CN107931891B - Solder paste soldering flux - Google Patents
Solder paste soldering flux Download PDFInfo
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- CN107931891B CN107931891B CN201711401090.5A CN201711401090A CN107931891B CN 107931891 B CN107931891 B CN 107931891B CN 201711401090 A CN201711401090 A CN 201711401090A CN 107931891 B CN107931891 B CN 107931891B
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- flux
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a tin paste soldering flux, wherein a film forming agent of the tin paste soldering flux comprises acrylic resin; the acrylic resin comprises a repeating structural unit of formula (I). The solder paste soldering flux disclosed by the invention has the advantages that the rosin is replaced by the acrylic resin, the corrosivity is low, the residue is less, and the acrylic resin coats the tin powder, so that the tin powder can be prevented from being oxidized. The solder paste added with the solder paste flux has a wide process window: the components in the solder paste have stable properties, and the stability of the solder paste is good; the acrylic resin has good thermal stability and wide reflow soldering temperature range.
Description
Technical Field
The invention relates to a soldering flux, in particular to a solder paste soldering flux for lead-free and halogen-free soldering for Surface Mount Technology (SMT)
Background
The existing soldering flux used by the solder paste mainly comprises rosin, an active agent, a solvent, an antioxidant and a thickening agent, and the rosin can protect solder powder from being oxidized in the reflow soldering process, prevent solder balls from being generated and improve the soldering performance. The rosin can play a role of a protective film and an active agent to remove an oxide layer, but the rosin has high residue and high corrosivity, and the long-term stability of the bonding pad is affected. In order to reduce the usage amount of rosin, resin is mainly selected to replace or partially replace the rosin, so that the resin can play a role of a protective layer and can reduce residues.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide the solder paste flux.
In order to achieve the purpose, the invention adopts the technical scheme that: a solder paste flux comprising a film former, the film former comprising an acrylic resin; the acrylic resin comprises a repeating structural unit of formula (I):
wherein R is1Is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C20 cyanogen, C1-C20 sulfone, C1-C20 thiol, C1-C20 sulfonic acid and C6-C20 phenyl;
R2C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C20 cyanogen, C1-C20 sulfone, C1-C20 thiol, C1-C20 sulfonic acid and C6-C20 phenylOne of (1);
R3is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C20 cyanogen, C1-C20 sulfone, C1-C20 thiol, C1-C20 sulfonic acid and C6-C20 phenyl;
m represents an integer of 1 to 300, and n represents an integer of 0 to 300;
the molecular weight of the acrylic resin is 200-300000.
The adsorption pattern of acrylic acid on the tin powder surface is shown in fig. 2, wherein fig. 2a shows single-site adsorption of acrylic resin chains, and fig. 2b shows multi-site adsorption of acrylic resin chains. Carboxyl on the acrylic resin has a chemical bonding effect with the surface of the tin powder alloy, the coating of the resin on the surface of the tin ball is realized by regulating and controlling the length of a molecular chain of the acrylic resin, after the tin ball is coated by the molecular chain of the acrylic resin, the surface of the tin ball can be prevented from being oxidized during reflow soldering, the carboxyl can effectively remove an oxide layer on the surface of the tin powder, and the high-temperature reflow soldering performance of the tin paste is improved.
The molecular formula of the acrylic resin comprises acrylic acid and acrylic ester, the Tg of the acrylic acid is relatively higher, and R is increased in the molecular formula1And R2The carbon chain of the substituent is beneficial to improving Tg and increasing R3The substituent carbon chain is beneficial to reducing Tg, thereby realizing the adjustment of the toughness and the film-forming property of the resin.
The ratio of acrylic acid and acrylate monomers can be regulated, so that the control of the activity and the hygroscopicity of the resin is realized. When the carboxyl reacts with an oxide layer on the surface of the tin powder, the melting of the tin powder can be promoted, and the activity is shown, however, the carboxyl is too much, and the reaction with the oxide layer of the tin powder is too fast, so that the storage of the tin paste is unstable. In addition, carboxyl is a hydrophilic group, and excessive carboxyl can aggravate the water absorption of the flux, so that the number of carboxyl needs to be controlled. The ester group has no effect on the oxide layer, so that the ratio of acrylic acid and acrylate monomers can be controlled, and the regulation and control of activity and hygroscopicity are realized. When the ratio of m to n in the present invention is used, the acrylic resin has good activity and moisture absorption. In addition, the dissolution of the resin in alcohol ether solvents can be realized by controlling the molecular weight of the acrylic resin and controlling the ratio of acrylic acid to acrylic ester.
The solder paste soldering flux disclosed by the invention has the advantages that the rosin is replaced by the acrylic resin, the corrosivity is low, the residue is less, and the acrylic resin coats the tin powder, so that the tin powder can be prevented from being oxidized. The solder paste added with the acrylic resin has a wide process window, which is specifically represented by the following steps: (1) the components in the solder paste are stable in property, and the stability of the solder paste is good; (2) the acrylic resin has good thermal stability and wide reflow soldering temperature range; (3) the method has no requirement on the grain diameter of the tin powder, and is suitable for common tin powder with 4 grain diameter ranges.
As a preferred embodiment of the solder paste flux of the present invention, R is1Is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C20 cyanogen, C1-C10 sulfone, C1-C10 thiol, C1-C10 sulfonic acid and C6-C20 phenyl;
the R is2Is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C10 cyanogen, C1-C10 sulfone, C1-C10 thiol, C1-C10 sulfonic acid and C6-C20 phenyl;
the R is3The compound is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C10 cyanogen, C1-C10 sulfone, C1-C10 thiol, C1-C10 sulfonic acid and C6-C20 phenyl.
As a preferred embodiment of the solder paste flux, the weight percentage of the film forming agent in the solder paste flux is 30-50%.
As a preferred embodiment of the solder paste flux of the present invention, the film forming agent further comprises at least one of rosin, epoxy resin, acrylic resin, polyurethane, polyethylene, polypropylene, polyisobutylene, polyethylene glycol, polyvinyl alcohol, and phenolic resin; the rosin is at least one of polymerized rosin, hydrogenated rosin, modified rosin, disproportionated rosin, acrylic rosin, white ice rosin and white water rosin.
The film forming agent may be only an acrylic resin, or the film forming agent may be added to an acrylic resin.
As a preferred embodiment of the solder paste flux of the present invention, the solder paste flux further comprises an active agent, wherein the active agent is 5 to 15% by weight of the solder paste flux; the active agent is succinic acid, glutaric acid, suberic acid, sebacic acid, pimelic acid, adipic acid, malonic acid, azelaic acid, phenylsuccinic acid, methylsuccinic acid, tartaric acid, o-hydroxybenzoic acid, 5-sulfosalicylic acid, terephthalic acid, oleic acid, anhydrous citric acid, 2-dimethylolpropionic acid, 2-dimethylolbutyric acid, benzoic acid, phthalic acid, p-tert-butylbenzoic acid, glutamic acid, glycine, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethylimidazole, 2-methylimidazole, 4-methyl-2-phenylimidazole, diphenylguanidine, valeric acid, hexanoic acid, 2-methylacetic acid, 2-phenylbutyric acid, 1,3, 5-benzenetricarboxylic acid, dodecahydroxystearic acid, 8-hydroxyquinoline, acetic acid, or the like, At least one of N-methylimidazole, N-ethylimidazole, benzimidazole, 2-methylbenzimidazole, isovanillin, quinaldinic acid, N-phenylanthranilic acid, phenylimidazole, itaconic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, octadecanoic acid, malic acid, maleic acid, sorbic acid, glycolic acid, dodecanedioic acid, lactic acid, salicylic acid, anthranilic acid, monoethanolamine, diethanolamine, triisopropanolamine, cyclohexylamine, oxalic acid, fumaric acid, succinic anhydride, dipropionic acid, and pyridine acid.
As a preferred embodiment of the solder paste flux of the present invention, the solder paste flux further comprises a solvent, wherein the solvent accounts for 24-59% of the solder paste flux by weight; the solvent is glycerol, diethylene glycol, methanol, ethanol, isopropanol, n-butanol, 2-ethyl-1-hexanol, terpineol, cyclohexanol, ethylene glycol, polyethylene glycol, polypropylene glycol, dibutyl ether, diethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, triethylene glycol monomethyl ether, diethylene glycol octyl ether, triethylene glycol monoethyl ether, tripropylene glycol methyl ether, diethylene glycol monooctyl ether, tripropylene glycol monobutyl ether, dipropylene glycol methyl ether, triethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, dipropylene glycol monomethyl ether, tripropylene glycol butyl ether, dipropylene glycol monoethyl ether, dipropylene glycol methyl ether, dipropylene glycol dimethyl ether, triethylene glycol butyl ether, dipropylene glycol, tripropylene glycol, 2-methyl-2, 4-pentanediol, diethylene glycol monobutyl ether, ethylene glycol phenyl ether, ethylene glycol diphenyl ether, propylene glycol methyl ether, propylene glycol propyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, dipropylene glycol monobutyl ether, ethylene glycol dibutyl ether, 2-ethyl-1, 3-hexanediol, ethyl formate, butyl formate, pentyl formate, ethyl acetate, dipentaerythritol ester, diglycidyl ether, ethylene glycol butyl ether, ethylene glycol monobutyl ether, diethylene glycol, triethylene glycol, ethylhexanediol, diethylene glycol ethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monobutyl ether acetate, 2-methyl-hexanediol, propylene glycol monobutyl ether, polyethylene glycol dibutyl ether, diethylene glycol dibutyl ether, tetrahydrofurfuryl alcohol, dioctyl phthalate, dioctyl sebacate, dibutyl sebacate, tetraethylene glycol, isohexadecyl alcohol, diethylene glycol monobutyl ether acetate, propylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol monobutyl ether, diethylene, At least one of nitroethane, dibutyl phthalate, neopentyl glycol, butyl carbitol and monohexyl ether acetate.
As a preferred embodiment of the solder paste flux of the present invention, the solder paste flux further comprises a thickener and a corrosion inhibitor, wherein the thickener accounts for 3 to 5 wt% of the solder paste flux; the weight percentage content of the corrosion inhibitor in the solder paste flux is 1-2%; the thickener is at least one of hydrogenated castor oil, polyamides, fatty acid monoglyceride, fatty acid triglyceride and polyethylene wax; the corrosion inhibitor is at least one of oleic acid imidazoline, azoles, pyrazines and hydroxy glyceride.
As a preferred embodiment of the solder paste flux of the present invention, the solder paste flux further comprises a thickener, an antioxidant and a corrosion inhibitor, wherein the weight percentage of the thickener in the solder paste flux is 3-5%; the weight percentage of the antioxidant in the solder paste flux is 3-5%; the weight percentage content of the corrosion inhibitor in the solder paste flux is 1-2%; the thickener is at least one of hydrogenated castor oil, polyamides, fatty acid monoglyceride, fatty acid triglyceride and polyethylene wax; the antioxidant is at least one of phenolic compounds, phosphate compounds, sulfur-containing compounds, tocopherol and derivatives thereof, ascorbic acid and derivatives thereof, hydroquinone, 2, 6-di-tert-butyl-p-cresol and resorcinol; the corrosion inhibitor is at least one of oleic acid imidazoline, azoles, pyrazines and hydroxy glyceride.
Another object of the present invention is to provide a solder paste including the solder paste flux.
In a preferred embodiment of the solder paste of the present invention, the solder paste further contains solder powder; the soldering flux is 10-20 wt% of the solder paste, and the solder powder is 80-90 wt% of the solder paste.
In a preferred embodiment of the solder paste of the present invention, the particle size of the solder powder is 2 to 38 μm.
The solder paste soldering flux has good formula universality, can be suitable for a wider particle size range of tin powder, and can select SAC series models with the following particle size ranges: t4, 20-38 μm; t5 is 15-25 μm; t6, 5-15 μm, superfine powder: 2-11 μm. The flux on the market at present cannot be applied to each of the tin powders.
The invention has the beneficial effects that: the invention provides a solder paste soldering flux, which adopts acrylic resin to replace rosin, has small corrosivity and less residue, and can prevent tin powder from being oxidized by coating the tin powder with the acrylic resin. The solder paste added with the solder paste flux has a wide process window: the components in the solder paste have stable properties, and the stability of the solder paste is good; the acrylic resin has good thermal stability and wide reflow soldering temperature range.
Drawings
FIG. 1 is a structural formula of formula (I);
FIG. 2 is a schematic view showing adsorption of acrylic resin chains on the surface of tin powder; wherein FIG. 2a is a single site adsorption of the acrylic resin chain; FIG. 2b shows multi-site adsorption of the acrylic resin chains.
Detailed Description
To better illustrate the objects, aspects and advantages of the present invention, the present invention will be further described with reference to specific examples.
Example 1
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 30% of film forming agent, 5% of active agent, 59% of solvent, 3% of thickening agent, 1% of corrosion inhibitor, 1% of antioxidant and 1% of pH regulator;
wherein R is1Is methyl, R2Is an ether group, R3Is a dimethyl sulfoxide group; m is 1, n is 1; the molecular weight of the acrylic resin is 306.
The film forming agent is a mixture of acrylic resin, hydrogenated rosin and polymerized rosin; the weight percentage content of the acrylic resin in the solder paste soldering flux is 20%; the active agent is a mixture of succinic acid, sebacic acid and maleic acid; the thickening agent is hydrogenated castor oil wax; the corrosion inhibitor is oleic acid imidazoline, and the antioxidant is hydroquinone; the pH regulator is triethanolamine; the solvent is a mixture of diethylene glycol dibutyl ether and tetraethylene glycol dimethyl ether.
The solder paste contains the solder paste flux of the embodiment, the weight percentage of the solder paste flux in the solder paste is 11%, and the solder powder in the solder paste is SAC series T5 solder powder with the particle size of 15-25 mu m.
Example 2
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 50% of film forming agent, 15% of active agent, 5% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 2% of pH regulator and 24% of solvent;
wherein R is1Is n-decyl ether group, R2Is n-decyl ether group; r3Is n-decyl ether group; m is 290, n is 290; the molecular weight of the acrylic resin is 299280.
The film forming agent is a mixture of acrylic resin, white ice rosin and modified rosin; the weight percentage content of the acrylic resin in the solder paste soldering flux is 30 percent; the active agent is a mixture of malonic acid, phenylimidazole and maleic acid; the thickening agent is polyamide wax; the corrosion inhibitor is benzotriazole; the antioxidant is 2, 6-di-tert-butyl-p-cresol; the pH regulator is diethanolamine; the solvent is a mixture of diethylene glycol monobutyl ether and diethylene glycol methyl ether.
The solder paste contains the solder paste flux of the embodiment, the weight percentage of the solder paste flux in the solder paste is 12%, and the solder powder in the solder paste is SAC series T4 solder powder with the particle size of 20-38 mu m.
Example 3
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 40% of film forming agent, 10% of active agent, 5% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 1% of pH regulator and 40% of solvent;
wherein R is1Is phenyl, R2Is n-hexyl, R3Is hydroxyethyl; m is 300, n is 300; the molecular weight of the acrylic resin is 122400.
The film forming agent is a mixture of acrylic resin, disproportionated rosin and acrylic rosin; the weight percentage content of the acrylic resin in the solder paste soldering flux is 30 percent; the active agent is a mixture of azelaic acid, phenylimidazole and diethanol amine; the thickening agent is polyamide wax; the corrosion inhibitor is hydroxy glyceride; the antioxidant is resorcinol; the pH regulator is ethanolamine; the solvent is a mixture of diethylene glycol monohexyl ether and tetrahydroxyethanol.
The solder paste contains the solder paste flux of the embodiment, the weight percentage of the solder paste flux in the solder paste is 12%, and the solder powder in the solder paste is SAC series T6 solder powder with the particle size of 5-15 μm.
Example 4
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 40% of film forming agent, 12% of active agent, 5% of thickening agent, 1% of corrosion inhibitor, 2% of antioxidant, 1% of pH regulator and 39% of solvent;
wherein R is1Is octanediocyano, R2Is phenylbutyl, R3Is a pentylcyano group; m is 5, n is 5; the molecular weight of the acrylic resin is 2455.
The film forming agent is a mixture of acrylic resin, disproportionated rosin and water white rosin; the weight percentage content of the acrylic resin in the solder paste soldering flux is 30 percent; the active agent is a mixture of glutaric acid, 2-undecylimidazole and diethanolamine; the thickener is fatty acid monoglyceride; the corrosion inhibitor is methyl benzotriazole; the antioxidant is methyl phosphate; the pH regulator is hydroxyethyl ethylenediamine; the solvent is a mixture of diethylene glycol ethyl ether and tripropylene glycol butyl ether.
The solder paste contains the solder paste soldering flux of the embodiment, the weight percentage of the solder paste soldering flux in the solder paste is 12%, and the solder powder in the solder paste is SAC series ultra-micro solder powder with the particle size of 2-11 mu m.
Example 5
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 50% of film forming agent, 10% of active agent, 4% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 2% of pH regulator and 30% of solvent;
wherein R is1Is eicosylsulfonic acid group, R2Is eicosylsulfonic acid group, R3Is eicosyl sulfonic acid group; m is 6, n is 9; the molecular weight of the acrylic resin is 24480.
The film forming agent is acrylic resin; the active agent is a mixture of citric acid, suberic acid and sorbic acid; the thickening agent is hydrogenated castor oil wax; the corrosion inhibitor is benzotriazole; the antioxidant is hydroquinone; the pH regulator is ethylenediamine; the solvent is a mixture of ethylene glycol phenyl ether and ethylene glycol monobutyl ether.
The solder paste contains 12 wt% of the solder paste flux of the embodiment, and the solder paste solder powder is SAC series T4 solder powder with the particle size of 20-38 μm.
Example 6
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 35% of film forming agent, 12% of active agent, 4% of thickening agent, 2% of corrosion inhibitor, 1% of antioxidant, 2% of pH regulator and 44% of solvent;
wherein R is1Is 2 hydroxypropyl, R2Is hydroxyethyl, R3Is 4-cyanophenyl; m is 13, n is 17; the molecular weight of the acrylic resin is 7119.
The film forming agent is acrylic resin; the active agent is a mixture of phthalic acid, methylsuccinic acid and N-ethylimidazole; the thickening agent is polyethylene wax; the corrosion inhibitor is hydroxy glyceride; the antioxidant is catechol; the pH regulator is hydroxymethyl diethyl triamine; the solvent is a mixture of diethylene glycol dibutyl ether and tetraethylene glycol.
The solder paste contains the solder paste flux of the embodiment, the weight percentage of the solder paste flux in the solder paste is 11%, and the solder paste solder powder is SAC series T5 solder powder with the grain size of 15-25 μm.
Example 7
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 40% of film forming agent, 8% of active agent, 4% of thickening agent, 1% of corrosion inhibitor, 2% of antioxidant, 2% of pH regulator and 43% of solvent;
wherein R is1Is tetramethylsulfoxide, R2Is n-octyl mercaptan, R3Is a 1-hydroxymethylphenol group; m is 30 and n is 40; the molecular weight of the acrylic resin is 18100.
The film forming agent is acrylic resin; the active agent is a mixture of anthranilic acid, ethylenediamine and 2-ethylimidazole; the thickener is fatty acid triglyceride; the corrosion inhibitor is oleic acid imidazoline; the antioxidant is resorcinol; the pH regulator is cyclobutane diamine; the solvent is a mixture of isohexadecane and dipropylene glycol methyl ether.
The solder paste contains 12 wt% of the solder paste flux of the embodiment, and the solder paste solder powder is SAC series T6 solder powder with a particle size of 5-15 μm.
Example 8
In one embodiment of the solder paste flux of the present invention, the solder paste flux of this embodiment comprises the following components by weight: 40% of film forming agent, 10% of active agent, 3% of thickening agent, 2% of corrosion inhibitor, 1% of antioxidant, 1% of pH regulator and 43% of solvent;
wherein R is1Is n-butyl thiol, R2Is sulfolane radical, R3Is a 1-decanethiol group; m is 180, n is 190; the molecular weight of the acrylic resin is 99480.
The film forming agent is acrylic resin; the active agent is a mixture of salicylic acid, monoethanolamine and phenylimidazole; the thickener is fatty acid triglyceride; the corrosion inhibitor is oleic acid imidazoline; the antioxidant is dimethyl phosphate; the pH regulator is hydroxymethyl ethylenediamine; the solvent is a mixture of diethylene glycol dibutyl ether and diethylene glycol octyl ether.
The solder paste contains the solder paste flux of the embodiment, the weight percentage of the solder paste flux in the solder paste is 12 percent, and the solder paste solder powder is SAC series superfine powder with the particle size of 2-11 mu m.
Comparative example 1
The invention discloses a comparative example of a solder paste soldering flux, which comprises the following components in percentage by weight: 55% of film forming agent, 15% of active agent, 5% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 2% of pH regulator and 29% of solvent;
the film-forming agent is polymerized rosin; the active agent is a mixture of glutaric acid, 2-undecylimidazole and diethanolamine; the film forming agent is disproportionated rosin and water white rosin; the thickener is fatty acid monoglyceride; the corrosion inhibitor is methyl benzotriazole; the antioxidant is methyl phosphate; the pH regulator is hydroxyethyl ethylenediamine; the solvent is a mixture of diethylene glycol ethyl ether and tripropylene glycol butyl ether.
The solder paste contains the solder paste soldering flux of the comparative example, the weight percentage of the solder paste soldering flux in the solder paste is 11 percent, and the solder paste solder powder is SAC series superfine powder with the grain diameter of 2-11 mu m.
Comparative example 2
The invention discloses a comparative example of a solder paste soldering flux, which comprises the following components in percentage by weight: 20% of film forming agent, 15% of polyvinyl alcohol, 5% of polypropylene, 10% of active agent, 4% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 1% of pH regulator and 41% of solvent;
the film-forming agent is modified rosin; the active agent is a mixture of glutaric acid, 2-undecylimidazole and diethanolamine; the film forming agent is disproportionated rosin and water white rosin; the thickener is fatty acid monoglyceride; the corrosion inhibitor is methyl benzotriazole; the antioxidant is methyl phosphate; the pH regulator is hydroxyethyl ethylenediamine; the solvent is a mixture of diethylene glycol ethyl ether and tripropylene glycol butyl ether.
The tin paste contains the tin paste soldering flux of the comparative example, the weight percentage of the tin paste soldering flux in the tin paste is 11-12%, and the tin paste tin powder is SAC series superfine powder with the particle size of 2-11 mu m.
Comparative example 3
The invention discloses a comparative example of a solder paste soldering flux, which comprises the following components in percentage by weight: 30% of film forming agent, 15% of active agent, 15% of polyethylene, 5% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 2% of pH regulator and 29% of solvent;
the film-forming agent is acrylic rosin; the active agent is a mixture of glutaric acid, 2-undecylimidazole and diethanolamine; the film forming agent is a mixture of disproportionated rosin and water white rosin; the thickener is fatty acid monoglyceride; the corrosion inhibitor is methyl benzotriazole; the antioxidant is methyl phosphate; the pH regulator is hydroxyethyl ethylenediamine; the solvent is a mixture of diethylene glycol ethyl ether and tripropylene glycol butyl ether.
The tin paste contains the tin paste soldering flux of the embodiment, the weight percentage of the tin paste soldering flux in the tin paste is 11%, and the tin paste and tin powder are SAC series ultrafine micro powder with the particle size of 2-11 mu m.
Comparative example 4
The invention discloses a comparative example of a solder paste soldering flux, which comprises the following components in percentage by weight: 15% of film forming agent, 30% of hydrogenated rosin, 7% of active agent, 3% of thickening agent, 2% of corrosion inhibitor, 2% of antioxidant, 1% of pH regulator and 40% of solvent;
the film forming agent is polyurethane; the active agent is a mixture of salicylic acid, monoethanolamine and phenylimidazole; the thickener is fatty acid triglyceride; the corrosion inhibitor is oleic acid imidazoline; the antioxidant is dimethyl phosphate; the pH regulator is hydroxymethyl ethylenediamine; the solvent is a mixture of diethylene glycol dibutyl ether and diethylene glycol octyl ether.
The solder paste contains the solder paste soldering flux of the comparative example, the weight percentage of the solder paste soldering flux in the solder paste is 11 percent, and the solder paste solder powder is SAC series superfine powder with the grain diameter of 2-11 mu m.
Example 9
The solder paste prepared in the embodiments 1 to 8 is subjected to screen printing with different sizes of solder joints, wherein the solder joints are respectively as follows: 0.87, 0.28, 026, 0.24, 0.23, 0.22, 0.21, 0.20, 0.19, 0.17 and 0.15, after printing, placing the pcb board in a standard reflow soldering with a constant temperature zone of 150-180 ℃ and a high temperature reflow soldering with a constant temperature zone of 160-200 ℃ respectively for soldering test, and table 1 lists the diameter of the minimum soldering point, the appearance of the soldering point and the appearance of the large soldering point with the diameter of 0.87mm which can be achieved by the examples 1-8 and the comparative examples 1-4.
TABLE 1 Performance test results for examples 1-8 and comparative examples 1-4
It can be seen from the results of examples 1 to 8 and comparative examples 1 to 4 that in examples 1 to 8, the solder paste containing acrylic resin is subjected to screen printing and passes through a standard reflow soldering curve and a high-temperature reflow soldering curve, and then the surface of the solder powder is not easily oxidized due to the coating effect of the acrylic resin, so that the minimum diameter of a solder joint without a grape ball phenomenon on the surface can be smaller, and the solder joint can be applied to fine soldering with smaller solder joint spacing requirements and is suitable for more integrated circuit design. Meanwhile, because the oxidation process is accelerated under the high temperature condition, the tin paste soldering flux containing the acrylic resin can also relieve the oxidation of tin powder, and the data in the table 1 show that the tin paste containing the acrylic resin can be suitable for a reflow soldering curve at a higher temperature under the condition that soldering points with the same size are needed, the process window is wider, and the usable range is wider.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (10)
1. The solder paste soldering flux is characterized by comprising a film forming agent, wherein the film forming agent comprises acrylic resin; the acrylic resin has a repeating structural unit of formula (I):
（I）
wherein R is1The organic solvent is one of C1-C20 alkyls, C1-C20 hydroxyalkyl, C1-C20 ethers, C1-C20 cyanogen groups, C1-C20 sulfones, C1-C20 thiols, C1-C20 sulfonic acid groups and C6-C20 phenyl groups;
R2the organic solvent is one of C1-C20 alkyls, C1-C20 hydroxyalkyl, C1-C20 ethers, C1-C20 cyanogen groups, C1-C20 sulfones, C1-C20 thiols, C1-C20 sulfonic acid groups and C6-C20 phenyl groups;
R3alkyl of C1-C20, hydroxyalkyl of C1-C20, ether of C1-C20, cyanogen of C1-C20, C1 to C20 sulfones, C1 to C20 thiols, C1 to C20 sulfonic acids, and C6 to C20 phenyl groups;
m represents an integer of 5 to 300, and n represents an integer of 5 to 300;
the molecular weight of the acrylic resin is 200-300000.
2. The solder paste flux of claim 1, wherein R is1The organic solvent is one of C1-C20 alkyls, C1-C20 hydroxyalkyl, C1-C20 ethers, C1-C20 cyanogen groups, C1-C10 sulfones, C1-C10 thiols, C1-C10 sulfonic acid groups and C6-C20 phenyl groups;
the R is2The organic solvent is one of C1-C20 alkyls, C1-C20 hydroxyalkyl, C1-C20 ethers, C1-C10 cyanogen groups, C1-C10 sulfones, C1-C10 thiols, C1-C10 sulfonic acid groups and C6-C20 phenyl groups;
the R is3The aromatic polyester resin is one of C1-C20 alkyl, C1-C20 hydroxyalkyl, C1-C20 ether, C1-C10 cyanogen, C1-C10 sulfone, C1-C10 thiol, C1-C10 sulfonic acid and C6-C20 phenyl.
3. The solder paste flux of claim 1, wherein the film-forming agent is present in the solder paste flux in an amount of 30 to 50% by weight.
4. The solder paste flux of claim 1, wherein the film former further comprises at least one of rosin, epoxy resin, acrylic resin, polyurethane, polyethylene, polypropylene, polyisobutylene, polyethylene glycol, polyvinyl alcohol, and phenolic resin; the rosin is at least one of polymerized rosin, hydrogenated rosin, modified rosin, disproportionated rosin, acrylic rosin, white ice rosin and white water rosin.
5. The solder paste flux of claim 1, further comprising an active agent, wherein the active agent is present in the solder paste flux in an amount of 5 to 15% by weight; the active agent is succinic acid, glutaric acid, suberic acid, sebacic acid, pimelic acid, adipic acid, malonic acid, azelaic acid, phenylsuccinic acid, methylsuccinic acid, tartaric acid, o-hydroxybenzoic acid, 5-sulfosalicylic acid, terephthalic acid, oleic acid, anhydrous citric acid, 2-dimethylolpropionic acid, 2-dimethylolbutyric acid, benzoic acid, phthalic acid, p-tert-butylbenzoic acid, glutamic acid, glycine, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethylimidazole, 2-methylimidazole, 4-methyl-2-phenylimidazole, diphenylguanidine, valeric acid, hexanoic acid, 2-methylacetic acid, 2-phenylbutyric acid, 1,3, 5-benzenetricarboxylic acid, dodecahydroxystearic acid, 8-hydroxyquinoline, acetic acid, or the like, At least one of N-methylimidazole, N-ethylimidazole, benzimidazole, 2-methylbenzimidazole, isovanillin, quinaldinic acid, N-phenylanthranilic acid, phenylimidazole, itaconic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, octadecanoic acid, malic acid, maleic acid, sorbic acid, glycolic acid, dodecanedioic acid, lactic acid, salicylic acid, anthranilic acid, monoethanolamine, diethanolamine, triisopropanolamine, cyclohexylamine, oxalic acid, fumaric acid, succinic anhydride, dipropionic acid, and pyridine acid.
6. The solder paste flux of claim 1, further comprising a solvent, wherein the solvent is present in the solder paste flux in an amount of 24 to 59 weight percent; the solvent is glycerol, diethylene glycol, methanol, ethanol, isopropanol, n-butanol, 2-ethyl-1-hexanol, terpineol, cyclohexanol, ethylene glycol, polyethylene glycol, polypropylene glycol, dibutyl ether, diethylene glycol dibutyl ether, tetraethylene glycol dimethyl ether, triethylene glycol monomethyl ether, diethylene glycol octyl ether, triethylene glycol monoethyl ether, tripropylene glycol methyl ether, diethylene glycol monooctyl ether, tripropylene glycol monobutyl ether, dipropylene glycol methyl ether, triethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, tripropylene glycol butyl ether, dipropylene glycol monoethyl ether, dipropylene glycol methyl ether, diethylene glycol methyl ether, dipropylene glycol dimethyl ether, triethylene glycol butyl ether, dipropylene glycol, tripropylene glycol, 2-methyl-2, 4-pentanediol, diethylene glycol monobutyl ether, ethylene glycol phenyl ether, ethylene glycol diphenyl ether, propylene glycol methyl ether, propylene glycol propyl ether, diethylene glycol ethyl ether, propylene glycol phenyl ether, dipropylene glycol monobutyl ether, ethylene glycol dibutyl ether, 2-ethyl-1, 3-hexanediol, ethyl formate, butyl formate, pentyl formate, ethyl acetate, dipentaerythritol, diglycidyl ether, ethylene glycol butyl ether, triethylene glycol, ethylhexylene glycol, diethylene glycol ethyl ether acetate, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monobutyl ether acetate, 2-methyl-hexylene glycol, propylene glycol monobutyl ether, polyethylene glycol dibutyl ether, diethylene glycol dibutyl ether, tetrahydrofurfuryl alcohol, dioctyl phthalate, dioctyl sebacate, dibutyl sebacate, tetraethylene glycol, isohexadecyl alcohol, diethylene glycol monobutyl ether acetate, propylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether, diethylene, At least one of nitroethane, dibutyl phthalate, neopentyl glycol, butyl carbitol and monohexyl ether acetate.
7. The solder paste flux of claim 1, further comprising a thickener, an antioxidant, and a corrosion inhibitor, wherein the thickener is present in the solder paste flux in an amount of 3 to 5% by weight; the weight percentage of the antioxidant in the solder paste flux is 3-5%; the weight percentage content of the corrosion inhibitor in the solder paste flux is 1-2%; the thickener is at least one of hydrogenated castor oil, polyamides, fatty acid monoglyceride, fatty acid triglyceride and polyethylene wax; the antioxidant is at least one of phenolic compounds, phosphate compounds, sulfur-containing compounds, tocopherol and derivatives thereof, ascorbic acid and derivatives thereof, hydroquinone, 2, 6-di-tert-butyl-p-cresol and resorcinol; the corrosion inhibitor is at least one of oleic acid imidazoline, azoles, pyrazines and hydroxy glyceride.
8. A solder paste comprising the solder paste flux of any one of claims 1-7.
9. The solder paste of claim 8, further comprising solder powder; the soldering flux is 10-20 wt% of the solder paste, and the solder powder is 80-90 wt% of the solder paste.
10. The solder paste according to claim 9, wherein the particle size of the solder powder is 2 to 38 μm.
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| CN108544140B (en) * | 2018-04-26 | 2021-05-18 | 东莞市仁信电子有限公司 | High-temperature soldering paste special for semiconductor |
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| CN108788512A (en) * | 2018-08-24 | 2018-11-13 | 东莞市仁信电子有限公司 | A kind of low voidage leadless environment-friendly solder(ing) paste of low melting point |
| CN109483089B (en) * | 2018-11-08 | 2021-04-30 | 云南锡业锡材有限公司 | Soldering flux for high-temperature soldering paste and preparation method thereof |
| CN109465571A (en) * | 2018-11-16 | 2019-03-15 | 华普通用技术研究（广州）有限公司 | A kind of the rosin melting appartus and its preparation process of high-performance scaling powder |
| CN109366041B (en) * | 2018-11-16 | 2021-04-23 | 桐庐明泽电子有限公司 | Formula and preparation process of high-performance soldering flux |
| CN109570825B (en) * | 2018-11-22 | 2021-07-13 | 东莞市绿志岛金属有限公司 | Low-temperature halogen-free lead-free soldering paste and preparation method thereof |
| JP2020116611A (en) * | 2019-01-24 | 2020-08-06 | 株式会社弘輝 | Flux and solder paste |
| CN110524139A (en) * | 2019-08-06 | 2019-12-03 | 界首市南都华宇电源有限公司 | A kind of scaling powder of low-corrosiveness |
| CN111015011B (en) * | 2019-12-30 | 2021-07-27 | 苏州优诺电子材料科技有限公司 | High-stability soldering paste and preparation method thereof |
| CN111531292A (en) * | 2020-05-15 | 2020-08-14 | 湖北省哈福生物化学有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN112692391B (en) * | 2021-01-29 | 2022-04-12 | 东莞市绿志岛金属有限公司 | High-temperature-resistant lead-free laser welding solder paste |
| CN115401358B (en) * | 2022-09-13 | 2023-12-19 | 苏州优诺电子材料科技有限公司 | Photo-curing soldering paste and preparation method thereof |
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