CN107941346A - Spatial resolution calibrating installation and preparation method - Google Patents

Spatial resolution calibrating installation and preparation method Download PDF

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Publication number
CN107941346A
CN107941346A CN201711138993.9A CN201711138993A CN107941346A CN 107941346 A CN107941346 A CN 107941346A CN 201711138993 A CN201711138993 A CN 201711138993A CN 107941346 A CN107941346 A CN 107941346A
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China
Prior art keywords
spatial resolution
calibrating installation
metal
nominal
telltale mark
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Pending
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CN201711138993.9A
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Chinese (zh)
Inventor
梁法国
刘岩
翟玉卫
乔玉娥
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CETC 13 Research Institute
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CETC 13 Research Institute
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Priority to CN201711138993.9A priority Critical patent/CN107941346A/en
Publication of CN107941346A publication Critical patent/CN107941346A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/48Thermography; Techniques using wholly visual means
    • G01J5/485Temperature profile
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/80Calibration
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077Imaging

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The invention discloses spatial resolution calibrating installation and preparation method, belongs to field of measuring techniques, including:Substrate, metal or metal compound layer are arranged at substrate top surface;Metal or metal compound layer are provided with for the telltale mark of located space resolving power calibrating installation position and for judging that the nominal value of imaging system spatial resolution identifies.The present invention makes the figure and background of spatial resolution calibrating installation using the material of different emissivity, and figure can clearly be differentiated under thermal microscope, realize the calibration function to infrared microscopy spatial resolution.

Description

Spatial resolution calibrating installation and preparation method
Technical field
The present invention relates to field of measuring techniques, more particularly to a kind of spatial resolution calibrating installation and preparation method.
Background technology
Thermal microscope is a kind of image-forming temperature measurement equipment based on infrared radiation temperature principle, can obtain object table The temperature distribution information in face.Thermal microscope uses infrared temperature-test technology, belongs to non-contacting Non-Destructive Testing, and space Resolving power is high, and thermometric accuracy is good, in semiconductor applications extensive use.
The spatial resolution of thermal microscope is mainly determined by the performance of infrared microscopy optical system and infrared detector It is fixed.The spatial resolution highest of existing commercial thermal microscope can reach 3 μm or so, and be limited by infrared wavelength System, the spatial resolution of existing commercial thermal microscope have basically reached the limit.
Wherein, spatial resolution is to reflect the ability that imaging system differentiates tested minor detail, is evaluation optical imagery system One of basic technical indicator for performance of uniting.The spatial resolution of optical imaging system be normally defined discernmible two points it Between minimum range, and judge the whether discernmible criterion of two points have it is a variety of, most commonly Rayleigh criterion.Commercial Application In for convenience of operating, determine the resolving power of imaging system usually using resolving power on-gauge plate.Traditional resolving power on-gauge plate bag Some groups of equidistant stripeds are included, the fringe spacing of difference group is different, is used as into by the discernmible minimum spacing of imaging system As the resolving power of system.
Since thermal microscope is imaged by catching infra-red radiation, and resolving power on-gauge plate is visible light wave range Optical System Design, therefore be not easy to differentiate using traditional resolving power on-gauge plate under thermal microscope, be not suitable for using In the calibration of thermal microscope.
The content of the invention
The purpose of the embodiment of the present invention is to provide a kind of spatial resolution standard edition and preparation method, it is intended to solves optics The spatial resolution calibrating installation of imaging system is only applicable to visible light wave range, and be difficult to differentiate under thermal microscope asks Topic, it is made the figure and background of spatial resolution calibrating installation using the material of different emissivity, realizes spatial resolution school Standard apparatus is suitable for infrared band.
In order to solve the above technical problems, the technical solution used in the present invention is:
A kind of spatial resolution calibrating installation, it is characterised in that including:
Substrate;Metal or metal compound layer, are arranged at the substrate top surface;The metal or metal compound layer are set It is equipped with telltale mark for positioning the spatial resolution calibrating installation position and for judging imaging system spatial resolution Nominal value mark.
Further, the telltale mark includes calibrating installation telltale mark and nominal value telltale mark;The calibration cartridge Put telltale mark to be arranged on the left of the metal or metal compound layer, the nominal value telltale mark is arranged at the calibration cartridge Put on the right side of telltale mark;The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is more than The area of the nominal value telltale mark.
Further, the nominal value mark includes being used to judge the nominal striped of imaging system resolving power and for showing The spacing nominal value of the nominal fringe spacing;The nominal value mark is arranged on the right side of the telltale mark, the nominal bar Line is arranged on the right side of the spacing nominal value;The width of the nominal striped is equal with the spacing of the nominal striped.
Further, the length of the nominal striped increases and increases with the width of the nominal striped.
Further, metal or the metallic compound layer thickness is 50nm-100nm.
The embodiment of the invention also discloses a kind of preparation method of spatial resolution calibrating installation, including step:
Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer over the substrate;
The positioning mark for being used for positioning the spatial resolution calibrating installation position is made on metal or metal compound layer Note and the nominal value mark for judging imaging system spatial resolution.
Further, Si, GaAs, SiC or Al are chosen2O3Semi-conducting material as substrate.
Further, metal or metal including Au, Pt, TiPt, TiPtAu, TiAl or TaN are prepared over the substrate Compound layer.
Further, by sputtering or electroplating technology, metal or metal compound layer are prepared over the substrate.
Further, by photoetching process, made on metal or metal compound layer and be used to position the spatial discrimination The telltale mark of power calibrating installation position and the nominal value mark for judging imaging system spatial resolution.
It is using beneficial effect caused by above-mentioned technical proposal:(1) the spatial resolution calibration of the embodiment of the present invention Device, makes substrate and metal or metal compound layer so that metal or metal compound layer using the material of different emissivity On telltale mark and nominal value mark can clearly be differentiated under thermal microscope, so as to fulfill to infrared microscopy thermal imagery The calibration function of instrument spatial resolution;(2) preparation method of the embodiment of the present invention is easy to operate, can be real using conventional technique It is existing, suitable for large-scale promotion and production.
Brief description of the drawings
Fig. 1 is the main structure diagram of spatial resolution calibrating installation provided in an embodiment of the present invention;
Fig. 2 is the overlooking the structure diagram of spatial resolution calibrating installation provided by Embodiment 2 of the present invention;
Fig. 3 is the overlooking the structure diagram for the spatial resolution calibrating installation that the embodiment of the present invention three provides;
Fig. 4 is the preparation method flow chart for the spatial resolution calibrating installation that the embodiment of the present invention five provides;
Fig. 5 is the preparation method flow chart for the spatial resolution calibrating installation that the embodiment of the present invention six provides;
In figure:100th, substrate, 200, metal or metal compound layer, 300, calibrating installation telltale mark, 400, nominal value Telltale mark, 500, spacing nominal value, 600, nominal striped.
Embodiment
With reference to the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Ground describes, it is clear that described embodiment is only the part of the embodiment of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work Embodiment, belongs to the scope of protection of the invention.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with Implemented using other different from other manner described here, those skilled in the art can be without prejudice to intension of the present invention In the case of do similar popularization, therefore the present invention is from the limitation of following public specific embodiment.
Embodiment one
Spatial resolution calibrating installation in the present embodiment, including substrate and metal or metal compound layer.The metal Or metal compound layer, the substrate top surface is arranged at, including for positioning the spatial resolution calibrating installation position Telltale mark and the nominal value mark for judging imaging system spatial resolution.
The embodiment of the present invention, makes substrate and metal or metal compound layer so that gold using the material of different emissivity Category or the telltale mark on metal compound layer and nominal value mark can clearly be differentiated under thermal microscope, so that real Now to the calibration function of thermal microscope spatial resolution.
Further, the telltale mark includes calibrating installation telltale mark and nominal value telltale mark.The calibration cartridge Put telltale mark to be arranged on the left of the metal or metal compound layer, the nominal value telltale mark is arranged at the calibration cartridge Put on the right side of telltale mark.The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is more than The area of the nominal value telltale mark.
Further, the nominal value mark includes being used to judge the nominal striped of imaging system resolving power and for showing The spacing nominal value of the nominal fringe spacing.The nominal value mark is arranged on the right side of the telltale mark, the nominal bar Line is arranged on the right side of the spacing nominal value.The width of the nominal striped is equal with the spacing of the nominal striped.
Further, the length of the nominal striped increases and increases with the width of the nominal striped.
Further, metal or the metallic compound layer thickness is 50nm-100nm.
Embodiment two
Please refer to Fig.1, Fig. 2, spatial resolution calibrating installation provided in an embodiment of the present invention, including Si substrates 100 and thickness The TaN metal compound layers 200 for 50nm are spent, TaN metal compound layers 200 are arranged at 100 upper surface of Si substrates.Due to metal Two kinds of materials of compound-material TaN and semi-conducting material Si have different emissivity, so when two kinds of emissivity different materials During figure and background as spatial resolution calibrating installation, thermal microscope can be differentiated clearly.In the present embodiment, Graphics field material is metallic compound TaN, background area material for semi-conducting material Si, TaN layer be equipped with telltale mark with Nominal value identifies.
Preferably, telltale mark is isosceles triangle, and telltale mark includes calibrating installation telltale mark 300 and nominal value is determined Position mark 400,300 area of calibrating installation telltale mark are more than nominal value telltale mark 400, enable micro-thermal imaging instrument easy The position of spatial resolution calibrating installation is navigated to, behind the position for determining spatial resolution calibrating installation, is determined further according to nominal value Position mark 400 determines the position of nominal value mark.Calibrating installation witness marker 300 is arranged at TaN layers of left side, nominal value positioning mark Note 400 is arranged at the right side of calibrating installation witness marker 300.
Preferably, nominal value mark includes the nominal striped 600 for judging imaging system resolving power and is marked for showing Claim the spacing nominal value 500 of fringe spacing, spacing nominal value 500 and nominal striped 600 are respectively arranged at nominal value telltale mark 400 left and right sides, and positioned at the right side of calibrating installation witness marker 300.Nominal value mark includes 4 groups of nominal bars in the present embodiment Line 600, every group of nominal striped 600 correspond to a spacing nominal value 500.Spacing nominal value 500 is respectively 1,2,3,4, is referred to pair The width for the 4 groups of nominal stripeds 600 answered is respectively 1 μm, 2 μm, 3 μm, 4 μm, the width of nominal striped 600 and two nominal stripeds Spacing between 600 is equal.
Preferably, the length of 4 groups of nominal stripeds 600 is respectively 5 μm, 10 μm, 15 μm, 20 μm, the length of nominal striped 600 Increase with the width increase of nominal striped 600, infrared microscopy thermal imaging system easier can identify.
In the present embodiment, by the material that different emissivity are used in the figure of spatial resolution calibrating installation and background area Expect TaN and Si, enable the clear resolution graphics of thermal microscope and background, realize to thermal microscope spatial discrimination The calibration function of power.
Embodiment three
Please refer to Fig.1, Fig. 3, spatial resolution calibrating installation provided in an embodiment of the present invention, including 100 He of GaAs substrates Thickness is the Pt metal layers 200 of 100nm, and Pt metal layers 200 are arranged at 100 upper surface of GaAs substrates.Due to metal material Pt and Semi-conducting material GaAs has different emissivity, so when two kinds of emissivity different materials are as spatial resolution calibrating installation Figure and during background, thermal microscope can be differentiated clearly.In the present embodiment, graphics field material is semi-conducting material GaAs, background area material are Pt metal, and Pt layers are equipped with telltale mark and nominal value identifies.
Preferably, telltale mark includes calibrating installation telltale mark 300 and nominal value telltale mark 400, and calibrating installation is fixed Position mark 300 is isosceles triangle, and nominal value telltale mark 400 is square, and 300 area of calibrating installation telltale mark is more than mark Title value telltale mark 400, enables micro-thermal imaging instrument easily to navigate to the position of spatial resolution calibrating installation, determines space Behind the position of resolving power calibrating installation, the position of nominal value mark is determined further according to nominal value telltale mark 400.Calibrating installation is determined Bit flag 300 is arranged at TaN layers of left side, and nominal value telltale mark 400 is arranged at the right side of calibrating installation witness marker 300.
Preferably, nominal value mark includes being used to judge the nominal striped 600 of imaging system resolving power and for showing The spacing nominal value 500 of nominal fringe spacing is stated, spacing nominal value 500 and nominal striped 600 are respectively arranged at nominal value positioning The left and right sides of mark 400, and positioned at the right side of calibrating installation witness marker 300.Nominal value mark includes 4 groups of marks in the present embodiment Claim striped 600, every group of nominal striped 600 corresponds to a spacing nominal value 500.Spacing nominal value 500 be respectively 10,15,20, 25, the width for referring to corresponding 4 groups of nominal stripeds 600 is respectively 10 μm, 15 μm, 20 μm, 25 μm, the width of nominal striped 600 Spacing between two nominal stripeds 600 is equal.
Preferably, the length of 4 groups of nominal stripeds 600 is respectively 50 μm, 75 μm, 100 μm, 125 μm, nominal striped 600 Length increases and increases with the width of nominal striped 600, and micro-thermal imaging instrument easier can identify.
In the present embodiment, by the material that different emissivity are used in the figure of spatial resolution calibrating installation and background area Expect GaAs and Pt, enable the clear resolution graphics of thermal microscope and background, realize to thermal microscope space point Distinguish the calibration function of power.
Example IV
The embodiment of the present invention discloses a kind of spatial resolution calibrating installation preparation method, and details are as follows:
Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer on substrate;
The positioning mark for being used for positioning the spatial resolution calibrating installation position is made on metal or metal compound layer Note and the nominal value mark for judging imaging system spatial resolution.
The preparation method of the embodiment of the present invention is easy to operate, can be achieved using conventional technique, suitable for large-scale promotion And production.Substrate and metal or metal compound layer are made using the material of different emissivity so that metal or metallic compound Telltale mark and nominal value mark on layer can clearly be differentiated under thermal microscope, so as to fulfill to infrared microscopy heat As the calibration function of instrument spatial resolution
Further, Si, GaAs, SiC or Al are chosen2O3Semi-conducting material as substrate.
Further, metal or metal including Au, Pt, TiPt, TiPtAu, TiAl or TaN are prepared over the substrate Compound layer.
The figure or background area of substrate and metal or metal compound layer as spatial resolution calibrating installation, selection is not Material with emissivity can be such that thermal microscope clearly differentiates, and realize calibration function.
Further, by sputtering or electroplating technology, metal or metal compound layer are prepared over the substrate.Using splashing Penetrate or electroplating technology can obtain the metal or metal compound layer of thinner thickness, be conducive to photoetching process and prepare more preferable figure Quality.
Further, by photoetching process, made on metal or metal compound layer and be used to position the spatial discrimination The telltale mark of power calibrating installation position and the nominal value mark for judging imaging system spatial resolution.Using photoetching process The high figure of precision can be obtained, is adapted to the making of various sizes figure, flexibility is strong, and cost is relatively low.
Embodiment five
Referring to Fig. 4, corresponding to the spatial resolution calibrating installation in embodiment two, the present embodiment discloses a kind of space point Distinguish power calibrating installation preparation method, details are as follows:
S101:Semi-conducting material Si is chosen as substrate;
S102:The TaN metal compound layers that thickness is 50nm are prepared by sputtering technology on a si substrate;
S103:Apply negative photoresist on TaN layers of metallic compound, by electron beam exposure technique prepare telltale mark and Nominal value identifies.
The preparation method of the present embodiment, relatively thin metal compound layer can be prepared using sputtering technology, easy to electron beam Exposure technology prepares more preferable graphical quality.Electron beam exposure artwork shape is high for precision, and flexibility is strong.
Embodiment six
Referring to Fig. 5, corresponding to the spatial resolution calibrating installation in embodiment three, the present embodiment discloses a kind of space point Distinguish power calibrating installation preparation method, details are as follows:
S201:Semi-conducting material GaAs is chosen as substrate;
S202:The Pt metal layers that thickness is 100nm are prepared by electroplating technology on gaas substrates;
S203:Positive photoresist is applied on Pt metal layer, telltale mark and mark are prepared by photolithography plate Projection Exposure Process Title value identifies.
The preparation method of the present embodiment, can prepare metal layer using electroplating technology, can avoid long-time high-temperature damage Substrate.Photolithography plate Projection Exposure Process figure preparation process time is short, and cost is low, easy to implement, suitable for more than 10 μm figures Make.
In conclusion the spatial resolution calibrating installation of the embodiment of the present invention makes space using the material of different emissivity The graphics field and background area of resolving power calibrating installation, figure can clearly be differentiated under thermal microscope, realization pair The calibration function of infrared microscopy spatial resolution;The preparation method of the embodiment of the present invention is easy to operate, is using conventional technique It can be achieved, suitable for large-scale promotion and production.
Foregoing is to example embodiment for example, and being not necessarily to be construed as the limitation to example embodiment.Although Some example embodiments have been described, but those skilled in the art will be readily understood that, not depart from this substantially In the case of disclosed novel teachings and advantage, many modifications in example embodiment are possible.Therefore, it is all these to repair Change and be intended to be included in as defined by the appended claims within the scope of the present disclosure.It will be appreciated, therefore, that foregoing is to each Kind of example embodiment for example, and should not be construed as limited to disclosed specific example embodiment, and to institute The modification of disclosed example embodiment and other example embodiments is intended to be included within the scope of claim.

Claims (10)

  1. A kind of 1. spatial resolution calibrating installation, it is characterised in that including:
    Substrate;Metal or metal compound layer, are arranged at the substrate top surface;The metal or metal compound layer are provided with For positioning the telltale mark of the spatial resolution calibrating installation position and mark for judging imaging system spatial resolution Title value identifies.
  2. 2. spatial resolution calibrating installation according to claim 1, it is characterised in that the telltale mark includes calibration cartridge Put telltale mark and nominal value telltale mark;
    The calibrating installation telltale mark is arranged on the left of the metal or metal compound layer, and the nominal value telltale mark is set It is placed on the right side of the calibrating installation telltale mark;
    The telltale mark is regular geometric figure, and the area of the calibrating installation telltale mark is determined more than the nominal value The area of position mark.
  3. 3. spatial resolution calibrating installation according to claim 1, it is characterised in that the nominal value mark includes being used for Judge the nominal striped of imaging system resolving power and the spacing nominal value for showing the nominal fringe spacing;
    The nominal value mark is arranged on the right side of the telltale mark, and it is right that the nominal striped is arranged at the spacing nominal value Side;The width of the nominal striped is equal with the spacing of the nominal striped.
  4. 4. spatial resolution calibrating installation according to claim 3, it is characterised in that the length of the nominal striped is with institute State the width increase of nominal striped and increase.
  5. 5. spatial resolution calibrating installation according to claim 1, it is characterised in that the metal or metal compound layer Thickness is 50nm-100nm.
  6. 6. a kind of preparation method of spatial resolution calibrating installation, it is characterised in that including step:
    Semi-conducting material is chosen as substrate, and prepares metal or metal compound layer over the substrate;
    On metal or metal compound layer make be used for position the spatial resolution calibrating installation position telltale mark and Nominal value for judging imaging system spatial resolution identifies.
  7. 7. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that selection Si, GaAs, SiC or Al2O3Semi-conducting material as substrate.
  8. 8. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that over the substrate Preparing includes the metal or metal compound layer of Au, Pt, TiPt, TiPtAu, TiAl or TaN.
  9. 9. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that pass through sputtering or electricity Depositing process, prepares metal or metal compound layer over the substrate.
  10. 10. the preparation method of spatial resolution calibrating installation according to claim 6, it is characterised in that pass through photoetching work Skill, makes the telltale mark and use for being used for positioning the spatial resolution calibrating installation position on metal or metal compound layer In the nominal value mark for judging imaging system spatial resolution.
CN201711138993.9A 2017-11-16 2017-11-16 Spatial resolution calibrating installation and preparation method Pending CN107941346A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111006772A (en) * 2019-12-31 2020-04-14 上海市计量测试技术研究院 Standard plate group and method for detecting minimum detectable size of thermal infrared imager

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TW201439665A (en) * 2013-01-07 2014-10-16 Tamaggo Inc Panoramic lens calibration for panoramic image and/or video capture apparatus
CN104897051A (en) * 2014-03-03 2015-09-09 卡尔蔡司显微镜有限责任公司 Calibration plate used for measurement calibration of digital microscope and use method thereof
EP3047912A1 (en) * 2015-01-26 2016-07-27 Inman S.r.l. Device and method for controlling a spray pattern

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Publication number Priority date Publication date Assignee Title
CN1267082A (en) * 1999-03-16 2000-09-20 日本电气株式会社 Graticule having new identifying pattern
CN101842886A (en) * 2007-10-29 2010-09-22 美光科技公司 Methods for fabricating sub-resolution alignment marks on semiconductor structures and semiconductor structures including same
CN101598645A (en) * 2009-07-01 2009-12-09 中国科学院微电子研究所 Method for manufacturing standard sample for scanning electron microscope magnification calibration
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111006772A (en) * 2019-12-31 2020-04-14 上海市计量测试技术研究院 Standard plate group and method for detecting minimum detectable size of thermal infrared imager

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Application publication date: 20180420