CN107941346A - Spatial resolution calibrating installation and preparation method - Google Patents
Spatial resolution calibrating installation and preparation method Download PDFInfo
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- CN107941346A CN107941346A CN201711138993.9A CN201711138993A CN107941346A CN 107941346 A CN107941346 A CN 107941346A CN 201711138993 A CN201711138993 A CN 201711138993A CN 107941346 A CN107941346 A CN 107941346A
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- 238000009434 installation Methods 0.000 title claims abstract description 72
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 46
- 229910052751 metal Inorganic materials 0.000 claims abstract description 46
- 150000002736 metal compounds Chemical class 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000003384 imaging method Methods 0.000 claims abstract description 19
- 230000004304 visual acuity Effects 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000004065 semiconductor Substances 0.000 claims description 13
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 238000001259 photo etching Methods 0.000 claims description 5
- 238000004544 sputter deposition Methods 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910010038 TiAl Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910052593 corundum Inorganic materials 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 229910003465 moissanite Inorganic materials 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 229910001845 yogo sapphire Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 17
- 238000004971 IR microspectroscopy Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 description 10
- 238000009713 electroplating Methods 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 239000003550 marker Substances 0.000 description 5
- 238000001931 thermography Methods 0.000 description 4
- -1 TiPtAu Inorganic materials 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007687 exposure technique Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000012634 optical imaging Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/48—Thermography; Techniques using wholly visual means
- G01J5/485—Temperature profile
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses spatial resolution calibrating installation and preparation method, belongs to field of measuring techniques, including:Substrate, metal or metal compound layer are arranged at substrate top surface;Metal or metal compound layer are provided with for the telltale mark of located space resolving power calibrating installation position and for judging that the nominal value of imaging system spatial resolution identifies.The present invention makes the figure and background of spatial resolution calibrating installation using the material of different emissivity, and figure can clearly be differentiated under thermal microscope, realize the calibration function to infrared microscopy spatial resolution.
Description
Technical field
The present invention relates to field of measuring techniques, more particularly to a kind of spatial resolution calibrating installation and preparation method.
Background technology
Thermal microscope is a kind of image-forming temperature measurement equipment based on infrared radiation temperature principle, can obtain object table
The temperature distribution information in face.Thermal microscope uses infrared temperature-test technology, belongs to non-contacting Non-Destructive Testing, and space
Resolving power is high, and thermometric accuracy is good, in semiconductor applications extensive use.
The spatial resolution of thermal microscope is mainly determined by the performance of infrared microscopy optical system and infrared detector
It is fixed.The spatial resolution highest of existing commercial thermal microscope can reach 3 μm or so, and be limited by infrared wavelength
System, the spatial resolution of existing commercial thermal microscope have basically reached the limit.
Wherein, spatial resolution is to reflect the ability that imaging system differentiates tested minor detail, is evaluation optical imagery system
One of basic technical indicator for performance of uniting.The spatial resolution of optical imaging system be normally defined discernmible two points it
Between minimum range, and judge the whether discernmible criterion of two points have it is a variety of, most commonly Rayleigh criterion.Commercial Application
In for convenience of operating, determine the resolving power of imaging system usually using resolving power on-gauge plate.Traditional resolving power on-gauge plate bag
Some groups of equidistant stripeds are included, the fringe spacing of difference group is different, is used as into by the discernmible minimum spacing of imaging system
As the resolving power of system.
Since thermal microscope is imaged by catching infra-red radiation, and resolving power on-gauge plate is visible light wave range
Optical System Design, therefore be not easy to differentiate using traditional resolving power on-gauge plate under thermal microscope, be not suitable for using
In the calibration of thermal microscope.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of spatial resolution standard edition and preparation method, it is intended to solves optics
The spatial resolution calibrating installation of imaging system is only applicable to visible light wave range, and be difficult to differentiate under thermal microscope asks
Topic, it is made the figure and background of spatial resolution calibrating installation using the material of different emissivity, realizes spatial resolution school
Standard apparatus is suitable for infrared band.
In order to solve the above technical problems, the technical solution used in the present invention is:
A kind of spatial resolution calibrating installation, it is characterised in that including:
Substrate;Metal or metal compound layer, are arranged at the substrate top surface;The metal or metal compound layer are set
It is equipped with telltale mark for positioning the spatial resolution calibrating installation position and for judging imaging system spatial resolution
Nominal value mark.
Further, the telltale mark includes calibrating installation telltale mark and nominal value telltale mark;The calibration cartridge
Put telltale mark to be arranged on the left of the metal or metal compound layer, the nominal value telltale mark is arranged at the calibration cartridge
Put on the right side of telltale mark;The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is more than
The area of the nominal value telltale mark.
Further, the nominal value mark includes being used to judge the nominal striped of imaging system resolving power and for showing
The spacing nominal value of the nominal fringe spacing;The nominal value mark is arranged on the right side of the telltale mark, the nominal bar
Line is arranged on the right side of the spacing nominal value;The width of the nominal striped is equal with the spacing of the nominal striped.
Further, the length of the nominal striped increases and increases with the width of the nominal striped.
Further, metal or the metallic compound layer thickness is 50nm-100nm.
The embodiment of the invention also discloses a kind of preparation method of spatial resolution calibrating installation, including step:
Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer over the substrate;
The positioning mark for being used for positioning the spatial resolution calibrating installation position is made on metal or metal compound layer
Note and the nominal value mark for judging imaging system spatial resolution.
Further, Si, GaAs, SiC or Al are chosen2O3Semi-conducting material as substrate.
Further, metal or metal including Au, Pt, TiPt, TiPtAu, TiAl or TaN are prepared over the substrate
Compound layer.
Further, by sputtering or electroplating technology, metal or metal compound layer are prepared over the substrate.
Further, by photoetching process, made on metal or metal compound layer and be used to position the spatial discrimination
The telltale mark of power calibrating installation position and the nominal value mark for judging imaging system spatial resolution.
It is using beneficial effect caused by above-mentioned technical proposal:(1) the spatial resolution calibration of the embodiment of the present invention
Device, makes substrate and metal or metal compound layer so that metal or metal compound layer using the material of different emissivity
On telltale mark and nominal value mark can clearly be differentiated under thermal microscope, so as to fulfill to infrared microscopy thermal imagery
The calibration function of instrument spatial resolution;(2) preparation method of the embodiment of the present invention is easy to operate, can be real using conventional technique
It is existing, suitable for large-scale promotion and production.
Brief description of the drawings
Fig. 1 is the main structure diagram of spatial resolution calibrating installation provided in an embodiment of the present invention;
Fig. 2 is the overlooking the structure diagram of spatial resolution calibrating installation provided by Embodiment 2 of the present invention;
Fig. 3 is the overlooking the structure diagram for the spatial resolution calibrating installation that the embodiment of the present invention three provides;
Fig. 4 is the preparation method flow chart for the spatial resolution calibrating installation that the embodiment of the present invention five provides;
Fig. 5 is the preparation method flow chart for the spatial resolution calibrating installation that the embodiment of the present invention six provides;
In figure:100th, substrate, 200, metal or metal compound layer, 300, calibrating installation telltale mark, 400, nominal value
Telltale mark, 500, spacing nominal value, 600, nominal striped.
Embodiment
With reference to the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Ground describes, it is clear that described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
Implemented using other different from other manner described here, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is from the limitation of following public specific embodiment.
Embodiment one
Spatial resolution calibrating installation in the present embodiment, including substrate and metal or metal compound layer.The metal
Or metal compound layer, the substrate top surface is arranged at, including for positioning the spatial resolution calibrating installation position
Telltale mark and the nominal value mark for judging imaging system spatial resolution.
The embodiment of the present invention, makes substrate and metal or metal compound layer so that gold using the material of different emissivity
Category or the telltale mark on metal compound layer and nominal value mark can clearly be differentiated under thermal microscope, so that real
Now to the calibration function of thermal microscope spatial resolution.
Further, the telltale mark includes calibrating installation telltale mark and nominal value telltale mark.The calibration cartridge
Put telltale mark to be arranged on the left of the metal or metal compound layer, the nominal value telltale mark is arranged at the calibration cartridge
Put on the right side of telltale mark.The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is more than
The area of the nominal value telltale mark.
Further, the nominal value mark includes being used to judge the nominal striped of imaging system resolving power and for showing
The spacing nominal value of the nominal fringe spacing.The nominal value mark is arranged on the right side of the telltale mark, the nominal bar
Line is arranged on the right side of the spacing nominal value.The width of the nominal striped is equal with the spacing of the nominal striped.
Further, the length of the nominal striped increases and increases with the width of the nominal striped.
Further, metal or the metallic compound layer thickness is 50nm-100nm.
Embodiment two
Please refer to Fig.1, Fig. 2, spatial resolution calibrating installation provided in an embodiment of the present invention, including Si substrates 100 and thickness
The TaN metal compound layers 200 for 50nm are spent, TaN metal compound layers 200 are arranged at 100 upper surface of Si substrates.Due to metal
Two kinds of materials of compound-material TaN and semi-conducting material Si have different emissivity, so when two kinds of emissivity different materials
During figure and background as spatial resolution calibrating installation, thermal microscope can be differentiated clearly.In the present embodiment,
Graphics field material is metallic compound TaN, background area material for semi-conducting material Si, TaN layer be equipped with telltale mark with
Nominal value identifies.
Preferably, telltale mark is isosceles triangle, and telltale mark includes calibrating installation telltale mark 300 and nominal value is determined
Position mark 400,300 area of calibrating installation telltale mark are more than nominal value telltale mark 400, enable micro-thermal imaging instrument easy
The position of spatial resolution calibrating installation is navigated to, behind the position for determining spatial resolution calibrating installation, is determined further according to nominal value
Position mark 400 determines the position of nominal value mark.Calibrating installation witness marker 300 is arranged at TaN layers of left side, nominal value positioning mark
Note 400 is arranged at the right side of calibrating installation witness marker 300.
Preferably, nominal value mark includes the nominal striped 600 for judging imaging system resolving power and is marked for showing
Claim the spacing nominal value 500 of fringe spacing, spacing nominal value 500 and nominal striped 600 are respectively arranged at nominal value telltale mark
400 left and right sides, and positioned at the right side of calibrating installation witness marker 300.Nominal value mark includes 4 groups of nominal bars in the present embodiment
Line 600, every group of nominal striped 600 correspond to a spacing nominal value 500.Spacing nominal value 500 is respectively 1,2,3,4, is referred to pair
The width for the 4 groups of nominal stripeds 600 answered is respectively 1 μm, 2 μm, 3 μm, 4 μm, the width of nominal striped 600 and two nominal stripeds
Spacing between 600 is equal.
Preferably, the length of 4 groups of nominal stripeds 600 is respectively 5 μm, 10 μm, 15 μm, 20 μm, the length of nominal striped 600
Increase with the width increase of nominal striped 600, infrared microscopy thermal imaging system easier can identify.
In the present embodiment, by the material that different emissivity are used in the figure of spatial resolution calibrating installation and background area
Expect TaN and Si, enable the clear resolution graphics of thermal microscope and background, realize to thermal microscope spatial discrimination
The calibration function of power.
Embodiment three
Please refer to Fig.1, Fig. 3, spatial resolution calibrating installation provided in an embodiment of the present invention, including 100 He of GaAs substrates
Thickness is the Pt metal layers 200 of 100nm, and Pt metal layers 200 are arranged at 100 upper surface of GaAs substrates.Due to metal material Pt and
Semi-conducting material GaAs has different emissivity, so when two kinds of emissivity different materials are as spatial resolution calibrating installation
Figure and during background, thermal microscope can be differentiated clearly.In the present embodiment, graphics field material is semi-conducting material
GaAs, background area material are Pt metal, and Pt layers are equipped with telltale mark and nominal value identifies.
Preferably, telltale mark includes calibrating installation telltale mark 300 and nominal value telltale mark 400, and calibrating installation is fixed
Position mark 300 is isosceles triangle, and nominal value telltale mark 400 is square, and 300 area of calibrating installation telltale mark is more than mark
Title value telltale mark 400, enables micro-thermal imaging instrument easily to navigate to the position of spatial resolution calibrating installation, determines space
Behind the position of resolving power calibrating installation, the position of nominal value mark is determined further according to nominal value telltale mark 400.Calibrating installation is determined
Bit flag 300 is arranged at TaN layers of left side, and nominal value telltale mark 400 is arranged at the right side of calibrating installation witness marker 300.
Preferably, nominal value mark includes being used to judge the nominal striped 600 of imaging system resolving power and for showing
The spacing nominal value 500 of nominal fringe spacing is stated, spacing nominal value 500 and nominal striped 600 are respectively arranged at nominal value positioning
The left and right sides of mark 400, and positioned at the right side of calibrating installation witness marker 300.Nominal value mark includes 4 groups of marks in the present embodiment
Claim striped 600, every group of nominal striped 600 corresponds to a spacing nominal value 500.Spacing nominal value 500 be respectively 10,15,20,
25, the width for referring to corresponding 4 groups of nominal stripeds 600 is respectively 10 μm, 15 μm, 20 μm, 25 μm, the width of nominal striped 600
Spacing between two nominal stripeds 600 is equal.
Preferably, the length of 4 groups of nominal stripeds 600 is respectively 50 μm, 75 μm, 100 μm, 125 μm, nominal striped 600
Length increases and increases with the width of nominal striped 600, and micro-thermal imaging instrument easier can identify.
In the present embodiment, by the material that different emissivity are used in the figure of spatial resolution calibrating installation and background area
Expect GaAs and Pt, enable the clear resolution graphics of thermal microscope and background, realize to thermal microscope space point
Distinguish the calibration function of power.
Example IV
The embodiment of the present invention discloses a kind of spatial resolution calibrating installation preparation method, and details are as follows:
Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer on substrate;
The positioning mark for being used for positioning the spatial resolution calibrating installation position is made on metal or metal compound layer
Note and the nominal value mark for judging imaging system spatial resolution.
The preparation method of the embodiment of the present invention is easy to operate, can be achieved using conventional technique, suitable for large-scale promotion
And production.Substrate and metal or metal compound layer are made using the material of different emissivity so that metal or metallic compound
Telltale mark and nominal value mark on layer can clearly be differentiated under thermal microscope, so as to fulfill to infrared microscopy heat
As the calibration function of instrument spatial resolution
Further, Si, GaAs, SiC or Al are chosen2O3Semi-conducting material as substrate.
Further, metal or metal including Au, Pt, TiPt, TiPtAu, TiAl or TaN are prepared over the substrate
Compound layer.
The figure or background area of substrate and metal or metal compound layer as spatial resolution calibrating installation, selection is not
Material with emissivity can be such that thermal microscope clearly differentiates, and realize calibration function.
Further, by sputtering or electroplating technology, metal or metal compound layer are prepared over the substrate.Using splashing
Penetrate or electroplating technology can obtain the metal or metal compound layer of thinner thickness, be conducive to photoetching process and prepare more preferable figure
Quality.
Further, by photoetching process, made on metal or metal compound layer and be used to position the spatial discrimination
The telltale mark of power calibrating installation position and the nominal value mark for judging imaging system spatial resolution.Using photoetching process
The high figure of precision can be obtained, is adapted to the making of various sizes figure, flexibility is strong, and cost is relatively low.
Embodiment five
Referring to Fig. 4, corresponding to the spatial resolution calibrating installation in embodiment two, the present embodiment discloses a kind of space point
Distinguish power calibrating installation preparation method, details are as follows:
S101:Semi-conducting material Si is chosen as substrate;
S102:The TaN metal compound layers that thickness is 50nm are prepared by sputtering technology on a si substrate;
S103:Apply negative photoresist on TaN layers of metallic compound, by electron beam exposure technique prepare telltale mark and
Nominal value identifies.
The preparation method of the present embodiment, relatively thin metal compound layer can be prepared using sputtering technology, easy to electron beam
Exposure technology prepares more preferable graphical quality.Electron beam exposure artwork shape is high for precision, and flexibility is strong.
Embodiment six
Referring to Fig. 5, corresponding to the spatial resolution calibrating installation in embodiment three, the present embodiment discloses a kind of space point
Distinguish power calibrating installation preparation method, details are as follows:
S201:Semi-conducting material GaAs is chosen as substrate;
S202:The Pt metal layers that thickness is 100nm are prepared by electroplating technology on gaas substrates;
S203:Positive photoresist is applied on Pt metal layer, telltale mark and mark are prepared by photolithography plate Projection Exposure Process
Title value identifies.
The preparation method of the present embodiment, can prepare metal layer using electroplating technology, can avoid long-time high-temperature damage
Substrate.Photolithography plate Projection Exposure Process figure preparation process time is short, and cost is low, easy to implement, suitable for more than 10 μm figures
Make.
In conclusion the spatial resolution calibrating installation of the embodiment of the present invention makes space using the material of different emissivity
The graphics field and background area of resolving power calibrating installation, figure can clearly be differentiated under thermal microscope, realization pair
The calibration function of infrared microscopy spatial resolution;The preparation method of the embodiment of the present invention is easy to operate, is using conventional technique
It can be achieved, suitable for large-scale promotion and production.
Foregoing is to example embodiment for example, and being not necessarily to be construed as the limitation to example embodiment.Although
Some example embodiments have been described, but those skilled in the art will be readily understood that, not depart from this substantially
In the case of disclosed novel teachings and advantage, many modifications in example embodiment are possible.Therefore, it is all these to repair
Change and be intended to be included in as defined by the appended claims within the scope of the present disclosure.It will be appreciated, therefore, that foregoing is to each
Kind of example embodiment for example, and should not be construed as limited to disclosed specific example embodiment, and to institute
The modification of disclosed example embodiment and other example embodiments is intended to be included within the scope of claim.
Claims (10)
- A kind of 1. spatial resolution calibrating installation, it is characterised in that including:Substrate;Metal or metal compound layer, are arranged at the substrate top surface;The metal or metal compound layer are provided with For positioning the telltale mark of the spatial resolution calibrating installation position and mark for judging imaging system spatial resolution Title value identifies.
- 2. spatial resolution calibrating installation according to claim 1, it is characterised in that the telltale mark includes calibration cartridge Put telltale mark and nominal value telltale mark;The calibrating installation telltale mark is arranged on the left of the metal or metal compound layer, and the nominal value telltale mark is set It is placed on the right side of the calibrating installation telltale mark;The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is determined more than the nominal value The area of position mark.
- 3. spatial resolution calibrating installation according to claim 1, it is characterised in that the nominal value mark includes being used for Judge the nominal striped of imaging system resolving power and the spacing nominal value for showing the nominal fringe spacing;The nominal value mark is arranged on the right side of the telltale mark, and it is right that the nominal striped is arranged at the spacing nominal value Side;The width of the nominal striped is equal with the spacing of the nominal striped.
- 4. spatial resolution calibrating installation according to claim 3, it is characterised in that the length of the nominal striped is with institute State the width increase of nominal striped and increase.
- 5. spatial resolution calibrating installation according to claim 1, it is characterised in that the metal or metal compound layer Thickness is 50nm-100nm.
- 6. a kind of preparation method of spatial resolution calibrating installation, it is characterised in that including step:Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer over the substrate;On metal or metal compound layer make be used for position the spatial resolution calibrating installation position telltale mark and Nominal value for judging imaging system spatial resolution identifies.
- 7. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that selection Si, GaAs, SiC or Al2O3Semi-conducting material as substrate.
- 8. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that over the substrate Preparing includes the metal or metal compound layer of Au, Pt, TiPt, TiPtAu, TiAl or TaN.
- 9. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that pass through sputtering or electricity Depositing process, prepares metal or metal compound layer over the substrate.
- 10. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that pass through photoetching work Skill, makes the telltale mark and use for being used for positioning the spatial resolution calibrating installation position on metal or metal compound layer In the nominal value mark for judging imaging system spatial resolution.
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CN111006772A (en) * | 2019-12-31 | 2020-04-14 | 上海市计量测试技术研究院 | Standard plate group and method for detecting minimum detectable size of thermal infrared imager |
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