaining at least one recyclable hole position success, can be returned at least one
Receive hole position and be arranged to unallocated hole position, and then any hole position is extracted as hole position to be allocated in unallocated hole position, to treat
Distribution hole bit allocation gives component to be managed, component to be managed is based on the hole position to be allocated management, namely perform following step
207。
In a step 208, if obtaining at least one recyclable hole position failure, generate and show recycling failure command.
In embodiments of the present invention, if obtaining at least one recyclable hole position failure, then it represents that in current sandbox not
There are idle hole position, there is the component of management in whole hole positions, in this way, just needing developer to increase the hole in sandbox
Position, therefore, sandbox can generate recycling failure command, and show the recycling failure command, so that developer knows current sandbox
In hole position deficiency.During practical application, sandbox can be connected with terminal, and when failure command is recycled in generation, will
The recycling failure command is transmitted to terminal, by the terminal display recycling failure command.The embodiment of the present invention shows this time to sandbox
The mode for receiving failure command is limited without specific.
It should be noted that during sandbox is run, can there are the component for having completed test, these groups in sandbox
Part can remove after completing test in its corresponding hole position, and can subsequently not enter its corresponding hole position pipe again
Reason, in this way, just needing to remove the component in position is cheated., can be by performing the step 209 in Fig. 2 B to step referring to Fig. 2 B
211 realize removal of the component in position is cheated.
In step 209, when receiving assembly removal request, the second component Name is extracted in assembly removal request,
Assembly removal request carries the second component Name of component to be removed.
In embodiments of the present invention, due to the correspondence between component and hole position be it is fixed, when needing to certain
, it is necessary to the second component Name of component to be removed be carried in assembly removal request, so that sandbox is receiving during one assembly removal
When being asked to assembly removal, the second component Name in being asked based on assembly removal determines the corresponding hole position of the component to be removed,
And then the component in the position of the hole is removed, and be recycling by the hole.Wherein, sandbox can be at the end with it there are connection relation
Assembly removal entrance is provided on end, when detecting that user triggers the assembly removal entrance, display module removes the page.Component moves
Component Name input frame and definite button are removed except that can be provided on the page, terminal receives user and removing component Name input
The second component Name being manually entered in frame, when detecting triggering of the user to determining button, terminal determines active user
Filling in for the second component Name through completion component to be removed, obtains the second component Name of component to be removed, based on second group
Part title formation component removes request, and assembly removal request is sent to sandbox, so that sandbox is receiving the assembly removal
After request, the corresponding hole position of component to be removed is determined, will cheat the assembly removal in position, and recycle hole position.
When sandbox receives assembly removal request, the second of component to be removed directly can be extracted in assembly removal request
Component Name, to be searched subsequently based on the second component Name, so that it is determined that hole corresponding with component to be removed position, will
The assembly removal in position is cheated, and will the recycling of hole position.
In step 210, based on the second component Name, hole position title to be removed corresponding with the second component Name is searched.
In embodiments of the present invention, after the second component Name of component to be removed is determined, the second component can be based on
Title is searched, and determines the hole to be removed position title of hole position corresponding with the second component Name, and then hole position to be removed is referred to
The hole position shown is discharged, and hole position to be removed is arranged to unallocated hole position.
During practical application, if based on the 1 storage assembly title of table shown in step 205 and hole position in sandbox
Relation between title, then after the second component Name is determined, can be based on the second component Name in component-hole position relation list
Middle inquiry, so that it is determined that hole position title to be removed.
In step 211, the hole to be removed position of position title instruction in hole to be removed is discharged, hole position to be removed is arranged to not divide
With hole position.
In embodiments of the present invention, after hole position title to be removed is determined, the group run in position can be cheated to be removed
Part removes, and by hole position to be removed recycling, realizes the release to hole position to be removed, and the hole position to be removed is arranged to unallocated hole
Position, to be subsequently the new component to be managed of the unallocated hole bit allocation.
It should be noted that above-mentioned steps 209 to the content in step 211 can only need carry out hole displacement except when hold
OK, if whole normal operations in hole position in current sandbox, and there is no the hole position for having completed test, then can not perform above-mentioned
Step 209 is to step 211.
During practical application, in order to which the more stable hole position in sandbox is managed, it can be set in sandbox
Position manager is cheated, referring to Fig. 2 C, above-mentioned steps 201 are performed to the hole bit allocation involved in step 211, hole position as hole position manager
The operations such as inquiry, the recycling of hole position and the release of hole position.The embodiment of the present invention is to performing hole bit allocation, the inquiry of hole position, the recycling of hole position
And the object of the operation such as hole position release is limited without specific.In fig. 2 c, it is husky when sandbox receives assembly management request
Case whether there is the first hole corresponding with the first assembly title carried in assembly management request to hole position manager request inquiry
Position title, if there is the corresponding with first assembly title first hole position name in the presentation of information sandbox that hole position manager returns
Claim, be then directly based upon the component to be managed carried in the hole position management assembly management request of the first hole position title instruction；If hole
There is no the corresponding with first assembly title first hole position title in the presentation of information sandbox that position manager returns, then sandbox is to hole
Position manager request distributes new hole position for component to be managed.When hole, position manager receives sandbox request as component to be managed point
During with new hole position, then any unallocated hole position is extracted at least one unallocated hole position as hole position to be allocated, this is treated
Distribution hole position returns to sandbox, so that sandbox is based on the hole position to be allocated and manages component to be managed.If cheat in the manager of position simultaneously
There is no unallocated hole position, then cheats position manager administration hole position recycling function, the recyclable hole position in sandbox is recycled, and
At least one recyclable hole position being recovered to is arranged to unallocated hole position, to give unallocated hole bit allocation to newly to be managed
Component.Wherein, when sandbox receives assembly removal request, which can be asked to be transmitted to hole position manager, by cheating
Second component Name of the component to be removed that position manager is carried in being asked based on assembly removal determines hole position, and hole position is released
Put, realize and treat the removal for removing component and the recycling to cheating position.
Method provided in an embodiment of the present invention, when receiving assembly management request, the is extracted in assembly management request
One component Name, based on first assembly title, searches whether there is the corresponding with first assembly title first hole position title, if
Determine there is the corresponding with first assembly title first hole position title, then pipe is treated in the hole position management based on the first hole position title instruction
Manage component so that the correspondence between component and hole position is fixed, can be directly based upon hole position corresponding with component management
Component, without being performed both by hole bit allocation in assembly management each time, avoids the assignment error of hole position, intelligent preferable.
Fig. 3 A are a kind of block diagrams of assembly management device according to an exemplary embodiment.With reference to Fig. 3 A, the device
Including extraction module 301, searching module 302 and management module 303.
The extraction module 301, for when receiving assembly management request, first assembly to be extracted in assembly management request
Title, assembly management request carry the first assembly title of component to be managed and component to be managed；
The searching module 302, for based on first assembly title, searching whether to exist corresponding with first assembly title the
One hole position title；
The management module 303, for if it is determined that in the presence of the corresponding with first assembly title first hole position title, being then based on
The hole position of first hole position title instruction manages component to be managed.
Device provided in an embodiment of the present invention, when receiving assembly management request, the is extracted in assembly management request
One component Name, based on first assembly title, searches whether there is the corresponding with first assembly title first hole position title, if
Determine there is the corresponding with first assembly title first hole position title, then pipe is treated in the hole position management based on the first hole position title instruction
Manage component so that the correspondence between component and hole position is fixed, can be directly based upon hole position corresponding with component management
Component, without being performed both by hole bit allocation in assembly management each time, avoids the assignment error of hole position, intelligent preferable.
In another embodiment, determining module 304 and memory module 305 are further included referring to Fig. 3 B, the device.
The determining module 304, for if it is determined that there is no corresponding with first assembly title first to cheat position title, then really
Fixed hole position to be allocated；
The memory module 305, for when determine it is to be allocated hole position success when, by it is to be allocated hole position second hole position title with
First assembly title corresponds to storage；
The management module 303, is additionally operable to manage component to be managed based on hole position to be allocated.
In another embodiment, referring to Fig. 3 C, the determining module 304, including determination sub-module 3041 and extraction submodule
Block 3042.
The determination sub-module 3041, for if it is determined that there is no corresponding with first assembly title first hole position title,
Then determine at least one unallocated hole position；
The extracting sub-module 3042, for extracting any unallocated hole position at least one unallocated hole position, will not divide
With hole position as hole position to be allocated.
In another embodiment, referring to Fig. 3 D, which further includes acquisition module 306, setup module 307 and generation mould
Block 308.
The acquisition module 306, for when determining hole position failure to be allocated, acquisition not yet to be recycled at least one recyclable
Position is cheated, the corresponding component in recyclable hole position is removed；
The setup module 307, if for obtaining at least one recyclable hole position success, by least one recyclable hole
Position is arranged to unallocated hole position；
The generation module 308, if for obtaining at least one recyclable hole position failure, generates and shows recycling failure
Instruction.
In another embodiment, release module 309 is further included referring to Fig. 3 E, the device.
The extraction module 301, is additionally operable to, when receiving assembly removal request, second group be extracted in assembly removal request
Part title, assembly removal request carry the second component Name of component to be removed；
The searching module 302, is additionally operable to be based on the second component Name, searches hole to be removed corresponding with the second component Name
Position title；
The release module 309, for discharging the hole to be removed position of position title instruction in hole to be removed, hole position to be removed is set
For unallocated hole position.
On the device in above-described embodiment, wherein modules perform the concrete mode of operation in related this method
Embodiment in be described in detail, explanation will be not set forth in detail herein.
Fig. 4 is a kind of block diagram of assembly management device 400 according to an exemplary embodiment.For example, device 400 can
To be mobile phone, computer, digital broadcast terminal, messaging devices, game console, tablet device, Medical Devices, are good for
Body equipment, personal digital assistant etc..
With reference to Fig. 4, device 400 can include following one or more assemblies：Processing component 402, memory 404, power supply
Component 406, multimedia component 408, audio component 410, the interface 412 of I/O (Input/Output, input/output), sensor
Component 414, and communication component 416.
The integrated operation of the usual control device 400 of processing component 402, such as with display, call, data communication, phase
The operation that machine operates and record operation is associated.Processing component 402 can refer to including one or more processors 420 to perform
Order, to complete all or part of step of above-mentioned method.In addition, processing component 402 can include one or more modules, just
Interaction between processing component 402 and other assemblies.For example, processing component 402 can include multi-media module, it is more to facilitate
Interaction between media component 408 and processing component 402.
Memory 404 is configured as storing various types of data to support the operation in device 400.These data are shown
Example includes the instruction of any application program or method for being operated on device 400, and contact data, telephone book data, disappears
Breath, picture, video etc..Memory 404 can be by any kind of volatibility or non-volatile memory device or their group
Close and realize, such as SRAM (Static Random Access Memory, static RAM), EEPROM
(Electrically-Erasable Programmable Read-Only Memory, the read-only storage of electrically erasable
Device), EPROM (Erasable Programmable Read Only Memory, Erasable Programmable Read Only Memory EPROM), PROM
(Programmable Read-Only Memory, programmable read only memory), and ROM (Read-Only Memory, it is read-only to deposit
Reservoir), magnetic memory, flash memory, disk or CD.
Power supply module 406 provides electric power for the various assemblies of device 400.Power supply module 406 can include power management system
System, one or more power supplys, and other components associated with generating, managing and distributing electric power for device 400.
Multimedia component 408 is included in the screen of one output interface of offer between described device 400 and user.One
In a little embodiments, screen can include LCD (Liquid Crystal Display, liquid crystal display) and TP (Touch
Panel, touch panel).If screen includes touch panel, screen may be implemented as touch-screen, from the user to receive
Input signal.Touch panel includes one or more touch sensors to sense the gesture on touch, slip and touch panel.Institute
The boundary of a touch or slide action can not only be sensed by stating touch sensor, but also be detected and the touch or slide phase
The duration and pressure of pass.In certain embodiments, multimedia component 408 includes a front camera and/or postposition is taken the photograph
As head.When device 400 is in operator scheme, during such as screening-mode or video mode, front camera and/or rear camera can
With the multi-medium data outside reception.Each front camera and rear camera can be a fixed optical lens systems
Or there is focusing and optical zoom capabilities.
Audio component 410 is configured as output and/or input audio signal.For example, audio component 410 includes a MIC
(Microphone, microphone), when device 400 is in operator scheme, such as call model, logging mode and speech recognition mode
When, microphone is configured as receiving external audio signal.The received audio signal can be further stored in memory 404
Or sent via communication component 416.In certain embodiments, audio component 410 further includes a loudspeaker, for exporting audio
Signal.
I/O interfaces 412 provide interface between processing component 402 and peripheral interface module, and above-mentioned peripheral interface module can
To be keyboard, click wheel, button etc..These buttons may include but be not limited to：Home button, volume button, start button and lock
Determine button.
Sensor component 414 includes one or more sensors, and the state for providing various aspects for device 400 is commented
Estimate.For example, sensor component 414 can detect opening/closed mode of equipment 400, the relative positioning of component, such as component
For the display and keypad of device 400, sensor component 414 can be with the position of 400 1 components of detection device 400 or device
Put change, the existence or non-existence that user contacts with device 400,400 orientation of device or acceleration/deceleration and the temperature of device 400
Change.Sensor component 414 can include proximity sensor, be configured to detect without any physical contact near
The presence of object.Sensor component 414 can also include optical sensor, such as CMOS (Complementary Metal Oxide
Semiconductor, complementary metal oxide) or CCD (Charge-coupled Device, charge coupled cell) image biography
Sensor, for being used in imaging applications.In certain embodiments, which can also include acceleration sensing
Device, gyro sensor, Magnetic Sensor, pressure sensor or temperature sensor.
Communication component 416 is configured to facilitate the communication of wired or wireless way between device 400 and other equipment.Device
400 can access the wireless network based on communication standard, such as WiFi, 2G or 3G, or combinations thereof.In an exemplary implementation
In example, communication component 416 receives broadcast singal or broadcast related information from external broadcasting management system via broadcast channel.
In one exemplary embodiment, the communication component 416 further includes NFC (Near Field Communication, near field leads to
Letter) module, to promote junction service.For example, RFID (Radio Frequency can be based in NFC module
Identification, radio frequency identification) technology, IrDA (Infra-red Data Association, Infrared Data Association) skill
Art, UWB (Ultra Wideband, ultra wide band) technology, BT (Bluetooth, bluetooth) technologies and other technologies are realized.
In the exemplary embodiment, device 400 can be by one or more ASIC (Application Specific
Integrated Circuit, application specific integrated circuit), DSP (Digital signal Processor, at digital signal
Manage device), DSPD (Digital signal Processor Device, digital signal processing appts), PLD (Programmable
Logic Device, programmable logic device), FPGA) (Field Programmable Gate Array, field programmable gate
Array), controller, microcontroller, microprocessor or other electronic components realize, for performing said modules management method.
In the exemplary embodiment, a kind of non-transitorycomputer readable storage medium including instructing, example are additionally provided
Such as include the memory 404 of instruction, above-metioned instruction can be performed to complete the above method by the processor 420 of device 400.For example,
The non-transitorycomputer readable storage medium can be ROM, RAM (Random Access Memory, random access memory
Device), CD-ROM (Compact Disc Read-Only Memory, compact disc read-only memory), tape, floppy disk and light data deposit
Store up equipment etc..
A kind of non-transitorycomputer readable storage medium, when the instruction in the storage medium is by assembly management device
When processor performs so that component starter is able to carry out said modules management method.
A1, a kind of assembly management method, it is characterised in that the described method includes：
When receiving assembly management request, first assembly title, the component are extracted in assembly management request
Management request carries the first assembly title of component to be managed and the component to be managed；
Based on the first assembly title, search whether there is the corresponding with the first assembly title first hole position name
Claim；
If it is determined that in the presence of the corresponding with the first assembly title first hole position title, then based on the described first hole position name
The hole position of instruction is claimed to manage the component to be managed.
A2, according to the method described in claim 1, it is characterized in that, the method further includes：
If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that hole position to be allocated；
When determining the hole position success to be allocated, by the second hole position title of the hole position to be allocated and described first group
Part title corresponds to storage；
The component to be managed is managed based on the hole position to be allocated.
A3, according to the method described in claim 2, it is characterized in that, it is described if it is determined that be not present and described first group
The corresponding first hole position title of part title, it is determined that hole position to be allocated includes：
If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that at least one not divide
With hole position；
Any unallocated hole position is extracted at least one unallocated hole position, using the unallocated hole position as described in
Hole position to be allocated.
A4, according to the method described in claim 2, it is characterized in that, the method further includes：
When determining the hole position failure to be allocated, at least one recyclable hole position not yet recycled is obtained, it is described to return
It is removed to receive the corresponding component in hole position；
If obtaining at least one recyclable hole position success, at least one recyclable hole position is arranged to not
Distribution hole position；
If obtaining at least one recyclable hole position failure, generate and show recycling failure command.
A5, according to the method described in claim 1, it is characterized in that, the method further includes：
When receiving assembly removal request, the second component Name, the component are extracted in assembly removal request
Remove the second component Name that request carries component to be removed；
Based on second component Name, hole position title to be removed corresponding with second component Name is searched；
The hole to be removed position of the position title instruction in hole to be removed is discharged, the hole position to be removed is arranged to unallocated hole
Position.
A6, a kind of assembly management device, it is characterised in that described device includes：
Extraction module, for when receiving assembly management request, first assembly to be extracted in assembly management request
Title, the assembly management request carry the first assembly title of component to be managed and the component to be managed；
Searching module, for based on the first assembly title, searching whether to exist corresponding with the first assembly title
First hole position title；
Management module, for if it is determined that in the presence of the corresponding with the first assembly title first hole position title, being then based on
The hole position of the first hole position title instruction manages the component to be managed.
A7, device according to claim 6, it is characterised in that described device further includes：
Determining module, for if it is determined that there is no corresponding with the first assembly title first to cheat position title, then really
Fixed hole position to be allocated；
Memory module, for when determining the hole position success to be allocated, position name to be cheated by the second of the hole position to be allocated
Claim storage corresponding with the first assembly title；
The management module, is additionally operable to manage the component to be managed based on the hole position to be allocated.
A8, device according to claim 7, it is characterised in that the determining module includes：
Determination sub-module, for if it is determined that there is no corresponding with the first assembly title first to cheat position title, then
Determine at least one unallocated hole position；
Extracting sub-module, for extracting any unallocated hole position at least one unallocated hole position, by described in not
Distribution hole position is as the hole position to be allocated.
A9, device according to claim 7, it is characterised in that described device further includes：
Acquisition module, for when determining the hole position failure to be allocated, acquisition not yet to be recycled at least one recyclable
Position is cheated, the corresponding component in the recyclable hole position is removed；
Setup module, if for obtaining at least one recyclable hole position success, at least one is returned described
Receive hole position and be arranged to unallocated hole position；
Generation module, if for obtaining at least one recyclable hole position failure, generates and shows recycling failure
Instruction.
A10, device according to claim 6, it is characterised in that described device further includes：
The extraction module, is additionally operable to, when receiving assembly removal request, the be extracted in assembly removal request
Two component Names, the assembly removal request carry the second component Name of component to be removed；
The searching module, is additionally operable to be based on second component Name, searches corresponding with second component Name
Hole position title to be removed；
Release module, for discharging the hole to be removed position of the position title instruction in hole to be removed, by the hole position to be removed
It is arranged to unallocated hole position.
A11, a kind of mobile terminal, it is characterised in that including the assembly management device described in claim 6-10.
A12, a kind of mobile terminal, it is characterised in that including：Memory, for storing executable instruction；
And processor, for communicating with the memory claim 1- is completed to perform the executable instruction
The operation of assembly management method described in 5.
Those skilled in the art will readily occur to the present invention its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover the present invention any variations, uses, or adaptations, these modifications, purposes or
Person's adaptive change follows the general principle of the present invention and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as exemplary, and true scope and spirit of the invention are by following
Claim is pointed out.
It should be appreciated that the invention is not limited in the precision architecture for being described above and being shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is only limited by appended claim.
Claims (10)
- A kind of 1. assembly management method, it is characterised in that the described method includes：When receiving assembly management request, first assembly title, the assembly management are extracted in assembly management request Request carries the first assembly title of component to be managed and the component to be managed；Based on the first assembly title, search whether there is the corresponding with the first assembly title first hole position title；If it is determined that in the presence of the corresponding with the first assembly title first hole position title, then referred to based on the described first hole position title The hole position shown manages the component to be managed.
- 2. according to the method described in claim 1, it is characterized in that, the method further includes：If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that hole position to be allocated；When determining the hole position success to be allocated, by the second hole position title of the hole position to be allocated and the first assembly name Claim corresponding storage；The component to be managed is managed based on the hole position to be allocated.
- It is 3. according to the method described in claim 2, it is characterized in that, described if it is determined that being not present and the first assembly title Corresponding first hole position title, it is determined that hole position to be allocated includes：If it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that at least one unallocated hole Position；Any unallocated hole position is extracted at least one unallocated hole position, the unallocated hole position is treated point as described in With hole position.
- 4. according to the method described in claim 2, it is characterized in that, the method further includes：When determining the hole position failure to be allocated, at least one recyclable hole position not yet recycled, the recyclable hole are obtained The corresponding component in position is removed；If obtaining at least one recyclable hole position success, at least one recyclable hole position is arranged to unallocated Cheat position；If obtaining at least one recyclable hole position failure, generate and show recycling failure command.
- 5. according to the method described in claim 1, it is characterized in that, the method further includes：When receiving assembly removal request, the second component Name, the assembly removal are extracted in assembly removal request Request carries the second component Name of component to be removed；Based on second component Name, hole position title to be removed corresponding with second component Name is searched；The hole to be removed position of the position title instruction in hole to be removed is discharged, the hole position to be removed is arranged to unallocated hole position.
- 6. a kind of assembly management device, it is characterised in that described device includes：Extraction module, for when receiving assembly management request, first assembly title to be extracted in assembly management request, The assembly management request carries the first assembly title of component to be managed and the component to be managed；Searching module, for based on the first assembly title, searching whether to exist corresponding with the first assembly title the One hole position title；Management module, for if it is determined that in the presence of the corresponding with the first assembly title first hole position title, then based on described The hole position of first hole position title instruction manages the component to be managed.
- 7. device according to claim 6, it is characterised in that described device further includes：Determining module, for if it is determined that there is no the corresponding with the first assembly title first hole position title, it is determined that treat Distribution hole position；Memory module, for when determine it is described it is to be allocated hole position success when, by it is described it is to be allocated hole position second hole position title with The first assembly title corresponds to storage；The management module, is additionally operable to manage the component to be managed based on the hole position to be allocated.
- 8. device according to claim 6, it is characterised in that described device further includes：The extraction module, is additionally operable to, when receiving assembly removal request, second group be extracted in assembly removal request Part title, the assembly removal request carry the second component Name of component to be removed；The searching module, is additionally operable to be based on second component Name, lookup is corresponding with second component Name to be waited to move Except hole position title；Release module, for discharging the hole to be removed position of the position title instruction in hole to be removed, the hole position to be removed is set For unallocated hole position.
- 9. a kind of mobile terminal, it is characterised in that including the assembly management device described in claim 6-8.
- A kind of 10. mobile terminal, it is characterised in that including：Memory, for storing executable instruction；And processor, for communicating with the memory claim 1-5 institutes are completed to perform the executable instruction The operation for the assembly management method stated.
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| CN201711350440.XA CN107944266A (en) | 2017-12-15 | 2017-12-15 | Assembly management method, device and mobile terminal |
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| CN201711350440.XA CN107944266A (en) | 2017-12-15 | 2017-12-15 | Assembly management method, device and mobile terminal |
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| CN111399806A (en) * | 2019-01-03 | 2020-07-10 | 百度在线网络技术（北京）有限公司 | Component management method and device, electronic equipment and storage medium |
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