CN107920428B - IC base is pulled out to integrated circuit Louis - Google Patents
IC base is pulled out to integrated circuit Louis Download PDFInfo
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- CN107920428B CN107920428B CN201711164419.0A CN201711164419A CN107920428B CN 107920428 B CN107920428 B CN 107920428B CN 201711164419 A CN201711164419 A CN 201711164419A CN 107920428 B CN107920428 B CN 107920428B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
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Abstract
The invention discloses an Integrated Circuit (IC) base which comprises an IC base body with a square frame body structure, wherein a jacking device is arranged in the IC base body and comprises an upper baffle plate, the two ends of the upper surface of the upper baffle plate are respectively provided with a left square block and a right square block, the two ends of the lower surface of the upper baffle plate are respectively provided with a left positioning round rod and a right positioning round rod, and a right oblique wedge and a left oblique wedge are arranged between the right positioning round rods of the left positioning round rods on the lower surface of the upper baffle plate; the wedge of the left wedge faces one end of the left square rod, the other end of the left square rod extends out of the left end face of the IC base body, the left square rod transversely moves relative to the left wedge, the wedge of the right wedge faces one end of the right square rod, the other end of the right square rod extends out of the right end face of the IC base body, and the right square rod transversely moves relative to the right wedge; the invention can ensure that the IC chip of the integrated circuit can be safely sprung and pulled out from the IC base, and prevent the pins or the integrated circuit from being damaged.
Description
Technical Field
The invention belongs to the technical field of integrated circuit bases, and particularly relates to an Integrated Circuit (IC) base.
Background
Currently, in order to facilitate replacement of an integrated circuit chip on a circuit board, various integrated circuit bases are appeared on the market, and when the integrated circuit chip needs to be replaced, the integrated circuit chip can be pulled out from the base, and then the replaced integrated circuit chip is plugged into the base. This provides convenience for replacement of the integrated circuit. However, once the integrated circuit chip is inserted into the base, the pins can be pulled out only by force because the pins are tightly inserted into the jacks, but once the pins are hard to force, the integrated circuit chip is hard to uniformly force, so that after the integrated circuit chip is pulled out, the pins are easy to bend, part of the pins can be broken off and the integrated circuit chip is easy to damage, and fig. 1 is a schematic diagram of the structure of the prior art, so that the integrated circuit chip is required to be safely pulled out from the base, and the base is improved.
Disclosure of Invention
The invention provides an Integrated Circuit (IC) base for pulling out an IC, which solves the problem that an IC chip is safely pulled out of the base in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the utility model provides an Integrated Circuit (IC) base of drawing IC is disclosed, which comprises an IC base body 20 with a square frame structure, wherein a jacking device is arranged in the IC base body 20, the jacking device comprises an upper baffle 1, a left square 2, a right square 3, a left positioning round rod 4, a right positioning round rod 5, a left wedge 6 and a right wedge 8, the two ends of the upper surface of the upper baffle 1 are respectively provided with the left square 2 and the right square 3, the two ends of the lower surface of the upper baffle 1 are respectively provided with the left positioning round rod 4 and the right positioning round rod 5, and the lower surface of the upper baffle 1 is provided with the right wedge 8 and the left wedge 6 from the left positioning round rod 4 to the right positioning round rod 5; the oblique face of left wedge 6 is towards the one end of left square pole 7, and left side pole 7's the other end stretches out in the left end face of IC base body 20, left square pole 7 is for the lateral movement of left wedge 6, the wedge of right wedge 8 is towards the one end of right square pole 9, and the other end of right square pole 9 stretches out in the right end face of IC base body 20, right square pole 9 is for the lateral movement of right wedge 8, left spring 16 is installed to the lower segment of left location round bar 4, and right spring 17 is installed to the lower segment of right location round bar 5.
Further, a left cross bar 10 and a right cross bar 11 are arranged between two opposite side walls of the IC base body 20, a left round hole 12 penetrating longitudinally is arranged on the left cross bar 10, and the left positioning round bar 4 is inserted into the left round hole 12; the right cross rod 11 is provided with a right round hole 15 which longitudinally penetrates through the right cross rod, and the right positioning round rod 5 is inserted into the right round hole 15.
Further, a left hole 13 is formed in the left cross bar 10 and is penetrated transversely, the left bar 7 is inserted into the left hole 13, a right hole 14 is formed in the right cross bar 11 and is penetrated transversely, and the right bar 9 is inserted into the right hole 14.
Further, the left round hole 12 and the right round hole 15 are located on the same straight line, the left round hole 13 and the right round hole 14 are located at two sides of a connecting line of the left round hole 12 and the right round hole 15, and the left round hole 13 and the right round hole 14 are centrally symmetrical about a midpoint of the connecting line.
Further, an inclined plane corresponding to the inclined plane of the left inclined wedge 6 is arranged at one end of the left square rod 7 opposite to the inclined plane of the left inclined wedge 6; one end of the right square rod 9 opposite to the wedge surface of the right wedge 8 is provided with an inclined surface corresponding to the wedge surface of the right wedge 8.
Further, the top of the left spring 16 is connected to the bottom of the left cross bar 10, and the top of the right spring 17 is connected to the bottom of the right cross bar 11.
Further, a left locating plate 18 is installed at the bottom of the left spring 16, the left locating plate 18 is sleeved at the bottom of the left locating round rod 4, a right locating plate 19 is installed at the bottom of the right spring 17, and the right locating plate 19 is sleeved at the bottom of the right locating round rod 5.
Further, the jack-up means is a single unit which moves up and down together with respect to the IC base body 20.
Further, the left block 2 and the right block 3 are used for supporting or jacking up the integrated circuit IC chip 21.
Compared with the prior art, the invention has the following beneficial effects:
the invention can ensure that the IC chip of the integrated circuit can be safely sprung and pulled out from the IC base, and prevent the pins or the integrated circuit from being damaged.
Drawings
FIG. 1 is a schematic diagram of a prior art structure;
FIG. 2 is a top view of the present invention;
FIG. 3 is a front view of the present invention;
FIG. 4 is a top view of the jacking device of the present invention;
FIG. 5 is a front view of the jacking device of the present invention;
FIG. 6 is a schematic view of the left half of the jack-up device of the present invention;
FIG. 7 is a schematic view of the structure of the right half of the jack-up device of the present invention;
FIG. 8 is a diagram of the position of the left and right rails within the IC base body in accordance with the present invention;
FIG. 9 is a schematic view of the structure of the left and right rails of the present invention;
FIG. 10 is a view of the mounting positions of the left and right springs of the present invention;
FIG. 11 is a view of the mounting locations of the left and right spacers in the present invention;
FIG. 12 is a state diagram of an integrated circuit IC chip inserted on an IC mount body;
FIG. 13 is a state diagram of an integrated circuit IC chip being ejected from an IC mount body;
wherein: 1-upper baffle, 2-left square, 3-right square, 4-left positioning round bar, 5-right positioning round bar, 6-left wedge, 7-left square bar, 8-right wedge, 9-right square bar, 10-left cross bar, 11-right cross bar, 12-left round hole, 13-left square hole, 14-right square hole, 15-right round hole, 16-left spring, 17-right spring, 18-left positioning piece, 19-right positioning piece, 20-IC base body, 21-IC chip, 22-IC pin.
Detailed Description
The invention will be further illustrated with reference to examples.
As shown in fig. 2-7, an IC base for pulling an IC by using an Integrated Circuit (IC) includes an IC base body 20 with a square frame structure, a jack-up device is disposed in the IC base body 20, the jack-up device includes an upper baffle 1, a left square block 2, a right square block 3, a left positioning round rod 4, a right positioning round rod 5, a left wedge 6 and a right wedge 8, the jack-up device is an integral body, the integral body moves up and down relative to the IC base body 20, two ends of the upper surface of the upper baffle 1 are respectively provided with the left square block 2 and the right square block 3, two ends of the lower surface of the upper baffle 1 are respectively provided with the left positioning round rod 4 and the right positioning round rod 5, and a right wedge 8 and a left wedge 6 are disposed between the right positioning round rod 5 and the left positioning round rod 4 on the lower surface of the upper baffle 1; the oblique face of left wedge 6 is towards the one end of left square pole 7, and left side pole 7's the other end stretches out in the left end face of IC base body 20, left square pole 7 is for the lateral movement of left wedge 6, the wedge of right wedge 8 is towards the one end of right square pole 9, and the other end of right square pole 9 stretches out in the right end face of IC base body 20, right square pole 9 is for the lateral movement of right wedge 8, left spring 16 is installed to the lower segment of left location round bar 4, and right spring 17 is installed to the lower segment of right location round bar 5.
As shown in fig. 8-9, a left cross bar 10 and a right cross bar 11 are arranged between two opposite side walls of the IC base body 20, a left round hole 12 passing through longitudinally is arranged on the left cross bar 10, and the left positioning round bar 4 is inserted into the left round hole 12; the right cross rod 11 is provided with a right round hole 15 which longitudinally penetrates through the right cross rod, and the right positioning round rod 5 is inserted into the right round hole 15. The left cross bar 10 is provided with a left hole 13 which is transversely penetrated, the left bar 7 is inserted into the left hole 13, the right cross bar 11 is provided with a right hole 14 which is transversely penetrated, and the right bar 9 is inserted into the right hole 14. The left round hole 12 and the right round hole 15 are positioned on the same straight line, the left round hole 13 and the right round hole 14 are respectively positioned at two sides of a connecting line of the left round hole 12 and the right round hole 15, and the left round hole 13 and the right round hole 14 are centrosymmetric with the midpoint of the connecting line.
One end of the left square rod 7 opposite to the wedge surface of the left wedge 6 is provided with an inclined surface corresponding to the wedge surface of the left wedge 6; one end of the right square rod 9 opposite to the wedge surface of the right wedge 8 is provided with an inclined surface corresponding to the wedge surface of the right wedge 8.
As shown in fig. 10 and 11, the top of the left spring 16 is connected with the bottom of the left cross bar 10, the top of the right spring 17 is connected with the bottom of the right cross bar 11, a left positioning plate 18 is installed at the bottom of the left spring 16, the left positioning plate 18 is sleeved at the bottom of the left positioning round bar 4, a right positioning plate 19 is installed at the bottom of the right spring 17, and the right positioning plate 19 is sleeved at the bottom of the right positioning round bar 5.
As shown in fig. 12 and 13, when the IC chip 21 is inserted into the IC base body 20, the left and right blocks 2 and 3 are closely attached to the bottom of the IC chip 21 (when the left and right blocks 2 and 3 are not required to support the IC chip, since the IC chip is inserted into the IC base body 20, since the insertion is very firm, there is no need for supporting the left and right blocks in the prior art, there is no need for supporting the left and right blocks, but only the left and right blocks 2 and 3 are closely attached to the bottom of the IC chip), and when the IC chip 21 is required to be pulled out or ejected from the IC base body 20, the left and right blocks 2 and 3 are used to jack up the IC chip 21 (when the pulling out or ejecting of the IC chip is achieved by the left and right blocks 2 and 3, the IC pins 22 are not in contact with the upper barrier 1 at any time, there is no relation therebetween).
The present invention adds a jacking device on the basis of the IC base body 20, as shown in fig. 4 and 5, the jacking device includes an upper baffle plate 1, a left square block 2, a right square block 3, a left positioning round bar 4, a right positioning round bar 5, a left wedge 6 and a right wedge 8, which are connected together to form a whole, and the whole can only move up and down in a vertical direction relative to the IC base body 20.
Principle that the jack-up device can only move up and down in the vertical direction with respect to the IC base body 20: as shown in fig. 8, a left cross bar 10 and a right cross bar 11 are installed between two opposite side walls of the IC base body 20, a left round hole 12 and a right round hole 15 are respectively provided on the left cross bar 10 and the right cross bar 11, which longitudinally penetrate, the left positioning round bar 4 is inserted into the left round hole 12, and meanwhile, the right positioning round bar 5 is inserted into the right round hole 15, so that the left positioning round bar 4 and the right positioning round bar 5 can move freely up and down, and the left cross bar 10 and the right cross bar 11 are fixed on the IC base body 20, so that the left positioning round bar 4 and the right positioning round bar 5 can only move freely up and down and cannot move left and right.
The left rod 7 and the right rod 9 are mutually independent from the jacking device, the cross sections of the left rod 7 and the right rod 9 are square, one end of the left rod 7 and one end of the right rod 9 are planes, and the other end of the left rod 7 and the other end of the right rod 9 are inclined planes; the left bar 7 and the right bar 9 can move only horizontally with respect to the IC base body 20.
Principle that the left bar 7 and the right bar 9 can move only left and right in the horizontal direction with respect to the IC base body 20: as shown in fig. 8, a left cross bar 10 and a right cross bar 11 are installed between two opposite side walls of the IC base body 20, a left hole 13 and a right hole 14 which are transversely penetrated are respectively arranged on the left cross bar 10 and the right cross bar 11, and a left rod 7 and a right rod 9 are respectively inserted into the left hole 13 and the right hole 14 and can move freely left and right, as shown in fig. 9, the square rods cannot rotate and can only move freely left and right because of the square rods and the square holes, which can ensure that the inclined planes of the left rod 7 and the right rod 9 are exactly parallel and opposite to the inclined planes of the left wedge 6 and the right wedge 8.
As shown in fig. 6, the inclined surfaces of the left square rod 7 and the left wedge 6 are exactly parallel and opposite, when the left square rod 7 moves horizontally and rightwards, the inclined surface of the right end of the left square rod 7 slides together with the inclined surface of the left wedge 6 to generate a force upwards right for the left wedge 6, and because the jacking device is as a whole and can only move up and down along the vertical direction all the time, when the left square rod 7 moves horizontally and rightwards, the final resultant force of the left wedge 6 is upwards, namely the resultant force born by the jacking device is upwards vertically, so as to move upwards. Since the left square 2 and the right square 3 are close to the bottom of the integrated circuit IC chip 21 at first, the integrated circuit IC chip 21 is lifted up and stressed uniformly in the process of moving up the left square 2 and the right square 3, so that the integrated circuit IC chip 21 is pulled out from the IC base body 20 safely.
Similarly, when the right rod 9 moves horizontally and leftwards, a vertical and upward resultant force is finally given to the right oblique wedge 8, so that the left square block 2 and the right square block 3 move upwards and jack up the integrated circuit IC chip 21, and the integrated circuit IC chip 21 is safely pulled out from the IC base body 20.
To ensure safety, the IC mount 20 is forced to be balanced when the left and right levers 7 and 9 are simultaneously pressed with force.
As is clear from the above analysis, when the left bar 7 and the right bar 9 are pressed toward the middle by a finger, the IC chip 21 is safely sprung by the left block 2 and the right block 3, and the IC chip 21 can be removed at this time, as shown in fig. 13. When the chip is taken away, the fingers are released, and the jack-up device is required to automatically return to the original position (i.e. reset), so that the left square block 2 and the right square block 3 are in high consistency with the upper surface of the IC base body 20, and the integrated circuit IC chip is convenient to install next time. The left positioning piece 18 and the right positioning piece 19 and the left spring 16 and the right spring 17 are respectively arranged at the lower ends of the left positioning round rod 4 and the right positioning round rod 5. As shown in fig. 10, the left positioning piece 18 and the right positioning piece 19 are respectively fixed at the lower ends of the left positioning round rod 4 and the right positioning round rod 5, the left spring 16 and the right spring 17 are respectively sleeved at the lower ends of the left positioning round rod 4 and the right positioning round rod 5, and the lower ends of the left spring 16 and the right spring 17 are fixedly connected with the left positioning piece 18 and the right positioning piece 19. The upper ends of the left spring 16 and the right spring 17 are fixed to the lower portions of the left rail 10 and the right rail 11, respectively. When the left bar 7 and the right bar 9 are pressed towards the middle by finger force, the integrated circuit IC chip 21 is sprung up safely by the left square block 2 and the right square block 3, the left spring 16 and the right spring 17 are in a compressed state at the moment, and after the hand is released, the jacking device automatically returns to the original position (returns to the original position) under the action of the elastic force of the left spring 16 and the right spring 17.
The invention uses two fingers to lightly press the left rod 7 and the right rod 9, the integrated circuit IC chip 21 can be safely pulled out from the tube seat, and the jacking device can automatically reset after the hands are loosened.
The foregoing is only a preferred embodiment of the invention, it being noted that: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the invention.
Claims (6)
1. An Integrated Circuit (IC) base is pulled out to Louis, its characterized in that: the IC base comprises an IC base body (20) of a square frame body structure, wherein a jacking device is arranged in the IC base body (20), the jacking device comprises an upper baffle (1), a left square block (2), a right square block (3), a left positioning round rod (4), a right positioning round rod (5), a left oblique wedge (6) and a right oblique wedge (8), the left square block (2) and the right square block (3) are respectively arranged at two ends of the upper surface of the upper baffle (1), the left positioning round rod (4) and the right positioning round rod (5) are respectively arranged at two ends of the lower surface of the upper baffle (1), and a right oblique wedge (8) and a left oblique wedge (6) are arranged between the right positioning round rods (5) from the left positioning round rod (4) on the lower surface of the upper baffle (1); the oblique splitting face of the left oblique wedge (6) faces one end of a left square rod (7), the other end of the left square rod (7) extends out of the left end face of the IC base body (20), the left square rod (7) transversely moves relative to the left oblique wedge (6), the oblique wedge of the right oblique wedge (8) faces one end of a right square rod (9), the other end of the right square rod (9) extends out of the right end face of the IC base body (20), the right square rod (9) transversely moves relative to the right oblique wedge (8), a left spring (16) is arranged at the lower section of the left positioning round rod (4), and a right spring (17) is arranged at the lower section of the right positioning round rod (5); one end of the left square rod (7) opposite to the wedge surface of the left wedge (6) is provided with an inclined surface corresponding to the wedge surface of the left wedge (6); one end of the right square rod (9) opposite to the wedge surface of the right wedge (8) is provided with an inclined surface corresponding to the wedge surface of the right wedge (8); the jacking device is a whole, and the whole moves up and down relative to the IC base body (20); the left square block (2) and the right square block (3) are tightly attached to the bottom of the integrated circuit IC chip (21); the left square block (2) and the right square block (3) are used for supporting or jacking the integrated circuit IC chip (21).
2. The integrated circuit IC package of claim 1, wherein: a left cross rod (10) and a right cross rod (11) are arranged between two opposite side walls of the IC base body (20), a left round hole (12) which longitudinally penetrates through the left cross rod (10) is formed in the left cross rod, and the left positioning round rod (4) is inserted into the left round hole (12); the right cross rod (11) is provided with a right round hole (15) which longitudinally penetrates through the right cross rod, and the right positioning round rod (5) is inserted into the right round hole (15).
3. The integrated circuit IC package of claim 2, wherein: left horizontal pole (10) are last to be provided with left hole (13) that transversely run through, left side pole (7) are inserted in left hole (13), be provided with right hole (14) that transversely run through on right horizontal pole (11), right side pole (9) are inserted in right hole (14).
4. The integrated circuit IC package of claim 3, wherein: the left round hole (12) and the right round hole (15) are positioned on the same straight line, the left round hole (13) and the right round hole (14) are respectively positioned at two sides of a connecting line of the left round hole (12) and the right round hole (15), and the left round hole (13) and the right round hole (14) are centrosymmetric with the midpoint of the connecting line.
5. The integrated circuit IC package of claim 2, wherein: the top of the left spring (16) is connected with the bottom of the left cross rod (10), and the top of the right spring (17) is connected with the bottom of the right cross rod (11).
6. The integrated circuit IC package of claim 5, wherein: the left locating piece (18) is installed to left spring (16) bottom, and the bottom of left location round bar (4) is located to left locating piece (18) cover, right locating piece (19) is installed to right spring (17) bottom, and the bottom of right location round bar (5) is located to right locating piece (19) cover.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711164419.0A CN107920428B (en) | 2017-11-21 | 2017-11-21 | IC base is pulled out to integrated circuit Louis |
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CN201711164419.0A CN107920428B (en) | 2017-11-21 | 2017-11-21 | IC base is pulled out to integrated circuit Louis |
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CN107920428A CN107920428A (en) | 2018-04-17 |
CN107920428B true CN107920428B (en) | 2023-06-30 |
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