CN111006772A - Standard plate group and method for detecting minimum detectable size of thermal infrared imager - Google Patents
Standard plate group and method for detecting minimum detectable size of thermal infrared imager Download PDFInfo
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- CN111006772A CN111006772A CN201911410312.9A CN201911410312A CN111006772A CN 111006772 A CN111006772 A CN 111006772A CN 201911410312 A CN201911410312 A CN 201911410312A CN 111006772 A CN111006772 A CN 111006772A
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- thermal infrared
- infrared imager
- metal wires
- standard plate
- minimum detectable
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 75
- 229910052751 metal Inorganic materials 0.000 claims abstract description 75
- 238000001514 detection method Methods 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 7
- 229910001111 Fine metal Inorganic materials 0.000 claims description 16
- 230000009191 jumping Effects 0.000 claims description 9
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/80—Calibration
Abstract
The invention discloses a standard plate group and a method for detecting the minimum detectable size of a thermal infrared imager, wherein the standard plate group comprises a plurality of standard plates, each standard plate comprises a metal wire, an insulating support plate, a voltmeter, a power supply and an adjustable resistor, the metal wires are different in diameter, are fixed on the insulating support plate and are connected in parallel through a lead, the insulating support plate can resist high temperature, the voltmeter is used for measuring the voltage at two ends of the parallel metal wires, and the adjustable resistor is connected in series on the power supply to supply power to the parallel metal wires; the standard plate is placed in the semi-closed glass cover when in work; the parallel metal wires have the same temperature rise, the temperature rise is rapid, and the rapid and accurate detection of the minimum detectable size of the thermal infrared imager is realized.
Description
Technical Field
The invention relates to the field of detection of thermal infrared imagers, in particular to a standard plate group and a method for detecting the minimum detectable size of a thermal infrared imager.
Background
The thermal infrared imager is a device for converting infrared radiation on the surface of an object into a visible image through an infrared optical system, an infrared detector and an electronic processing system. The method has the temperature measuring function, has the characteristic of quantitatively drawing the surface temperature distribution of an object, and carries out pseudo-color coding on the gray level image.
The infrared thermal imager's minimum detectable dimension characterizes its ability to resolve details of the object's spatial geometry. It is related to the size of the pixel area of the infrared detector, the focal length and image quality of the optical system, the signal processing bandwidth and the like. At present, this parameter is represented by the field angle of the detector pixel or the instantaneous field of view, and is obtained by approximate calculation: the minimum detectable size is the horizontal field angle/horizontal pixel count.
Obviously, the deviation exists between the approximate calculation result and the real minimum detectable size of the thermal infrared imager, and the evaluation of the performance of the minimum detectable size of the thermal infrared imager is hindered. Thus, there is a need to develop testing methods to objectively and truly evaluate the minimum detectable dimension of a thermal infrared imager.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a standard plate group and a method for detecting the minimum detectable size of a thermal infrared imager.
In order to achieve the purpose, the invention adopts the following technical scheme:
a standard plate group for detecting the minimum detectable size of a thermal infrared imager is characterized by comprising a plurality of standard plates, wherein each standard plate comprises a plurality of metal wires with different diameters, an insulating support plate, a voltmeter, a power supply, a lead and an adjustable resistor; the metal wires are fixedly arranged on the insulating support plate and are connected in parallel through a lead; the voltmeter measures the voltage at two ends of the parallel metal wires, and the power supply is connected with the adjustable resistor in series, so that the parallel metal wires are supplied with power.
Further, the standard plate group for detecting the minimum detectable size of the thermal infrared imager is characterized in that: the metal wires with different diameters are respectively ultrafine metal wires, fine metal wires, common metal wires and thick metal wires with gradually increased diameters.
Further, the standard plate group for detecting the minimum detectable size of the thermal infrared imager is characterized in that: the standard plates are different in specification, and the diameters of the wires with the same name contained in each standard plate are different.
Further, the standard plate group for detecting the minimum detectable size of the thermal infrared imager is characterized in that: the insulating support plate 5 is made of high-temperature-resistant materials.
A method for detecting the minimum detectable size of a thermal infrared imager is characterized in that: the method adopts the standard plate group for detection, and comprises the following steps:
a. placing a standard plate with any specification on a workbench, surrounding the workbench by a semi-closed glass cover, turning on a power supply 7, and turning on a thermal infrared imager to be detected;
b. vertically aligning the detected thermal infrared imager to the standard plate, enabling the distance between the detected thermal infrared imager and the standard plate to be equal to the minimum focal length of the detected thermal infrared imager, and enabling the metal wires of the standard plate to be distributed at least in 80% of the screen of the detected thermal infrared imager;
c. d, when a detector observes the general metal wires 3 and the thick metal wires 4 on the screen of the thermal infrared imager to be detected and cannot observe the ultra-thin metal wires 1 and the fine metal wires 2, jumping to the step d, otherwise, jumping to the step e;
d. replacing the detection personnel, wherein the replaced detection personnel can observe the general metal wires 3 and the thick metal wires 4 on the screen of the thermal imager, and jump to the step f when the ultra-thin metal wires 1 and the fine metal wires 2 cannot be observed, or jump to the step e;
e. replacing a standard plate with another specification, and jumping to the step a;
f. the diameter of the general metal wire 3 of the standard plate with the current specification is the smallest detectable size of the detected thermal infrared imager.
Further, the method for detecting the minimum detectable size of the thermal infrared imager is characterized in that: after the power supply is switched on, the resistance value of the adjustable resistor is gradually reduced, so that the value displayed on the voltmeter is 50 mV.
Compared with the prior art, the invention has the beneficial effects that:
the standard plate group comprises a plurality of standard plates containing metal wires with different diameters, the distance between the thermal imager and the standard plates is equal to the minimum focal length of the thermal imager when the standard plate group is used, and the standard plates are placed on the workbench in the semi-closed glass cover, so that the influence of external air flow on the uneven convection heat exchange of the standard plates when the standard plates work is avoided; the metal wires have the same temperature rise, so that the difference of infrared radiation quantity caused by different temperatures is avoided; the invention realizes the rapid and accurate detection of the minimum detectable size of the thermal infrared imager.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a schematic view of a standard plate for detecting the minimum detectable size of a thermal infrared imager according to the present invention;
FIG. 2 is a flow chart of the method for detecting the minimum detectable dimension of a thermal infrared imager according to the present invention.
Reference numbers in the figures: 1. an ultra-fine wire; 2. fine metal wires; 3. a common metal wire; 4. a thick wire; 5. an insulating support plate; 6. a voltmeter; 7. a power source; 8. a wire; 9. and (4) an adjustable resistor.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
Referring to fig. 1, a standard plate group for detecting the minimum detectable size of a thermal infrared imager comprises a plurality of standard plates, wherein each standard plate comprises an ultra-fine metal wire 1, a fine metal wire 2, a general metal wire 3, a thick metal wire 4, an insulating support plate 5, a voltmeter 6, a power supply 7, a lead 8 and an adjustable resistor 9; the ultra-fine metal wire 1, the fine metal wire 2, the common metal wire 3 and the thick metal wire 4 are fixedly arranged on the insulating support plate 5 and are connected in parallel through a lead 8; the voltmeter 6 measures the voltage at the two ends of the parallel metal wires, and the power supply 7 is connected with the adjustable resistor 9 in series, so that the parallel metal wires are supplied with power.
In this embodiment, the specification of each standard plate is different, and the diameters of the wires with the same name included in each standard plate are different.
In this embodiment, the insulating support plate 5 is made of a high temperature resistant material, and the standard plate can be placed in the semi-closed glass cover when in operation.
Referring to fig. 1 and 2, a method for detecting the minimum detectable size of a thermal infrared imager, which uses the standard plate group for detection, comprises the following steps:
a. placing a standard plate with any specification on a workbench, surrounding the workbench by a semi-closed glass cover, turning on a power supply 7, and turning on a thermal infrared imager to be detected;
b. vertically aligning the detected thermal infrared imager to the standard plate, enabling the distance between the detected thermal infrared imager and the standard plate to be equal to the minimum focal length of the detected thermal infrared imager, and enabling the metal wires of the standard plate to be distributed at least in 80% of the screen of the detected thermal infrared imager;
c. d, when a detector observes the general metal wires 3 and the thick metal wires 4 on the screen of the thermal infrared imager to be detected and cannot observe the ultra-thin metal wires 1 and the fine metal wires 2, jumping to the step d, otherwise, jumping to the step e;
d. replacing the detection personnel, wherein the replaced detection personnel can observe the general metal wires 3 and the thick metal wires 4 on the screen of the thermal imager, and jump to the step f when the ultra-thin metal wires 1 and the fine metal wires 2 cannot be observed, or jump to the step e;
e. replacing a standard plate with another specification, and jumping to the step a;
f. the diameter of the general metal wire 3 of the standard plate with the current specification is the smallest detectable size of the detected thermal infrared imager.
In this example, the standard plates should be intermittently energized to prevent overheating of the wires due to long-term energization.
In this embodiment, the voltmeter 6 is a millivoltmeter with a measuring range of 100mV, the output voltage of the power supply 7 is 24V, and the adjustable range of the resistance value of the adjustable resistor 9 is 0～1 omega, the diameters of the superfine metal wire 1, the fine metal wire 2, the common metal wire 3 and the thick metal wire 4 of the standard plate with any specification adopted in the step a are respectively 0.2mm, 0.3mm, 0.4mm and 0.5mm of copper wires, and the length of the metal wires is 0.1 m. The lengths of the metal wires of the standard plates with different specifications are the same, and the diameters of the metal wires with the same name are increased and decreased by taking 0.1mm as a unit; for example, the wire size of a standard plate that is one gauge larger than the standard plate of the above gauge is: the diameters of the ultra-fine metal wire 1, the fine metal wire 2, the common metal wire 3 and the thick metal wire 4 are respectively 0.3mm, 0.4mm, 0.5mm and 0.6mm of copper wires, and the length of the metal wires is 0.1 m; and the wire size of the standard plate which is smaller than the standard plate with the above specification by one specification is as follows: the diameters of the ultra-fine metal wire 1, the fine metal wire 2, the common metal wire 3 and the thick metal wire 4 are respectively 0.2mm, 0.3mm, 0.4mm and 0,5mm of copper wires, and the length of the metal wires is 0.1 m.
After the power supply 7 is turned on, the resistance of the adjustable resistor 9 is gradually reduced to make the indication value on the voltmeter 6 be 50mV, in this embodiment, the lead 8 is a copper lead with a diameter of 3.6mm, and since the resistance of the lead 8 is significantly smaller than that of the metal wire, the resistance of the lead 8 per unit length is 1/50 of the resistance of the thick metal wire 4, and thus the voltage loss on the lead 8 is negligible as an approximate calculation. On the other hand, in the embodiment, the standard board should be cooled for a period of time after being powered off every 1 min. The semi-closed glass cover can avoid the influence of external air flow on uneven convection heat exchange of the standard plate when the standard plate works. The wire was not in time to conduct heat to the air within seconds of the first energization, and it was considered to be in a heat-insulating state, and if this state was maintained for 10 seconds, the wire was found to be heated to 41.5 ℃.
In this embodiment, if 2 testers can only observe the general metal wires 3 and the thick metal wires 4 by using a thermal infrared imager, and the diameter of the general metal wires 3 is 0.4mm, the minimum detectable size of the thermal infrared imager is 0.4 mm.
In the embodiment, the metal wires have the same temperature rise, so that the difference of infrared radiation amount caused by different temperatures is avoided, and only the diameter of the metal wire is used as a variable in the process of detecting the minimum detectable size of the thermal infrared imager by using the standard plate group, so that the real and objective detection of the minimum detectable size of the thermal infrared imager is realized.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The standard plate group for detecting the minimum detectable size of the thermal infrared imager is characterized by comprising a plurality of standard plates, wherein each standard plate comprises a plurality of metal wires with different diameters, an insulating support plate (5), a voltmeter (6), a power supply (7), a lead (8) and an adjustable resistor (9); the metal wires are fixedly arranged on the insulating support plate (5) and are connected in parallel through a lead (8); the voltmeter (6) is used for measuring the voltage at two ends of the parallel metal wires, and the power supply (7) is connected with the adjustable resistor (9) in series, so that the parallel metal wires are supplied with power.
2. The set of standards for detecting the minimum detectable dimension of a thermal infrared imager as set forth in claim 1, wherein: the metal wires with different diameters are respectively an ultra-thin metal wire (1), a thin metal wire (2), a common metal wire (3) and a thick metal wire (4) with gradually increasing diameters.
3. The set of standards for detecting the minimum detectable dimension of a thermal infrared imager as set forth in claim 2, wherein: the standard plates are different in specification, and the diameters of the wires with the same name contained in each standard plate are different.
4. The set of standards for detecting the minimum detectable dimension of a thermal infrared imager as set forth in claim 3, wherein: the insulating support plate (5) is made of high-temperature-resistant materials.
5. A method for detecting the minimum detectable size of a thermal infrared imager is characterized in that: the method for detecting the minimum detectable size of the infrared thermal imager is carried out by adopting the standard plate set for detecting the minimum detectable size of the infrared thermal imager as set forth in any one of claims 1 to 4, and the method comprises the following steps:
a. placing a standard plate with any specification on a workbench, surrounding the workbench by a semi-closed glass cover, turning on a power supply (7), and turning on a thermal infrared imager to be detected;
b. vertically aligning the detected thermal infrared imager to the standard plate, enabling the distance between the detected thermal infrared imager and the standard plate to be equal to the minimum focal length of the detected thermal infrared imager, and enabling the metal wires of the standard plate to be distributed at least in 80% of the screen of the detected thermal infrared imager;
c. d, when a detector observes a common metal wire (3) and a thick metal wire (4) on a screen of the detected thermal infrared imager and cannot observe an extremely thin metal wire (1) and an extremely thin metal wire (2), jumping to the step d, otherwise, jumping to the step e;
d. replacing the detection personnel, wherein the replaced detection personnel can observe the common metal wires (3) and the thick metal wires (4) on the screen of the thermal imager, and jump to the step f when the ultra-thin metal wires (1) and the fine metal wires (2) cannot be observed, otherwise, jump to the step e;
e. replacing a standard plate with another specification, and jumping to the step a;
f. the diameter of a common metal wire (3) of a standard plate with the current specification is the smallest detectable size of the detected thermal infrared imager.
6. A method of detecting a minimum detectable dimension of a thermal infrared imager as claimed in claim 5, wherein: after the power supply (7) is switched on, the resistance value of the adjustable resistor (9) is gradually reduced, so that the indication value on the voltmeter (6) is 50 mV.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911410312.9A CN111006772A (en) | 2019-12-31 | 2019-12-31 | Standard plate group and method for detecting minimum detectable size of thermal infrared imager |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911410312.9A CN111006772A (en) | 2019-12-31 | 2019-12-31 | Standard plate group and method for detecting minimum detectable size of thermal infrared imager |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201964960U (en) * | 2010-12-23 | 2011-09-07 | 河南中光学集团有限公司 | Simple infrared thermal image target plate |
| CN203572785U (en) * | 2013-08-15 | 2014-04-30 | 国家电网公司 | Digital radiographic detection test block for line defects of disc insulator |
| WO2014106303A1 (en) * | 2013-01-07 | 2014-07-10 | Tamaggo Inc. | Panoramic lens calibration for panoramic image and/or video capture apparatus |
| CN105203508A (en) * | 2015-09-01 | 2015-12-30 | 中国科学院苏州生物医学工程技术研究所 | Preparation method of fluorescent nanometer standard board |
| CN107941346A (en) * | 2017-11-16 | 2018-04-20 | 中国电子科技集团公司第十三研究所 | Spatial resolution calibrating installation and preparation method |
| CN209247174U (en) * | 2019-01-30 | 2019-08-13 | 无锡市星迪仪器有限公司 | Self calibration thermal image detection instrument |
-
2019
- 2019-12-31 CN CN201911410312.9A patent/CN111006772A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201964960U (en) * | 2010-12-23 | 2011-09-07 | 河南中光学集团有限公司 | Simple infrared thermal image target plate |
| WO2014106303A1 (en) * | 2013-01-07 | 2014-07-10 | Tamaggo Inc. | Panoramic lens calibration for panoramic image and/or video capture apparatus |
| CN203572785U (en) * | 2013-08-15 | 2014-04-30 | 国家电网公司 | Digital radiographic detection test block for line defects of disc insulator |
| CN105203508A (en) * | 2015-09-01 | 2015-12-30 | 中国科学院苏州生物医学工程技术研究所 | Preparation method of fluorescent nanometer standard board |
| CN107941346A (en) * | 2017-11-16 | 2018-04-20 | 中国电子科技集团公司第十三研究所 | Spatial resolution calibrating installation and preparation method |
| CN209247174U (en) * | 2019-01-30 | 2019-08-13 | 无锡市星迪仪器有限公司 | Self calibration thermal image detection instrument |
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