CN107940563A - A kind of indoor apparatus of air conditioner and air-conditioning - Google Patents
A kind of indoor apparatus of air conditioner and air-conditioning Download PDFInfo
- Publication number
- CN107940563A CN107940563A CN201711125847.2A CN201711125847A CN107940563A CN 107940563 A CN107940563 A CN 107940563A CN 201711125847 A CN201711125847 A CN 201711125847A CN 107940563 A CN107940563 A CN 107940563A
- Authority
- CN
- China
- Prior art keywords
- cooling device
- semiconductor cooling
- refrigerant
- air conditioner
- indoor apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/0007—Indoor units, e.g. fan coil units
- F24F1/0059—Indoor units, e.g. fan coil units characterised by heat exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
Abstract
The embodiment of the present invention provides a kind of indoor apparatus of air conditioner and air-conditioning, is related to air-conditioning technical field, can reduce energy loss, improves the efficiency of air-conditioning.The indoor apparatus of air conditioner includes housing, and it is arranged on the evaporator in housing, the import of evaporator is connected with refrigerant inlet pipe, the outlet of evaporator is connected with refrigerant exit pipe, when indoor apparatus of air conditioner carries out kind of refrigeration cycle, refrigerant flows into evaporator from refrigerant inlet pipe, then is flowed into refrigerant exit pipe from the outlet of evaporator；Further include：Semiconductor cooling device and the controller for controlling semiconductor cooling device to be powered；The cold end of semiconductor cooling device is bonded with refrigerant inlet pipe；And/or the hot junction of semiconductor cooling device is bonded with refrigerant exit pipe.The present invention is used for indoor apparatus of air conditioner.
Description
Technical field
The present invention relates to air-conditioning technical field, more particularly to a kind of indoor apparatus of air conditioner and air-conditioning.
Background technology
Domestic air conditioning can generally set electrical auxiliary heater in indoor apparatus of air conditioner at present, in extreme cold weather conditions
Under, electrical auxiliary heater is opened to improve indoor heating amount, meets user demand.But current electric heater efficiency is little
In 1, i.e. its heat produced is not more than the electric energy inputted.Which results in the reduction of air-conditioner efficiency under heating state, power consumption
Increase.In addition, the refrigerant system design of current domestic air conditioning relative maturity, the design of indoor evaporator is evaporator
Import connection refrigerant inlet pipe, evaporator outlet connection refrigerant exit pipe.Indoor heat exchange amount is mainly derived from evaporator
Fin-tube type heat exchanger, and do not accounted for for the cold on refrigerant inlet pipe and refrigerant exit pipe and thermal loss.This
Energy loss is also result in, further results in air-conditioner efficiency reduction.
The content of the invention
The embodiment of the present invention provides a kind of indoor apparatus of air conditioner and air-conditioning, can reduce energy loss, improve the effect of air-conditioning
Rate.
To reach above-mentioned purpose, the embodiment of the present invention adopts the following technical scheme that：
On the one hand, the embodiment of the present invention provides a kind of indoor apparatus of air conditioner, including housing, and is arranged in the housing
Evaporator, the import of the evaporator are connected with refrigerant inlet pipe, and the outlet of the evaporator is connected with refrigerant exit pipe, works as institute
When stating indoor apparatus of air conditioner and carrying out kind of refrigeration cycle, refrigerant flows into the evaporator from the refrigerant inlet pipe, then from the evaporator
Outlet be flowed into the refrigerant exit pipe；Further include：
Semiconductor cooling device and the controller for controlling the semiconductor cooling device to be powered；
The cold end of the semiconductor cooling device is bonded with the refrigerant inlet pipe；And/or the semiconductor cooling device
Hot junction be bonded with the refrigerant exit pipe.
On the other hand, the embodiment of the present invention provides a kind of air-conditioning, including air-conditioner outdoor unit, and above-mentioned described in any one
Indoor apparatus of air conditioner.
Indoor apparatus of air conditioner and air-conditioning provided in an embodiment of the present invention, the indoor apparatus of air conditioner includes housing, and is arranged on
Evaporator in housing, the import of evaporator are connected with refrigerant inlet pipe, and the outlet of evaporator is connected with refrigerant exit pipe, works as sky
When adjusting indoor unit progress kind of refrigeration cycle, refrigerant flows into evaporator from refrigerant inlet pipe, then is flowed into refrigerant from the outlet of evaporator
Outlet；Further include：Semiconductor cooling device and the controller for controlling semiconductor cooling device to be powered；Semiconductor refrigerating fills
The cold end put is bonded with refrigerant inlet pipe；And/or the hot junction of semiconductor cooling device is bonded with refrigerant exit pipe.Compared to existing
There is technology, the embodiment of the present invention in indoor apparatus of air conditioner by adding semiconductor cooling device, when carrying out heating circulation, due to
The heat that the hot junction of semiconductor cooling device produces is much larger than the input electric power of semiconductor cooling device, thus compared to existing
Electrical auxiliary heater in technology, it is more efficient when carrying out aiding in heating using semiconductor cooling device, so as to improve sky
The efficiency of tune.Simultaneously as the cold end of semiconductor cooling device is bonded with refrigerant inlet pipe；And/or semiconductor cooling device
Hot junction is bonded with refrigerant exit pipe, thus when indoor apparatus of air conditioner works, cold end and the refrigerant inlet pipe of semiconductor cooling device
In refrigerant can carry out heat exchange, and/or, the hot junction of semiconductor cooling device carries out heat with the refrigerant in refrigerant exit pipe
Exchange, so as to recycle the cold or heat that a part will be wasted in refrigerant inlet pipe and/or refrigerant exit pipe, so
Reduce energy loss, further increase the efficiency of air-conditioning.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structure diagram one of indoor apparatus of air conditioner provided in an embodiment of the present invention；
Fig. 2 is the structure diagram two of indoor apparatus of air conditioner provided in an embodiment of the present invention；
Fig. 3 is the structure diagram three of indoor apparatus of air conditioner provided in an embodiment of the present invention；
Fig. 4 is the structure diagram four of indoor apparatus of air conditioner provided in an embodiment of the present invention.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art are obtained every other without making creative work
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of indoor apparatus of air conditioner, as shown in Figures 1 to 4, including housing, and be arranged on described
Evaporator 11 in housing, the import of evaporator 11 are connected with refrigerant inlet pipe 12, and the outlet of evaporator 11 is connected with refrigerant and goes out
Mouthful pipe 13, when the indoor apparatus of air conditioner carries out kind of refrigeration cycle, refrigerant flows into evaporator 11 from refrigerant inlet pipe 12, then from evaporation
The outlet of device 11 is flowed into refrigerant exit pipe 13；The indoor apparatus of air conditioner further includes：Semiconductor cooling device 14 and for controlling
The controller that semiconductor cooling device 14 is powered；The cold end 141 of semiconductor cooling device 14 is bonded with refrigerant inlet pipe 12；With/
Or, the hot junction 142 of semiconductor cooling device 14 is bonded with refrigerant exit pipe 13.
The embodiment of the present invention is not limited for the specific cross sectional shape of refrigerant inlet pipe 12 and refrigerant exit pipe 13, in reality
In the application of border, refrigerant inlet pipe 12 and refrigerant exit pipe 13 generally use pipe.The embodiment of the present invention is filled for semiconductor refrigerating
Put 14 cold end 141 and the concrete shape in hot junction 142 does not also limit.Preferably, in order to make the cold of semiconductor cooling device 14
End 141 is more efficient with the heat transfer of refrigerant inlet pipe 12, and/or, the hot junction 142 of semiconductor cooling device 14 and refrigerant exit
The heat transfer of pipe 13 is more efficient, the general cold end 141 and the shape phase of refrigerant inlet pipe 12 for setting semiconductor cooling device 14
Adapt to, the cold end 141 and the binding face of refrigerant inlet pipe 12 of such semiconductor cooling device 14 are larger, and heat transfer is more efficient；
And/or set the hot junction 142 of semiconductor cooling device 14 and the shape of refrigerant exit pipe 13 to be adapted, such semiconductor refrigerating
The hot junction 142 of device 14 and the binding face of refrigerant exit pipe 13 are larger, and heat transfer is more efficient.
So, compared to the prior art, the embodiment of the present invention in indoor apparatus of air conditioner by adding semiconductor refrigerating
Device, when carrying out heating circulation, since the heat that the hot junction of semiconductor cooling device produces is much larger than semiconductor cooling device
Input electric power, thus compared to electrical auxiliary heater of the prior art, using semiconductor cooling device carry out auxiliary plus
It is more efficient when hot, so as to improve the efficiency of air-conditioning.Simultaneously as the cold end of semiconductor cooling device and refrigerant inlet pipe
Fitting；And/or the hot junction of semiconductor cooling device is bonded with refrigerant exit pipe, thus when indoor apparatus of air conditioner works, semiconductor
The cold end of refrigerating plant can carry out heat exchange with the refrigerant in refrigerant inlet pipe, and/or, the hot junction of semiconductor cooling device with
Refrigerant in refrigerant exit pipe carries out heat exchange, so as to recycle in refrigerant inlet pipe and/or refrigerant exit pipe a part i.e.
By the cold being wasted or heat, so reduce energy loss, further increase the efficiency of air-conditioning.
Optionally, refering to what is shown in Fig. 1, when the hot junction 142 of semiconductor cooling device 14 is not bonded with refrigerant exit pipe 13,
In the cold end 141 of semiconductor cooling device 14 heat-barrier material is coated with what refrigerant inlet pipe 12 was not bonded；The control
Device is used for when the indoor apparatus of air conditioner carries out heating circulation, and control semiconductor cooling device 14 is powered.By in semiconductor system
The surface parcel heat-barrier material not being bonded with refrigerant inlet pipe 12 in the cold end 141 of device for cooling 14, can so cause semiconductor
The cold that the cold end 141 of refrigerating plant 14 produces does not get in air.
Arrow in Fig. 1 shows refrigerant flow direction of the indoor apparatus of air conditioner when carrying out heating circulation；Air-conditioning is heating
During operation, the gas of high temperature and pressure is sprayed from the compressor outlet of air-conditioner outdoor unit, by thick online pipe, the evaporation got in
The refrigerant exit pipe 13 of device 11, and then exchange heat in evaporator 11 with room air, then by the refrigerant of evaporator 11
Inlet tube 12, then enter outdoor through meticulous online pipe, by throttling arrangement, enter compressor into condenser, then by air intake duct,
Complete a circulation.In the air-conditioning of no semiconductor cooling device 14, air-conditioner outdoor unit is removed at indoor refrigerant inlet pipe 12
Refrigerant temperature be typically about 30 DEG C, and this temperature is above general heating season indoor environment temperature, this has resulted in one
Partial heat loses.
Refering to what is shown in Fig. 1, when the indoor apparatus of air conditioner of the embodiment of the present invention carries out heating circulation, in indoor apparatus of air conditioner
Semiconductor cooling device 14 is powered, and cold end 141 produces cold, and hot junction 142 produces heat.Cold end 141 due to refrigerant inlet pipe
12 fittings, cold end 141 and the refrigerant of flowing in refrigerant inlet pipe 12 carry out heat exchange, and the cold of cold end 141 causes refrigerant temperature
Reduce, i.e., refrigerant takes away the cold that the cold end 141 of semiconductor cooling device 14 produces；And the hot junction of semiconductor cooling device 14
Under the drive of 142 wind turbine in indoor apparatus of air conditioner, the heat of heat exchange, i.e. semiconductor cooling device 14 is carried out with room air
The heat that end 142 produces is taken away by room air, so as to output heat.And in this process, since semiconductor refrigerating fills
The heat for putting 14 generation of hot junction 142 is much larger than the input electric power of semiconductor cooling device 14, so improves the prior art
The quantity of heat given up of middle electrical auxiliary heater can not be more than the shortcomings that input electric power.Simultaneously as semiconductor cooling device 14
Cold end 141 exchanges heat with refrigerant inlet pipe 12, makes the refrigerant temperature of outflow refrigerant inlet pipe 12 further reduce, and so recycles
The heat of partial loss, also makes 142 liberated heat of hot junction further increase, so as to increase the heating capacity of air-conditioning.
Optionally, refering to what is shown in Fig. 2, when the cold end 141 of semiconductor cooling device 14 is not bonded with refrigerant inlet pipe 12,
On the hot junction 142 of semiconductor cooling device 14 heat-barrier material is coated with what refrigerant exit pipe 13 was not bonded；The control
Device is used for when the indoor apparatus of air conditioner carries out kind of refrigeration cycle, and control semiconductor cooling device 14 is powered.It can so cause half
The heat that the hot junction 141 of conductor refrigerating plant 14 produces does not get in air.
Arrow in Fig. 2 shows refrigerant flow direction of the indoor apparatus of air conditioner when carrying out kind of refrigeration cycle；Air-conditioning is freezing
During operation, the gas of high temperature and pressure is sprayed from the compressor outlet of air-conditioner outdoor unit, is condensed by outdoor condenser, then
By throttling arrangement, by thin online pipe, into the refrigerant inlet pipe 12 of indoor apparatus of air conditioner, so in evaporator 11 with it is indoor
Air exchanges heat, then by refrigerant exit pipe 13, then by thick online pipe into outdoor, into compressor, completion one
Circulation.In the indoor apparatus of air conditioner of no semiconductor cooling device 14, when carrying out kind of refrigeration cycle, indoor refrigerant exit pipe 13
It is about 10 DEG C to locate refrigerant temperature, this temperature will be far below the indoor air temperature in refrigeration season, so cause a part of cold
Loss.
Refering to what is shown in Fig. 2, when the indoor apparatus of air conditioner of the embodiment of the present invention carries out kind of refrigeration cycle, in indoor apparatus of air conditioner
Semiconductor cooling device 14 is powered, and cold end 141 produces cold, and hot junction 142 produces heat.Hot junction 142 due to refrigerant exit pipe
13 fittings, hot junction 142 and the refrigerant of flowing in refrigerant exit pipe 13 carry out heat exchange, and the heat in hot junction 142 causes refrigerant temperature
The heat that the hot junction 142 of semiconductor cooling device 14 produces is taken away in rise, i.e. refrigerant；And the cold end of semiconductor cooling device 14
Under the drive of 141 wind turbine in indoor apparatus of air conditioner, heat exchange is carried out with room air, i.e., semiconductor cooling device 14 is cold
The cold that end 141 produces is taken away by room air, so as to output cold.And in this process, since semiconductor refrigerating fills
The hot junction 142 and refrigerant exit pipe 13 for putting 14 exchange heat, and the refrigerant temperature of outflow refrigerant exit pipe 13 is further raised, this
Sample has recycled the cold of partial loss, the cold that cold end 141 is released further is increased, so as to increase the refrigeration of air-conditioning
Amount.
Further, with reference to shown in figure 3 and Fig. 4, when cold end 141 and the refrigerant inlet pipe 12 of semiconductor cooling device 14 paste
Close, and when the hot junction 142 of semiconductor cooling device 14 is bonded with refrigerant exit pipe 13；The cold end 141 of semiconductor cooling device 14
It is upper be not bonded with refrigerant inlet pipe 12 be coated with heat-barrier material, and on the hot junction 142 of semiconductor cooling device 14 with it is cold
What matchmaker's outlet 13 was not bonded is coated with heat-barrier material.
Arrow in Fig. 3 shows refrigerant flow direction of the indoor apparatus of air conditioner when carrying out heating circulation；In air-conditioning heating
During operation, it is powered to the semiconductor cooling device 14 in indoor apparatus of air conditioner, cold end 141 produces cold, and hot junction 142 produces heat,
And the one end for making to be bonded with refrigerant inlet pipe 12 is cold end 141, the one end being bonded with refrigerant exit pipe 13 is hot junction 142.Cold end
141 with refrigerant inlet pipe 12 in flow out evaporator 11 refrigerant carry out heat exchange, reduce refrigerant temperature, and hot junction 142 with it is cold
Matchmaker's outlet 13 carries out heat exchange, and the refrigerant temperature that evaporator 11 is flowed into refrigerant exit pipe 13 is further raised, equivalent to
The remaining heat of the entrance of evaporator 11 is recycled, it is reentered evaporator 11 and releases heat, heat Interior Space
Gas, so increases the heating capacity of indoor apparatus of air conditioner.
Arrow in Fig. 4 shows refrigerant flow direction of the indoor apparatus of air conditioner when carrying out kind of refrigeration cycle；In air conditioner refrigerating
During operation, it is powered to the semiconductor cooling device 14 in indoor apparatus of air conditioner, cold end 141 produces cold, and hot junction 142 produces heat,
And the one end for making to be bonded with refrigerant inlet pipe 12 is cold end 141, the one end being bonded with refrigerant exit pipe 13 is hot junction 142.Hot junction
142 carry out heat exchange with the refrigerant in refrigerant exit pipe 13, raise refrigerant temperature, and in cold end 141 and refrigerant inlet pipe 12
Refrigerant carry out heat exchange, the refrigerant temperature in refrigerant inlet pipe 12 is further reduced, equivalent to by the outlet of evaporator 11
Locate remaining cold to be recycled, it is reentered evaporator 11 and release cold, cool down room air, so increase air-conditioning
The refrigerating capacity of indoor unit.
In practical applications, when the cold end 141 of semiconductor cooling device 14 is bonded with refrigerant inlet pipe 12, generally require
The cold end 141 of semiconductor cooling device 14 welded or be bonded with refrigerant inlet pipe 12, semiconductor cooling device is fixed with this
14.Preferably, the cold end 141 of semiconductor cooling device 14 passes through heat conduction glue sticking with refrigerant inlet pipe 12.It can so cause
Heat exchange between the cold end 141 and refrigerant inlet pipe 12 of semiconductor cooling device 14 is more efficient.
In practical applications, when the hot junction 142 of semiconductor cooling device 14 is bonded with refrigerant exit pipe 13, generally require
The hot junction 142 of semiconductor cooling device 14 welded or be bonded with refrigerant exit pipe 13, semiconductor cooling device is fixed with this
14.Preferably, the hot junction 142 of semiconductor cooling device 14 passes through heat conduction glue sticking with refrigerant exit pipe 13.It can so cause
Heat exchange between the hot junction 142 of semiconductor cooling device 14 and refrigerant exit pipe 13 is more efficient.
Another embodiment of the present invention provides a kind of air-conditioning, including air-conditioner outdoor unit, and above-mentioned sky described in any one
Adjust indoor unit.Indoor apparatus of air conditioner provided in an embodiment of the present invention is being made by adding semiconductor cooling device inside it
During thermal cycle, since the heat that the hot junction of semiconductor cooling device produces is much larger than the input electric power of semiconductor cooling device,
Thus compared to electrical auxiliary heater of the prior art, efficiency when carrying out aiding in heating using semiconductor cooling device is more
Height, so as to improve the efficiency of air-conditioning.Simultaneously as the cold end of semiconductor cooling device is bonded with refrigerant inlet pipe；And/or
The hot junction of semiconductor cooling device is bonded with refrigerant exit pipe, thus when indoor apparatus of air conditioner works, semiconductor cooling device
Cold end can carry out heat exchange with the refrigerant in refrigerant inlet pipe, and/or, hot junction and the refrigerant exit pipe of semiconductor cooling device
In refrigerant carry out heat exchange so that having recycled a part in refrigerant inlet pipe and/or refrigerant exit pipe will be wasted
Cold or heat, so reduce energy loss, further increase the efficiency of air-conditioning.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of indoor apparatus of air conditioner, including housing, and the evaporator being arranged in the housing, the import of the evaporator connects
Refrigerant inlet pipe is connected to, the outlet of the evaporator is connected with refrigerant exit pipe, when the indoor apparatus of air conditioner carries out kind of refrigeration cycle
When, refrigerant flows into the evaporator from the refrigerant inlet pipe, then is flowed into the refrigerant exit from the outlet of the evaporator
Pipe；It is characterized in that, further include：
Semiconductor cooling device and the controller for controlling the semiconductor cooling device to be powered；
The cold end of the semiconductor cooling device is bonded with the refrigerant inlet pipe；And/or the heat of the semiconductor cooling device
End is bonded with the refrigerant exit pipe.
2. indoor apparatus of air conditioner according to claim 1, it is characterised in that hot junction and institute when the semiconductor cooling device
When stating refrigerant exit pipe and not being bonded, the surface not being bonded with the refrigerant inlet pipe in the cold end of the semiconductor cooling device is wrapped
It is wrapped with heat-barrier material；
The controller is used to, when the indoor apparatus of air conditioner carries out heating circulation, control the semiconductor cooling device to be powered.
3. indoor apparatus of air conditioner according to claim 1, it is characterised in that cold end and institute when the semiconductor cooling device
When stating refrigerant inlet pipe and not being bonded, the surface not being bonded with the refrigerant exit pipe on the hot junction of the semiconductor cooling device is wrapped
It is wrapped with heat-barrier material；
The controller is used to, when the indoor apparatus of air conditioner carries out kind of refrigeration cycle, control the semiconductor cooling device to be powered.
4. indoor apparatus of air conditioner according to claim 1, it is characterised in that cold end and institute when the semiconductor cooling device
The fitting of refrigerant inlet pipe is stated, and when the hot junction of the semiconductor cooling device is bonded with the refrigerant exit pipe；The semiconductor
What is be not bonded with the refrigerant inlet pipe in the cold end of refrigerating plant is coated with heat-barrier material, and the semiconductor refrigerating fills
On the hot junction put heat-barrier material is coated with what the refrigerant exit pipe was not bonded.
5. indoor apparatus of air conditioner according to claim 1, it is characterised in that cold end and institute when the semiconductor cooling device
When stating the fitting of refrigerant inlet pipe, the cold end of the semiconductor cooling device is welded or Nian Jie with the refrigerant inlet pipe.
6. indoor apparatus of air conditioner according to claim 5, it is characterised in that the cold end of the semiconductor cooling device with it is described
Refrigerant inlet pipe passes through heat conduction glue sticking.
7. indoor apparatus of air conditioner according to claim 1 or 5, it is characterised in that when the hot junction of the semiconductor cooling device
When being bonded with the refrigerant exit pipe, the hot junction of the semiconductor cooling device is welded or Nian Jie with the refrigerant exit pipe.
8. indoor apparatus of air conditioner according to claim 7, it is characterised in that the hot junction of the semiconductor cooling device with it is described
Refrigerant exit pipe passes through heat conduction glue sticking.
9. a kind of air-conditioning, it is characterised in that including the air-conditioning described in any one in air-conditioner outdoor unit, and claim 1 to 8
Indoor unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711125847.2A CN107940563B (en) | 2017-11-14 | 2017-11-14 | Machine and air conditioner in air conditioning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711125847.2A CN107940563B (en) | 2017-11-14 | 2017-11-14 | Machine and air conditioner in air conditioning |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107940563A true CN107940563A (en) | 2018-04-20 |
| CN107940563B CN107940563B (en) | 2020-05-12 |
Family
ID=61932189
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711125847.2A Active CN107940563B (en) | 2017-11-14 | 2017-11-14 | Machine and air conditioner in air conditioning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107940563B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| WO2023279873A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Method and apparatus for air conditioner control, and air conditioner |
| WO2023279871A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Air conditioner, and method and apparatus used for air conditioner control |
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| CN202229361U (en) * | 2011-09-19 | 2012-05-23 | 珠海格力电器股份有限公司 | Air-conditioning system |
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| CN105371523A (en) * | 2014-08-29 | 2016-03-02 | 青岛海尔空调器有限总公司 | Air conditioner refrigerating loop and air conditioner |
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| JP2004144399A (en) * | 2002-10-25 | 2004-05-20 | Matsushita Electric Ind Co Ltd | Refrigeration cycle device |
| DE102009036898A1 (en) * | 2008-10-13 | 2010-06-17 | Dirk Schneider | Cooling system for dissipating heat from e.g. electrical devices, of portable computer in clean room, has housing wall provided with heat exchanger, where cooling medium in heat exchanger is guided through channel-like structure |
| CN202229361U (en) * | 2011-09-19 | 2012-05-23 | 珠海格力电器股份有限公司 | Air-conditioning system |
| CN203298524U (en) * | 2013-05-02 | 2013-11-20 | 广东美的电器股份有限公司 | Indoor heat exchanger for variable frequency air conditioner and variable frequency air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111447809A (en) * | 2020-05-13 | 2020-07-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| CN111447809B (en) * | 2020-05-13 | 2023-10-24 | 珠海格力电器股份有限公司 | Photovoltaic air conditioner, cooling assembly and control method of cooling assembly |
| WO2023279873A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Method and apparatus for air conditioner control, and air conditioner |
| WO2023279871A1 (en) * | 2021-07-09 | 2023-01-12 | 青岛海尔空调器有限总公司 | Air conditioner, and method and apparatus used for air conditioner control |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107940563B (en) | 2020-05-12 |
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Address after: 266100 Zhuzhou Road, Laoshan District, Qingdao, Shandong Province, No. 151 Applicant after: Hisense (Shandong) Air-conditioning Co., Ltd. Address before: 266736 Hisense Road 1, South Village Town, Pingdu City, Qingdao, Shandong Applicant before: Hisense (Shandong) Air-conditioning Co., Ltd. |
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